HSMF-C15x Bi-color Surface Mount Chip LEDs Data Sheet HSMF-C153/C155/C156/C157/C158 Description Features The HSMF-C15x series of bicolor chip-type LEDs is designed in an industry standard package for ease of handling and use. These bicolor LEDs are available as high efficiency red/yellow, high efficiency red/green, yellow/ green, orange/green and green/amber. The HSMF-C15x has the widely used 3.2 x 2.7 mm footprint and wide viewing angle make this LED exceptional for backlighting applications. • • • • • • All packages are compatible with reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel indicators especially where space is a premium. Small size Industry standard footprint Compatible with IR solder Diffused optics Operating temperature range of –30°C to +85°C Five color combinations available: Red/Yellow, Red/Green, Yellow/Green, Orange/Green and Green/Amber. • Available in 8 mm tape on 7 in. (178 mm) diameter reels Applications • • • • Push-button backlighting Symbol backlighting Status indicator Front panel indicator Device Selection Guide Part Number Parts per Reel Color Package Description HSMF-C153 3000 GaP Yellow / GaP HER Untinted, Diffused HSMF-C155 3000 GaP HER / GaP Green Untinted, Diffused HSMF-C156 3000 GaP Yellow / GaP Green Untinted, Diffused HSMF-C157 3000 GaP Orange / GaP Green Untinted, Diffused HSMF-C158 3000 AlInGaP Green / AlInGap Amber Untinted, Diffused CAUTION: HSMF-C15x LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions HSMF-C153/C155/C156/C157/C158 CATHODE MARK LED DIE 2 1 1.4 (0.055) 3 2.7 (0.106) 4 3.2 (0.126 ) 2.00 (0.079) 0.60 (0.024) DIFFUSED EPOXY 1.10 (0.043) PC BOARD 0.50 (0.020) 0.55 (0.022) 0.55 (0.022) R 0.25 (0.010) TYP. SOLDERING TERMINAL 1.10 (0.043) 0.40 (0.016) 4 Ð 0.05 (0.002) MAX. CATHODE LINE NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. POLARITY HSMF-C153 HSMF-C155 HSMF-C156 HSMF-C157 HSMF-C158 1 2 Yellow Green Green Green Green 3 4 HER HER Yellow Orange Amber Absolute Maximum Ratings at TA = 25°C Parameter GaP AlInGaP Green AlInGaP Amber Units DC Forward Current [1] 20 20 25 mA Power Dissipation [2] 65 52 60 mW Reverse Voltage (IR = 100mA) 5 5 5 V LED Junction Temperature 95 95 95 °C Operating Temperature Range -30 to 85 °C Storage Temperature Range -40 to 85 °C Soldering Temperature See reflow soldering profile (Figure 6 & 7) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25°C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. Optical Characteristics at TA = 25°C Luminous Intensity IV [1] (mcd) @ 20mA Part Number Min. Typ. Color, Peak Wavelength ld (nm) Typical Color, Dominant Wavelength ld [2] (nm) Typical Viewing Angle 2q1/2 [3] (Degrees) Typical GaP HER 2.50 10.0 630 626 170 GaP Yellow 2.50 8.0 589 586 170 GaP Green 4.00 15.0 570 572 170 GaP Orange 2.50 8.0 605 604 170 AlInGaP Green 28.50 45.0 570 572 170 AlInGap Amber 28.50 55.0 595 592 170 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. l1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts) [1] @ IF = 20mA Reverse Breakdown VR (Volts) @ IR = 100mA Capacitance C (pF) @VF = 0, f = 1Mhz Thermal Resistance RθJ-P (°C/W) Part Number Typ. Max. Min. Typ. Typ. GaP HER 2.1 2.6 5 5 325 GaP Yellow 2.1 2.6 5 6 325 GaP Green 2.2 2.6 5 9 325 GaP Orange 2.2 2.6 5 7 325 AlInGaP Green 2.1 2.4 5 22 325 AlInGap Amber 1.9 2.4 5 45 325 Notes: The bicolor package contain two individual light sources of different color. The specifications above refer to each color of a particular package. Color Bin Limits GaP HER Color Bins [1] GaP Green Color Bins [1] Dominant Wavelength (nm) Bin ID Minimum Maximum Bin ID Minimum Maximum - 620.0 635.0 A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance : ±1nm GaP Yellow / AlInGaP Amber Color Bins [1] Dominant Wavelength (nm) Bin ID Minimum Maximum A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 Bin ID Minimum Maximum E 592.0 594.5 A 561.5 564.5 F 594.5 597.0 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance : ±1nm GaP Orange Color Bins [1] Dominant Wavelength (nm) Bin ID Minimum Maximum A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 F 612.0 615.0 Tolerance : ±1nm Dominant Wavelength (nm) Tolerance : ±1nm AlInGaP Green Color Bins [1] Dominant Wavelength (nm) Tolerance : ±1nm Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Intensity (mcd) Bin ID Min. Max. Bin ID Min. Max. A 0.11 0.18 N 28.50 45.00 B 0.18 0.29 P 45.00 71.50 C 0.29 0.45 Q 71.50 112.50 D 0.45 0.72 R 112.50 180.00 E 0.72 1.10 S 180.00 285.00 F 1.10 1.80 T 285.00 450.00 G 1.80 2.80 U 450.00 715.00 H 2.80 4.50 V 715.00 1125.00 J 4.50 7.20 W 1125.00 1800.00 K 7.20 11.20 X 1800.00 2850.00 L 11.20 18.00 Y 2850.00 4500.00 M 18.00 28.50 Tolerance: ±15%. Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 1.0 RELATIVE INTENSITY GREEN YELLOW 0.5 0 ORANGE 500 550 HER 600 650 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. 700 750 HER 10 GREEN 1 YELLOW 0.1 1.2 0.8 0.4 ORANGE 1.5 1.7 1.9 2.1 0 2.3 0 10 20 30 40 IF - FORWARD CURRENT - mA VF - FORWARD VOLTAGE - V Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current (all colors). IF MAX. - MAXIMUM FORWARD CURRENT - mA 1.6 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF - FORWARD CURRENT - mA 100 35 30 25 20 RθJ-A = 600°C/W 15 RθJ-A = 800°C/W 10 5 0 0 20 60 40 80 100 TA - AMBIENT TEMPERATURE - °C Figure 4. Maximum forward current vs. ambient temperature. 1.00 0.80 0.70 0.60 10 SEC. MAX. 0.50 TEMPERATURE RELATIVE INTENSITY - % 0.90 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 230°C MAX. 4°C/SEC. MAX. 140-160°C OVER 2 MIN. 10 20 30 40 50 60 70 80 90 TIME ANGLE Figure 5. Relative intensity vs. angle for HSMF-C153, C155, C156, C157 and C158. Figure 6. Recommended reflow soldering profile. TEMPERATURE 10 - 30 SEC. 217°C 200°C 1.0 (0.039) 255 - 260 °C 3 °C/SEC. MAX. 0.4 (0.016) 6 °C/SEC. MAX. 150°C 1.0 (0.039) 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Figure 7. Recommended Pb free reflow soldering profile. 3°C/SEC. MAX. 4°C/SEC. MAX. 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Note: 1. All dimensions in millimeters (inches). Figure 8. Recommended solder pad pattern. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 9. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) ∅ 20.20 MIN. (∅ 0.795 MIN.) 10.50 ± 1.0 (0.413 ± 0.039) ∅ 13.1 ± 0.5 (∅ 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Note: All dimensions in millimeters (inches). Figure 10. Reel dimensions. 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C15x SERIES DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 3.52 (0.139) 3.02 (0.119) 1.40 (0.055) Figure 11. Tape dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60% RH max. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 12. Tape leader and trailer dimensions. Notes: Baking recommended condition: 60 ± 5°C for 20 hours. 1. All dimensions in millimeters (inches). 2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified. For product information and a complete list of distributors, please go to our website: Baking is required under the condition: a) Humidity Indicator Card is >10% when read at 23 ± 5°C b) Device exposed to factory conditions < 30°C/60% RH more than 672 hours. www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0671EN AV02-0427EN - February 20, 2008