PIP250M Integrated buck converter Rev. 02 — 21 February 2003 Product data M3D797 1. Description The PIP250M is a fully integrated synchronous buck converter intended for use as a point-of-load regulator. It contains two N-channel power MOSFETs, a Schottky diode and a voltage mode, pulse width modulated (PWM) controller. The controller features include overcurrent and overvoltage protection and undervoltage lockout functions. By combining the power components and the controller into a single component, stray inductances are virtually eliminated, resulting in lower switching losses and a compact, efficient design with minimal external component count. 2. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ Output current up to 15 A Single supply 5 V operation Fixed 300 kHz operating frequency Voltage mode control Minimum regulated output voltage 0.8 V Internal soft start Overcurrent protection Overvoltage protection Remote sensing. ■ ■ ■ ■ ■ ■ ■ High-current point-of-load regulation Distributed power architectures Multiple output telecom power supplies Microprocessor and Digital Signal Processing (DSP) supplies Computer peripheral supplies Cable modems Set-top boxes. 3. Applications 4. Ordering information Table 1: Ordering information Type number PIP250M Package Name Description Version HVQFN68 plastic, thermal enhanced very thin quad flat package; no leads; SOT687-1 68 terminals; body 10 × 10 × 0.85 mm PIP250M Philips Semiconductors Integrated buck converter 5. Block diagram VDDC 61, 62 7 6.0 V REGULATOR 40 µA POWER ON RESET PIP250M CB 1, 2 5 OCSET/ ENABLE PHASE strobe 0.8 V REFERENCE 9, 12 to 17, 25, 26, PAD2 SOFT START 1V OVP UVP 0.5 V 0.8 V FB VSSC 35 dB 8, 60, 67 68, PAD1 10, 18 to 24, 27 to 41 59, PAD3 CONTROL LOGIC PWM 65 VDDO VO VDDC ERROR AMP 300 kHz OSCILLATOR 42 to 58 VSSO 03aj54 Fig 1. Block diagram © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 2 of 19 PIP250M Philips Semiconductors Integrated buck converter 6. Pinning information VO VSSO VSSO VSSO VSSO VSSO VSSO VSSO VDDC VDDC VSSC FB n.c. n.c. 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 VSSC VSSC n.c. 6.1 Pinning OCSET/ENABLE OCSET/ENABLE n.c. n.c. PHASE n.c. CB VSSC VDDO VO n.c. VSSC PAD 1 VO PAD 3 VDDO PAD 2 PIP250M 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 VSSO VSSO VSSO VSSO VSSO VSSO VSSO VSSO VSSO VSSO VO VO VO VO VO VO VO VO VO VO VO VO VO VO VO VDDO VDDO VO VO VO VO VO VO VO 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 VDDO VDDO VDDO VDDO VDDO VDDO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 03aj53 Grey area denotes terminal 1 index area. Fig 2. Pin configuration (footprint view). 6.2 Pin description Table 2: Symbol Pin description Pin [1] I/O Description - output stage supply voltage VDDO 9, 12 to 17, 25, 26, PAD2 VSSO 42 to 58 - output stage ground VDDC 61, 62 - control circuit supply voltage - control circuit ground O output VSSC 8, 60, 67, 68, PAD1 [1] VO 10, 18 to 24, 27 to 41, 59, PAD3 [1] CB 7 I/O bootstrap capacitor connection PHASE 5 I sense connection for current limit OCSET/ ENABLE 1, 2 I current limit set and enable input FB 65 I feedback input - no internal connection n.c. 3, 4, 6, 11, 63, 64, 66 [2] © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 3 of 19 PIP250M Philips Semiconductors Integrated buck converter [1] [2] PAD1, PAD2 and PAD3 are electrical connections and must be soldered to the printed circuit board All n.c. pins should be connected to VSSC. 7. Functional description 7.1 Pin functions 7.1.1 Output stage supply (VDDO, VSSO) The power output stage of the PIP250M consists of two N-channel, power MOSFETs and a Schottky diode configured as a synchronous buck converter. The drain of the upper MOSFET is connected to the positive conversion supply (VDDO), and the source of the lower MOSFET is connected to power ground (VSSO). The Schottky diode is connected between the source and drain of the lower MOSFET. 7.1.2 Output voltage (VO) VO is the switched node of the power MOSFET output stage. This node is connected internally to the source of the upper MOSFET and the drain of the lower MOSFET. 7.1.3 Control circuit supply (VDDC, VSSC) VDDC is the positive supply to the control circuit. VSSC is the control circuit ground. All control voltages are measured with respect to VSSC. 7.1.4 Bootstrap capacitor connection (CB) The upper MOSFET driver stage is powered from the CB pin. 7.1.5 Voltage feedback pin (FB) The FB pin is connected to the inverting input of the error amplifier, and to the inputs of the overvoltage and undervoltage comparators. 7.1.6 Current limit set and enable input (OCSET/ENABLE) The overcurrent threshold is set by an external resistor between VDDO and OCSET/ENABLE. The PIP250M can be shut down by pulling this pin LOW. 7.1.7 Sense connection for current limit (PHASE) The PHASE input is normally connected externally to the power output stage switched node (VO). The voltage on the PHASE input is compared with the voltage on the OCSET/ENABLE input during the interval when the upper MOSFET is on. The overcurrent trip operates if the voltage on the PHASE input is lower than the voltage on the OCSET/ENABLE input. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 4 of 19 PIP250M Philips Semiconductors Integrated buck converter 7.2 Operation 7.2.1 Single supply operation 10 Ω 5V D1 VDDC CB VDDO 100 nF VO 1 µF 100 µF PIP250M VSSC VSSO 03ak42 Fig 3. Single supply operation. Operation of the PIP250M from a single 5 V conversion supply is shown in Figure 3. The upper MOSFET gate driver stage is supplied from the CB pin. An external bootstrap circuit, comprising D1 and the 100 nF capacitor generates a voltage on CB of twice VDDO. The control circuit supply, VDDC is protected from transients by a low pass filter comprising a 10 Ω resistor and a 1 µF capacitor. These components should be placed close to the device pins. 7.2.2 Regulated output voltage The reference voltage of the PIP250M is 0.8 V. The regulated output voltage is set using a resistive divider as shown in Figure 9. The resistors should be placed as close as possible to the FB pin. Both resistors should be less than 1 kΩ in order to avoid noise coupling. The 68 nF capacitor across the upper resistor improves the control loop stability by adding a small amount of phase margin. 7.2.3 Power on reset The PIP250M control circuit powers up when the voltage on VDDC rises above the start-up threshold voltage (typically 4.1 V). The control circuit stops operating when the voltage on VDDC falls below the power-down threshold voltage (typically 3.6 V). Once the voltage on VDDC is above the start-up threshold voltage, the PIP250M does not produce pulses until the voltage on OCSET/ENABLE rises above the OCSET/ ENABLE start-up threshold voltage (typically 1.25 V). 7.2.4 Soft start The soft start sequence prevents surge currents being drawn from the conversion supply when the PIP250M is powered up into a high current load. The soft start sequence is controlled by an internal digital counter. During the soft start sequence, the reference voltage on the non inverting input of the error amplifier is increased from zero up to the normal operating level of 0.8 V. The duration of the soft start sequence is typically 2 ms. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 5 of 19 PIP250M Philips Semiconductors Integrated buck converter 7.2.5 Overcurrent protection 5V ROCSET 1 nF OCSET/ ENABLE VDDO PIP250M 40 µA OC PHASE VO strobe CONTROL LOGIC 03ak44 Fig 4. Overcurrent protection. The overcurrent protection function is shown in Figure 4. The overcurrent trip function is enabled when the upper MOSFET gate drive signal is HIGH. During this interval, the voltage on the PHASE input is compared with the voltage on the OCSET/ENABLE input. If the voltage on the PHASE input is lower than the voltage on the OCSET/ENABLE input, then the PIP250M detects an overcurrent trip condition and turns off the gate drive to the upper MOSFET. There is an internal filter with a time constant of 30 µs in series with the PHASE input. Since the switching frequency is 300 kHz, this means that the overcurrent trip operates if the overcurrent condition persists for10 switching cycles. If three overcurrent pulses are detected, the PIP250M latches off and produces no more pulses until it has been reset. To reset the PIP250M, the supply voltage (VDDC) must be reduced below the power down reset threshold and then increased back up to 5 V. An external resistor (ROCSET) sets the overcurrent trip level. Figure 5 shows the overcurrent trip level (ITRIP) as a function of ROCSET. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 6 of 19 PIP250M Philips Semiconductors Integrated buck converter 03ak48 30 ITRIP (A) 20 10 0 1 2 3 4 ROCSET (kΩ) Fig 5. Overcurrent trip level as a function of ROCSET. 7.2.6 Undervoltage and overvoltage protection With reference to Figure 1, the FB pin is connected internally to the overvoltage and undervoltage comparators, labelled OVP and UVP respectively. In normal operation, the voltage on FB is regulated at 0.8 V. If the voltage on FB exceeds the overvoltage protection (OVP) threshold (1 V) for longer than 30 µs, an overvoltage condition is detected, the gate drive signals to the MOSFETs are disabled, and the PIP250M latches off. To reset the latch, the PIP250M must be powered down by reducing VDDC below the power down reset threshold and then increasing VDDC back up to 5 V. If the voltage on FB drops below the undervoltage protection (UVP) threshold (0.5 V) for longer than 30 µs, then an undervoltage condition is detected and the gate drive signals to the MOSFET drivers are turned off. If three undervoltage pulses are detected then the PIP250M latches off. To reset the PIP250M, the supply voltage (VDDC) must be reduced below the power down reset threshold and then increased back up to 5 V. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 7 of 19 PIP250M Philips Semiconductors Integrated buck converter 8. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDDC Min Max Unit control circuit supply voltage −0.3 +7 V VDDO output stage supply voltage −0.3 +7 V VPHASE input voltage on PHASE −0.3 +7 V VOCSET input voltage on OCSET −0.3 +7 V VFB input voltage on FB −0.3 +7 V VO output voltage −0.3 +VDDO + 0.3 V VCB bootstrap voltage −0.3 +15 V IO(AV) average output current Tpcb ≤ 110 °C; Figure 6 - 15 A repetitive peak output current tp ≤ 10 µs; duty cycle ≤ 0.075 [1] - 200 A total power dissipation Tpcb = 25 °C [2] - 20 W Tpcb = 90 °C [2] IORM Ptot Conditions - 7 W Tj junction temperature −40 +125 °C Tstg storage temperature −55 +150 °C Vesd electrostatic discharge voltage - 2 kV - 200 V human body model; C = 100 pF; R = 1500 Ω [3] machine model; C = 200 pF; R = 10 Ω; L = 0.75 µH [1] [2] [3] Pulse width and repetition rate limited by maximum value of Tj. Assumes a thermal resistance from junction to printed-circuit board of 5 K/W The PIP250M meets class 2 for Human Body Model and class M3 for Machine Model. 03ak50 16 IO(AV) (A) 12 8 4 0 0 50 100 Tpcb (°C) 150 Circuit of Figure 9; VDDC = 5 V; VDDO = 5 V; VO = 2.5 V. Fig 6. Average output current as a function of printed-circuit board temperature. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 8 of 19 PIP250M Philips Semiconductors Integrated buck converter 9. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Rth(j-pcb) thermal resistance from junction to printed-circuit board Rth(j-a) thermal resistance from junction to ambient Rth(j-c) thermal resistance from junction to case Conditions Min Typ Max Unit - 4 5 K/W no thermal vias - 25 - K/W with thermal vias - 20 - K/W with thermal vias and forced air cooling; airflow = 0.8 ms-1 (150 LFM) - 15 - K/W - 11 - K/W Min Typ Max Unit device mounted on FR4 printed-circuit board; copper area around device 25 × 25 mm measured on upper surface of package. 10. Characteristics Table 5: Characteristics VDDC = 5 V; Tamb = 25 °C; circuit of Figure 9 unless otherwise specified. Symbol Parameter Conditions Control circuit supply VDDC control circuit supply voltage −40 °C ≤ Tj ≤ +125 °C - 5 - V IDDC control circuit supply current - 24 - mA Power dissipation Ptot power dissipation VDDC = 5 V; VDDO = 5 V; VO = 2.5 V; IO(AV) = 15 A; Figure 7 - 3.6 - W η efficiency VDDC = 5 V; VDDO = 5 V; VO = 2.5 V; IO(AV) = 15 A; Figure 8 - 88 - % Power-on Reset VDDC(th)su start-up threshold control circuit supply voltage VDDC increasing; VOCSET = 4.5 V 3.85 4.1 4.35 V VDDC(th)sd shut-down threshold control circuit supply voltage VDDC decreasing; VOCSET = 4.5 V 3.25 3.7 3.98 V Vhys hysteresis VOCSET(th)su start-up threshold voltage OCSET VOCSET = 4.5 V 0.3 0.5 0.7 V VOCSET increasing 0.8 1.25 2.0 V measured at FB pin 0.78 0.8 0.82 V Reference Vi(ref)FB reference voltage Oscillator fosc oscillator frequency 250 300 350 kHz Vosc(p-p) oscillator ramp amplitude (peak-to-peak value) - 1.75 - V © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 9 of 19 PIP250M Philips Semiconductors Integrated buck converter Table 5: Characteristics…continued VDDC = 5 V; Tamb = 25 °C; circuit of Figure 9 unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Error amplifier Gol open loop gain - 35 - dB GB Gain bandwidth product - 17 - MHz Overvoltage, overcurrent and undervoltage protection VFB(th)OV overvoltage threshold feedback voltage voltage on FB increasing 1.0 1.1 - V VFB(th)UV undervoltage threshold feedback voltage voltage on FB decreasing - 0.5 0.6 V IOCSET OCSET sink current VOCSET = 4.5 V 35 40 45 µA tD(OC) overcurrent trip delay - 30 - µs tD(UV) undervoltage trip delay - 30 - µs tSS soft start interval - 2 - ms 03ak51 4 03al76 100% η (%) Ptot (W) 95% (1) 3 (2) 90% (3) 2 85% (4) (5) 1 0 80% 75% 0 4 8 12 16 IO(AV) (A) See circuit of Figure 9. 2 5 7 10 12 15 IO(AV) (A) See circuit of Figure 9. VDDC = 5 V; VDDO = 5 V; VO = 2.5 V (1) VO = 3.3 V (2) VO = 2.5 V (3) VO = 1.8 V (4) VO = 1.5 V (5) VO = 1.2 V Fig 7. Total power dissipation as a function of average output current; typical values. Fig 8. Total solution efficiency as a function of average output current; typical values. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 10 of 19 PIP250M Philips Semiconductors Integrated buck converter 11. Application information conversion supply (5 V) 1.2 µH 10 Ω BAW62 100 nF 2.7 kΩ 1 µF 1.2 kΩ shut down VDDC CB VDDO PIP250M OCSET/ ENABLE VSSC 2000 µF 2.5 µH VO PHASE VSSO FB 2000 µF output voltage (2.5 V) VO 4.7 κΩ 6.8 nF BSH112 2.2 κΩ 03ak52 Fig 9. Typical application circuit. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 11 of 19 PIP250M Philips Semiconductors Integrated buck converter 12. Marking terminal 1 index area TYPE No. Design centre k = Hazel Grove, UK Release status code X = Development Sample Y = Customer Qualification Sampl blank = Released for Supply DIFFUSION LOT No. Diffusion centre = Hazel Grove, UK MANUFACTURING CODE hfkYYWWY COUNTRY OF ORIGIN Assembly centre f = Anam Korea Date code YY = last two digits of year WW = week number 03ag38 03ai72 TYPE No: PIP250M-NN (NN is version number) DIFFUSION LOT No: 7 characters MANUFACTURING CODE: see Figure 11 COUNTRY OF ORIGIN: Korea Fig 10. SOT687-1 marking. Fig 11. Interpretation of manufacturing code. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 12 of 19 PIP250M Philips Semiconductors Integrated buck converter 13. Package outline HVQFN68: plastic thermal enhanced very thin quad flat package; no leads; 68 terminals; body 10 x 10 x 0.85 mm SOT687-1 B D A D1 terminal 1 index area A E1 E A4 A1 c detail X C e1 e 18 34 L y y1 C v M C A B w M C b 35 17 Eh1 e Eh e2 Eh1 1 terminal 1 index area 51 68 52 Dh Dh 0 2.5 X 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A max. A1 A4 b 1 0.05 0.00 0.80 0.65 0.30 0.18 c 0.2 D D1 10.15 9.95 9.85 9.55 Dh E E1 Eh 3.8 3.5 10.15 9.85 9.95 9.55 7.85 7.55 Eh1 3.8 3.5 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT687-1 --- MO-220 --- e 0.5 e1 8 e2 L v w y y1 8 0.75 0.50 0.1 0.05 0.05 0.1 EUROPEAN PROJECTION ISSUE DATE 02-04-24 02-10-18 Fig 12. SOT687-1. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 13 of 19 PIP250M Philips Semiconductors Integrated buck converter 14. Soldering 14.1 Introduction to soldering HVQFN packages The HVQFN package is a near Chip Scale Package (CSP) with a copper lead frame. It is a leadless package, where electrical contact to the printed circuit board is made through metal pads on the underside of the package. In addition to the small pads around the periphery of the package, there are large pads on the underside that provide low thermal resistance, low electrical resistance, low inductance connections between the power components inside the package and the PCB. It is this feature of the HVQFN package that makes it ideally suited for low voltage, high current DC to DC converter applications. Electrical connection between the package and the printed circuit board is made by printing solder paste on the printed circuit board, placing the component and reflowing the solder in a convection or infra-red oven. The solder reflow process is shown in Figure 13 and the typical temperature profile is shown in Figure 14. To ensure good solder joints, the peak temperature Tp should not exceed 220° C, and the time above liquidus temperature should be less than 1.25 minutes. The ramp rate during preheat should not exceed 3 K/s. Nitrogen purge is recommended during reflow. SOLDER PASTE PRINTING 03aj26 300 POST PRINT INSPECTION Temp (°C) COMPONENT PLACEMENT Tp 200 Tr PRE REFLOW INSPECTION 1 min max REFLOW SOLDERING 100 rate of rise of temperature < 3 K/s POST REFLOW INSPECTION (PREFERABLY X-RAY) REWORK AND TOUCH UP 0 0 03aj25 Fig 13. Typical reflow soldering process flow. 1 2 time (minutes) 3 Fig 14. Typical reflow soldering temperature profile. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data 1.25 min max Te Rev. 02 — 21 February 2003 14 of 19 PIP250M Philips Semiconductors Integrated buck converter 14.2 Rework guidelines Since the solder joints are largely inaccessible, only the side fillets can be touched up. If there are defects underneath the package, then the whole package has to be removed. The first step in component removal is to reflow the solder joints. It is recommended that the board is heated from the underside using a convective heater whilst hot air or gas is directed at the upper surface of the component. Nozzles should be used to direct the hot air or gas to minimize heating of adjacent components. Excessive airflow should be avoided since this may cause the package to skew. An airflow of 15 to 20 liters per minute is usually adequate. Once the solder joints have reflowed, the component should be lifted off the board using a vacuum pen. The next step is to clean the solder pads using solder braid and a blade shaped soldering tool. Finally, the pads should be cleaned with a solvent. The solvent is usually specific to the type of solder paste used in the original assembly and the paste manufacturers recommendations should be followed. 15. Mounting 15.1 PCB design guidelines The terminals on the underside of the package are rectangular in shape with a rounded edge on the inside. Electrical connection between the package and the printed-circuit board is made by printing solder paste onto the PCB footprint followed by component placement and reflow soldering. The PCB footprint shown in Figure 15 is designed to form reliable solder joints. The use of solder resist between each solder land is recommended. PCB tracks should not be routed through the corner areas shown in Figure 15. This is because there is a small, exposed remnant of the lead frame in each corner of the package, left over from the cropping process. Good surface flatness of the PCB lands is desirable to ensure accuracy of placement after soldering. Printed-circuit boards that are finished with a roller tin process tend to leave small lumps of tin in the corners of each land. Levelling with a hot air knife improves flatness. Alternatively, an electro-less silver or silver immersion process produces completely flat PCB lands. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 15 of 19 PIP250M Philips Semiconductors Integrated buck converter 1 SP (8×) 0.4 SP 0.6 Cu 0.4 SP 0.28 Cu (68×) 1 SP (8×) 11.15 OA 7.6 Cu 4.1 (2×) (2×) 8.9 Cu 10.8 Cu (2×) (2×) 0.6 Cu 0.5 SP (4×) 0.4 SP (2×) 0.9 SP (10×) e = 0.5 4.1 1 SP (10×) 8.63 OA (4×) solder lands MGW820 0.1 Cu pattern 0.2 clearance 0.025 solder paste occupied area Fig 15. PCB footprint for SOT687-1 package (reflow soldering). 15.2 Solder paste printing The process of printing the solder paste requires care because of the fine pitch and small size of the solder lands. A stencil thickness of 0.125 mm is recommended. The stencil apertures can be made the same size as the PCB lands in Figure 15. The type of solder paste recommended for HVQFN packages is “No clean”, Type 3, due to the difficulty of cleaning flux residues from beneath the package. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 16 of 19 PIP250M Philips Semiconductors Integrated buck converter 16. Revision history Table 6: Revision history Rev Date 02 20030221 CPCN Description - Product data (9397 750 10904) Modifications: • • Table 2: Pin description OCSET changed to OCSET/ENABLE Section 7: – Dual supply operation deleted – Regulated output voltage section added – Overcurrent protection description clarified – Figure 5 revised • Table 5: – Typical value of IDDC changed from 20 mA to 24 mA – Efficiency added • 01 20021018 - Figure 8 added. Objective data (9397 750 10579) © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Product data Rev. 02 — 21 February 2003 17 of 19 PIP250M Philips Semiconductors Integrated buck converter 17. Data sheet status Level Data sheet status[1] Product status[2][3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 18. Definitions 19. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: [email protected]. Product data Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 10904 Rev. 02 — 21 February 2003 18 of 19 Philips Semiconductors PIP250M Integrated buck converter Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.1.2 7.1.3 7.1.4 7.1.5 7.1.6 7.1.7 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.6 8 9 10 11 12 13 14 14.1 14.2 15 15.1 15.2 16 17 18 19 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Output stage supply (VDDO, VSSO) . . . . . . . . . . 4 Output voltage (VO) . . . . . . . . . . . . . . . . . . . . . 4 Control circuit supply (VDDC, VSSC) . . . . . . . . . . 4 Bootstrap capacitor connection (CB) . . . . . . . . 4 Voltage feedback pin (FB). . . . . . . . . . . . . . . . . 4 Current limit set and enable input (OCSET/ENABLE) . . . . . . . . . . . . . . . . . 4 Sense connection for current limit (PHASE) . . . 4 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Single supply operation . . . . . . . . . . . . . . . . . . 5 Regulated output voltage . . . . . . . . . . . . . . . . . 5 Power on reset . . . . . . . . . . . . . . . . . . . . . . . . . 5 Soft start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Overcurrent protection . . . . . . . . . . . . . . . . . . . 6 Undervoltage and overvoltage protection . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 9 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application information. . . . . . . . . . . . . . . . . . 11 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Introduction to soldering HVQFN packages . . 14 Rework guidelines . . . . . . . . . . . . . . . . . . . . . 15 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 PCB design guidelines . . . . . . . . . . . . . . . . . . 15 Solder paste printing. . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 © Koninklijke Philips Electronics N.V. 2003. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 21 February 2003 Document order number: 9397 750 10904