2SA1374 Silicon PNP Epitaxial ADE-208-1016 (Z) 1st. Edition Mar. 2001 Application Low frequency amplifier Outline SPAK 1 23 1. Emitter 2. Collector 3. Base 2SA1374 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Collector to base voltage VCBO –55 V Collector to emitter voltage VCEO –55 V Emitter to base voltage VEBO –5 V Collector current IC –100 mA Base current IB –30 mA Collector power dissipation PC 300 mW Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test conditions Collector to base breakdown voltage V(BR)CBO –55 — — V I C = –10 µA, IE = 0 Collector to emitter breakdown V(BR)CEO voltage –55 — — V I C = –1 mA, RBE = ∞ Emitter to base breakdown voltage V(BR)EBO –5 — — V I E = –10 µA, IC = 0 Collector cutoff current I CBO — — –0.1 µA VCB = –18 V, IE = 0 Emitter cutoff current I EBO — — –0.05 µA VEB = –2 V, IE = 0 160 — 500 1 DC current transfer ratio hFE* Base to emitter voltage VBE — –0.66 –0.75 V VCE = –12 V, IC = –2 mA Collector to emitter saturation voltage VCE(sat) — –0.1 –0.5 V I C = –10 mA, IB = –1 mA Gain bandwidth product fT — 250 — MHz VCE = –12 V, IC = –2 mA Collector output capacitance Cob — 2.5 — pF VCB = –10 V, IE = 0, f = 1 MHz Note: 1. The 2SA1374 is grouped by hFE as follows. C D 160 to 320 250 to 500 See characteristic curves of 2SA836. 2 VCE = –12 V, IC = –2 mA 2SA1374 Collector Power Dissipation PC (mW) Maximum Collector Dissipation Curve 300 200 100 0 100 150 50 Ambient Temperature Ta (°C) 3 2SA1374 Package Dimensions 2.2 Max As of January, 2001 Unit: mm 0.6 0.6 Max 0.45 ± 0.1 14.5 Min 1.8 Max 3.2 Max 4.2 Max 0.4 ± 0.1 1.27 1.27 2.54 4 Hitachi Code JEDEC EIAJ Mass (reference value) SPAK — — 0.10 g 2SA1374 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. 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