Agilent HDSP-B0xE 18:88 and 88:88 0.56" Four Digit GaP HER Seven Segment Display Data Sheet Features • Excellent appearance • Evenly illuminated segments • Gray face for optimum on/off contrast • Choice of colors: HER • Choice of character size: 0.56 inch Description The 18:88 and 88:88 0.56" Four Digit Seven Segment Displays have surface painted in neutral gray for enhanced on/off contrast. All devices are available in either common anode or common cathode configuration with untinted segments. Package Dimensions 88:88 0.56" Four Digit Display FRONT SIDE RIGHT SIDE 2 – ∅1.70 (0.067) 7.80 (0.307) 10.00° PIN 12 + PIN 8 + 6.00 (0.236) 14.22 (0.560) + + PIN 1 PIN 7 15.24 (0.600) 19.10 (0.752) E A B G C D DIGIT 1 12.7 x 3 = 38.10 (1.500) 51.20 (2.016) BOTTOM SIDE 7.00 (0.276) 8.00 (0.315) 0.50 (0.020) 2.54 x 6 = 15.24 (0.600) NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm. 2 F 4.00 (0.157) F E A A B DP3 F G G BF C DP2 D DIGIT 2 E A CE D DIGIT 3 B G C D DIGIT 4 Package Dimensions 18:88 0.56" Four Digit Display FRONT SIDE RIGHT SIDE 2 – ∅1.70 (0.067) 7.80 (0.307) 10.00° PIN 12 + PIN 8 A + 6.00 (0.236) 14.22 (0.560) + + PIN 1 PIN 7 15.24 (0.600) 19.10 (0.752) DIGIT 1 51.20 (2.016) BOTTOM SIDE 7.00 (0.276) 8.00 (0.315) 0.50 (0.020) 4.00 (0.157) 2.54 x 6 = 15.24 (0.600) NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm. Pin Configuration Function 3 F E C DP2 D 12.7 x 3 = 38.10 (1.500) Pin 1 2 3 4 5 6 7 8 9 10 11 12 B C A B DP3 F G G BF HDSP-B01E/B03E Anode E Anode D Anode DP Anode C Anode G Digit 4 Common Cathode Anode B Digit 3 Common Cathode Digit 2 Common Cathode Anode F Anode A Digit 1 Common Cathode HDSP-B02E/B04E Cathode E Cathode D Cathode DP Cathode C Cathode G Digit 4 Common Anode Cathode B Digit 3 Common Anode Digit 2 Common Anode Cathode F Cathode A Digit 1 Common Anode DIGIT 2 E A D DIGIT 3 B G CE C D DIGIT 4 Internal Circuit Diagram HDSP-B01E (Common Cathode) DIGIT 1 12 B DIGIT 2 9 DIGIT 3 8 DIGIT 4 6 DIGIT 3 8 DIGIT 4 6 C A 11 B 7 C 4 D 2 E 1 F 10 G 5 DP 3 HDSP-B02E (Common Anode) DIGIT 1 12 B DIGIT 2 9 C A 11 4 B 7 C 4 D 2 E 1 F 10 G 5 DP 3 Internal Circuit Diagram HDSP-B03E (Common Cathode) DIGIT 1 12 DIGIT 2 9 A 11 B 7 C 4 D 2 E 1 F 10 G 5 DIGIT 3 8 DIGIT 4 6 DIGIT 3 8 DIGIT 4 6 DP 3 HDSP-B04E (Common Anode) DIGIT 1 12 DIGIT 2 9 A 11 5 B 7 C 4 D 2 E 1 F 10 G 5 DP 3 Devices HDSPB01E B02E B03E B04E Description 88:88 0.56" HER 4 Digit, Untinted, Common Cathode, Display 18:88, Gray Color Surface 88:88 0.56" HER 4 Digit, Untinted, Common Anode, Display 18:88, Gray Color Surface 88:88 0.56" HER 4 Digit, Untinted, Common Cathode, Display 88:88, Gray Color Surface 88:88 0.56" HER 4 Digit, Untinted, Common Anode, Display 88:88, Gray Color Surface Part Numbering System 5082 -X X X X-X X X X X HDSP-X X X X-X X X X X Mechanical Options[1] 00: No Mechanical Option Color Bin Options[1,2] 0: No Color Bin Limitation Maximum Intensity Bin[1,2] 0: No Maximum Intensity Bin Limitation Minimum Intensity Bin[1,2] 0: No Minimum Intensity Bin Limitation Device Configuration/Color[1] E: High Efficiency Red Device Specific Configuration[1] Refer to Respective Datasheet Package[1] Refer to Respective Datasheet Notes: 1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details. 2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1 bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information. 6 Absolute Maximum Ratings Description Average Power per Segment or DP Peak Forward Current per Segment or DP DC Forward Current per Segment or DP Operating Temperature Range Storage Temperature Range Reverse Voltage per Segment or DP Lead Solder Temperature for 3 seconds 1.59 mm below seating plane. HER 65 100 25 –40 to +105 –40 to +105 5 260 Units mW mA mA ˚C ˚C V ˚C Note: 1. Derate above 40˚C at 0.33 mA/˚C for HER. Electrical/Optical Characteristics at TA = 25˚C Device Series HDSPB01E B02E B03E B04E Parameter Luminous Intensity/Segment (Digit Average) Forward Voltage/Segment or DP Peak Wavelength Dominant Wavelength Luminous Intensity Matching Ratio Reverse Current Symbol IV Min. 3200 Typ. 5500 Max. Units µcd Test Conditions IF = 10 mA VF 2.05 2.60 V IF = 20 mA λPEAK λd IV-M 632 622 nm nm IF = 20 mA IF = 20 mA IF = 10 mA µA VR = 5 V 2:1 IR 100 Notes: 1. Typical specification for reference only. Do not exceed absolute maximum ratings. 2. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device. Intensity Bin Limits (Tolerance ± 10%) Rank L M 7 Symbol IV IV Condition IF = 10 mA IF = 10 mA Min. 3200 5050 Max. 5050 8000 Unit µcd µcd 25 HIGH EFFICIENCY RED (HER) 20 15 10 5 0 0 20 40 60 80 120 100 TA – AMBIENT TEMPERATURE – °C Figure 1. Maximum allowable average or DC current vs. ambient temperature. IF – FORWARD CURRENT PER SEGMENT – mA MAXIMUM DC CURRENT PER SEGMENT – mA 30 100 80 60 40 20 0.5 0 1.0 1.5 2.0 2.5 3.0 VF – FORWARD VOLTAGE – V 1.2 RELATIVE EFFICIENCY (NORMALIZED TO 1 AT 10 mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED TO 1 AT 10 mA) 0 Figure 2. Forward current vs. forward voltage. 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 Contrast Enhancement For information on contrast enhancement, please see Application Note 1015. 120 0 5 10 15 20 25 30 35 FORWARD CURRENT PER SEGMENT – mA Figure 3. Relative luminous intensity vs. DC forward current. www.semiconductor.agilent.com Data subject to change. Copyright © 2001 Agilent Technologies, Inc. August 21, 2001 5988-3569EN 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 35 40 45 50 PEAK FORWARD CURRENT PER SEGMENT – mA Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current. Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloroethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.