ETC HDSP-B01E

Agilent HDSP-B0xE
18:88 and 88:88 0.56" Four Digit GaP
HER Seven Segment Display
Data Sheet
Features
• Excellent appearance
• Evenly illuminated segments
• Gray face for optimum on/off
contrast
• Choice of colors: HER
• Choice of character size:
0.56 inch
Description
The 18:88 and 88:88 0.56" Four
Digit Seven Segment Displays
have surface painted in neutral
gray for enhanced on/off
contrast. All devices are available
in either common anode or
common cathode configuration
with untinted segments.
Package Dimensions
88:88 0.56" Four Digit Display
FRONT SIDE
RIGHT SIDE
2 – ∅1.70
(0.067)
7.80
(0.307)
10.00°
PIN 12
+
PIN 8
+
6.00
(0.236)
14.22
(0.560)
+
+
PIN 1
PIN 7
15.24
(0.600)
19.10
(0.752)
E
A
B
G
C
D
DIGIT 1
12.7 x 3 = 38.10
(1.500)
51.20
(2.016)
BOTTOM SIDE
7.00
(0.276)
8.00
(0.315)
0.50
(0.020)
2.54 x 6 = 15.24
(0.600)
NOTE:
ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm.
2
F
4.00
(0.157)
F
E
A
A
B DP3 F
G
G BF
C
DP2
D
DIGIT 2
E
A
CE
D
DIGIT 3
B
G
C
D
DIGIT 4
Package Dimensions
18:88 0.56" Four Digit Display
FRONT SIDE
RIGHT SIDE
2 – ∅1.70
(0.067)
7.80
(0.307)
10.00°
PIN 12
+
PIN 8
A
+
6.00
(0.236)
14.22
(0.560)
+
+
PIN 1
PIN 7
15.24
(0.600)
19.10
(0.752)
DIGIT 1
51.20
(2.016)
BOTTOM SIDE
7.00
(0.276)
8.00
(0.315)
0.50
(0.020)
4.00
(0.157)
2.54 x 6 = 15.24
(0.600)
NOTE:
ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm.
Pin Configuration
Function
3
F
E
C
DP2
D
12.7 x 3 = 38.10
(1.500)
Pin
1
2
3
4
5
6
7
8
9
10
11
12
B
C
A
B DP3 F
G
G BF
HDSP-B01E/B03E
Anode E
Anode D
Anode DP
Anode C
Anode G
Digit 4 Common Cathode
Anode B
Digit 3 Common Cathode
Digit 2 Common Cathode
Anode F
Anode A
Digit 1 Common Cathode
HDSP-B02E/B04E
Cathode E
Cathode D
Cathode DP
Cathode C
Cathode G
Digit 4 Common Anode
Cathode B
Digit 3 Common Anode
Digit 2 Common Anode
Cathode F
Cathode A
Digit 1 Common Anode
DIGIT 2
E
A
D
DIGIT 3
B
G
CE
C
D
DIGIT 4
Internal Circuit Diagram
HDSP-B01E (Common Cathode)
DIGIT 1
12
B
DIGIT 2
9
DIGIT 3
8
DIGIT 4
6
DIGIT 3
8
DIGIT 4
6
C
A
11
B
7
C
4
D
2
E
1
F
10
G
5
DP
3
HDSP-B02E (Common Anode)
DIGIT 1
12
B
DIGIT 2
9
C
A
11
4
B
7
C
4
D
2
E
1
F
10
G
5
DP
3
Internal Circuit Diagram
HDSP-B03E (Common Cathode)
DIGIT 1
12
DIGIT 2
9
A
11
B
7
C
4
D
2
E
1
F
10
G
5
DIGIT 3
8
DIGIT 4
6
DIGIT 3
8
DIGIT 4
6
DP
3
HDSP-B04E (Common Anode)
DIGIT 1
12
DIGIT 2
9
A
11
5
B
7
C
4
D
2
E
1
F
10
G
5
DP
3
Devices
HDSPB01E
B02E
B03E
B04E
Description
88:88 0.56" HER 4 Digit, Untinted, Common Cathode, Display 18:88, Gray Color Surface
88:88 0.56" HER 4 Digit, Untinted, Common Anode, Display 18:88, Gray Color Surface
88:88 0.56" HER 4 Digit, Untinted, Common Cathode, Display 88:88, Gray Color Surface
88:88 0.56" HER 4 Digit, Untinted, Common Anode, Display 88:88, Gray Color Surface
Part Numbering System
5082 -X X X X-X X X X X
HDSP-X X X X-X X X X X
Mechanical Options[1]
00: No Mechanical Option
Color Bin Options[1,2]
0: No Color Bin Limitation
Maximum Intensity Bin[1,2]
0: No Maximum Intensity Bin Limitation
Minimum Intensity Bin[1,2]
0: No Minimum Intensity Bin Limitation
Device Configuration/Color[1]
E: High Efficiency Red
Device Specific Configuration[1]
Refer to Respective Datasheet
Package[1]
Refer to Respective Datasheet
Notes:
1. For codes not listed in the figure above, please refer to the respective datasheet or contact
your nearest Agilent representative for details.
2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically
restricted to 1 bin per tube (exceptions may apply). Please refer to respective datasheet for
specific bin limit information.
6
Absolute Maximum Ratings
Description
Average Power per Segment or DP
Peak Forward Current per Segment or DP
DC Forward Current per Segment or DP
Operating Temperature Range
Storage Temperature Range
Reverse Voltage per Segment or DP
Lead Solder Temperature for 3 seconds 1.59 mm below seating plane.
HER
65
100
25
–40 to +105
–40 to +105
5
260
Units
mW
mA
mA
˚C
˚C
V
˚C
Note:
1. Derate above 40˚C at 0.33 mA/˚C for HER.
Electrical/Optical Characteristics at TA = 25˚C
Device Series
HDSPB01E
B02E
B03E
B04E
Parameter
Luminous Intensity/Segment
(Digit Average)
Forward Voltage/Segment
or DP
Peak Wavelength
Dominant Wavelength
Luminous Intensity
Matching Ratio
Reverse Current
Symbol
IV
Min.
3200
Typ.
5500
Max.
Units
µcd
Test Conditions
IF = 10 mA
VF
2.05
2.60
V
IF = 20 mA
λPEAK
λd
IV-M
632
622
nm
nm
IF = 20 mA
IF = 20 mA
IF = 10 mA
µA
VR = 5 V
2:1
IR
100
Notes:
1. Typical specification for reference only. Do not exceed absolute maximum ratings.
2. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.
Intensity Bin Limits (Tolerance ± 10%)
Rank
L
M
7
Symbol
IV
IV
Condition
IF = 10 mA
IF = 10 mA
Min.
3200
5050
Max.
5050
8000
Unit
µcd
µcd
25
HIGH EFFICIENCY RED (HER)
20
15
10
5
0
0
20
40
60
80
120
100
TA – AMBIENT TEMPERATURE – °C
Figure 1. Maximum allowable average or DC
current vs. ambient temperature.
IF – FORWARD CURRENT PER SEGMENT – mA
MAXIMUM DC CURRENT PER SEGMENT – mA
30
100
80
60
40
20
0.5
0
1.0
1.5
2.0
2.5
3.0
VF – FORWARD VOLTAGE – V
1.2
RELATIVE EFFICIENCY
(NORMALIZED TO 1 AT 10 mA)
RELATIVE LUMINOUS INTENSITY
(NORMALIZED TO 1 AT 10 mA)
0
Figure 2. Forward current vs. forward voltage.
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Contrast Enhancement
For information on contrast
enhancement, please see
Application Note 1015.
120
0
5
10
15
20
25
30
35
FORWARD CURRENT PER SEGMENT – mA
Figure 3. Relative luminous intensity vs. DC
forward current.
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2001 Agilent Technologies, Inc.
August 21, 2001
5988-3569EN
1.0
0.8
0.6
0.4
0.2
0
0
5
10 15 20 25 30 35 40 45 50
PEAK FORWARD CURRENT
PER SEGMENT – mA
Figure 4. Relative efficiency (luminous
intensity per unit current) vs. peak current.
Soldering/Cleaning
Cleaning agents from the ketone
family (acetone, methyl ethyl
ketone, etc.) and from the
chlorinated hydrocarbon family
(methylene chloride,
trichloroethylene, carbon
tetrachloride, etc.) are not
recommended for cleaning LED
parts. All these various solvents
attack or dissolve the
encapsulating epoxies used to
form the package of plastic LED
parts.