www.fairchildsemi.com RC5534/RC5534A High Performance Low Noise Operational Amplifier Features • • • • Small signal bandwidth – 10 MHz Output drive capability – 600W, 10 VRMS at VS = ±18V Input noise voltage – 4 nV/ÖHz DC voltage gain – 100,000 Description • • • • AC voltage gain – 6000 at 10 kHz Power bandwidth – 200 kHz Slew rate – 13 V/mS Large supply voltage range – ±3V to ±20V Block Diagram The RC5534 is a high performance, low noise operational amplifier. This amplifier features popular pin-out, superior noise performance, and high output drive capability. This amplifier also features guaranteed noise performance with substantially higher gain-bandwidth product, power bandwidth, and slew rate which far exceeds that of the 741 type amplifiers. The RC5534 is internally compensated for a gain of three or higher and may be externally compensated for optimizing specific performance requirements of various applications such as unity-gain voltage followers, drivers for capacitive loads or fast settling. –Input – +Input + Output 65-3476-01 The specially designed low noise input transistors allow the RC5534 to be used in very low noise signal processing applications such as audio preamplifiers and servo error amplifiers. Pin Assignments VOS Trim/Comp 8 VOS Trim –Input +Input 1 +VS 7 6 2 Output VOS Trim 1 8 VOS Trim/Comp –Input 2 7 +VS +Input 3 6 Output –VS 4 5 Comp 5 3 4 –VS Comp 65-3476-02 65-3476-03 Rev. 1.0.0 PRODUCT SPECIFICATION RC5534/RC5534A Absolute Maximum Ratings (beyond which the device may be damaged)1 Parameter Max Units Supply Voltage Min ±22 V Input Voltage ±VS V Differential Input Voltage 0.5 V PDIP 468 mW CerDIP 833 SOIC 658 PDIP 125 CerDIP, TO-99 175 PDTA < 50°C Junction Temperature °C -65 150 °C RM5534/A -55 125 °C RC5534/A 0 70 Storage Temperature Operating Temperature Typ Lead Soldering Temperature (60 sec) °C 300 2 Indefinite Output Short Circuit Duration Notes: 1. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only if Operating Conditions are not exceeded. 2. Short circuit may be to ground only. Rating applies to +125°C case temperature or +175°C junction temperature. Operating Conditions Parameter qJC qJA Thermal resistance Thermal resistance For TA > 50°C Derate at Min Typ CerDIP 45 TO-99 50 PDIP 160 CerDIP 150 TO-99 190 PDIP 6.25 CerDIP 8.33 TO-99 5.26 Max Units °C/W °C/W mW/°C Operating Conditions (RM = -55°C £ TA £ +125°C; RC = 0°C £ TA £ + 70°C, VS = ±15V) 2 Parameter Test Conditions Input Offset Voltage RS £ 1 kW RM5534/A RC5534/A 3.0 Units 5.0 mV Input Offset Current 500 400 nA Input Bias Current 1500 2000 nA Large Signal Voltage Gain RL ³ 600W, VOUT = ±10V 25 15 V/mV Output Voltage Swing RL ³ 600W ±10 ±10 V Supply Current VS = ±15V, RL = ¥ 9.0 14 mA RC5534/RC5534A PRODUCT SPECIFICATION DC Electrical Characteristics (VS = ±15V and TA = +25˚C unless otherwise noted) RM5534/A Parameters Typ Max 0.5 Input Offset Current Input Bias Current Input Offset Voltage Test Conditions Min RS £ 1kW RC5534/A Min Typ Max Units 2.0 0.5 4.0 mV 10 200 20 300 nA 400 800 500 1500 nA 100 kW Large Signal Voltage Gain RL ³ 600W, VOUT = ±10V 50 100 25 100 V/mV Output Voltage Swing RL ³ 600W ±12 ±13 ±12 ±13 V ±12 ±13 ±12 ±13 V RS £ 1kW 80 100 70 100 dB 86 100 86 100 Input Resistance (Diff. Mode) 100 Input Voltage Range Common Mode Rejection Ratio Power Supply Rejection Ratio RS £ 1kW Supply Current RL = ¥ 4.0 Transient Response Rise Time VIN = 50 mV, RL = 600W, CL = 100 pF, CC = 22 pF 35 35 nS 17 17 % Overshoot 6.5 4.0 dB 8.0 mA Slew Rate CC = 0 13 13 V/mS Gain Bandwidth Product CC = 22 pF, CL = 100 pF 10 10 MHz Power Bandwidth VOUT = 20Vp-p, CC = 0 200 200 kHz Input Noise Voltage F = 20 Hz to 20 kHz 1.0 1.0 mVRMS Input Noise Current F = 20 Hz to 20 kHz 25 25 pARMS Channel Separation F = 1 kHz, RS = 5 kW 110 110 dB RC/RM5534A RC/RM5534 Units nV/ ÖHz AC Electrical Characteristics (VS = ±15V and TA = +25˚C unless otherwise noted) Parameters Test Conditions Input Noise Voltage Density FO = 30 Hz 5.5 7.0 7.0 FO = 1 kHz 3.5 4.5 4.0 Input Noise Current Density Broadband Noise Figure FO = 30 Hz 1.5 2.5 FO = 1 kHz 0.4 0.6 F = 10 Hz - 20 kHz, RS = 5 kW 0.9 pA/ ÖHz dB 3 PRODUCT SPECIFICATION RC5534/RC5534A Typical Performance Characteristics 14 0.7 VS = 15V 10 SR (V/ m S) 0.4 0.3 8 6 4 65-1758 0.2 0.1 0 +10 +20 +30 +40 +50 +60 2 65-1759 IB ( m A) 0.5 0 VS = 15V TA = +25 C 12 0.6 0 +70 1 0 10 100 CC (pF) TA (¡C) Figure 1. Input Bias Current vs. Temperature Figure 2. Slew Rate vs. Compensation Capacitor 15 100 AVOL (dB) 5 VCM (V) 80 VS = 15V TA = +25 C 60 C C = 0 pF TA = +25 C 10 0 -5 CC = 22 pF 40 65-1760 -15 ±4 ±6 ±8 ±10 ±12 ±14 ±16 65-1761 20 -10 0 ±18 0 100 1K +VS/-VS (V) 10K 100K 1M 10M 100M F (Hz) Figure 3. Common Mode Input Range vs. Supply Voltage Figure 4. Open Loop Gain vs. Frequency 15 VOUT P-P (V) RL = 2 k W 100 50 0 0 +10 +20 +30 +40 +50 +60 TA (¡C) Figure 5. Open Loop Gain vs. Temperature 4 10 15V 65-1762 AVOL (V/mV) VS = +70 TA = +25 C 5 0 -5 -10 -15 ±4 RL = 2 k W ±6 65-1763 150 ±8 ±10 ±12 ±14 ±16 ±18 +VS/-VS (V) Figure 6. Output Voltage Swing vs. Supply Voltage RC5534/RC5534A PRODUCT SPECIFICATION Typical Performance Characteristics (continued) 30 42 26 36 30 14 18 12 6 6 65-1764 10 2 10 100 1K CC = 0 pF 24 CC = 27 pF CC = 47 pF 0 100 10K 1K 10K Figure 7. Output Voltage Swing vs. Load Resistance Figure 8. Output Voltage Swing vs. Frequency 70 5 CL = 500 pF CC = 47 pF C L = 100 pF CC = 22 pF 60 4 50 VOUT (mV) TA = +25 C 3 2 90% 40 30 VS = 15V T A = +25 C R L = 600 W A V = +1 20 10 65-1766 1 0 ±3 0 ±6 ±9 ±12 ±15 100% 0 ±18 0 +VS/-VS (V) 100 150 200 Figure 10. Transient Response Output Voltage vs. Time 1000 Output en (nV/ Hz) VS = 15V TA = +25 C C C = 0 pF Input VS = 15V TA = +25 C RS = 50 W A V = 60 dB 100 10 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Time (µS) Figure 11. Follower Large Signal Pulse Response Output Voltage vs. Time 1 65-1769 65-1768 VOUT (V) 50 Time (nS) Figure 9. Quiescent Current vs. Supply Voltage 10 8 6 4 2 0 -2 -4 -6 -8 -10 1M F (Hz) RL ( W) IQ (mA) 100K 65-1767 18 65-1765 VS = ±15V F = 1 kHz T.H.D. < 1% A V = +10 VOUT P-P (V) VOUT P-P (V) 22 VS = 15V TA = +25 C RL = 2 kW 0 10 100 1K 10K 100K F (Hz) Figure 12. Input Noise Density vs. Frequency 5 PRODUCT SPECIFICATION RC5534/RC5534A Typical Performance Characteristics (continued) AVGL (dB) 10 40 1 0.1 20 C C = 0, R F = 9 k W; R E = 1 kW 0 0 10 100 1K 10K CC = 0, R F = 10 k W; R E = 100W CC = 22 pF, R F = 1 k W; R E = ¥ 65-1771 VS = ±15V TA = +25¡C RS = 100 kW A V = 60 dB 65-1770 IN (pA/ Hz) 100 -20 10K 100K 100K 1M 10M 100M F (Hz) F (Hz) Figure 13. Input Noise Current Density vs. Frequency Figure 14. Closed Loop Gain vs. Frequency 0.07 VS = 15V 20 Hz < F < 20 kHz R L = 600 W C L = 100 pF A V = +10 or -10 0.06 THD(%) 0.05 0.04 0.03 0.02 65-1773 0.01 0 0.1 1 10 VOUT (VRMS ) Figure 15. Total Harmonic Distortion vs. Output Voltage Typical Test Circuits +VS 22K VOS Trim 100K CC 8 1 3 RS 200½ 5 5534 6 2 VIN RF RE –VIN VOUT 8 VOS Trim/ Comp 2 Comp 5 7 RL 600½ 5534 +VIN CL 100 pF CC 3 VOUT 6 4 65-1774 65-1772 –VS Figure 16. Closed Loop Frequency Response Test Circuit 6 Figure 17. Offset Voltage Trim Circuit RC5534/RC5534A PRODUCT SPECIFICATION Simplified Schematic Diagram Compensation (5) VOS Trim/ Compensation VOS Trim (1) +VS (7) C1 100 pF R1 13.3K R2 13.3K R10 5.9K R9 5.9K Q10 R16 570 +Input (3) Q3 D2 -Input (2) D1 Q1 C2 32 pF R17 150 Q4 Q13 D4 Q2 Q11 R18 14 Q14 C3 12 pF R15 4K C4 7 pF R19 14 Q7 R3 3.7K Output (6) Q12 D5 Q8 Q19 Q22 Q18 Q5 Q20 Q17 Q16 Q6 R4 120 R11 180 R12 3K R13 180 R14 1.5K Q15 R20 2K -VS (4) 65-1726 7 PRODUCT SPECIFICATION RC5534/RC5534A Mechanical Dimensions 8-Lead Ceramic DIP Package Inches Symbol Min. A b1 b2 c1 D E e eA L Q s1 a Millimeters Max. Min. — .200 .014 .023 .045 .065 .008 .015 — .405 .220 .310 .100 BSC .300 BSC .125 .200 .015 .060 .005 — 90¡ 105¡ Notes: Notes Max. — 5.08 .36 .58 1.14 1.65 .20 .38 — 10.29 5.59 7.87 2.54 BSC 7.62 BSC 3.18 5.08 .38 1.52 .13 — 90¡ 105¡ 1. Index area: a notch or a pin one identification mark shall be located adjacent to pin one. The manufacturer's identification shall not be used as pin one identification mark. 8 2, 8 2. The minimum limit for dimension "b2" may be .023 (.58mm) for leads number 1, 4, 5 and 8 only. 8 4 3. Dimension "Q" shall be measured from the seating plane to the base plane. 4 5, 9 7 4. This dimension allows for off-center lid, meniscus and glass overrun. 3 6 5. The basic pin spacing is .100 (2.54mm) between centerlines. Each pin centerline shall be located within ±.010 (.25mm) of its exact longitudinal position relative to pins 1 and 8. 6. Applies to all four corners (leads number 1, 4, 5, and 8). 7. "eA" shall be measured at the center of the lead bends or at the centerline of the leads when "a" is 90¡. 8. All leads – Increase maximum limit by .003 (.08mm) measured at the center of the flat, when lead finish applied. 9. Six spaces. D 4 1 Note 1 E 5 8 s1 eA e A Q a L b2 b1 8 c1 RC5534/RC5534A PRODUCT SPECIFICATION Mechanical Dimensions (continued) 8-Lead Plastic DIP Package Inches Symbol A A1 A2 B B1 C D D1 E E1 e eB L Millimeters Min. Max. Min. Max. — .015 .115 .014 .045 .008 .348 .005 .300 .240 .210 — .195 .022 .070 .015 .430 — .325 .280 — .38 2.93 .36 1.14 .20 8.84 .13 7.62 6.10 5.33 — 4.95 .56 1.78 .38 10.92 — 8.26 7.11 .100 BSC — .430 .115 .160 2.54 BSC — 10.92 2.92 4.06 8¡ 8¡ N Notes: Notes 1. Dimensioning and tolerancing per ANSI Y14.5M-1982. 2. "D" and "E1" do not include mold flashing. Mold flash or protrusions shall not exceed .010 inch (0.25mm). 3. Terminal numbers are for reference only. 4. "C" dimension does not include solder finish thickness. 5. Symbol "N" is the maximum number of terminals. 4 2 2 5 D 4 1 5 8 E1 D1 E e A2 A A1 C L B1 B eB 9 PRODUCT SPECIFICATION RC5534/RC5534A Mechanical Dimensions (continued) 8-Lead Metal Can IC Header Package øD Symbol Min. øD1 F L1 Q A øb øb1 øD øD1 øD2 e e1 A L2 L Inches øb BASE and SEATING PLANE øb1 REFERENCE PLANE F k k1 L L1 L2 Q a Max. .165 .185 .016 .019 .016 .021 .335 .375 .305 .335 .110 .160 .200 BSC .100 BSC — .040 .027 .034 .027 .045 .500 .750 — .050 .250 — .010 .045 45¡ BSC Millimeters Min. Notes Max. 4.19 4.70 .41 .48 .41 .53 8.51 9.52 7.75 8.51 2.79 4.06 5.08 BSC 2.54 BSC — 1.02 .69 .86 .69 1.14 12.70 19.05 — 1.27 6.35 — .25 1.14 45¡ BSC 1, 5 1, 5 2 1 1 1 e Notes: e1 øD2 1. (All leads) øb applies between L1 & L2. øb1 applies between L2 & .500 (12.70mm) from the reference plane. Diameter is uncontrolled in L1 & beyond .500 (12.70mm) from the reference plane. 2. Measured from the maximum diameter of the product. 3. Leads having a maximum diameter .019 (.48mm) measured in gauging plane, .054 (1.37mm) +.001 (.03mm) –.000 (.00mm) below the reference plane of the product shall be within .007 (.18mm) of their true position relative to a maximum width tab. 4. The product may be measured by direct methods or by gauge. a 5. All leads – increase maximum limit by .003 (.08mm) when lead finish is applied. k k1 10 PRODUCT SPECIFICATION RC5534/RC5534A Ordering Information Product Number Temperature Range Screening Package RC5534D/RC5534AD 0°C to +70°C Commercial 8 Pin Ceramic DIP RC5534N/RC5534AN 0°C to +70°C Commercial 8 Pin Plastic DIP RM5534D/RM5534AD -55°C to +125°C Commercial 8 Pin Ceramic DIP RM5534D/883 -55°C to +125°C Military 8 Pin Plastic DIP RM5534AD/883 -55°C to +125°C Military 8 Pin Plastic DIP RM5534T/RM5534AT -55°C to +125°C Commercial 8 Pin TO-99 Metal Can RM5534T/883 -55°C to +125°C Military 8 Pin TO-99 Metal Can RM5534AT/883 -55°C to +125°C Military 8 Pin TO-99 Metal Can Note: /883 denotes MIL-STD-883, Par. 1.2.1 compliant device. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 5/20/98 0.0m 001 Stock#DS30005534 Ó 1998 Fairchild Semiconductor Corporation