ETC 2SJ479(L)|2SJ479(S)

2SJ479(L), 2SJ479(S)
Silicon P Channel DV–L MOS FET
High Speed Power Switching
ADE-208-541 (Z)
1st. Edition
Sep. 1997
Features
• Low on-resistance
R DS(on) = 25 mΩ typ.
• 4V gate drive devices.
• High speed switching
Outline
LDPAK
4
D
1
1
G
S
4
2
3
2
3
1. Gate
2. Drain
3. Source
4. Drain
2SJ479(L), 2SJ479(S)
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Drain to source voltage
VDSS
–30
V
Gate to source voltage
VGSS
±20
V
Drain current
ID
–30
A
–120
A
–30
A
50
W
Drain peak current
I D(pulse)
Body to drain diode reverse drain current
I DR
Note1
Note2
Channel dissipation
Pch
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–55 to +150
°C
Notes: 1. PW ≤ 10µs, duty cycle ≤ 1 %
2. Value at Tc = 25°C
2
2SJ479(L), 2SJ479(S)
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Drain to source breakdown
voltage
V(BR)DSS
–30
—
—
V
I D = –10mA, VGS = 0
Gate to source breakdown
voltage
V(BR)GSS
±20
—
—
V
I G = ±100µA, VDS = 0
Zero gate voltege drain
current
I DSS
—
—
–10
µA
VDS = –30 V, VGS = 0
Gate to source leak current
I GSS
—
—
±10
µA
VGS = ±16V, VDS = 0
Gate to source cutoff voltage VGS(off)
–1.0
—
–2.0
V
I D = –1mA, VDS = –10V
Static drain to source on state RDS(on)
—
25
35
mΩ
I D = –15A, VGS = –10V Note3
resistance
RDS(on)
—
40
60
mΩ
I D = –15A, VGS = –4V Note3
Forward transfer admittance
|yfs|
12
20
—
S
I D = –15A, VDS = –10V Note3
Input capacitance
Ciss
—
1700
—
pF
VDS = –10V
Output capacitance
Coss
—
950
—
pF
VGS = 0
Reverse transfer capacitance Crss
—
260
—
pF
f = 1MHz
Turn-on delay time
t d(on)
—
20
—
ns
VGS = –10V, ID = –15A
Rise time
tr
—
290
—
ns
RL = 0.67Ω
Turn-off delay time
t d(off)
—
170
—
ns
Fall time
tf
—
130
—
ns
Body to drain diode forward
voltage
VDF
—
–1.1
—
V
I F = –30A, VGS = 0
Body to drain diode reverse
recovery time
t rr
—
70
—
ns
I F = –30A, VGS = 0
diF/ dt = 50A/µs
Note:
3. Pulse test
See characteristic curves of 2SJ471
3
2SJ479(L), 2SJ479(S)
Main Characteristics
Power vs. Temperature Derating
Maximun Safe Operation Area
–500
75
–10
–5
(1
sh
ot
)
)
°C
150
s
25
100
s
m
=
50
m
c
–1
0
1
10
Operation in
this area is
limited by R DS(on)
–2
–0.5
=
µs
–20
0
PW
(T
25
–50
10
50
10 µs
–100
n
tio
ra
pe
O
Drain Current I D (A)
–200
C
D
Channel Dissipation Pch (W)
100
Ta = 25 °C
–3
–0.1 –0.3
–1
–10 –30 –100
Drain to Source Voltage V DS (V)
200
Case Temperature Tc (°C)
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermao Impedance γ s (t)
3
Tc = 25°C
1
D=1
0.5
0.3
0.2
0.1
θ ch – c(t) = γ s (t) • θ ch – c
θ ch – c = 2.5 °C/W, Tc = 25 °C
0.1
0.05
0.03
0.01
10 µ
PDM
0.02
1
lse
0.0 t pu
ho
1s
100 µ
PW
T
PW
T
1m
10 m
Pulse Width PW (S)
4
D=
100 m
1
10
2SJ479(L), 2SJ479(S)
Switching Timen Test Circuit
Waveform
Vout
Monitor
Vin Monitor
Vin
10%
D.U.T.
RL
90%
Vin
10 V
50Ω
V DD
= –10 V
90%
90%
Vout
td(on)
10%
10%
tr
td(off)
tf
5
2SJ479(L), 2SJ479(S)
Package Dimensions
As of January, 2001
Unit: mm
2.54 ± 0.5
(1.4)
2.54 ± 0.5
11.3 ± 0.5
10.0
1.27 ± 0.2
0.2
0.86 +– 0.1
0.76 ± 0.1
11.0 ± 0.5
1.2 ± 0.2
4.44 ± 0.2
1.3 ± 0.15
+ 0.3
– 0.5
8.6 ± 0.3
10.2 ± 0.3
2.59 ± 0.2
0.4 ± 0.1
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
6
LDPAK (L)
—
—
1.4 g
2SJ479(L), 2SJ479(S)
As of January, 2001
Unit: mm
2.54 ± 0.5
0.2
0.86 +– 0.1
2.54 ± 0.5
0.3
3.0 +– 0.5
1.27 ± 0.2
1.2 ± 0.2
(1.5)
7.8
7.0
1.7
7.8
6.6
1.3 ± 0.15
0.3
10.0 +– 0.5
8.6 ± 0.3
(1.5)
(1.4)
4.44 ± 0.2
10.2 ± 0.3
0.2
0.1 +– 0.1
2.2
0.4 ± 0.1
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
LDPAK (S)-(1)
—
—
1.3 g
7
2SJ479(L), 2SJ479(S)
As of January, 2001
Unit: mm
(1.5)
7.8
7.0
1.7
7.8
6.6
1.3 ± 0.2
0.3
10.0 +– 0.5
8.6 ± 0.3
(1.5)
(1.4)
4.44 ± 0.2
10.2 ± 0.3
0.2
0.1 +– 0.1
2.2
1.2 ± 0.2
2.54 ± 0.5
0.2
0.86 +– 0.1
2.54 ± 0.5
0.3
5.0 +– 0.5
1.27 ± 0.2
0.4 ± 0.1
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
8
LDPAK (S)-(2)
—
—
1.35 g
2SJ479(L), 2SJ479(S)
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Colophon 2.0
9