AT6000/LV Series Features • • • • • • • • • • High Performance System Speeds > 100 MHz Flip-Flop Toggle Rates > 250 MHz 1.2 ns/1.5 ns Input Delay 3.0 ns/6.0 ns Output Delay Up to 204 User I/Os Thousands of Registers Cache Logic® Design Complete/Partial In-System Reconfiguration No Loss of Data or Machine State Adaptive Hardware Low Voltage and Standard Voltage Operation 5.0 (VCC = 4.75V to 5.25V) 3.3 (VCC = 3.0V to 3.6V) Automatic Component Generators Reusable Custom Hard Macro Functions Very Low Power Consumption Standby Current of 500 µA/ 200 µA Typical Operating Current of 15 to 170 mA Programmable Clock Options Independently Controlled Column Clocks Independently Controlled Column Resets Clock Skew Less Than 1 ns Across Chip Independently Configurable I/O (PCI Compatible) TTL/CMOS Input Thresholds Open Collector/Tri-state Outputs Programmable Slew-Rate Control I/O Drive of 16 mA (combinable to 64 mA) Easy Migration to Atmel Gate Arrays for High Volume Production Coprocessor Field Programmable Gate Arrays Description AT6000 Series SRAM-Based Field Programmable Gate Arrays (FPGAs) are ideal for use as reconfigurable coprocessors and implementing compute intensive logic. Supporting system speeds greater than 100 MHz and using a typical operating current of 15 to 170 mA, AT6000 Series devices are ideal for high-speed, compute-intensive designs. These FPGAs are designed to implement Cache Logic®, which provides the user with the ability to implement adaptive hardware and perform hardware acceleration. The patented AT6000 Series architecture employs a symmetrical grid of small yet powerful cells connected to a flexible busing network. Independently controlled clocks and resets govern every column of cells. The array is surrounded by programmable I/O. (continued) AT6000 and AT6000LV Series AT6000 Series Field Programmable Gate Arrays Device AT6002 AT6003 AT6005 AT6010 Usable Gates 6,000 9,000 15,000 30,000 Cells 1,024 1,600 3,136 6,400 Registers (maximum) 1,024 1,600 3,136 6,400 96 120 108 204 15-30 25-45 40-80 85-170 32 x 32 40 x 40 56 x 56 80 x 80 I/O (maximum) Typ. Operating Current (mA) Cell Rows x Columns 0264E 2-3 Description (Continued) Devices range in size from 4,000 to 30,000 usable gates, and 1024 to 6400 registers. Pin locations are consistent throughout the AT6000 Series for easy design migration. High-I/O versions are available for the lower gate count devices. AT6000 Series FPGAs utilize a reliable 0.6 µm singlepoly, double-metal CMOS process and are 100% factorytested. Atmel’s PC- and workstation-based Integrated Development System is used to create AT6000 Series designs. Multiple design entry methods are supported. The Atmel architecture was developed to provide the highest levels of performance, functional density and design flexibility in an FPGA. The cells in the Atmel array are small, very efficient and contain the most important and most commonly used logic and wiring functions. The cell’s small size leads to arrays with large numbers of cells, greatly multiplying the functionality in each cell. A simple, high-speed busing network provides fast, efficient communication over medium and long distances. Figure 1. Symmetrical Array Surrounded by I/O 2-4 AT6000/LV Series The Symmetrical Array At the heart of the Atmel architecture is a symmetrical array of identical cells (Figure 1). The array is continuous and completely uninterrupted from one edge to the other, except for bus repeaters spaced every eight cells (Figure 2). In addition to logic and storage, cells can also be used as wires to connect functions together over short distances and are useful for routing in tight spaces. The Busing Network There are two kinds of buses: local and express (see Figures 2 and 3). Local buses are the link between the array of cells and the busing network. There are two local buses— North-South 1 and 2 (NS1 and NS2)— for every column of cells, and two local buses— East-West 1 and 2 (EW1 and EW2)— for every row of cells. In a sector (an 8 x 8 array of cells enclosed by repeaters) each local bus is connected to every cell in its column or row, thus providing every cell in (continued) AT6000/LV Series Figure 2. Busing Network (one sector) CELL REPEATER Figure 3. Cell-to-Cell and Bus-to-Bus Connections 2-5 Description (Continued) the array with read/write access to two North-South and two East-West buses. Each cell, in addition, provides the ability to route a signal on a 90° turn between the NS1 bus and EW1 bus and between the NS2 bus and EW2 bus. Express buses are not connected directly to cells, and thus provide higher speeds. They are the fastest way to cover long, straight-line distances within the array. Each express bus is paired with a local bus, so there are two express buses for every column and two express buses for every row of cells. Connective units, called repeaters, spaced every eight cells, divide each bus, both local and express, into segments spanning eight cells. Repeaters are aligned in rows and columns thereby partitioning the array into 8 x 8 sectors of cells. Each repeater is associated with a local/express pair, and on each side of the repeater are connections to a local-bus segment and an express-bus segment. The repeater can be programmed to provide any one of twenty-one connecting functions. These functions are symmetric with respect to both the two repeater sides and the two types of buses. Among the functions provided are the ability to: • Isolate bus segments from one another • Connect two local-bus segments • Connect two express-bus segments • Implement a local/express transfer In all of these cases, each connection provides signal regeneration and is thus unidirectional. For bidirectional connections, the basic repeater function for the NS2 and EW2 repeaters is augmented with a special programmable connection allowing bidirectional communication between local-bus segments. This option is primarily used to implement long, tri-state buses. Figure 4. Cell Structure 2-6 AT6000/LV Series The Cell Structure The Atmel cell (Figure 4) is simple and small and yet can be programmed to perform all the logic and wiring functions needed to implement any digital circuit. Its four sides are functionally identical, so each cell is completely symmetrical. Read/write access to the four local buses— NS1, EW1, NS2 and EW2— is controlled, in part, by four bidirectional pass gates connected directly to the buses. To read a local bus, the pass gate for that bus is turned on and the three-input multiplexer is set accordingly. To write to a local bus, the pass gate for that bus and the pass gate for the associated tri-state driver are both turned on. The twoinput multiplexer supplying the control signal to the drivers permits either: (1) active drive, or (2) dynamic tri-stating controlled by the B input. Turning between LNS1 and LEW1 or between LNS2 and LEW2 is accomplished by turning on the two associated pass gates. The operations of reading, writing and turning are subject to the restriction that each bus can be involved in no more than a single operation. In addition to the four local-bus connections, a cell receives two inputs and provides two outputs to each of its North (N), South (S), East (E) and West (W) neighbors. These inputs and outputs are divided into two classes: “A” and “B.” There is an A input and a B input from each neighboring cell and an A output and a B output driving all four neighbors. Between cells, an A output is always connected to an A input and a B output to a B input. Within the cell, the four A inputs and the four B inputs enter two separate, independently configurable multiplexers. Cell flexibility is enhanced by allowing each multiplexer to select also the logical constant “1.” The two multiplexer outputs enter the two upstream AND gates. Downstream from these two AND gates are an ExclusiveOR (XOR) gate, a register, an AND gate, an inverter and two four-input multiplexers producing the A and B outputs. These multiplexers are controlled in tandem (unlike the A and B input multiplexers) and determine the function of the cell. • In State 0— corresponding to the “0" inputs of the multiplexers— the output of the left-hand upstream AND gate is connected to the cell’s A output, and the output of the right-hand upstream AND gate is connected to the cell’s B output. • In State 1— corresponding to the “1" inputs of the multiplexers— the output of the left-hand upstream AND gate is connected to the cell’s B output, the output of the right-hand upstream AND gate is connected to the cell’s A output. • In State 2— corresponding to the “2" inputs of the multiplexers— the XOR of the outputs from the two upstream AND gates is provided to the cell’s A output, (continued) AT6000/LV Series Figure 5c. Physical Constants Figure 5a. Combinatorial Physical States Li Li A, L o B A, L o B A Li B A Li B A, L o B A, L o A Li B A Li B A Li A, L o A, L o Li B A Li A, L o A, L o B "0" "0" A, L o B "0" A, L o "1" "1" "0" B A, L o B "1" A, L o "1" B A Li B B Figure 6a. Two-Input AND Feeding XOR B A, L o Li B B B B A, L o B A, L o A, L o A, L o A, L o Li B Li A A Li B A Li B A, L o B B A B Li A Li B B A Li B A 1 0 A, L o A, L o B A, L o B A, L o B A, L o B Figure 6b. Cell Configuration (A•L) XOR B Figure 5b. Register States Li A A D Q "0" A, L o B A Li D Q A, L o B A B D Q D Q A, L o Li B B D Q A, L o Li B A Li D Q D Q A, L o A, L o B A Li B B A, L o B A Li B 1 0 D Q A, L o B D Q A, L o B D Q D Q A, L o A, L o B 2-7 Description (Continued) • while the NAND of these two outputs is provided to the cell’s B output. In State 3— corresponding to the “3" inputs of the multiplexers— the XOR function of State 2 is provided to the D input of a D-type flip-flop, the Q output of which is connected to the cell’s A output. Clock and asynchronous reset signals are supplied externally as described later. The AND of the outputs from the two upstream AND gates is provided to the cell’s B output. Logic States The Atmel cell implements a rich and powerful set of logic functions, stemming from 44 logical cell states which permutate into 72 physical states. Some states use both A and B inputs. Other states are created by selecting the “1" input on either or both of the input multiplexers. There are 28 combinatorial primitives created from the cell’s tri-state capabilities and the 20 physical states represented in the Figure 5a. Five logical primitives are derived from the physical constants shown in Figure 5c. More complex functions are created by using cells in combination. A two-input AND feeding an XOR (Figure 6a) is produced using a single cell (Figure 6b). A two-to-one multiplexer selects the logical constant “0" and feeds it to the righthand AND gate. The AND gate acts as a feed-through, letting the B input pass through to the XOR. The three-toone multiplexer on the right side selects the local-bus input, LNS1, and passes it to the left-hand AND gate. The A and LNS1 signals are the inputs to the AND gate. The output of the AND gate feeds into the XOR, producing the logic state (A•L) XOR B. Figure 7. Column Clock and Column Reset GLOBAL CLOCK GLOBAL CLOCK "1" A D Q CELL EXPRESS BUS EXPRESS BUS D Q CELL D E D I C A T E D B U R I E D R O U T I N G CELL D Q EXPRESS BUS EXPRESS BUS CELL D Q A "1" GLOBAL RESET 2-8 GLOBAL RESET AT6000/LV Series Clock Distribution Along the top edge of the array is logic for distributing clock signals to the D flip-flop in each logic cell (Figure 7). The distribution network is organized by column and permits columns of cells to be independently clocked. At the head of each column is a user-configurable multiplexer providing the clock signal for that column. It has four inputs: • Global clock supplied through the CLOCK pin • Express bus adjacent to the distribution logic • “A” output of the cell at the head of the column • Logical constant “1" to conserve power (no clock) Through the global clock, the network provides low-skew distribution of an externally supplied clock to any or all of the columns of the array. The global clock pin is also connected directly to the array via the A input of the upper left and right corner cells (AW on the left, and AN on the right). The express bus is useful in distributing a secondary clock to multiple columns when the global clock line is used as a primary clock. The A output of a cell is useful in providing a clock signal to a single column. The constant “1" is used to reduce power dissipation in columns using no registers. Asynchronous Reset Along the bottom edge of the array is logic for asynchronously resetting the D flip-flops in the logic cells (Figure 7). Like the clock network, the asynchronous reset network is organized by column and permits columns to be independently reset. At the bottom of each column is a userconfigurable multiplexer providing the reset signal for that column. It has four inputs: • Global asynchronous reset supplied through the RESET pin • Express bus adjacent to the distribution logic • “A” output of the cell at the foot of the column • Logical constant “1"to conserve power The asynchronous reset logic uses these four inputs in the same way that the clock distribution logic does. Through the global asynchronous reset, any or all columns can be reset by an externally supplied signal. The global asynchronous reset pin is also connected directly to the array via the A input of the lower left and right corner cells (AS on the left, and AE on the right). The express bus can be used to distribute a secondary reset to multiple columns when the global reset line is used as a primary reset, the A output of a cell can also provide an asynchronous reset signal to a single column, and the constant “1" is used by columns with registers requiring no reset. All registers are reset during power-up. (continued) AT6000/LV Series Description (Continued) Input/Output The Atmel architecture provides a flexible interface between the logic array, the configuration control logic and the I/O pins. Two adjacent cells— an “exit” and an “entrance” cell— on the perimeter of the logic array are associated with each I/O pin. There are two types of I/Os: A-type (Figure 8a) and B-type (Figure 8b). For A-type I/Os, the edge-facing A output of an exit cell is connected to an output driver, and the edgefacing A input of the adjacent entrance cell is connected to an input buffer. The output of the output driver and the input of the input buffer are connected to a common pin. B-type I/Os are the same as A-type I/Os, but use the B inputs and outputs of their respective entrance and exit cells. A- and B-type I/Os alternate around the array. Control of the I/O logic is provided by user-configurable memory bits. TTL/CMOS Inputs A user-configurable bit determines the threshold level— TTL or CMOS— of the input buffer. Open Collector/Tri-state Outputs A user-configurable bit which enables or disables the active pull-up of the output device. Slew Rate Control A user-configurable bit controls the slew rate— fast or slow— of the output buffer. A slow slew rate, which reduces noise and ground bounce, is recommended for out- Figure 8a. A-Type I/O Logic puts that are not speed-critical. Fast and slow slew rates have the same DC-current sinking capabilities, but the rate at which each allows the output devices to reach full drive differs. Pull-up A user-configurable bit controls the pull-up transistor in the I/O pin. It’s primary function is to provide a logical “1" to unused input pins. When on, it is approximately equivalent to a 25K resistor to VCC. Enable Select User-configurable bits determine the output-enable for the output driver. The output driver can be static - - always on or always off - - or dynamically controlled by a signal generated in the array. Four options are available from the array: (1) the control is low and always driving; (2) the control is high and never driving; (3) the control is connected to a vertical local bus associated with the output cell; or (4) the control is connected to a horizontal local bus associated with the output cell. On power-up, the user I/Os are configured as inputs with pull-up resistors. In addition to the functionality provided by the I/O logic, the entrance and exit cells provide the ability to register both inputs and outputs. Also, these perimeter cells (unlike interior cells) are connected directly to express buses: the edge-facing A and B outputs of the entrance cell are connected to express buses, as are the edge-facing A and B inputs of the exit cell. These buses are perpendicular to the edge, and provide a rapid means of bringing I/O signals to and from the array interior and the opposite edge of the chip. Figure 8b. B-Type I/O Logic 2-9 Chip Configuration The Integrated Development System generates the SRAM bit pattern required to configure a AT6000 Series device. A PC parallel port, microprocessor, EPROM or serial configuration memory can be used to download configuration patterns. Users select from several configuration modes. Many factors, including board area, configuration speed and the number of designs implemented in parallel can influence the user’s final choice. Configuration is controlled by dedicated configuration pins and dual-function pins that double as I/O pins when the device is in operation. The number of dual-function pins required for each mode varies. The devices can be partially reconfigured while in operation. Portions of the device not being modified remain operational during reconfiguration. Simultaneous configuration of more than one device is also possible. Full configuration takes as little as a millisecond, partial configuration is even faster. Refer to the Pin Function Description section following for a brief summary of the pins used in configuration. For more information about configuration, refer to the AT6000 Series Configuration data sheet. Pin Function Description This section provides abbreviated descriptions of the various AT6000 Series pins. For more complete descriptions, refer to the AT6000 Series Configuration data sheet. Pinout tables for the AT6000 series of devices follow. Power Pins VCC, VDD, GND, VSS VCC and GND are the I/O supply pins, VDD and VSS are the internal logic supply pins. VCC and VDD should be tied to the same trace on the printed circuit board. GND and VSS should be tied to the same trace on the printed circuit board. Input/Output Pins All I/O pins can be used in the same way (refer to the I/O section of the architecture description). Some I/O pins are dual-function pins used during configuration of the array. When not being used for configuration, dual-function I/Os are fully functional as normal I/O pins. On initial power-up, all I/Os are configured as TTL inputs with a pull-up. Dedicated Timing and Control Pins CON Configuration-in-process pin. After power-up, CON staysLow until power-up initialization is complete, at which time 2-10 AT6000/LV Series CON is then released. CON is an open collector signal. After power-up initialization, forcing CON low begins the configuration process. CS Configuration enable pin. All configuration pins are ignored if CS is high. CS must be held low throughout the configuration process. CS is a TTL input pin. M0, M1, M2 Configuration mode pins are used to determine the configuration mode. All three are TTL input pins. CCLK Configuration clock pin. CCLK is a TTL input or a CMOS output depending on the mode of operation. In modes 1, 2, 3, and 6 it is an input. In modes 4 and 5 it is an output with a typical frequency of 1 MHz. In all modes, the rising edge of the CCLK signal is used to sample inputs and change outputs. CLOCK External logic source used to drive the internal global clock line. Registers toggle on the rising edge of CLOCK. The CLOCK signal is neither used nor affected by the configuration modes. It is always a TTL input. RESET Array register asynchronous reset. RESET drives the internal global reset. The RESET signal is neither used nor affected by the configuration modes. It is always a TTL input. Dual-Function Pins When CON is high, dual-function I/O pins act as device I/Os; when CON is low, dual-function pins are used as configuration control or data signals as determined by the configuration modes. Care must be taken when using these pins to ensure that configuration activity does not interfere with other circuitry connected to these pins in the application. D0 or I/O Serial configuration modes use D0 as the serial data input pin. Parallel configuration modes use D0 as the least-significant bit. Input data must meet setup and hold requirements with respect to the rising edge of CCLK. D0 is a TTL input during configuration. D1 to D7 or I/O Parallel configuration modes use these pins as inputs. Serial configuration modes do not use them. Data must meet setup and hold requirements with respect to the rising edge of CCLK. D1-D7 are TTL inputs during configuration. (continued) AT6000/LV Series Pin Function Description (Continued) A0 to A16 or I/O During configuration in modes 1, 2 and 5, these pins are CMOS outputs and act as the address pins for a parallel EPROM. A0-A16 eliminates the need for an external address counter when using an external parallel nonvolatile memory to configure the FPGA. Addresses change after the rising edge of the CCLK signal. CSOUT or I/O When cascading devices, CSOUT is an output used to enable other devices. CSOUT should be connected to the CS input of the downstream device. The CSOUT function is optional and can be disabled during initial programming when cascading is not used. When cascading devices, CSOUT should be dedicated to configuration and not used as a configurable I/O. to D0 (or D0-D7, in parallel mode) is compared with the current contents of the internal configuration RAM. If a mismatch is detected between the data being loaded and the data already in the RAM, the ERR pin goes low. The CHECK function is optional and can be disabled during initial programming. ERR or I/O During configuration, ERR is an output. When the CHECK function is activated and a mismatch is detected between the current configuration data stream and the data already loaded in the configuration RAM, ERR goes low. The ERR output is a registered signal. Once a mismatch is found, the signal is set and is only reset after the configuration cycle is restarted. ERR is also asserted for configuration file errors. The ERR function is optional and can be disabled during initial programming. CHECK or I/O During configuration, CHECK is a TTL input that can be used to enable the data check function at the beginning of a configuration cycle. No data is written to the device while CHECK is low. Instead, the configuration file being applied Device Pinout Selection (Max. Number of User I/O) AT6002 AT6003 AT6005 AT6010 84 PLCC 64 I/O 64 I/O 64 I/O — 100 VQFP 80 I/O 80 I/O 80 I/O — 132 PQFP 96 I/O 108 I/O 108 I/O 108 I/O 144 TQFP 96 I/O 120 I/O 108 I/O 120 I/O 208 PQFP — — — 172 I/O 240 PQFP — — — 204 I/O Bit-Stream Sizes Mode(s) Type (1, 2) 1 P 2 Beginning Sequence AT6002 AT6003 AT6005 AT6010 Preamble 2677 4153 8077 16393 P Preamble 2677 4153 8077 16393 3 S Null Byte/Preamble 2678 4154 8078 16394 4 S Null Byte/Preamble 2678 4154 8078 16394 5 P Preamble 2677 4153 8077 16393 6 P Preamble/Preamble 2678 4154 8078 16394 Notes: 1. P = Parallel. 2. S = Serial. 2-11 Pinout Assignment Left Side (Top to Bottom) AT6002 AT6003 AT6005 AT6010 84 100 132 144 PLCC VQFP PQFP TQFP 180 CPGA 208 240 PQFP PQFP — — — I/O51(A) — — — — B1 1 I/O24(A) or A7 I/O30(A) or A7 I/O27(A) or A7 I/O50(A) or A7 12 1 18 1 C1 2 1 2 — I/O29(B) — I/O49(A) — — — 2 D1 3 3 — — — I/O48(B) — — — — — — 4 — — — VCC — — — — PWR (1) 4 5 — — — I/O47(A) — — — — E1 5 6 — — — GND — — — — GND (2) 6 7 — I/O28(A) I/O26(A) I/O46(A) — — 19 3 G1 7 8 I/O23(A) or A6 I/O27(A) or A6 I/O25(A) or A6 I/O45(A) or A6 13 2 20 4 H1 8 9 — — — I/O44(B) — — — — — — 10 — — — I/O43(A) — — — — C2 9 11 I/O22(B) I/O26(A) I/O24(A) I/O42(A) — — 21 5 D2 10 12 I/O21(A) or A5 I/O25(A) or A5 I/O23(A) or A5 I/O41(A) or A5 14 3 22 6 E2 11 13 — — — I/O40(B) — — — — — — 14 — — — I/O39(A) — — — — F2 12 15 I/O20(B) I/O24(B) I/O22(A) I/O38(A) — 4 23 7 G2 13 16 I/O19(A) or A4 I/O23(A) or A4 I/O21(A) or A4 I/O37(A) or A4 15 5 24 8 H2 14 17 — — — I/O36(B) — — — — — — 18 I/O18(B) I/O22(B) I/O20(A) I/O35(A) — — 25 9 D3 15 19 I/O17(A) or A3 I/O21(A) or A3 I/O19(A) or A3 I/O34(A) or A3 16 6 26 10 E3 16 20 I/O16(B) I/O20(B) I/O18(A) I/O33(A) — 7 27 11 F3 17 21 — — — I/O32(B) — — — — — 18 22 I/O15(A) or A2 I/O19(A) or A2 I/O17(A) or A2 I/O31(A) or A2 17 8 28 12 G3 19 23 — I/O18(B) I/O16(A) I/O30(A) — — 29 13 H3 20 24 GND GND GND GND 18 9 30 14 GND (2) 21 25 VSS VSS VSS VSS 19 10 31 15 GND (2) 22 26 I/O14(A) or A1 I/O17(A) or A1 I/O15(A) or A1 I/O29(A) or A1 20 11 32 16 F4 23 27 — — — I/O28(B) — — — — — 24 28 — I/O16(B) — I/O27(A) — — — 17 G4 25 29 I/O13(A) or A0 I/O15(A) or A0 I/O14(A) or A0 I/O26(A) or A0 21 12 33 18 H4 26 30 I/O12(B) or D7 I/O14(A) or D7 I/O13(A) or D7 I/O25(A) or D7 22 13 34 19 H5 27 31 — — — I/O24(B) — — — — — 28 32 I/O11(A) or D6 I/O13(A) or D6 I/O12(A) or D6 I/O23(A) or D6 23 14 35 20 J4 29 33 I/O10(A) or D5 I/O12(A) or D5 I/O11(A) or D5 I/O22(A) or D5 24 15 36 21 K4 30 34 VDD VDD VDD VDD 25 16 37 22 PWR (1) 31 35 VCC VCC VCC VCC 26 17 38 23 PWR (1) 32 36 I/O9(B) I/O11(B) I/O10(A) I/O21(A) — — 39 24 J3 33 37 — — — I/O20(B) — — — — — 34 38 I/O8(A) or D4 I/O10(A) or D4 I/O9(A) or D4 I/O19(A) or D4 27 18 40 25 K3 35 39 I/O7(B) I/O9(B) I/O8(A) I/O18(A) — 19 41 26 L3 36 40 — — — I/O17(A) — — — — M3 37 41 — — — I/O16(B) — — — — — — 42 I/O6(A) or D3 I/O8(A) or D3 I/O7(A) or D3 I/O15(A) or D3 28 20 42 27 N3 38 43 — I/07(B) I/O6(A) I/014(A) — — 43 28 J2 39 44 — — — I/O13(A) — — — — K2 40 45 GND GND GND GND — — 44 29 GND (2) 41 46 — — — VSS — — — — GND (2) 42 47 — — — I/O12(B) — — — — — — 48 I/O5(A) or D2 I/O6(A) or D2 I/O5(A) or D2 I/O11(A) or D2 29 21 45 30 M2 43 49 I/O4(B) I/O5(B) I/O4(A) I/O10(A) — 22 46 31 N2 44 50 (continued) 2-12 AT6000/LV Series AT6000/LV Series Pinout Assignment (Continued) Left Side (Top to Bottom) (Continued) AT6002 AT6003 AT6005 AT6010 84 100 132 144 PLCC VQFP PQFP TQFP 180 CPGA 208 240 PQFP PQFP — — — I/O9(A) — — — — P2 45 51 — — — I/O8(B) — — — — — — 52 I/O3(A) or D1 I/O4(A) or D1 I/O3(A) or D1 I/O7(A) or D1 30 23 47 32 J1 46 53 I/O2(B) I/O3(A) I/O2(A) I/O6(A) — — 48 33 K1 47 54 — — — I/O5(A) — — — — L1 48 55 — — — I/O4(B) — — — — — — 56 — I/O2(B) — I/O3(A) — — — 34 M1 49 57 I/O1(A) or D0 I/O1(A) or D0 I/O1(A) or D0 I/O2(A) or D0 31 24 49 35 N1 50 58 — — — I/O1(A) — — — — P1 51 59 CCLK CCLK CCLK CCLK 32 25 50 36 R1 52 60 180 CPGA 208 240 PQFP PQFP Notes: 1. PWR = Pins connected to power plane = F1, E4/E5, L2, R4, K15, L12, E14, A12. 2. GND = Pins connected to ground plane = L4, M4, N9, N10, E12, D12, C7, C6. Bottom Side (Left to Right) AT6002 AT6003 AT6005 AT6010 84 100 132 144 PLCC VQFP PQFP TQFP CON CON CON CON 33 26 51 37 M5 53 61 — — — I/O204(A) — — — — M6 54 62 I/O96(A) I/O120(A) I/O108(A) I/O203(A) 34 27 52 38 M7 55 63 — I/O119(B) — I/O202(A) — — — 39 R2 56 64 — — — I/O201(B) — — — — — — 65 — — — VCC — — — — PWR (1) 57 66 — — — I/O200(A) — — — — R3 58 67 — — — GND — — — — GND (2) 59 68 — I/O118(A) I/O107(A) I/O199(A) — — 53 40 R5 60 69 I/O95(A) or CSOUT I/O117(A) or CSOUT I/O106(A) or CSOUT I/O198(A) or CSOUT 35 28 54 41 R6 61 70 — — — I/O197(B) — — — — — — 71 — — — I/O196(A) — — — — R7 62 72 I/O94(B) I/O116(A) I/O105(A) I/O195(A) — — 55 42 P3 63 73 I/O93(A) I/O115(A) I/O104(A) I/O194(A) 36 29 56 43 P4 64 74 — — — I/O193(B) — — — — — — 75 — — — I/O192(A) — — — — P5 65 76 I/O92(B) I/O114(B) I/O103(A) I/O191(A) — 30 57 44 P6 66 77 I/O91(A) or CHECK I/O113(A) or CHECK I/O102(A) or CHECK I/O190(A) or CHECK 37 31 58 45 P7 67 78 — — — I/O189(B) — — — — — — 79 I/O90(B) I/O112(B) I/O101(A) I/O188(A) — — 59 46 N4 68 80 I/O89(A) or ERR I/O111(A) or ERR I/O100(A) or ERR I/O187(A) or ERR 38 32 60 47 N5 69 81 I/O88(B) I/O110(B) I/O99(A) I/O186(A) — 33 61 48 N6 70 82 — — — I/O185(B) — — — — — 71 83 39 34 I/O87(A) I/O109(A) I/O98(A) I/O184(A) I/O108(B) I/O97(A) I/O183(A) 62 49 N7 72 84 63 50 M8 73 85 GND GND GND GND 40 35 64 51 GND (2) I/O86(A) I/O107(A) I/O96(A) I/O182(A) 74 86 41 36 65 52 M9 75 — — — 87 I/O181(B) — — — — — 76 88 — I/O106(B) I/O85(A) I/O105(A) — I/O180(A) — — — 53 M10 77 89 I/O95(A) I/O179(A) 42 37 66 54 M11 78 CS 90 CS CS CS 43 38 67 55 L8 79 91 I/O84(B) I/O104(A) I/O94(A) I/O178(A) 44 39 68 56 M12 80 92 (continued) 2-13 Pinout Assignment (Continued) Bottom Side (Left to Right) (Continued) AT6002 AT6003 AT6005 AT6010 84 100 132 144 PLCC VQFP PQFP TQFP 180 CPGA 208 240 PQFP PQFP — — — I/O177(B) — — — — — 81 I/O83(A) I/O103(A) I/O93(A) I/O176(A) 45 40 69 57 N8 82 93 94 — — — VDD — — — — PWR (1) 83 95 VCC VCC VCC VCC 46 41 70 58 PWR (1) 84 96 I/O82(A) I/O102(A) I/O92(A) I/O175(A) 47 42 71 59 N11 85 97 I/O81(B) I/O101(B) I/O91(A) I/O174(A) — — 72 60 N12 86 98 — — — I/O173(B) — — — — — 87 99 I/O80(A) I/O100(A) I/O90(A) I/O172(A) 48 43 73 61 N13 88 100 I/O79(B) I/O99(B) I/O89(A) I/O171(A) — 44 74 62 P8 89 101 — — — I/O170(A) — — — — P9 90 102 — — — I/O169(B) — — — — — — 103 I/O78(A) I/O98(A) I/O88(A) I/O168(A) 49 45 75 63 P10 91 104 — I/O97(B) I/O87(A) I/O167(A) — — 76 64 P11 92 105 — — — I/O166(A) — — — — P12 93 106 GND GND GND GND — — 77 65 GND (2) 94 107 — — — I/O165(B) — — — — — — 108 I/O77(A) I/O96(A) I/O86(A) I/O164(A) 50 46 78 66 P13 95 109 I/O76(B) I/O95(B) I/O85(A) I/O163(A) — 47 79 67 P14 96 110 — — — I/O162(A) — — — — R8 97 111 — — — I/O161(B) — — — — — — 112 I/O75(A) I/O94(A) I/O84(A) I/O160(A) 51 48 80 68 R9 98 113 I/O74(B) I/O93(A) I/O83(A) I/O159(A) — — 81 69 R10 99 114 — — — I/O158(A) — — — — R11 100 115 — — — I/O157(B) — — — — — — 116 — I/O92(B) — I/O156(A) — — — 70 R12 101 117 I/O73(A) I/O91(A) I/O82(A) I/O155(A) 52 49 82 71 R13 102 118 — — — I/O154(A) — — — — R14 103 119 RESET RESET RESET RESET 53 50 83 72 R15 104 120 84 100 132 144 PLCC VQFP PQFP TQFP 180 CPGA 208 240 PQFP PQFP Notes: 1. PWR = Pins connected to power plane = F1, E4/E5, L2, R4, K15, L12, E14, A12. 2. GND = Pins connected to ground plane = L4, M4, N9, N10, E12, D12, C7, C6. Right Side (Bottom to Top) AT6002 AT6003 AT6005 AT6010 — — — I/O153(A) — — — — P15 105 I/O72(A) I/O90(A) I/O81(A) I/O152(A) 54 51 84 73 N15 106 121 122 — I/O89(B) I/O80(A) I/O151(A) — — 85 (3) 74 M15 107 123 — — — I/O150(B) — — — — — — 124 — — — VCC — — — — PWR (1) 108 125 — — — I/O149(A) — — — — L15 109 126 — — — GND — — — — GND (2) 110 127 128 — I/O88(A) — I/O148(A) — — 85 (4) 75 J15 111 I/O71(A) I/O87(A) I/O79(A) I/O147(A) 55 52 86 76 H15 112 129 — — — I/O146(B) — — — — — — 130 — — — I/O145(A) — — — — N14 113 131 I/O70(B) I/O86(A) I/O78(A) I/O144(A) — — 87 77 M14 114 132 I/O69(A) I/O85(A) I/O77(A) I/O143(A) 56 53 88 78 L14 115 133 — — — I/O142(B) — — — — — — 134 (continued) 2-14 AT6000/LV Series AT6000/LV Series Pinout Assignment (Continued) Right Side (Bottom to Top) (Continued) AT6002 AT6003 AT6005 AT6010 84 100 132 144 PLCC VQFP PQFP TQFP 180 CPGA 208 240 PQFP PQFP — — — I/O141(A) — — — — K14 116 135 I/O68(B) I/O84(B) I/O76(A) I/O140(A) — 54 89 79 J14 117 136 I/O67(A) I/O83(A) I/O75(A) I/O139(A) 57 55 90 80 H14 118 137 — — — I/O138(B) — — — — — — 138 I/O66(B) I/O82(B) I/O74(A) I/O137(A) — — 91 81 M13 119 139 I/O65(A) I/O81(A) I/O73(A) I/O136(A) 58 56 92 82 L13 120 140 I/O64(B) I/O80(B) I/O72(A) I/O135(A) — 57 93 83 K13 121 141 — — — I/O134(B) — — — — — 122 142 I/O63(A) I/O79(A) I/O71(A) I/O133(A) 59 58 94 84 J13 123 143 — I/O78(B) I/O70(A) I/O132(A) — — 95 85 H13 124 144 GND GND GND GND 60 59 96 86 GND (2) 125 145 VSS VSS VSS VSS 61 60 97 87 GND (2) 126 146 I/O62(A) I/O77(A) I/O69(A) I/O131(A) 62 61 98 88 K12 127 147 — — — I/O130(B) — — — — — 128 148 — I/O76(B) — I/O129(A) — — — 89 J12 129 149 I/O61(A) I/O75(A) I/O68(A) I/O128(A) 63 62 99 90 H12 130 150 I/O60(B) I/O74(A) I/O67(A) I/O127(A) 64 63 100 91 H11 131 151 — — — I/O126(B) — — — — — 132 152 I/O59(A) I/O73(A) I/O66(A) I/O125(A) 65 64 101 92 G12 133 153 I/O58(A) I/O72(A) I/O65(A) I/O124(A) 66 65 102 93 F12 134 154 VDD VDD VDD VDD 67 66 103 94 PWR(1) 135 155 VCC VCC VCC VCC 68 67 104 95 PWR(1) 136 156 I/O57(B) I/O71(B) I/O64(A) I/O123(A) — — 105 96 G13 137 157 — — — I/O122(B) — — — — — 138 158 I/O56(A) I/O70(A) I/O63(A) I/O121(A) 69 68 106 97 F13 139 159 I/O55(B) I/O69(B) I/O62(A) I/O120(A) — 69 107 98 E13 140 160 — — — I/O119(A) — — — — D13 141 161 — — — I/O118(B) — — — — — 162 I/O54(A) I/O68(A) I/O61(A) I/O117(A) 70 70 108 99 C13 142 163 — I/O67(B) I/O60(A) I/O116(A) — — 109 100 G14 143 164 — — — I/O115(A) — — — — F14 144 165 GND GND GND GND — — 110 101 GND (2) 145 166 — — — VSS — — — — GND (2) 146 167 — — — I/O114(B) — — — — — — 168 I/O53(A) I/O66(A) I/O59(A) I/O113(A) 71 71 111 102 D14 147 169 I/O52(B) I/O65(B) I/O58(A) I/O112(A) — 72 112 103 C14 148 170 — — — I/O111(A) — — — — B14 149 171 — — — I/O110(B) — — — — — — 172 I/O51(A) I/O64(A) I/O57(A) I/O109(A) 72 73 113 104 G15 150 173 I/O50(B) I/O63(A) I/O56(A) I/O108(A) — — 114 105 F15 151 174 — — — I/O107(A) — — — — E15 152 175 — — — I/O106(B) — — — — — — 176 — I/O62(B) — I/O105(A) — — — 106 D15 153 177 I/O49(A) I/O61(A) I/O55(A) I/O104(A) 73 74 115 107 C15 154 178 — — — I/O103(A) — — — — B15 155 179 M2 M2 M2 M2 74 75 116 108 A15 156 180 Notes: 1. PWR = Pins connected to power plane = F1, E4/E5, L2, R4, K15, L12, E14, A12. 2. GND = Pins connected to ground plane = L4, M4, N9, N10, E12, D12, C7, C6. 3. 85 = Pin 85 on AT6005. 4. 85 = pin 85 on AT6003 and AT6010. 2-15 Pinout Assignment (Continued) Top Side (Right to Left) AT6002 AT6003 AT6005 AT6010 84 100 132 144 PLCC VQFP PQFP TQFP 180 CPGA 208 240 PQFP PQFP M1 M1 M1 M1 75 76 117 109 D11 157 181 — — — I/O102(A) — — — — D10 158 182 I/O48(A) I/O60(A) I/O54(A) I/O101(A) 76 77 118 110 D9 159 183 — I/O59(B) — I/O100(A) — — — 111 A14 160 184 — — — I/O99(B) — — — — — — 185 — — — VCC — — — — PWR (1) 161 186 — — — I/O98(A) — — — — A13 162 187 — — — GND — — — — GND (2) 163 188 — I/O58(A) I/O53(A) I/O97(A) — — 119 112 A11 164 189 I/O47(A) I/O57(A) I/O52(A) I/O96(A) 77 78 120 113 A10 165 190 — — — I/O95(B) — — — — — — 191 — — — I/O94(A) — — — — A9 166 192 I/O46(B) I/O56(A) I/O51(A) I/O93(A) — — 121 114 B13 167 193 I/O45(A) I/O55(A) I/O50(A) I/O92(A) 78 79 122 115 B12 168 194 — — — I/O91(B) — — — — — — 195 — — — I/O90(A) — — — — B11 169 196 I/O44(B) I/O54(B) I/O49(A) I/O89(A) — 80 123 116 B10 170 197 I/O43(A) I/O53(A) I/O48(A) I/O88(A) 79 81 124 117 B9 171 198 — — — I/O87(B) — — — — — — 199 I/O42(B) I/O52(B) I/O47(A) I/O86(A) — — 125 118 C12 172 200 I/O41(A) I/O51(A) I/O46(A) I/O85(A) 80 82 126 119 C11 173 201 I/O40(B) I/O50(B) I/O45(A) I/O84(A) — 83 127 120 C10 174 202 — — — I/O83(B) — — — — — 175 203 I/O39(A) I/O49(A) I/O44(A) I/O82(A) 81 84 128 121 C9 176 204 — I/O48(B) I/O43(A) I/O81(A) — — 129 122 D8 177 205 GND GND GND GND 82 85 130 123 GND (2) 178 206 I/O38(A) I/O47(A) I/O42(A) I/O80(A) 83 86 131 124 D7 179 207 — — — I/O79(B) — — — — — 180 208 — I/O46(B) — I/O78(A) — — — 125 D6 181 209 I/O37(A) or A16 I/O45(A) or A16 I/O41(A) or A16 I/O77(A) or A16 84 87 132 126 D5 182 210 CLOCK CLOCK CLOCK CLOCK 1 88 1 127 E8 183 211 I/O36(B) or A15 I/O44(A) or A15 I/O40(A) or A15 I/O76(A) or A15 2 89 2 128 D4 184 212 — — — I/O75(B) — — — — — 185 213 I/O35(A) or A14 I/O43(A) or A14 I/O39(A) or A14 I/O74(A) or A14 3 90 3 129 C8 186 214 — — — VDD — — — — PWR (1) 187 215 VCC VCC VCC VCC 4 91 4 130 PWR (1) 188 216 I/O34(A) or A13 I/O42(A) or A13 I/O38(A) or A13 I/O73(A) or A13 5 92 5 131 C5 189 217 I/O33(B) I/O41(B) I/O37(A) I/O72(A) — — 6 132 C4 190 218 — — — I/O71(B) — — — — — 191 219 I/O32(A) or A12 I/O40(A) or A12 I/O36(A) or A12 I/O70(A) or A12 6 93 7 133 C3 192 220 I/O31(B) I/O39(B) I/O35(A) I/O69(A) — 94 8 134 B8 193 221 — — — I/O68(A) — — — — B7 194 222 — — — I/O67(B) — — — — — — 223 I/O30(A) or A11 I/O38(A) or A11 I/O34(A) or A11 I/O66(A) or A11 7 95 9 135 B6 195 224 — I/O37(B) I/O33(A) I/O65(A) — — 10 136 B5 196 225 — — — I/O64(A) — — — — B4 197 226 GND GND GND GND — — 11 137 GND (2) 198 227 — — — I/O63(B) — — — — — — 228 I/O29(A) or A10 I/O36(A) or A10 I/O32(A) or A10 I/O62(A) or A10 8 96 12 138 B3 199 229 (continued) 2-16 AT6000/LV Series AT6000/LV Series Pinout Assignment (Continued) Top Side (Right to Left) (Continued) AT6002 AT6003 AT6005 AT6010 84 100 132 144 PLCC VQFP PQFP TQFP 180 CPGA 208 240 PQFP PQFP I/O28(B) I/O35(B) I/O31(A) I/O61(A) — 97 13 139 B2 200 230 — — — I/O60(A) — — — — A8 201 231 — — — I/O59(B) — — — — — — 232 I/O27(A) or A9 I/O34(A) or A9 I/O30(A) or A9 I/O58(A) or A9 9 98 14 140 A7 202 233 I/O26(B) I/O33(A) I/O29(A) I/O57(A) — — 15 141 A6 203 234 — — — I/O56(A) — — — — A5 204 235 — — — I/O55(B) — — — — — — 236 — I/O32(B) — I/O54(A) — — — 142 A4 205 237 I/O25(A) or A8 I/O31(A) or A8 I/O28(A) or A8 I/O53(A) or A8 10 99 16 143 A3 206 238 — — — I/O52(A) — — — — A2 207 239 M0 M0 M0 M0 11 100 17 144 A1 208 240 Notes: 1. PWR = Pins connected to power plane = F1, E4/E5, L2, R4, K15, L12, E14, A12. 2. GND = Pins connected to ground plane = L4, M4, N9, N10, E12, D12, C7, C6. 2-17 AC Timing Characteristics – 5V Operation Delays are based on fixed load. Loads for each type of device are described in the notes. Delays are in nanoseconds. Worst case: Vcc = 4.75V to 5.25V. Temperature = 0°C to 70°C. Load Definition Cell Function Parameter From To -1 -2 -4 Units Wire (4) tPD (max) (4) A, B, L A, B 1 0.8 1.2 1.8 ns NAND tPD (max) A, B, L B 1 1.6 2.2 3.2 ns XOR tPD (max) A, B, L A 1 1.8 2.4 4.0 ns AND tPD (max) A, B, L B 1 1.7 2.2 3.2 ns MUX tPD (max) A, B A 1 1.7 2.3 4.0 ns L A 1 2.1 3.0 4.9 ns tsetup (min) A, B, L CLK 1.5 2.0 3.0 ns thold (min) CLK A, B, L 0.0 0.0 0.0 ns D-Flip-Flop tPD (max) CLK A 1 1.5 2.0 3.0 ns Bus Driver tPD (max) A L 2 2.0 2.6 4.0 ns Repeater tPD (max) L, E E 3 1.3 1.6 2.3 ns L, E L 2 1.7 2.1 3.0 ns Column Clock tPD (max) GCLK, A, ES CLK 3 1.8 2.4 3.0 ns Column Reset 3 1.8 2.4 3.0 ns D-Flip-Flop (5) D-Flip-Flop (5) tPD (max) GRES, A, EN RES Clock Buffer (5) tPD (max) CLOCK PIN GCLK 1.6 2.0 2.9 ns Reset Buffer (5) 1.5 1.9 2.8 ns tPD (max) RESET PIN GRES (1) tPD (max) I/O A 3 1.0 1.2 1.5 ns Input (2) tPD (max) I/O A 3 1.3 1.4 2.3 ns tPD (max) A I/O PIN 4 3.3 3.5 6.0 ns tPD (max) A I/O PIN 4 7.5 8.0 12.0 ns TTL Input CMOS Fast Output (3) Slow Output Output Disable (5) tPXZ (max) L I/O PIN 4 3.1 3.3 5.5 ns (3, 5) tPZX (max) L I/O PIN 4 3.8 4.0 6.5 ns Enable (3, 5) tPZX (max) L I/O PIN 4 8.2 8.5 12.5 ns Fast Enable Slow (3) Device Cell Types Outputs Cell (6) Wire, XWire, Half-Adder, Flip-Flop A, B 4.5 µA/MHz Bus (6) Wire, XWire, Half-Adder, Flip-Flop, Repeater L 2.5 µA/MHz Column Clock (6) Column Clock Driver CLK 40 µA/MHz Notes: 1. TTL buffer delays are measured from a VIH of 1.5V at the pad to the internal V IH at A. The input buffer load is constant. 2. CMOS buffer delays are measured from a VIH of 1/2 VCC at the pad to the internal VIH at A. The input buffer load is constant. 3. Buffer delay is to a pad voltage of 1.5V with one output switching. 2-18 AT6000/LV Series 4. Max specifications are the average of max tPDLH and tPDHL. 5. Parameter based on characterization and simulation; not tested in production. 6. Exact power calculation is available in an Atmel application note. Icc (max) Load Definition: 1. Load of one A or B input 2. Load of one L input 3. Constant Load 4. Tester Load of 50 pF = Preliminary Information AT6000/LV Series AC Timing Characteristics – 3.3V Operation Delays are based on fixed load. Loads for each type of device are described in the notes. Delays are in nanoseconds. Worst case: Vcc = 3.0V to 3.6V. Temperature = 0°C to 70°C. Cell Function (4) Wire Parameter tPD (max) (4) From To Load Definition -4 Units A, B, L A, B 1 1.8 ns NAND tPD (max) A, B, L B 1 3.2 ns XOR tPD (max) A, B, L A 1 4.0 ns AND tPD (max) A, B, L B 1 3.2 ns MUX tPD (max) A, B A 1 4.0 ns L A 1 4.9 ns tsetup (min) A, B, L CLK 3.0 ns thold (min) CLK A, B, L 0.0 ns D-Flip-Flop tPD (max) CLK A 1 3.0 ns Bus Driver tPD (max) A L 2 4.0 ns Repeater tPD (max) L, E E 3 2.3 ns L, E L 2 3.0 ns Column Clock tPD (max) GCLK, A, ES CLK 3 3.0 ns Column Reset D-Flip-Flop (5) D-Flip-Flop (5) tPD (max) GRES, A, EN RES 3 3.0 ns Clock Buffer (5) tPD (max) CLOCK PIN GCLK 4 2.9 ns Reset Buffer (5) tPD (max) RESET PIN GRES 5 2.8 ns (1) tPD (max) I/O A 3 1.5 ns Input (2) tPD (max) I/O A 3 2.3 ns tPD (max) A I/O PIN 6 6.0 ns tPD (max) A I/O PIN 6 12.0 ns TTL Input CMOS Fast Output (3) Slow Output Output Disable (5) tPXZ (max) L I/O PIN 6 5.5 ns (3, 5) tPZX (max) L I/O PIN 6 6.5 ns Enable (3, 5) tPZX (max) L I/O PIN 6 12.5 ns Fast Enable Slow (3) Device Cell Types Outputs Cell (6) Wire, XWire, Half-Adder, Flip-Flop A, B 2.3 µA/MHz Bus (6) Wire, XWire, Half-Adder, Flip-Flop, Repeater L 1.3 µA/MHz Column Clock (6) Column Clock Driver CLK 20 µA/MHz Notes: 1. TTL buffer delays are measured from a VIH of 1.5V at the pad to the internal VIH at A. The input buffer load is constant. 2. CMOS buffer delays are measured from a VIH of 1/2 VCC at the pad to the internal VIH at A. The input buffer load is constant. 3. Buffer delay is to a pad voltage of 1.5V with one output switching. 4. Max specifications are the average of max tPDLH and tPDHL. 5. Parameter based on characterization and simulation; not tested in production. Icc (max) 6. Exact power calculation is available in an Atmel application note. Load Definition: 1. Load of one A or B input 2. Load of one L input 3. Constant Load 4. Load of 28 Clock Columns 5. Load of 28 Reset Columns 6. Tester Load of 50 pF 2-19 Absolute Maximum Ratings* Supply Voltage (VCC)......................... -0.5V to +7.0V DC Input Voltage (VIN)...............-0.5V to VCC + 0.5V DC Output Voltage (VON)...........-0.5V to VCC + 0.5V Storage Temperature Range (TSTG) ............................................ -65°C to +150°C *NOTICE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability. Power Dissipation (PD).............................. 1500 mW Lead Temperature (TL) (Soldering, 10 sec.)..........................................260°C ESD (RZAP=1.5K, CZAP=100 pF) .................... 2000V DC and AC Operating Range – 5V Operation Operating Temperature (Case) VCC Power Supply AT6002-2/4 AT6003-2/4 AT6005-2/4 AT6010-2/4 Commercial AT6002-2/4 AT6003-2/4 AT6005-2/4 AT6010-2/4 Industrial AT6002-4 AT6003-4 AT6005-4 AT6010-4 Military 0°C - 70°C -40°C - 85°C -55°C - 125°C 5V ± 5% 5V ± 10% 5V ± 10% Input Voltage Level (TTL) High (VIHT) 2.0V - VCC 2.0V - VCC 2.0V - VCC Low (VILT) 0V - 0.8V 0V - 0.8V 0V - 0.8V Input Voltage Level (CMOS) High (VIHC) 70% - 100% VCC 70% - 100% VCC 70% - 100% VCC Low (VILC) 0 - 30% VCC 0 - 30% VCC 0 - 30% VCC 50 ns (max) 50 ns (max) 50 ns (max) Input Signal Transition Time (TIN) DC and AC Operating Range – 3.3V Operation AT6002-4, AT6003-4 AT6005-4, AT6010-4 Commercial Operating Temperature (Case) 0°C - 70°C VCC Power Supply 3.3V ± 10% Input Voltage Level (TTL) High (VIHT) 2.0V - VCC Low (VILT) 0V - 0.8V Input Voltage Level (CMOS) High (VIHC) 70% - 100% VCC Low (VILC) 0 - 30% VCC Input Signal Transition Time (TIN) 2-20 AT6000/LV Series 50 ns (max) AT6000/LV Series DC Characteristics – 5V Operation Symbol Parameter Conditions Max Units 70% VCC VCC V 2.0 VCC V CMOS 0 30% VCC V TTL 0 0.8 V CMOS V IH High-Level Input Voltage V IL Low-Level Input Voltage V OH High-Level Output Voltage Commercial V OL Low-Level Output Voltage Commercial IOZH High-Level Tristate Output Leakage Current VO = VCC (max) Low-Level Tristate Without Pull-Up, VO = VSS -10 µA Output Leakage Current With Pull-Up, VO = V SS -500 µA IIH High-Level Input Current VIN = VCC (max) IIL Low-Level Input Current ICC Power Consumption Without Internal Oscillator (Standby) 500 µA CIN Input Capacitance All Pins 10 pF IOZL Commercial Min TTL Commercial IOH = -4 mA, VCC min 3.9 V IOH = -16 mA, VCC min 3.0 V IOL = 4 mA, VCC min 0.4 V IOL = 16 mA, VCC min 0.5 V 10 µA 10 µA Without Pull-Up, VIN = VSS -10 µA With Pull-Up, VIN = VSS -500 µA 2-21 DC Characteristics – 3.3V Operation Symbol Parameter V IH High-Level Input Voltage V IL Low-Level Input Voltage Conditions Commercial Min Max Units 70% VCC VCC V 2.0 VCC V CMOS 0 30% VCC V TTL 0 0.8 V CMOS TTL Commercial IOH = -2 mA, VCC min 2.4 V IOH = -6 mA, VCC min 2.0 V V OH High-Level Output Voltage Commercial V OL Low-Level Output Voltage Commercial IOZH High-Level Tristate Output Leakage Current VO = VCC (max) Low-Level Tristate Without Pull-Up, VO = VSS -10 µA Output Leakage Current With Pull-Up, VO = V SS -250 µA IIH High-Level Input Current VIN = VCC (max) IIL Low-Level Input Current ICC Power Consumption Without Internal Oscillator (Standby) 200 µA CIN (1) Input Capacitance All Pins 10 pF IOZL Note: 2-22 IOL = +2 mA, VCC min 0.4 V IOL = +6 mA, VCC min 0.5 V 10 µA 10 µA Without Pull-Up, VIN = VSS -10 µA With Pull-Up, VIN = VSS -250 µA 1. Parameter based on characterization and simulation; it is not tested in production. AT6000/LV Series AT6000/LV Series Device Timing: During Operation Ordering Information Usable Gates Grade (ns) 6,000 2 6,000 Speed 4 Ordering Code Package Operation Range AT6002-2AC AT6002A-2AC AT6002-2JC AT6002-2QC 100A 144A 84J 132Q 5V Commercial (0°C to 70°C) AT6002-2AI AT6002A-2AI AT6002-2JI AT6002-2QI 100A 144A 84J 132Q 5V Industrial (-40°C to 85°C) AT6002-4AC AT6002A-4AC AT6002-4JC AT6002-4QC 100A 144A 84J 132Q 5V Commercial (0°C to 70°C) AT6002LV-4AC AT6002ALV-4AC AT6002LV-4JC AT6002LV-4QC 100A 144A 84J 132Q 3.3V Commercial (0°C to 70°C) AT6002-4AI AT6002A-4AI AT6002-4JI AT6002-4QI 100A 144A 84J 132Q 5V Industrial (-40°C to 85°C) 2-23 Ordering Information Usable Gates Grade (ns) 9,000 2 9,000 4 Usable Gates Grade (ns) 15,000 2 15,000 2-24 Speed Speed 4 Ordering Code Package AT6003-2AC AT6003A-2AC AT6003-2JC AT6003-2QC 100A 144A 84J 132Q 5V Commercial (0°C to 70°C) AT6003-2AI AT6003A-2AI AT6003-2JI AT6003-2QI 100A 144A 84J 132Q Industrial (-40°C to 85°C) AT6003-4AC AT6003A-4AC AT6003-4JC AT6003-4QC 100A 144A 84J 132Q 5V Commercial (0°C to 70°C) AT6003LV-4AC AT6003ALV-4AC AT6003LV-4JC AT6003LV-4QC 100A 144A 84J 132Q 3.3V Commercial (0°C to 70°C) AT6003-4AI AT6003A-4AI AT6003-4JI AT6003-4QI 100A 144A 84J 132Q 5V Industrial (-40°C to 85°C) Ordering Code Package AT6005-2AC AT6005A-2AC AT6005-2JC AT6005-2QC AT6005A-2QC 100A 144A 84J 132Q 208Q 5V Commercial (0°C to 70°C) AT6005-2AI AT6005A-2AI AT6005-2JI AT6005-2QI AT6005A-2QI 100A 144A 84J 132Q 208Q Industrial (-40°C to 85°C) AT6005-4AC AT6005A-4AC AT6005-4JC AT6005-4QC AT6005A-4QC 100A 144A 84J 132Q 208Q 5V Commercial (0°C to 70°C) AT6005LV-4AC AT6005ALV-4AC AT6005LV-4JC AT6005LV-4QC AT6005ALV-4QC 100A 144A 84J 132Q 208Q 3.3V Commercial (0°C to 70°C) AT6000/LV Series Operation Range Operation Range AT6000/LV Series Ordering Information Usable Gates Grade (ns) 15,000 30,000 30,000 Speed Ordering Code Package 4 AT6005-4AI AT6005A-4AI AT6005-4JI AT6005-4QI AT6005A-4QI 100A 144A 84J 132Q 208Q 5V Industrial (-40°C to 85°C) 2 AT6010-2JC AT6010A-2AC AT6010-2QC AT6010A-2QC AT6010H-2QC 84J 144A 132Q 208Q 240Q 5V Commercial (0°C to 70°C) AT6010-2JI AT6010A-2AI AT6010-2QI AT6010-2QI AT6010-2QI 84J 144A 132Q 208Q 240Q Industrial (-40°C to 85°C) AT6010A-4AC AT6010-4QC AT6010-4JC AT6010A-4QC AT6010H-4QC 144A 132Q 84J 208Q 240Q 5V Commercial (0°C to 70°C) AT6010ALV-4AC AT6010LV-4QC AT6010LV-4JC AT6010ALV-4QC AT6010HLV-4QC 144A 132Q 84J 208Q 240Q 3.3V Commercial (0°C to 70°C) AT6010A-4AI AT6010-4QI AT6010-4JI AT6010A-4QI AT6010H-4QI 144A 132Q 84J 208Q 240Q 5V Industrial (-40°C to 85°C) 4 Operation Range Ordering Information Package Type 84J 84 Lead, Plastic J-Leaded Chip Carrier (PLCC) 100A 100 Lead, Very Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (VQFP) 132Q 132 Lead, Bumpered Plastic Gull Wing Quad Flat Package (BQFP) 144A 144 Lead, Thin (1.4 mm) Plastic Gull Wing Quad Flat Package (TQFP) 208Q 208 Lead, Plastic Gull-Wing Quad Flat Package (PQFP) 240Q 240 Lead, Plastic Gull-Wing Quad Flat Package (PQFP) 2-25