ETC HFA40HF120

PD-20376
HFA40HF120
HEXFRED
TM
Ultrafast, Soft Recovery Diode
Features
VR = 1200V
(ISOLATED BASE)
• Reduced RFI and EMI
• Reduced Snubbing
• Extensive Characterization of Recovery Parameters
• Hermetic
• Surface Mount
VF = 3.1V
Qrr = 510 nC
CATHODE
di(rec)M/dt = 350A/µs
ANODE
Description
TM
HEXFRED diodes are optimized to reduce losses and
EMI/RFI in high frequency power conditioning systems.
An extensive characterization of the recovery behavior
for different values of current, temperature and di/dt
simplifies the calculations of losses in the operating
conditions. The softness of the recovery eliminates the
need for a snubber in most applications. These devices
are ideally suited for power converters, motors drives and
other applications where switching losses are significant
portion of the total losses.
SMD -1
Absolute Maximum Ratings (per Leg)
Parameter
VR
IF @ TC = 100°C
IFSM @ TC = 25°C
PD @ TC = 25°C
TJ
TSTG
D.C. Reverse Voltage
Continuous Forward Current 
Single Pulse Forward Current ‚
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Max.
Units
1200
11
190
83
-55 to +150
V
A
W
°C
Thermal - Mechanical Characteristics
Parameter
RθJC
Junction-to-Case, Single Leg Conducting
Weight
Typ.
Max.
Units
—
2.6
1.5
—
°C/W
g
Note:  D.C. = 50% rect. wave
‚ 1/2 sine wave, 60 Hz , P.W. = 8.33 ms
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6/30/99
HFA40HF120
Electrical Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
Parameter
VBR
VFM
Min. Typ. Max. Units
Cathode Anode Breakdown Voltage
Max Forward Voltage
IRM
Max Reverse Leakage Current
CT
LS
Junction Capacitance
Series Inductance
1200
—
—
—
—
—
—
—
—
—
—
—
—
—
28
2.8
—
3.1
4.0
2.7
10
1.0
42
—
V
V
µA
mA
pF
nH
Test Conditions
IR = 100µA
IF = 11A
IF = 22A
See Fig. 1
IF = 11A, TJ = 125°C
VR = VR Rated
See Fig. 2
TJ = 125°C, VR = 960V
VR = 200V
See Fig. 3
Measured from center of bond pad to
end of anode bonding wire
Dynamic Recovery Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
Parameter
trr1
trr2
IRRM1
IRRM2
Q rr1
Q rr2
di(rec)M /dt1
di(rec)M /dt2
Min. Typ. Max. Units
Reverse Recovery Time
Peak Recovery Current
Reverse Recovery Charge
Peak Rate of Fall of Recovery Current
During tb
—
—
—
—
—
—
—
—
80
130
7.25
10.2
340
825
230
160
120
ns
195
10.9
A
15.3
510
nC
1240
350
A/µs
240
Test Conditions
TJ = 25°C See Fig.
TJ = 125°C
5
IF = 11A
TJ = 25°C See Fig.
TJ = 125°C
6
VR = 200V
TJ = 25°C See Fig.
TJ = 125°C
7
dif/dt = 200A/µs
T J = 25°C See Fig.
TJ = 125°C
8
Legend:
1 - Cathode
2 - N/C
3 - Anode
IR Case Style SMD-1
2
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HFA40HF120
R eve rse C urre nt - I R (µA )
10000
TJ = 150°C
TJ = 125°C
1000
TJ = 15 0 °C
100
TJ = 1 25 °C
10
1
0.1
T J = 2 5 °C
0.01
T J = -5 5°C
0.001
TJ = 25°C
0
10
300
600
900
1200
R e ve rse V o lta g e - V R (V )
Fig. 2 - Typical Reverse Current vs. Reverse
Voltage
Ju nction C a pa citan ce - C T (p F )
Instantaneous Forw ard Current - I F (A)
100
1000
1
0.0
2.0
4.0
6.0
8.0
10.0
Forward V oltage Drop - V FM (V )
Fig. 1 - Maximum Forward Voltage Drop
vs. Instantaneous Forward Current
A
TJ = 25°C
100
10
1
10
100
1000
R e verse V oltag e - V R (V )
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage
Thermal Response (Z thJC)
10
1
D = 0.50
0.20
0.10
0.1
0.01
0.00001
PDM
0.05
0.02
0.01
t1
t2
SINGLE PULSE
(THERMAL RESPONSE)
0.0001
Notes:
1. Duty factor D = t 1 / t 2
2. Peak TJ = P DM x Z thJC + TC
0.001
0.01
0.1
1
10
t1 , Rectangular Pulse Duration (sec)
Fig. 4 - Maximum Thermal Impedance Zthjc Characteristics
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HFA40HF120
250
100
I F = 22A
I F = 11A
200
I F = 5.5A
I F = 22 A
Irr- ( A)
150
trr - (n s )
IF = 1 1 A
I F = 5 .5 A
10
100
50
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
0
100
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
d i f /d t - (A /µ s)
1
100
1000
Fig. 5 - Typical Reverse Recovery vs. dif/dt,
di f /d t - (A /µs)
1000
Fig. 6 - Typical Recovery Current vs. dif/dt,
10000
10000
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
I F = 22 A
IF = 11A
d i(re c )M /d t - (A /µ s )
Q R R - (n C )
I F = 5 .5A
1000
1000
100
I F = 5.5A
I F = 11A
IF = 22A
VR = 2 0 0 V
TJ = 1 2 5 °C
TJ = 2 5 °C
100
100
d i f /d t - (A /µ s)
1000
Fig. 7 - Typical Stored Charge vs. dif/dt
4
10
100
1000
d i f /d t - (A /µ s)
Fig. 8 - Typical di(rec)M/dt vs. dif/dt
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HFA40HF120
3
t rr
IF
R E V E R S E R E C O V E R Y C IR C U IT
tb
ta
0
Q rr
VR = 200V
2
I RRM
4
0 .5 I R R M
d i(re c)M /d t
0.0 1 Ω
0 .7 5 I R R M
L = 7 0µ H
D .U .T .
d if/d t
ADJUST
D
G
5
IR F P 2 5 0
S
Fig. 9 - Reverse Recovery Parameter Test
Circuit
1
d i f /d t
1. dif/dt - Rate of change of current
through zero crossing
2. IRRM - Peak reverse recovery current
3. trr - Reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current
4. Qrr - Area under curve defined by trr
and IRRM
trr X IRRM
Qrr =
2
5. di(rec)M/dt - Peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and
Definitions
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http://www.irf.com/
Data and specifications subject to change without notice.
6/99
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