ETC PSMF05

05123
PSMF05
and
PSMF12
. . . engineered solutions for the transient environment™
SUBMINATURE TVS ARRAYS
APPLICATIONS
✔ Cellular Phones
✔ MP3 Players
✔ Notebooks & Handheld Devices
✔ Personal Digital Assistants (PDAs)
✔ Digital Cameras
IEC COMPATIBILITY (EN61000-4)
SC-70-5L
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ 100 Watts Peak Pulse Power per Line (tp=8/20µs)
✔ Low Clamping Voltage & Low Leakage Current
✔ Available in 2 Voltages: 5V & 12V
✔ Up to Four (4) Lines of Protection
MECHANICAL CHARACTERISTICS
✔ Molded JEDEC SC-70-5L
✔ Weight 0.14 grams (Approximate)
✔ Flammability Rating UL 94V-0
✔ 8mm Tape and Reel Per EIA Standard 481
✔ Device Marking: Marking Code
PIN CONFIGURATION
1
5
2
4
3
05123.R3 6/02
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PSMF05
and
PSMF12
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
UNITS
Peak Pulse Power (tp = 8/20µs) - See Figure 1
PPP
100
Watts
Operating Temperature
TJ
-55°C to 150°C
°C
Storage Temperature
TSTG
-55°C to 150°C
°C
Forward Voltage @ 1A, 8/20µs
VFP
1.5
Volts
PARAMETER
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
DEVICE
MARKING
CODE
05
12
PSMF05
PSMF12
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
(See Note 1)
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
VWM
VOLTS
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
5.0
12.0
6.0
13.3
9.5
15.0
MAXIMUM
LEAKAGE
CURRENT
MAXIMUM
CAPACITANCE
@8/20µs
VC @ IPP
@VWM
ID
µA
0V @ 1 MHz
C
pF
12.0V @ 9.0A
22.0V @ 5.0A
10
1
60
30
Note 1: Test between pins 1 to 2, 3 to 2, 4 to 2 and 5 to 2.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
IPP - Peak Pulse Current - % of IPP
PPP - Peak Pulse Current - Watts
10,000
1,000
100W, 8/20µs Waveform
100
10
0.01
05123.R3 6/02
FIGURE 2
PULSE WAVE FORM
120
tf
100
Peak Value IPP
80
e-t
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
60
40
td = t I /2
PP
20
0
1
10
100
td - Pulse Duration - µs
1,000
10,000
2
0
5
10
15
t - Time - µs
20
25
www.protekdevices.com
30
PSMF05
and
PSMF12
GRAPHS
FIGURE 3
POWER DERATING CURVE
100
35
Peak Pulse Power
8/20µs
5 Volts per Division
80
% Of Rated Power
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PSMF05
60
40
25
15
5
20
-5
Average Power
0
0
25
50
75
100
125
TL - Lead Temperature - °C
ESD Test Pulse: 5 kilovolt, 1/30ns (waveform)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT
20
VC - Clamping Voltage - Volts
150
16
PSMF05
12
8
4
0
0
4
8
12
IPP - Peak Pulse Current - Amps
16
20
FIGURE 6
TYPICAL REVERSE VOLTAGE VS CAPACITANCE
160
C - Capacitance - pF
120
80
40
PSMF05
0
0
05123.R3 6/02
1
2
3
4
VR - Reverse Voltage - Volts
3
5
6
www.protekdevices.com
PSMF05
and
PSMF12
APPLICATION NOTES
The PSMF Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD (> 25kv) or EFT. This product provides
unidirectional protection, with a surge capability of 200 Watts PPP per line for an 8/20µs waveform.
UNIDIRECTIONAL COMMON MODE CONFIGURATION (Figure 1)
The PSMF Series provides up to four (4) lines of protection in a common mode configuration as depicted in Figure 1.
Circuit connectivity is as follows:
I/O 1 is connected to Pin 1.
I/O 2 is connected to Pin 3.
I/O 3 is connected to Pin 4.
I/O 4 is connected to Pin 5.
Pin 2 is connected to ground.
I/O 4
I/O 3
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following guidelines
are recommended:
¨
The protection device should be placed near the
input terminals or connectors, the device will divert
the transient current immediately before it can be
coupled into the nearby traces.
¨
The path length between the TVS device and the
protected line should be minimized.
¨
All conductive loops including power and ground
loops should be minimized.
¨
The transient current return path to ground should
be kept as short as possible to reduce parasitic
inductance.
¨
Ground planes should be used whenever possible.
For multilayer PCBs, use ground vias.
05123.R3 6/02
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1
4
2
3
I/O INTEGRATED CIRCUIT
¨
¨
¨
¨
¨
I/O 2
I/O 1
Figure 1 - Unidirectional Configuration
Common-Mode I/O Port Protection
4
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PSMF05
and
PSMF12
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
SC 70-5L
D
E
5
4
0º - 8º
K
PACKAGE DIMENSIONS
J
2
1
3
DIM
L
J
V
B
M
F
A
G
C
MOUNTING PAD
4
1
2
3
4
5
6
7
0.50
1.30
0.65
2.40
0.60
0.70
2.50
Inches
0.020
0.051
0.026
0.094
0.024
0.028
0.098
1.90
1.15
0.80
0.15
0.65 BSC
1.30 BSC
0.80
0.08
1.90
0
0.26
2.15
1.35
1.00
0.30
1.10
0.25
2.15
0.10
0.46
INCHES
MIN
MAX
0.074
0.045
0.031
0.006
0.0255 BSC
0.0512 BSC
0.031
0.003
0.074
0
0.010
0.084
0.055
0.040
0.012
0.043
0.010
0.084
0.004
0.018
NOTES:
1. Dimensioning and tolerances per ANSI Y14.5M,
1985.
2. Controlling Dimension: Inches
3. Dimensions are exclusive of mold flash and metal
burrs.
TYPICAL
DIM Millimeters
A
B
C
D
E
F
G
J
K
L
M
MILLIMETERS
MIN
MAX
3
2
1
5
6
7
06005 Rev 0 - 11/01
PART NUMBER SUFFIXES USED FOR TAPE & REEL/BULK ORDERING:
Surface mount product is taped and reeled in accordance with EIA-481.
Suffix-T7 = 7 Inch Reel - 3,000 pieces per reel i.e.: PSMF05-T7
Suffix-T13 = 13 Inch Reel - 10,000 pieces per reel i.e: PSMF05-T13
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: [email protected]
Web Site: www.protekdevices.com
COPYRIGHT © ProTek Devices 2001
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
05123.R3 6/02
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