2SC3390 Silicon NPN Epitaxial ADE-208-1083 (Z) 1st. Edition Mar. 2001 Application • Low frequency low noise amplifier • HF amplifier Outline SPAK 1 23 1. Emitter 2. Collector 3. Base 2SC3390 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Collector to base voltage VCBO 55 V Collector to emitter voltage VCEO 50 V Emitter to base voltage VEBO 5 V Collector current IC 100 mA Collector power dissipation PC 300 mW Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test conditions Collector to base breakdown voltage V(BR)CBO 55 — — V I C = 10 µA, IE = 0 Collector to emitter breakdown voltage V(BR)CEO 50 — — V I C = 1 mA, RBE = ∞ Emitter to base breakdown voltage V(BR)EBO 5 — — V I E = 10 µA, IC = 0 Collector cutoff current I CBO — — 0.5 µA VCB = 18 V, IE = 0 Emitter cutoff current I EBO — — 0.5 µA VEB = 2 V, IC = 0 100 — 320 1 DC current transfer ratio hFE* Base to emitter voltage VBE — — 0.75 V VCE = 12 V, IC = 2 mA Collector to emitter saturation voltage VCE(sat) — — 0.2 V I C = 10 mA, IB = 1 mA Gain bandwidth product fT — 200 — MHz VCE = 12 V, IC = 2 mA Collector output capacitance Cob — — 3.5 pF VCB = 10 V, IE = 0, f = 1 MHz Noise figure NF — 1.0 5.0 dB VCE = 6 V, IC = 0.1 mA, Rg = 1 kΩ, f = 1 kHz Note: 1. The 2SC3390 is grouped by h FE as follows. B C 100 to 200 160 to 320 See characteristic curves of 2SC458(LG). 2 VCE = 12 V, IC = 2 mA 2SC3390 Collector Power Dissipation PC (mW) Maximum Collector Dissipation Curve 300 200 100 0 50 100 Ambient Temperature Ta (°C) 150 3 2SC3390 Package Dimensions 2.2 Max As of January, 2001 Unit: mm 0.6 0.6 Max 0.45 ± 0.1 14.5 Min 1.8 Max 3.2 Max 4.2 Max 0.4 ± 0.1 1.27 1.27 2.54 4 Hitachi Code JEDEC EIAJ Mass (reference value) SPAK — — 0.10 g 2SC3390 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. 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