ETC UPD6604GS-XXX

DATA SHEET
MOS INTEGRATED CIRCUIT
µPD6604
4-BIT SINGLE-CHIP MICROCONTROLLER
FOR INFRARED REMOTE CONTROL TRANSMISSION
DESCRIPTION
Equipped with low-voltage 1.8 V operation, a carrier generation circuit for infrared remote control transmission,
a standby release function through key entry, and a programmable timer, the µPD6604 is suitable for infrared remote
control transmitters.
For the µPD6604, we have made available the one-time PROM product µPD66P04B for program evaluation or
small-quantity production.
FEATURES
• Program memory (ROM)
: 1002 × 10 bits
• Data memory (RAM)
: 32 × 4 bits
• Built-in carrier generation circuit for infrared remote control
• 9-bit programmable timer
: 1 channel
• Command execution time
: 8 µs (when operating at fOSC = 1 MHz: RC oscillation)
• Stack level
: 1 level (Stack RAM is for data memory RF as well.)
• I/O pins (KI/O)
: 8 pins
• Input pins (KI)
: 4 pins
• Sense input pin (S0)
: 1 pin
• S1/LED pin (I/O)
: 1 pin (When in output mode, this is the remote control transmission
display pin.)
• Power supply voltage
: VDD = 1.8 to 3.6 V (when operating at fOSC = 500 kHz)
VDD = 2.2 to 3.6 V (when operating at fOSC = 1 MHz)
• Operating ambient temperature : TA = –40 to + 85 °C
• Oscillator frequency
: fOSC = 300 kHz to 1 MHz
• POC circuit (Mask option)
APPLICATION
Infrared remote control transmitter (for key-less entry)
Because the µPD6604 uses an RC oscillation system clock, its accuracy and stability are lower than
the models using ceramic oscillation.
In applications where the clock accuracy and stability pose a problem, use the µPD6134 (ceramic
oscillation type).
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. U11281EJ3V0DSJ1 (3rd edition)
Date Published November 2000 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1996
µPD6604
ORDERING INFORMATION
Part Number
Package
µPD6604GS-×××
20-pin plastic SOP (300 mil)
µPD6604GS-×××-GJG
20-pin plastic shrink SOP (300 mil)
Remark ××× indicates ROM code suffix.
PIN CONFIGURATION (TOP VIEW)
20-pin Plastic SOP
• µPD6604GS-×××
20-pin Plastic Shrink SOP
• µPD6604GS-×××-GJG
KI/O6
1
20
KI/O5
KI/O7
2
19
KI/O4
S0
3
18
KI/O3
S1/LED
4
17
KI/O2
REM
5
16
KI/O1
VDD
6
15
KI/O0
OSCOUT
7
14
KI3
OSCIN
8
13
KI2
OSCND
9
12
KI1
RESET
10
11
KI0
BLOCK DIAGRAM
REM
S1/LED
CARRIER
GENERATOR
CPU
CORE
4
PORT KI
4
KI0-KI3
8
PORT KI/O
8
KI/O0-KI/O7
2
PORT S
2
S0, S1/LED
ROM
9-bit
TIMER
RAM
RESET
SYSTEM
CONTROL
OSCIN
OSCOUT
VDD
GND
2
Data Sheet U11281EJ3V0DS00
µPD6604
LIST OF FUNCTIONS
µPD6604
Item
ROM capacity
µPD66P04B
1002 × 10 bits
Mask ROM
One-time PROM
RAM capacity
32 × 4 bits
Stack
1 level (multiplexed with RF of RAM)
I/O pins
• Key input (KI)
: 4
• Key I/O (KI/O)
: 8
• Key extended input (S0, S1)
: 2
• Remote control transmission display output (LED) : 1 (multiplexed with S1 pin)
Number of keys
• 32 keys
• 48 keys (when extended by key extension input)
• 96 keys (when extended by key extension input and diode)
Clock frequency
RC oscillation
• fOSC = 300 kHz to 1 MHz
• fOSC = 300 to 500 kHz (with POC circuit)
Instruction execution time
8 µs (fOSC = 1 MHz)
Carrier frequency
fOSC , fOSC/2, fOSC/8, fOSC/12, fOSC/16, fOSC/24, no carrier (high level)
Timer
9-bit programmable timer: 1 channel
POC circuit
Mask option
Provided
Supply voltage
• VDD = 1.8 to 3.8 V
VDD = 2.2 to 3.6 V
• VDD = 2.2 to 3.6 V (with POC circuit)
Operating ambient temperature
• T A = –40 to +85 °C
• T A = –20 to +70 °C (with POC circuit)
Package
• 20-pin plastic SOP (300 mil)
• 20-pin plastic shrink SOP (300 mil)
Data Sheet U11281EJ3V0DS00
3
µPD6604
CONTENTS
1. PIN FUNCTIONS .........................................................................................................................
6
1.1
List of Pin Functions .........................................................................................................................
6
1.2
Input/Output Circuits of Pins ...........................................................................................................
7
1.3
Dealing with Unused Pins ................................................................................................................
8
2. INTERNAL CPU FUNCTIONS ....................................................................................................
9
2.1
Program Counter (PC) ......................................................................................................................
9
2.2
Stack Pointer (SP) .............................................................................................................................
9
2.3
Address Stack Register (ASR (RF)) .................................................................................................
9
2.4
Program Memory (ROM) ................................................................................................................. 10
2.5
Data Memory (RAM) .......................................................................................................................... 10
2.6
Data Pointer (DP) ............................................................................................................................... 11
2.7
Accumulator (A) ................................................................................................................................ 11
2.8
Arithmetic and Logic Unit (ALU) ...................................................................................................... 12
2.9
Flags ................................................................................................................................................... 12
2.9.1
Status flag (F) .......................................................................................................................... 12
2.9.2
Carry flag (CY) ........................................................................................................................ 13
3. PORT REGISTERS (PX) ............................................................................................................. 14
3.1
KI/O Port (P0) ....................................................................................................................................... 15
3.2
KI Port/Special Ports (P1) ................................................................................................................. 16
3.2.1
KI port (P11: bits 4-7 of P1) ..................................................................................................... 16
3.2.2
S0 port (bit 2 of P1) .................................................................................................................. 16
3.2.3
S1/LED (bit 3 of P1) ................................................................................................................. 16
3.3
Control Register 0 (P3) ..................................................................................................................... 17
3.4
Control Register 1 (P4) ..................................................................................................................... 18
4. TIMER ......................................................................................................................................... 19
4.1
Timer Configuration .......................................................................................................................... 19
4.2
Timer Operation ................................................................................................................................. 20
4.3
Carrier Output .................................................................................................................................... 21
4.4
Software Control of Timer Output ................................................................................................... 21
5. STANDBY FUNCTION ................................................................................................................ 22
5.1
Outline of Standby Function ............................................................................................................ 22
5.2
Standby Mode Setup and Release ................................................................................................... 23
5.3
Standby Mode Release Timing ........................................................................................................ 24
6. RESET PIN .................................................................................................................................. 26
7. POC CIRCUIT (MASK OPTION) ................................................................................................ 27
7.1
Functions of POC Circuit .................................................................................................................. 28
8. SYSTEM CLOCK OSCILLATOR ................................................................................................ 29
4
Data Sheet U11281EJ3V0DS00
µPD6604
9. INSTRUCTION SET .................................................................................................................... 31
9.1
Machine Language Output by Assembler ...................................................................................... 31
9.2
Circuit Symbol Description .............................................................................................................. 32
9.3
Mnemonic to/from Machine Language (Assembler Output) Contrast Table ............................... 33
9.4
Accumulator Operation Instructions ............................................................................................... 37
9.5
Input/Output Instructions ................................................................................................................. 40
9.6
Data Transfer Instruction .................................................................................................................. 41
9.7
Branch Instructions .......................................................................................................................... 43
9.8
Subroutine Instructions .................................................................................................................... 44
9.9
Timer Operation Instructions ........................................................................................................... 45
9.10 Others ................................................................................................................................................. 46
10. ASSEMBLER RESERVED WORDS .......................................................................................... 48
10.1 Mask Option Directives .................................................................................................................... 48
10.1.1 OPTION and ENDOP directives ............................................................................................. 48
10.1.2 Mask option definition directive ............................................................................................... 48
11. ELECTRICAL SPECIFICATIONS ............................................................................................... 49
12. CHARACTERISTIC CURVE (REFERENCE VALUES) .............................................................. 52
13. APPLIED CIRCUIT EXAMPLE ................................................................................................... 54
14. PACKAGE DRAWINGS .............................................................................................................. 55
15. RECOMMENDED SOLDERING CONDITIONS .......................................................................... 57
APPENDIX A. DEVELOPMENT TOOLS ......................................................................................... 58
APPENDIX B. FUNCTIONAL COMPARISON BETWEEN µPD6604 AND
OTHER SUBSERIES ................................................................................................ 59
APPENDIX C. EXAMPLE OF REMOTE-CONTROL TRANSMISSION FORMAT .......................... 60
Data Sheet U11281EJ3V0DS00
5
µPD6604
1. PIN FUNCTIONS
1.1 List of Pin Functions
Pin No.
Symbol
Function
1
2
15-20
KI/O0-KI/O7
These pins refer to the 8-bit I/O ports. I/O switching can
be made in 8-bit units.
In INPUT mode, a pull-down resistor is added.
In OUTPUT mode, they can be used as the key scan
output of the key matrix.
3
S0
Refers to the input port.
Can also be used as the key return input of the key
matrix.
In INPUT mode, the availability of the pull-down resistor
of the S0 and S1 ports can be specified by software in
Output Format
CMOS
push-pullNote 1
—
When Reset
High-level output
High-impedance
(OFF mode)
terms in 2-bit units.
If INPUT mode is canceled by software, this pin is placed
in OFF mode and enters the high-impedance state.
4
S1/LED
Refers to the I/O port.
In INPUT mode (S1), this pin can also be used as the key
return input of the key matrix.
The availability of the pull-down resistor of the S0 and S1
ports can be specified by software in 2-bit units.
In OUTPUT mode (LED), it becomes the remote control
transmission display output (active low). When the
remote control carrier is output from the REM output, this
pin outputs the low level from the LED output synchronously
with the REM signal.
CMOS
push-pull
High-level output
(LED)
5
REM
Refers to the infrared remote control transmission output.
The output is active high.
Carrier frequency: fOSC , fOSC/8, fOSC /12, high-level,
f OSC /2, f OSC /16, f OSC /24 (usable
on software)
CMOS
push-pull
Low-level output
6
VDD
Refers to the power supply.
—
—
7
OSCIN
These pins refer to the pins for RC oscillation.
—
High-impedance
(oscillation stopped)
8
OSCOUT
Low level
(oscillation stopped)
9
GND
Refers to the ground.
—
—
10
RESET
Normally, this pin is a system reset input. By
inputting a low level, the CPU can be reset. When
resetting with the POC circuit (mask option) a low
level is output. A pull-up resistor is incorporated.
—
—
11-14
KI0-KI3Note 2 These pins refer to the 4-bit input ports.
They can be used as the key return input of the key
matrix.
The use of the pull-down resistor can be specified by
software in 4-bit units.
—
Input (Low-level)
Notes 1. Be careful about this because the drive capability of the low-level output side is held low.
2. In order to prevent malfunction, be sure to input a low level to more than one of pins KI0 to KI3 when
reset is released (when RESET pin changes from low level to high level, or POC is released due to
supply voltage startup).
6
Data Sheet U11281EJ3V0DS00
µPD6604
1.2 Input/Output Circuits of Pins
The input/output circuits of the µPD6604 pins are shown in partially simplified forms below.
(1) K I/O0-K I/O7
(4) S 0
VDD
Input buffer
Output
latch
data
P-ch
OFF mode
N-chNote
Selector
output
disable
standby
release
N-ch
pull-down flag
Input buffer
N-ch
(5) S1/LED
VDD
Note The drive capability is held low.
REM
output latch
(2) K I0-K I3
P-ch
output
disable
standby
release
Input buffer
N-ch
standby
release
Input buffer
pull-down flag
N-ch
N-ch
pull-down flag
(3) REM
(6) RESET
VDD
VDD
P-ch
P-ch
data
Output
latch
N-ch
Carrier
generator
Input buffer
Internal reset signal
other than POC
N-ch
POC circuit
Data Sheet U11281EJ3V0DS00
Mask option
7
µPD6604
1.3 Dealing with Unused Pins
The following connections are recommended for unused pins.
Table 1-1. Connections for Unused Pins
Connection
Pin
Inside the microcontroller
KI/O
INPUT mode
OUTPUT mode
REM
—
High-level output
—
S1/LED
OUTPUT mode (LED) setting
S0
OFF mode setting
KI
RESETNote
Outside the microcontroller
Open
Directly connect to GND
—
Built-in POC circuit
Open
Note If the circuit is an applied one requiring high reliability, be sure to design it in such a manner that the RESET
signal is entered externally.
Caution The I/O mode and the terminal output level are recommended to be fixed by setting them
repeatedly in each loop of the program.
8
Data Sheet U11281EJ3V0DS00
µPD6604
2. INTERNAL CPU FUNCTIONS
2.1 Program Counter (PC): 10 Bits
Refers to the binary counter that holds the address information of the program memory.
Figure 2-1. Program Counter Organization
PC
PC9
PC8
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
The program counter contains the address of the instruction that should be executed next. Normally, the counter
contents are automatically incremented in accordance with the instruction length (byte count) each time an
instruction is executed.
However, when executing JUMP instructions (JMP, JC, JNC, JF, JNF), the program counter contains the jump
destination address written in the operand.
When executing the subroutine call instruction (CALL), the call destination address written in the operand is
entered in the PC after the PC contents at the time are saved in the address stack register (ASR). If the return
instruction (RET) is executed after the CALL instruction is executed, the address saved in the ASR is restored to
the PC.
When reset, the value of the program counter becomes “000H”.
2.2 Stack Pointer (SP): 1 Bit
Refers to the 1-bit register which holds the status of the address stack register.
The stack pointer contents are incremented when the call instruction (CALL) is executed; they are decremented
when the return instruction (RET) is executed.
When reset, the stack pointer contents are cleared to “0”.
When the stack pointer overflows (stack level 2 or more) or underflows, the CPU is hung up thus a system reset
signal is generated and the PC becoming “000H”.
As no instruction is available to set a value directly for the stack pointer, it is not possible to operate the pointer
by means of a program.
2.3 Address Stack Register (ASR (RF)): 10 Bits
The address stack register saves the return address of the program after a subroutine call instruction is executed.
The low-order 8 bits are arranged in the RF of the data memory as a dual-function RAM. The register holds
the ASR value even after the RET is executed.
When reset, it holds the previous data (undefined when turning on the power).
Caution If the RF is accessed as the data memory, the high-order 2 bits of the ASR become undefined.
Figure 2-2.
Address Stack Register Organization
RF
ASR
ASR9
ASR8
ASR7
ASR6
ASR5
ASR4
ASR3
Data Sheet U11281EJ3V0DS00
ASR2
ASR1
ASR0
9
µPD6604
2.4 Program Memory (ROM): 1002 Steps × 10 Bits
The ROM consists of 10 bits per step, and is addressed by the program counter.
The program memory stores programs and table data, etc.
The 22 steps from 3EAH to 3FFH cannot be used in the test program area.
Figure 2-3.
Program Memory Map
10 bits
000H
0FFH
100H
1FFH
200H
2FFH
300H
3E9H
3EAH
Test
program areaNote
3FFH
Note The test program area is so designed that a program or data placed in either of them by mistake is returned
to the 000H address.
2.5 Data Memory (RAM): 32 × 4 Bits
The data memory, which is a static RAM consisting of 32 × 4 bits, is used to retain processed data. The data
memory is sometimes processed in 8-bit units. R0 can be used as the ROM data pointer.
RF is also used as the ASR.
When reset, R0 is cleared to “00H” and R1 to RF retain the previous data (undefined when turning on the power).
10
Data Sheet U11281EJ3V0DS00
µPD6604
Figure 2-4. Data Memory Organization
R1n (high-order 4 bits) R0n (low-order 4 bits)
→DP (see 2.6 Data Pointer (DP))
R0
R10
R00
R1
R11
R01
R2
R12
R02
R3
R13
R03
R4
R14
R04
R5
R15
R05
R6
R16
R06
R7
R17
R07
R8
R18
R08
R9
R19
R09
RA
R1A
R0A
RB
R1B
R0B
RC
R1C
R0C
RD
R1D
R0D
RE
R1E
R0E
RF
→ASR (see 2.3 Address Stack Register (ASR (RF)))
R1F
R0F
2.6 Data Pointer (DP): 10 Bits
The ROM data table can be referenced by setting the ROM address in the data pointer to call the ROM contents.
The low-order 8 bits of the ROM address are specified by R0 of the data memory; and the high-order 2 bits by
bits 4 and 5 of the P3 register (CR0).
When reset, the pointer contents become “000H”.
Figure 2-5. Data Pointer Organization
P3 Register
P3
b5
b4
DP9
DP8
R10
DP7
DP6
R00
DP5
DP4
DP3
DP2
DP1
DP0
R0
2.7 Accumulator (A): 4 Bits
The accumulator, which refers to a register consisting of 4 bits, plays a leading role in performing various
operations.
When reset, the accumulator contents are left undefined.
Figure 2-6. Accumulator Organization
A3
A2
A1
A0
Data Sheet U11281EJ3V0DS00
A
11
µPD6604
2.8 Arithmetic and Logic Unit (ALU): 4 Bits
The arithmetic and logic unit (ALU), which refers to an arithmetic circuit consisting of 4 bits, executes simple
manipulations with priority given to logical operations.
2.9 Flags
2.9.1 Status flag (F)
Pin and timer statuses can be checked by executing the STTS instruction to check the status flag.
The status flag is set (to 1) in the following cases.
• If the condition specified with the operand is met when the STTS instruction has been executed
• When STANDBY mode is canceled.
• When the cancelation condition is met at the point of executing the HALT instruction. (In this case, the system
is not placed in STANDBY mode.)
Conversely, the status flag is cleared (to 0) in the following cases:
• If the condition specified with the operand is not met when the STTS instruction has been executed.
• When the status flag has been set (to 1), the HALT instruction executed, but the cancelation condition is not
met at the point of executing the HALT instruction. (In this case, the system is not placed in STANDBY mode.)
Table 2-1. Conditions for Status Flag (F) to be Set by STTS Instruction
Operand Value of STTS Instruction
b2
b1
b0
0
0
0
0
High level is input to at least one of KI pins.
0
1
1
High level is input to at least one of KI pins.
1
1
0
High level is input to at least one of KI pins.
1
0
1
The down counter of the timer is 0.
1
12
Condition for Status Flag (F) to be Set
b3
Either of the combinations
of b2, b1, and b 0 above.
[The following condition is added in addition to the above.]
High level is input to at least one of S0 and S1 pins.
Data Sheet U11281EJ3V0DS00
µPD6604
2.9.2 Carry flag (CY)
The carry flag is set (to 1) in the following cases:
• If the ANL instruction or the XRL instruction is executed when bit 3 of the accumulator is “1” and bit 3 of the
operand is “1”.
• If the RL instruction or the RLZ instruction is executed when bit 3 of the accumulator is “1”.
• If the INC instruction or the SCAF instruction is executed when the value of the accumulator is 0FH.
The carry flag is cleared (to 0) in the following cases:
• If the ANL instruction or the XRL instruction is executed when at least either bit 3 of the accumulator or bit
3 of the operand is “0”.
• If the RL instruction or the RLZ instruction is executed when bit 3 of the accumulator is “0”.
• If the INC instruction or the SCAF instruction is executed when the value of the accumulator is other than 0FH.
• If the ORL instruction is executed.
• When Data is written to the accumulator by the MOV instruction or the IN instruction.
Data Sheet U11281EJ3V0DS00
13
µPD6604
3. PORT REGISTERS (PX)
The KI/O port, the KI port, the special ports (S0, S1/LED), and the control register are treated as port registers.
At reset, port register values are shown below.
Figure 3-1. Port Register Organization
Port Register
At Reset
P0
FFH
P10
KI/O7
P00
KI/O5
KI/O6
KI/O4
KI/O3
KI/O2
KI/O1
KI/O0
× FHNote
P1
P11
KI3
KI2
P01
KI1
KI0
S1/LED
S0
1
1
P3 (Control register 0)
03H
P13
0
0
P03
DP9
DP8
TCTL
CARY
MOD1
MOD0
P4 (Control register 1)
26H
P14
0
Note
P04
KI
S0/S1
pull-down pull-down
0
0
S1/LED mode KI/O mode
S0 mode
×: Refers to the value based on the KI pin state.
Table 3-1. Relationship between Ports and their Read/Write
Port Name
INPUT Mode
Read
OUTPUT Mode
Write
Read
Write
KI/O
Pin state
Output latch
Output latch
Output latch
KI
Pin state
—
—
—
S0
Pin state
—
Note
—
S1/LED
Pin state
—
Pin state
—
Note When in OFF mode, “1” is normally read.
14
Data Sheet U11281EJ3V0DS00
µPD6604
3.1 K I/O Port (P0)
The KI/O port is an 8-bit input/output port for key scan output.
INPUT/OUTPUT mode is set by bit 1 of the P4 register.
If a read instruction is executed, the pin state can be read in INPUT mode, whereas the output latch contents
can be read in OUTPUT mode.
If the write instruction is executed, data can be written to the output latch regardless of INPUT or OUTPUT mode.
When reset, the port is placed in OUTPUT mode; and the value of the output latch (P0) becomes 1111 1111B.
The KI/O port contains the pull-down resistor, allowing pull-down in INPUT mode only.
Caution During double pressing of a key, a high-level output and a low-level output may coincide with
each other at the KI/O port. To avoid this, the low-level output current of the KI/O port is held
low. Therefore, be careful when using the KI/O port for purposes other than key scan output.
The KI/O port is so designed that, even when connected directly to VDD within the normal supply
voltage range (VDD = 1.8 to 3.6 V), no problem may occur.
Table 3-2. KI/O Port (P0)
b0-b7
Bit
b7
b6
b5
b4
b3
b2
b1
b0
Name
KI/O7
KI/O6
KI/O5
KI/O4
KI/O3
KI/O2
KI/O1
KI/O0
: In reading : In INPUT mode, the KI/O pin’s state is read.
In OUTPUT mode, the KI/O pin’s output latch contents are read.
In writing
: Data is written to the K I/O pin’s output latch regardless of INPUT or OUTPUT mode.
Data Sheet U11281EJ3V0DS00
15
µPD6604
3.2 K I Port/Special Ports (P1)
3.2.1 K I port (P 11: bits 4-7 of P1)
The KI port is to the 4-bit input port for key entry.
The pin state can be read.
Software can be used to set the availability of the pull-down resistor of the KI port in 4-bit units by means of bit
5 of the P4 register.
When reset, the pull-down resistor is connected.
Table 3-3. KI/Special Port Register (P1)
b2
Bit
b7
b6
b5
b4
b3
b2
b1
b0
Name
KI3
KI2
KI1
KI0
S1/LED
S0
(Fixed to “1”)
: In INPUT mode, state of the S0 pin is read (Read only).
In OFF mode, this bit is fixed to “1”.
b3
: The state of the S1/LED pin is read regardless of INPUT/OUTPUT mode (Read only).
b4-b7
: The state of the KI pin is read (Read only).
Caution In order to prevent malfunction, be sure to input a low level to more than one of pins KI0 to KI3
when reset is released (when RESET pin changes from low level to high level, or POC is released
due to supply voltage startup).
3.2.2 S 0 port (bit 2 of P1)
The S0 port is the INPUT/OFF mode port.
The pin state can be read by setting this port to INPUT mode with bit 0 of the P4 register.
In INPUT mode, software can be used to set the availability of the pull-down resistor of the S0 and S1/LED port
in 2-bit units by means of bit 4 of the P4 register.
If INPUT mode is canceled (thus set to OFF mode), the pin becomes high-impedance but it also makes that the
through current does not flow internally. In OFF mode, “1” can be read regardless of the pin state.
When reset, it is set to OFF mode, thus becoming high-impedance.
3.2.3 S 1/LED (bit 3 of P1)
The S1/LED port is the input/output port.
It uses bit 2 of the P4 register to set INPUT or OUTPUT mode. The pin state can be read in both INPUT mode
and OUTPUT mode.
When in INPUT mode, software can be used to set the availability of the pull-down resistor of the S0 and
S 1/LED ports in 2-bit units by means of bit 4 of the P4 register.
When in OUTPUT mode, the pull-down resistor is automatically disconnected thus becoming the remote
transmission display pin (see 4. TIMER).
When reset, it is placed in OUTPUT mode, and high level is output.
16
Data Sheet U11281EJ3V0DS00
µPD6604
3.3 Control Register 0 (P3)
Control register 0 consists of 8 bits. The contents that can be controlled are as shown below.
When reset, the register becomes 0000 0011B.
Table 3-4. Control Register 0 (P3)
Bit
b7
Name
b6
b5
—
—
b4
b3
DP (Data pointer) TCTL
b2
b1
b0
CARY
MOD1
MOD0
See Table 3-5.
DP9
DP8
Set
0
Fixed
Fixed
0
0
1/1
ON
value
1
to “0”
to “0”
1
1
1/2
OFF
0
0
0
0
0
0
When reset
1
1
b0, b1 : These bits specify the carrier frequency and duty ratio of the REM output.
b2
: This bit specifies the availability of the carrier of the frequency specified by b0 and b1.
“0” = ON (with carrier); “1” = OFF (without carrier; high level)
b3
: This bit changes the carrier frequency and the timer clock’s frequency division ratio.
“0” = 1/1 (carrier frequency: the specified value of b0 and b1; timer clock: fOSC/8)
“1” = 1/2 (carrier frequency: half of the specified value of b0 and b1; timer clock: fOSC/16)
Table 3-5. Timer Clock and Carrier Frequency Setup
b3
0
1
b2
0
b1
b0
Timer Clock
0
0
0
1
fOSC /8 (Duty 1/2)
1
0
fOSC /12 (Duty 1/2)
1
1
fOSC /12 (Duty 1/3)
1
×
×
0
0
0
0
1
fOSC /16 (Duty 1/2)
1
0
fOSC /24 (Duty 1/2)
1
1
fOSC /24 (Duty 1/3)
×
×
Without carrier (high level)
1
fOSC/8
Carrier Frequency (Duty Ratio)
fOSC (Duty 1/2)
Without carrier (high level)
fOSC/16
fOSC /2 (Duty 1/2)
b4 and b5 : These bits specify the high-order 2 bits (DP8 and DP9) of ROM’s data pointer.
Remark
×: don’t care
Data Sheet U11281EJ3V0DS00
17
µPD6604
3.4 Control Register 1 (P4)
Control register 1 consists of 8 bits. The contents that can be controlled are as shown below.
When reset, the register becomes 0010 0110B.
Table 3-6. Control Register 1 (P4)
Bit
b7
Name
b6
—
—
b5
b4
KI
S0/S1
b3
—
Pull-down Pull-down
b2
b1
b0
S1/LED
KI/O
S0
mode
mode
mode
Set
0
Fixed
Fixed
OFF
OFF
Fixed
S1
IN
OFF
value
1
to “0”
to “0”
ON
ON
to “0”
LED
OUT
IN
0
0
1
0
0
1
1
0
When reset
b0
: Specifies the input mode of the S0 port. “0” = OFF mode (high impedance); “1” = IN (INPUT mode).
b1
: Specifies the I/O mode of the KI/O port.
“0” = IN (INPUT mode); “1” = OUT (OUTPUT mode).
b2
: Specifies the I/O mode of the S1/LED port. “0” = S1 (INPUT mode); “1” = LED (output mode).
b4
: Specifies the availability of the pull-down resistor in S0/S1 port INPUT mode. “0” = OFF (unavailable);
b5
: Specifies the availability of the pull-down resistor in KI port. “0” = OFF (unavailable);
“1” = ON (available)
“1” = ON (available).
Remark In OUTPUT mode or in OFF mode, all the pull-down resistors are automatically disconnected.
18
Data Sheet U11281EJ3V0DS00
µPD6604
4. TIMER
4.1 Timer Configuration
The timer is the block used for creating a remote control transmission pattern. As shown in Figure 4-1, it consists
of a 9-bit down counter (t8 to t0), a flag (t9) permitting the 1-bit timer output, and a zero detecting circuit.
Figure 4-1. Timer Configuration
t9
t8
T0
t7
t6
t5
t4
t3
t2
9-bit down counter
t0
fOSC/8
fOSC/16
Timer operation end signal
(HALT #×101B release
signal)
S1/LED
Carrier
synchronous
circuit
REM
t1
Count
clock
Selector
Bit 3 of control register 0 (P3)
T
T1
Zero detecting circuit
Bit 2 of control register 0 (P3)
Carrier signal
Data Sheet U11281EJ3V0DS00
19
µPD6604
4.2 Timer Operation
The timer starts (counting down) when a value other than 0 is set for the down counter with a timer operation
instruction. The timer operation instructions for making the timer start operation are shown below:
MOV T0, A
MOV T1, A
MOV T, #data10
MOV T, @R0
The down counter is decremented (–1) in the cycle of 8/fOSC or 16/fOSCNote. If the value of the down counter
becomes 0, the zero detecting circuit generates the timer operation end signal to stop the timer operation. At this
time, if the timer is in HALT mode (HALT #×101B) waiting for the timer to stop its operation, the HALT mode is
canceled and the instruction following the HALT instruction is executed. The output of the timer operation end signal
is continued while the down counter is 0 and the timer is stopped. There is the following relational expression
between the timer’s time and the down counter’s set value.
Timer time = (Set value + 1) × 8/fOSC (or 16/fOSCNote)
Note This becomes 16/fOSC if bit 3 of the control register is set (to 1).
By setting 1 for the flag (t9) which enables the timer output, the timer can output its operation status from the
S1/LED pin and the REM pin. The REM pin can also output the carrier while the timer is in operation.
Table 4-1. Timer Output (at t9 = 1)
S 1/LED Pin
REM Pin
Timer operating
L
H (or carrier outputNote)
Timer halting
H
L
Note The carrier output results if bit 2 of the control register 0 is cleared (to 0).
Figure 4-2. Timer Output (When Carrier is Not Output)
Timer value: (Set value + 1) × 8/fOSC (or 16/fOSC)
LED
REM
20
Data Sheet U11281EJ3V0DS00
µPD6604
4.3 Carrier Output
The carrier for remote-controlled transmission can be output from the REM pin by clearing (to 0) bit 2 of the control
register 0.
As shown in Figure 4-3, in the case where the timer stops when the carrier is at a high level, the carrier continues
to be output until its next fall and then stops due to the function of the carrier synchronous circuit. When the timer
starts operation, however, the high-level width of the first carrier may become shorter than the specified width.
Figure 4-3. Timer Output (When Carrier is Output)
Timer value: (set value + 1) × 8/fOSC (16/fOSC)
LED
REM (at low-level started)
Note 1
REM (at high-level started)
Note 2
Notes 1. Error when the REM output ends: Lead by “the carrier’s low-level width” to lag by “the carrier’s highlevel width”
2. Error of the carrier’s high-level width: 0 to “the carrier’s high-level width”
4.4 Software Control of Timer Output
The timer output can be controlled by software. As shown in Figure 4-4, the pulse with a minimum width of 1instruction cycle (8/fOSC) can be output.
Figure 4-4. Pulse Output of 1-Instruction Cycle Width
..
.
MOV T, #0000000000B; low-level output from the REM pin
..
.
MOV T, #1000000000B; high-level output from the REM pin
MOV T, #0000000000B; low-level output from the REM pin
..
.
8/fOSC
LED
REM
Data Sheet U11281EJ3V0DS00
21
µPD6604
5. STANDBY FUNCTION
5.1 Outline of Standby Function
To save current consumption, two types of standby modes, i.e., HALT mode and STOP mode, are made available.
In STOP mode, the system clock stops oscillation. At this time, the OSCIN and OSC OUT pins are fixed at a low
level.
In HALT mode, CPU operation halts, while the system clock continues oscillation. When in HALT mode, the
timer (including REM output and LED output) operates.
In either STOP mode or HALT mode, the statuses of the data memory, accumulator, and port register, etc.
immediately before the standby mode is set are retained. Therefore, make sure to set the port status for the system
so that the current consumption of the whole system is suppressed before the standby mode is set.
Table 5-1. Statuses During Standby Mode
STOP Mode
Setting instruction
HALT Mode
HALT instruction
Clock oscillation circuit
Oscillation stopped
CPU
• Operation halted
Data memory
• Immediately preceding status retained
Operation
Accumulator
• Immediately preceding status retained
statuses
Flag
Oscillation continued
F
• 0 (When 1, the flag is not placed in the standby mode.)
CY
• Immediately preceding status retained
Port register
• Immediately preceding status retained
Timer
• Operation halted
(The count value is reset to “0”)
• Operable
Cautions 1. Write the NOP instruction as the first instruction after STOP mode is released.
2. When standby mode is canceled, the status flag (F) is set (to 1).
3. If, at the point the standby mode has been set, its cancelation condition is met, then the
system is not placed in the standby mode. However, the status flag (F) is set (1).
22
Data Sheet U11281EJ3V0DS00
µPD6604
5.2 Standby Mode Setup and Release
The standby mode is set with the HALT #b3b 2b1b 0B instruction for both STOP mode and HALT mode. For the
standby mode to be set, the status flag (F) is required to have been cleared (to 0).
The standby mode is released by the release condition specified with the RESET (RESET input; POC) or the
operand of HALT instruction. If the standby mode is released, the status flag (F) is set (to 1).
Even when the HALT instruction is executed in the state that the status flag (F) has been set (to 1), the standby
mode is not set. If the release condition is not met at this time, the status flag is cleared (to 0). If the release condition
is met, the status flag remains set (to 1).
Even in the case when the release condition has been already met at the point that the HALT instruction is
executed, the standby mode is not set. Here, also, the status flag (F) is set (to 1).
Caution Depending on the status of the status flag (F), the HALT instruction may not be executed. Be
careful about this. For example, when setting HALT mode after checking the key status with
the STTS instruction, the system does not enter HALT mode as long as the status flag (F)
remains set (to 1) thus sometimes performing an unintended operation. In this case, the
intended operation can be realized by executing the STTS instruction immediately after timer
setting to clear (to 0) the status flag.
#03H
;To check the KI pin status.
MOV
T, #0xxH
;To set the timer
STTS
#05H
;To clear the status flag
STTS
…
…
Example
HALT
(During this time, be sure not to execute an instruction that may set the status flag.)
#05H
;To set HALT mode
Table 5-2. Addresses Executed After Standby Mode Released
Release Condition
Address Executed After Released
Reset
0 address
Release condition shown in Table 5-3
The address following the HALT instruction
Data Sheet U11281EJ3V0DS00
23
µPD6604
Table 5-3. Standby Mode Setup (HALT #b3b2b1b0B) and Release Conditions
Operand Value of
HALT Instruction
Setting Mode
Precondition for Setup
Release Condition
b3
b2
b1
b0
0
0
0
0
STOP
All KI/O pins are high-level output.
High level is input to at least one
of KI pins.
0
1
1
STOP
All KI/O pins are high-level output.
High level is input to at least one
of KI pins.
1
1
0
STOPNote 1
The KI/O0 pin is high-level output.
High level is input to at least one
of KI pins.
1
Any of the
STOP
[The following condition is added in addition to the above.]
combinations of
—
High level is input to at least one
of S0 and S1 pins Note 2.
b2b1b0 above
0/1
1
0
1
HALT
—
When the timer’s down counter is 0
Notes 1. When setting HALT #×110B, configure a key matrix by using the KI/O0 pin and the KI pin so that an
internal reset takes effect at the time of program overrun.
2. At least one of the S0 and S1 pins (the pin used for canceling the standby) must be in INPUT mode.
(The internal reset does not take effect even when both pins are in OUTPUT mode.)
Cautions 1. The internal reset takes effect when the HALT instruction is executed with an operand value
other than that above or when the precondition has not been satisfied when executing the
HALT instruction.
2. If STOP mode is set when the timer’s down counter is not 0 (timer operating), the system
is placed in STOP mode only after all the 10 bits of the timer’s down counter and the timer
output permit flag are cleared to 0.
3. Write the NOP instruction as the first instruction after STOP mode is released.
5.3 Standby Mode Release Timing
(1) STOP Mode Release Timing
Figure 5-1. STOP Mode Cancelation by Release Condition
HALT instruction
(STOP mode)
Wait
(36/fOSC)
Standby
release signal
OPERATING
mode
STOP mode
Oscillation
Oscillation
stopped
HALT mode
OPERATING
mode
Oscillation
Clock
Caution When a release condition is established in the STOP mode, the device is released from the
STOP mode and goes into a wait status. At this time, if the release condition is not held,
the device goes into the STOP mode again after the wait time has elapsed. Therefore, when
releasing the STOP mode, it is necessary to hold the release condition longer than the wait
time.
24
Data Sheet U11281EJ3V0DS00
µPD6604
Figure 5-2. STOP Mode Release by RESET Input
HALT instruction
(STOP mode)
Wait
(60 to 116)/fOSC
0 address start
RESET
OPERATING
mode
Oscillation
STOP
mode
Reset
HALT mode
Oscillation stopped
OPERATING
mode
Oscillation
Clock
(2) HALT Mode Release Timing
Figure 5-3. HALT Mode Release by Release Condition
Standby
release signal
HALT instruction
(HALT mode)
OPERATING
mode
HALT mode
OPERATING mode
Oscillation
Clock
Figure 5-4. HALT Mode Release by RESET Input
HALT instruction
(HALT mode)
Wait
(60 to 116)/fOSC
0 address start
RESET
OPERATING
HALT mode
mode
Oscillation
Reset
HALT mode
Oscillation
stopped
OPERATING
mode
Oscillation
Clock
Data Sheet U11281EJ3V0DS00
25
µPD6604
6. RESET PIN
The system reset takes effect by inputting low level to the RESET pin.
While the RESET pin is at low level, the system clock oscillator is stopped and the OSCOUT pin is fixed to highimpedance, the OSCIN pin is fixed to the GND.
If the RESET pin is raised from low level to high level, it executes the program from the 0 address after counting
60 to 116 of the system clock (f OSC).
Figure 6-1. Reset Operation by RESET Input
Wait
(60 to 116)/fOSC
0 address start
RESET
OPERATING mode or Oscillation
STANDBY mode
stopped
HALT mode
OPERATING
mode
The RESET pin outputs low level when the POC circuit (mask option) is in operation.
Caution When connecting a reset IC to the RESET pin, ensure that the IC is of the N-ch open-drain output
type.
Table 6-1. Hardware Statuses After Resetting
• RESET Input in Operation
• Resetting by Internal POC Circuit in Operation
• Resetting by Other FactorsNote 1
Hardware
PC (10 bits)
000H
SP (1 bit)
0B
Data
R0 = DP
000H
memory
R1-RF
Undefined
Accumulator (A)
Undefined
• Status flag (F)
• Carry flag (CY)
0B
Timer (10 bits)
000H
Port register
P0
FFH
P1
×FHNote 2
Control register P3
03H
P4
26H
• RESET Input During STANDBY Mode
• Resetting by the Internal POC Circuit During
STANDBY Mode
Previous status retained
Notes 1. The following resets are available.
• Reset when executing the HALT instruction (when the operand value is illegal or does not satisfy
the precondition)
• Reset when executing the RLZ instruction (when A = 0)
• Reset by stack pointer’s overflow or underflow
2. Refers to the value by the KI pin status.
In order to prevent malfunction, be sure to input a low level to more than one of pins KI0 to KI3 when
reset is released (when RESET pin changes from low level to high level, or POC is released due to
supply voltage startup).
26
Data Sheet U11281EJ3V0DS00
µPD6604
7. POC CIRCUIT (MASK OPTION)
The POC circuit monitors the power supply voltage and applies an internal reset in the microcontroller at the
time of battery replacement. If the applied circuit satisfies the following conditions, the POC circuit can be
incorporated by the mask option.
• High reliability is not required.
• Clock frequency fOSC = 300 to 500 kHz
• Power supply voltage VDD = 2.2 to 3.6 V
• Operating ambient temperature TA = –20 to +70 °C
Cautions 1. The one-time PROM product (µPD66P04B) originally contains the POC circuit.
2. There are cases in which the POC circuit cannot detect a low power supply voltage of less
than 1 ms. Therefore, if the power supply voltage has become low for a period of less than
1 ms, the POC circuit may malfunction because it does not generate an internal reset signal.
3. If the applied circuit does not satisfy the conditions above, design the applied circuit in such
a manner that the reset takes effect without failure within the power supply voltage range
by means of an external reset circuit.
4. In order to prevent malfunction, be sure to input a low level to more than one of pins KI0 to
KI3 when reset is released (when RESET pin changes from low level to high level, or POC
is released due to supply voltage startup).
Remarks 1. It is recommended that the POC circuit be incorporated when applied circuits are infrared remotecontrol transmitters for consumer appliances.
2. Even when a POC circuit is incorporated, the externally entered RESET input is valid with the OR
condition; therefore, the POC circuit and the RESET input can be used at the same time. However,
if the POC circuit detects a low power supply voltage, the RESET pin will be forced to low level;
therefore, use an N-ch open drain output or NPN open collector output for the external reset circuit.
Data Sheet U11281EJ3V0DS00
27
µPD6604
7.1 Functions of POC Circuit
The POC circuit has the following functions:
• Generates an internal reset signal when VDD ≤ V POC.
• Cancels an internal reset signal when VDD > VPOC.
Here, VDD: power supply voltage, VPOC: POC-detected voltage.
VDD
Operating ambient temperature TA = _ 20 to + 70°C
3.6 V
Clock frequency fOSC = 300 to 500 kHz
2.2 V
←POC-detected voltage VPOC = 0.9 to 2.2 VNote 3
VPOS
0.9 V
0V
→t
Internal reset signal
Reset
↑
Note 1
OPERATING mode
↑ Reset
Note 2
Notes 1. In reality, there is the oscillation stabilization wait time until the circuit is switched to OPERATING
mode. The oscillation stabilization wait time is about 60/fOSC to about 116/fOSC (about 130 to 250 µs;
when fOSC = 455 kHz).
2. For the POC circuit to generate an internal reset signal when the power supply voltage has fallen,
it is necessary for the power supply voltage to be kept less than the VPOC for the period of 1 ms or
more. Therefore, in reality, there is the time lag of up to 1 ms until the reset takes effect.
3. The POC-detected voltage (VPOC) varies between 0.9 to 2.2 V; thus, the resetting may be canceled
at a power supply voltage smaller than the assured range (VDD = 1.8 to 3.6 V). However, as long as
the conditions for operating the POC circuit are met, the actual lowest operating power supply voltage
becomes lower than the POC-detected voltage. Therefore, there is no malfunction occurring due to
the shortage of power supply voltage.
28
Data Sheet U11281EJ3V0DS00
µPD6604
8. SYSTEM CLOCK OSCILLATOR
The system clock oscillator consists of RC oscillation circuits (fOSC = 300 kHz to 1 MHz).
Figure 8-1. System Clock
µ PD6604
OSCOUT
OSCIN
GND
R
C
The system clock oscillator stops its oscillation when reset or in STOP mode.
Caution When using the system clock oscillator, wire area indicated by the dotted-line in the diagram
as follows to reduce the effects of the wiring capacitance, etc.
• Make the wiring as short as possible.
• Do not allow the wiring to intersect other signal lines. Do not wire close to lines through
which large fluctuating currents flow.
• Make sure that the point where the oscillation circuit capacitor is installed is always at the
same electric potential as the ground. Never earth with a ground pattern through which large
currents flow.
• Do not extract signals from the oscillation circuit.
Data Sheet U11281EJ3V0DS00
29
µPD6604
Remark Theoretically, the oscillation frequency of the system clock is determined by the values of C and R.
Actually, however, it also changes depending on supply voltage VDD and operating ambient temperature
TA. Moreover, the oscillation frequency of some devices differs from that of the others even when R and
C of the same values are connected because of variations in the devices and wiring of the set board.
It is therefore difficult to accurately calculate the values of the oscillation frequency and R.
However, an approximate value can be obtained by an approximate calculation (such as an expression
calculating the value of R from the fOSC value) using data measured under fixed conditions.
The expression shown below was obtained experimentally. This can be used to calculate the resistor
R necessary to obtain the oscillation frequency fOSC under the conditions of C = 27 pF, VDD = 3.0 V,
and TA = 25 °C.
R=
26400
fOSC [kHz]
– 2.40 [kΩ] (Where VDD = 3.0 V, and TA = 25 °C, and C = 27 pF)
Example of fOSC vs R characteristics (Reference)
(C = 27 pF, VDD = 3.0 V, and TA = 25 °C)
Oscillation frequency fOSC [kHz]
1000
300
100
10
20
30
Oscillation resistance R [kΩ]
30
Data Sheet U11281EJ3V0DS00
50
70
80
100
µPD6604
9. INSTRUCTION SET
9.1 Machine Language Output by Assembler
The bit length of the machine language of this product is 10 bits per word. However, the machine language that
is output by the assembler is extended to 16 bits per word. As shown in the example below, the expansion is made
by inserting 3-bit extended bits (111) in two locations.
Figure 9-1. An Example of Assembler Output (10 bits extended to 16 bits)
<1> In the case of “ANL A, @R0H”
1 1 1
1
1 0 1 0
1
1
1 0 1 0
1 1 1
Extended bits
0 0 0 0
1
0 0 0 0
= FAF0
1 0 0 0
= E6F8
Extended bits
<2> In the case of “OUT P0, #data8”
1 1 1
Extended bits
0
0 1 1 0
1
0
0 1 1 0
1 1 1
1 0 0 0
1
Extended bits
Data Sheet U11281EJ3V0DS00
31
µPD6604
9.2 Circuit Symbol Description
32
A
: Accumulator
ASR
: Address Stack Register
addr
: Program memory address
CY
: Carry flag
data4
: 4-bit immediate data
data8
: 8-bit immediate data
data10
: 10-bit immediate data
F
: Status flag
PC
: Program Counter
Pn
: Port register pair (n = 0, 1, 3, 4)
P0n
: Port register (low-order 4 bits)
P1n
: Port register (high-order 4 bits)
ROMn
: Bit n of the program memory’s (n = 0-9)
Rn
: Register pair
R0n
: Data memory (General-purpose register; n = 0-F)
R1n
: Data memory (General-purpose register; n = 0-F)
SP
: Stack Pointer
T
: Timer register
T0
: Timer register (low-order 4 bits)
T1
: Timer register (high-order 4 bits)
(×)
: Content addressed with ×
Data Sheet U11281EJ3V0DS00
µPD6604
9.3 Mnemonic to/from Machine Language (Assembler Output) Contrast Table
Accumulator Operation Instructions
Instruction Code
Operand
1st Word
Operation
Instruction
Instruction
Length
Cycle
3rd Word
A, R0n
FBEn
(A) ← (A)
A, R1n
FAEn
CY ← A3 • Rmn3
A, @R0H
FAF0
(A) ← (A)
∨
ANL
2nd Word
∨
Mnemonic
(Rmn)
m = 0, 1
n = 0-F
1
1
((P13), (R0))7-4
CY ← A3 • ROM7
(A) ← (A)
FBF0
∨
A, @R0L
((P13), (R0)) 3-0
CY ← A3 • ROM3
FBF1
data4
(A) ← (A)
∨
A, #data4
data4
2
CY ← A3 • data4 3
ORL
A, R0n
FDEn
(A) ← (A) ∨ (Rmn)
A, R1n
FCEn
CY ← 0
A, @R0H
FCF0
m = 0, 1
n = 0-F
1
(A) ← (A) ∨ ((P13), (R0))7-4
CY ← 0
A, @R0L
(A) ← (A) ∨ ((P13), (R0))3-0
FDF0
CY ← 0
A, #data4
FDF1
data4
(A) ← (A) ∨ data4
2
CY ← 0
XRL
A, R0n
F5En
(A) ← (A) ∨ (Rmn)
A, R1n
F4En
CY ← A3 • Rmn3
A, @R0H
F4F0
(A) ← (A) ∨ ((P13), (R0))7-4
m = 0, 1
n = 0-F
1
CY ← A3 • ROM7
A, @R0L
(A) ← (A) ∨ ((P13), (R0))3-0
F5F0
CY ← A3 • ROM3
A, #data4
F5F1
data4
(A) ← (A) ∨ data4
2
CY ← A3 • data4 3
INC
A
F4F3
(A) ← (A) + 1
if (A) = 0
1
CY ← 1
else CY ← 1
RL
A
FCF3
(An+1) ← (A n), (A 0) ← (A3)
RLZ
A
FEF3
if A = 0
CY ← A3
reset
else (An+1) ← (An), (A0) ← (A3)
CY ← A3
Data Sheet U11281EJ3V0DS00
33
µPD6604
Input/output Instructions
IN
OUT
ANL
ORL
XRL
Mnemonic
Instruction Code
Operand
2nd Word
3rd Word
A, P0n
FFF8 + n
—
—
(A) ← (Pmn)
A, P1n
FEF8 + n
—
—
CY ← 0
(Pmn) ← (A)
P0n, A
E5F8 + n
—
—
P1n, A
E4F8 + n
—
—
Remark
m = 0, 1
n = 0, 1, 3, 4
m = 0, 1
n = 0, 1, 3, 4
A, P0n
FBF8 + n
—
—
(A) ← (A)
A, P1n
FAF8 + n
—
—
CY ← A3 • Pmn 3
A, P0n
FDF8 + n
—
—
(A) ← (A) ∨ (Pmn) m = 0, 1 n = 0, 1, 3, 4
A, P1n
FCF8 + n
—
—
CY ← 0
A, P0n
F5F8 + n
—
—
(A) ← (A) ∨ (Pmn) m = 0, 1 n = 0, 1, 3, 4
A, P1n
F4F8 + n
—
—
CY ← A3 • Pmn 3
Pn, #data8 E6F8 + n
2nd Word
Instruction
Instruction
Length
Cycle
1
1
Instruction
Instruction
(Pmn) m = 0, 1 n = 0, 1, 3, 4
Instruction Code
Operand
1st Word
OUT
Operation
1st Word
∨
Mnemonic
Operation
3rd Word
Length
(Pn) ← data8
data8
n = 0, 1, 3, 4
2
Cycle
1
Pn: P1n-P0n are dealt with in pairs.
Data Transfer Instruction
Mnemonic
Instruction Code
Operand
1st Word
MOV
2nd Word
Operation
Instruction
Instruction
Length
Cycle
3rd Word
A, R0n
FFEn
(A) ← (Rmn)
A, R1n
FEEn
CY ← 0
A, @R0H
FEF0
(A) ← ((P13), (R0))7-4
m = 0, 1
n = 0-F
1
1
CY ← 0
A, @R0L
(A) ← ((P13), (R0))7-4
FFF0
CY ← 0
Mnemonic
A, #data4
FFF1
R0n, A
E5En
R1n, A
E4En
Instruction Code
Operand
Remark
34
2
(Rmn) ← (A)
1st Word
MOV
(A) ← data4
CY ← 0
data4
2nd Word
m = 0, 1
n = 0-F
Operation
1
Instruction
Instruction
Length
Cycle
3rd Word
Rn, #data8 E6En
data8
—
(R1n-R0n) ← data8
n = 0-F
2
Rn, @R0
—
—
(R1n-R0n) ← ((P13), (R0))
n = 1-F
1
E7En
Rn: R1n-R0n are dealt with in pairs.
Data Sheet U11281EJ3V0DS00
1
µPD6604
Branch Instructions
Mnemonic
Instruction Code
Operand
1st Word
JMP
JC
JNC
JF
JNF
2nd Word
addr (Page 0) E8F1
addr
addr (Page 1) E9F1
addr
Operation
Instruction
Instruction
Length
Cycle
3rd Word
PC ← addr
2
1
PC ← addr
addr (Page 0) ECF1
addr
if CY = 1
addr (Page 1) EAF1
addr
else PC ← PC + 2
addr (Page 0) EDF1
addr
if CY = 0
addr (Page 1) EBF1
addr
else PC ← PC + 2
addr (Page 0) EEF1
addr
if F = 1
addr (Page 1) F0F1
addr
else PC ← PC + 2
addr (Page 0) EFF1
addr
if F = 0
addr (Page 1) F1F1
addr
else PC ← PC + 2
PC ← addr
PC ← addr
PC ← addr
Caution 0 and 1, which refer to PAGE0 and 1, are not written when writing mnemonics.
Subroutine Instructions
Mnemonic
Instruction Code
Operand
1st Word
CALL
2nd Word
3rd Word
addr (Page 0) E6F2
E8F1
addr
addr (Page 1) E6F2
E9F1
addr
RET
E8F2
Operation
Instruction
Instruction
Length
Cycle
SP ← SP + 1, ASR ← PC, PC ← addr
3
2
PC ← ASR, SP ← SP – 1
1
1
Caution 0 and 1, which refer to PAGE0 and 1, are not written when writing mnemonics.
Timer Operation Instructions
Mnemonic
Instruction Code
Operand
1st Word
MOV
Mnemonic
MOV
2nd Word
3rd Word
FFFF
A, T1
FEFF
CY ← 0
T0, A
E5FF
(Tn) ← (A)
T1, A
F4FF
(T) n ← 0
Instruction Code
1st Word
2nd Word
T, #data10
E6FF
data10
T, @R0
F4FF
Instruction
Length
(A) ← (Tn)
A, T0
Operand
Instruction
Operation
n = 0, 1
1
Cycle
1
n = 0, 1
Operation
Instruction
Instruction
Length
Cycle
3rd Word
(T) ← data10
1
1
(T) ← ((P13), (R0))
Data Sheet U11281EJ3V0DS00
35
µPD6604
Others
Mnemonic
Instruction Code
Operand
1st Word
2nd Word
Operation
HALT
#data4
E2F1
data4
Standby mode
STTS
#data4
E3F1
data4
if statuses match
R0n
E3En
else
FAF3
NOP
E0E0
Cycle
2
F←1
F←1
F←0
if A = 0FH
else
36
Instruction
Length
F←0
if statuses match
else
SCAF
Instruction
3rd Word
1
n = 0-F
CY ← 1
CY ← 0
PC ← PC + 1
Data Sheet U11281EJ3V0DS00
1
µPD6604
9.4 Accumulator Operation Instructions
ANL A, R0n
ANL A, R1n
1 1 0 1 R4 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (A) ← (A)
∨
<1> Instruction code :
(Rmn)
m = 0, 1
n = 0 to F
CY ← A 3 • Rmn3
The accumulator contents and the register Rmn contents are ANDed and the results are entered in the
accumulator.
ANL A, @R0H
ANL A, @R0L
1 1 0 1 0/1 1 0 0 0 0
<2> Cycle count
:1
<3> Function
: (A) ← (A)
∨
<1> Instruction code :
((P13), (R0)) 7-4 (in the case of ANL A, @R0H)
CY ← A 3 • ROM 7
∨
(A) ← (A)
((P13), (R0)) 3-0 (in the case of ANL A, @R0L)
CY ← A 3 • ROM 3
The accumulator contents and the program memory contents specified with the control register P13 and
register pair R10-R00 are ANDed and the results are entered in the accumulator.
If H is specified, b 7, b6, b5 and b4 take effect. If L is specified, b 3, b2, b1 and b0 take effect.
• Program memory (ROM) organization
b7
b9
b6
b5
b4
b8
b3
H↓
b2
b1
b0
L↓
Valid bits at the time of accumulator operation
ANL A, #data4
<1> Instruction code :
1 1 0 1 1 1 0 0 0 1
0 0 0 0 0 0 d3 d2 d1 d0
:1
<3> Function
: (A) ← (A)
∨
<2> Cycle count
data4
CY ← A 3 • data43
The accumulator contents and the immediate data are ANDed and the results are entered in the
accumulator.
Data Sheet U11281EJ3V0DS00
37
µPD6604
ORL A, R0n
ORL A, R1n
<1> Instruction code :
1 1 1 0 R4 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (Rmn)
m = 0, 1
n = 0 to F
CY ← 0
The accumulator contents and the register Rmn contents are ORed and the results are entered in the
accumulator.
ORL A, @R0H
ORL A, @R0L
<1> Instruction code :
1 1 1 0 0/1 1 0 0 0 0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (P13), (R0)) 7-4 (in the case of ORL A, @R0H)
(A) ← (A) ∨ (P13), (R0)) 3-0 (in the case of ORL A, @R0L)
CY ← 0
The accumulator contents and the program memory contents specified with the control register P13 and
register pair R10-R00 are ORed and the results are entered in the accumulator.
If H is specified, b7, b6, b5 and b4 take effect. If L is specified, b3, b2, b1 and b0 take effect.
ORL A, #data4
<1> Instruction code :
1 1 1 0 1 1 0 0 0 1
0 0 0 0 0 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ data4
CY ← 0
The accumulator contents and the immediate data are exclusive-ORed and the results are entered in
the accumulator.
XRL A, R0n
XRL A, R1n
<1> Instruction code :
1 0 1 0 R4 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (Rmn)
m = 0, 1
n = 0 to F
CY ← A 3 • Rmn3
The accumulator contents and the register Rmn contents are ORed and the results are entered in the
accumulator.
38
Data Sheet U11281EJ3V0DS00
µPD6604
XRL A, @R0H
XRL A, @R0L
<1> Instruction code :
1 0 1 0 0/1 1 0 0 0 0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (P13), (R0)) 7-4 (in the case of XRL A, @R0H)
CY ← A 3 • ROM 7
(A) ← (A) ∨ (P13), (R0)) 3-0 (in the case of XRL A, @R0L)
CY ← A 3 • ROM 3
The accumulator contents and the program memory contents specified with the control register P13 and
register pair R10-R00 are exclusive-ORed and the results are entered in the accumulator.
If H is specified, b7, b6, b5, and b4 take effect. If L is specified, b3, b2, b1, and b 0 take effect.
XRL A, #data4
<1> Instruction code :
1 0 1 0 1 1 0 0 0 1
0 0 0 0 0 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ data4
CY ← A 3 • data43
The accumulator contents and the immediate data are exclusive-ORed and the results are entered in
the accumulator.
INC A
<1> Instruction code :
1 0 1 0 0 1 0 0 1 1
<2> Cycle count
:1
<3> Function
: (A) ← (A) + 1
if
A = 0
else
CY ← 1
CY ← 0
The accumulator contents are incremented (+1).
RL A
<1> Instruction code :
1 1 1 0 0 1 0 0 1 1
<2> Cycle count
:1
<3> Function
: (A n + 1) ← (An), (A 0) ← (A3)
CY ← A 3
The accumulator contents are rotated anticlockwise bit by bit.
RLZ A
<1> Instruction code :
1 1 1 1 0 1 0 0 1 1
<2> Cycle count
:1
<3> Function
: if
A = 0
else
reset
(A n + 1) ← (An), (A 0) ←(A3)
CY ← A 3
The accumulator contents are rotated anticlockwise bit by bit.
If A = 0H at the time of command execution, an internal reset takes effect.
Data Sheet U11281EJ3V0DS00
39
µPD6604
9.5 Input/Output Instructions
IN A, P0n
IN A, P1n
<1> Instruction code :
1 1 1 1 P4 1 1 P2 P1 P0
<2> Cycle count
:1
<3> Function
: (A) ← (Pmn)
m = 0, 1
n = 0, 1, 3, 4
CY ← 0
The port Pmn data is loaded (read) onto the accumulator.
OUT P0n, A
OUT P1n, A
<1> Instruction code :
0 0 1 0 P4 1 1 P2 P1 P0
<2> Cycle count
:1
<3> Function
: (Pmn) ← (A)
m = 0, 1
n = 0, 1, 3, 4
The accumulator contents are transferred to port Pmn to be latched.
ANL A, P0n
ANL A, P1n
1 1 0 1 P4 1 1 P2 P1 P0
<2> Cycle count
:1
<3> Function
: (A) ← (A)
∨
<1> Instruction code :
(Pmn)
m = 0, 1
n = 0, 1, 3, 4
CY ← A 3 • Pmn
The accumulator contents and the port Pmn contents are ANDed and the results are entered in the
accumulator.
ORL A, P0n
ORL A, P1n
<1> Instruction code :
1 1 1 0 P4 1 1 P2 P1 P0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (Pmn)
m = 0, 1
n = 0, 1, 3, 4
CY ← 0
The accumulator contents and the port Pmn contents are ORed and the results are entered in the
accumulator.
XRL A, P0n
XRL A, P1n
<1> Instruction code :
1 0 1 0 P4 1 1 P2 P1 P0
<2> Cycle count
:1
<3> Function
: (A) ← (A) ∨ (Pmn)
m = 0, 1
n = 0, 1, 3, 4
CY ← A 3 • Pmn
The accumulator contents and the port Pmn contents are exclusive-ORed and the results are entered
in the accumulator.
40
Data Sheet U11281EJ3V0DS00
µPD6604
OUT Pn, #data8
<1> Instruction code :
0 0 1 1 0 1 1 P2 P1 P0
:
0 d7 d6 d5 d4 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: (Pn) ← data8
n = 0, 1, 3, 4
The immediate data is transferred to port Pn. In this case, port Pn refers to P1n-P 0n operating in pairs.
9.6 Data Transfer Instruction
MOV A, R0n
MOV A, R1n
<1> Instruction code :
1 1 1 1 R4 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (A) ← (Rmn)
m = 0, 1
n = 0 to F
CY ← 0
The register Rmn contents are transferred to the accumulator.
MOV A, @R0H
<1> Instruction code :
1 1 1 1 0 1 0 0 0 0
<2> Cycle count
:1
<3> Function
: (A) ← ((P13), (R0))7-4
CY ← 0
The high-order 4 bits (b7 b 6 b5 b4) of the program memory specified with control register P13 and register
pair R10-R00 are transferred to the accumulator. b9 is ignored.
MOV A, @R0L
<1> Instruction code :
1 1 1 1 1 1 0 0 0 0
<2> Cycle count
:1
<3> Function
: (A) ← ((P13), (R0))3-0
CY ← 0
The low-order 4 bits (b3 b 2 b1 b0) of the program memory specified with control register P13 and register
pair R10-R00 are transferred to the accumulator. b8 is ignored.
• Program memory (ROM) contents
@R0 H
b9
b7
b6
b5
@R0 L
b4
b8
b3
b2
b1
b0
MOV A, #data4
<1> Instruction code :
1 1 1 1 1 1 0 0 0 1
:
0 0 0 0 0 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: (A) ← data4
CY ← 0
The immediate data is transferred to the accumulator.
Data Sheet U11281EJ3V0DS00
41
µPD6604
MOV R0n, A
MOV R1n, A
<1> Instruction code :
0 0 1 0 R4 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (Rmn) ← (A)
m = 0, 1
n = 0 to F
The accumulator contents are transferred to register Rmn.
MOV Rn, #data8
<1> Instruction code :
0 0 1 1 0 0 R3 R2 R1 R0
:
0 d7 d6 d5 d4 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: (R1n-R0n) ← data8
n = 0-F
The immediate data is transferred to the register. Using this instruction, registers operate as register
pairs.
The pair combinations are as follows:
R0 : R10 - R00
R1 : R11 - R01
:
RE : R 1E - R0E
RF : R1F - R0F
Lower column
Higher column
MOV Rn, @R0
<1> Instruction code :
0 0 1 1 1 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: (R1n-R0n) ← ((P13), R0))
n = 1 to F
The program memory contents specified with control register P13 and register pair R10-R00 are
transferred to register pair R1n-R0n. The program memory consists of 10 bits and has the following
state after the transfer to the register.
Program memory
b9
b7
b6
b5
b4
b8
b3
b2
b1
b0
→
b9
b7
@R0
b6
b5
R1n
b4
b8
b3
b2
b1
b0
R0n
The high-order 2 bits of the program memory address is specified with the control register (P13).
42
Data Sheet U11281EJ3V0DS00
µPD6604
9.7 Branch Instructions
The program memory consists of pages in steps of 1K (000H to 3FFH). However, as the assembler automatically
performs page optimization, it is unnecessary to designate pages. The pages allowed for each product are as
follows.
µPD6604 (ROM: 1K steps)
: page 0
µPD66P04B (PROM: 1K steps) : page 0
JMP addr
<1> Instruction code : page 0
0 1 0 0 0 1 0 0 0 1
; page 1
0 1 0 0 1 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:1
<3> Function
: PC ← addr
The 10 bits (PC9-0) of the program counter are replaced directly by the specified address addr (a9 to
a0).
JC addr
<1> Instruction code : page 0
0 1 1 0 0 1 0 0 0 1
; page 1
0 1 0 1 0 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:1
<3> Function
: if
CY = 1
else
PC ← addr
PC ← PC + 2
If the carry flag CY is set (to 1), a jump is made to the address specified with addr (a9 to a0).
JNC addr
<1> Instruction code : page 0
0 1 1 0 1 1 0 0 0 1
; page 1
0 1 0 1 1 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:1
<3> Function
: if
CY = 0
else
PC ← addr
PC ← PC + 2
If the carry flag CY is cleared (to 0), a jump is made to the address specified with addr (a9 to a0).
JF addr
<1> Instruction code : page 0
0 1 1 1 0 1 0 0 0 1
; page 1
1 0 0 0 0 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:1
<3> Function
: if
F = 1
else
PC ← addr
PC ← PC + 2
If the status flag F is set (to 1), a jump is made to the address specified with addr (a9 to a0).
JNF addr
<1> Instruction code : page 0
0 1 1 1 1 1 0 0 0 1
; page 1
1 0 0 0 1 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:1
<3> Function
: if
F = 0
else
PC ← addr
PC ← PC + 2
If the status flag F is cleared (to 0), a jump is made to the address specified with addr (a9 to a 0).
Data Sheet U11281EJ3V0DS00
43
µPD6604
9.8 Subroutine Instructions
The program memory consists of pages in steps of 1K (000H to 3FFH). However, as the assembler automatically
performs page optimization, it is unnecessary to designate pages. The pages allowed for each product are as
follows.
µPD6604 (ROM: 1K steps)
: page 0
µPD66P04B (PROM: 1K steps) : page 0
CALL addr
<1> Instruction code :
0 0 1 1 0 1 0 0 1 0
page 0
0 1 0 0 0 1 0 0 0 1
; page 1
0 1 0 0 1 1 0 0 0 1
a9 a7 a6 a5 a4 a8 a3 a2 a1 a0
<2> Cycle count
:2
<3> Function
: SP ← SP + 1
ASR ← PC
PC ← addr
Increments (+1) the stack pointer value and saves the program counter value in the address stack
register. Then, enters the address specified with the operand addr (a9 to a0) into the program counter.
If a carry is generated when the stack pointer value is incremented (+1), an internal reset takes effect.
RET
<1> Instruction code :
0 1 0 0 0 1 0 0 1 0
<2> Cycle count
:1
<3> Function
: PC ← ASR
SP ← SP – 1
Restores the value saved in the address stack register to the program counter. Then, decrements
(–1) the stack pointer.
If a borrow is generated when the stack pointer value is decremented (–1), an internal reset takes effect.
44
Data Sheet U11281EJ3V0DS00
µPD6604
9.9 Timer Operation Instructions
MOV A, T0
MOV A, T1
<1> Instruction code :
1 1 1 1 0/1 1 1 1 1 1
<2> Cycle count
:1
<3> Function
: (A) ← (Tn)
n = 0, 1
CY ← 0
The timer Tn contents are transferred to the accumulator. T1 corresponds to (t9, t8, t7, t6); T0 corresponds
to (t5, t4, t3, t2).
T
t9
t8
t7
t6
t5
T1
t4
t3
t2
t1
t0
T0
↓
MOV T, #data10
Can be set with
MOV T, @R0
MOV T0, A
MOV T1, A
<1> Instruction code :
0 0 1 0 0/1 1 1 1 1 1
<2> Cycle count
:1
<3> Function
: (Tn) ← (A)
n = 0, 1
The accumulator contents are transferred to the timer register Tn. T1 corresponds to (t9, t8, t7, t6); T0
corresponds to (t5, t4, t3, t2). After executing this instruction, if data is transferred to T1, t1 becomes 0;
if data is transferred to T0, t0 becomes 0.
MOV T, #data10
<1> Instruction code :
0 0 1 1 0 1 1 1 1 1
t1 t9 t8 t7 t6 t0 t5 t4 t3 t2
<2> Cycle count
:1
<3> Function
: (T) ← data10
The immediate data is transferred to the timer register T (t9-t 0).
Remark The timer time is set with
(set value + 1) × 8/fOSC or 16/fOSC.
Data Sheet U11281EJ3V0DS00
45
µPD6604
MOV T, @R0
<1> Instruction code :
0 0 1 1 1 1 1 1 1 1
<2> Cycle count
:1
<3> Function
: (T) ← ((P13), (R0))
Transfers the program memory contents to the timer register T (t9 to t0) specified with the control register
P13 and the register pair R10-R00.
The program memory, which consists of 10 bits, is placed in the following state after the transfer to the
register.
Timer
Program memory
t9
t1
t8
t7
t6
t0
T
t5
t4
t3
→
t2
@R0
t9
t8
t7
T1
t6
t5
t4
t3
t2
t1
t0
T0
The high-order 2 bits of the program memory address are specified with the control register (P13).
Caution When setting a timer value in the program memory, ensure to use the DT directive.
9.10 Others
HALT #data4
<1> Instruction code :
0 0 0 1 0 1 0 0 0 1
:
0 0 0 0 0 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: Sandby mode
Places the CPU in standby mode.
The condition for having the standby mode (HALT/STOP mode) canceled is specified with the immediate
data.
STTS R0n
<1> Instruction code :
0 0 0 1 1 0 R3 R2 R1 R0
<2> Cycle count
:1
<3> Function
: if statuses match
else
F ← 0
F← 1
n = 0 to F
Compares the S0, S1, KI/O, KI, and TIMER statuses with the register R0n contents. If at least one of the
statuses coincides with the bits that have been set, the status flag F is set (to 1).
If none of them coincide, the status flag F is cleared (to 0).
46
Data Sheet U11281EJ3V0DS00
µPD6604
STTS #data4
<1> Instruction code :
0 0 0 1 1 1 0 0 0 1
:
0 0 0 0 0 0 d3 d2 d1 d0
<2> Cycle count
:1
<3> Function
: if statuses match
else
F← 1
F ← 0
Compares the S0, S1, KI/O, KI, and TIMER statuses with the immediate data contents. If at least one
of the statuses coincides with the bits that have been set, the status flag F is set (to 1).
If none of them coincide, the status flag F is cleared (to 0).
SCAF (Set Carry If ACC = F H)
<1> Instruction code :
1 1 0 1 0 1 0 0 1 1
<2> Cycle count
:1
<3> Function
: if
A = 0FH
else
CY ← 1
CY ← 0
Sets the carry flag CY (to 1) if the accumulator contents are FH.
The accumulator values after executing the SCAF instruction are as follows:
Accumulator Value
Before execution
Carry Flag
After execution
×××0
0000
0 (clear)
××01
0001
0 (clear)
×011
0011
0 (clear)
0111
0111
0 (clear)
1111
1111
1 (set)
Remark
×: don’t care
NOP
<1> Instruction code :
0 0 0 0 0 0 0 0 0 0
<2> Cycle count
:1
<3> Function
: PC ← PC + 1
No operation
Data Sheet U11281EJ3V0DS00
47
µPD6604
10. ASSEMBLER RESERVED WORDS
10.1 Mask Option Directives
When creating the µPD6604 program, it is necessary to use a mask option directive in the assembler’s source
program to specify a mask option.
10.1.1 OPTION and ENDOP directives
From the OPTION directive on to the ENDOP directive are called the mask option definition block. The format
of the mask option definition block is as follows:
Format:
Symbol field
Mnemonic field
[Label:]
OPTION
Operand field
Comment field
[; Comment]
:
:
ENDOP
10.1.2 Mask option definition directive
The directives that can be used in the mask option definition block are listed in Table 10-1.
An example of the mask option definition is shown below.
Example:
Symbol field
Mnemonic field
Operand field
Comment field
OPTION
USEPOC
; POC circuit incorporated
ENDOP
Table 10-1. List of Mask Option Definition Directives
Name
POC
PRO File
Mask Option Definition Directive
USEPOC
(POC circuit incorporated)
Address value
Data value
2044H
01
NOUSEPOC
(Without POC circuit)
48
Data Sheet U11281EJ3V0DS00
00
µPD6604
11. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = +25 °C)
Parameter
Power supply voltage
Symbol
Input voltage
VI
Output voltage
VO
High-level output current
Test Conditions
Rating
Unit
–0.3 to +5.0
V
–0.3 to V DD + 0.3
V
–0.3 to V DD + 0.3
V
VDD
IOHNote
KI/O, K I, S0, S1, RESET
REM
LED
Peak value
–30
mA
rms
–20
mA
Peak value
–7.5
mA
–5
mA
–13.5
mA
–9
mA
rms
One KI/O pin
Peak value
rms
Total of LED and KI/O pins
Low-level output current
IOL Note
REM
Peak value
–18
mA
rms
–12
mA
Peak value
7.5
mA
5
mA
rms
LED
Peak value
rms
7.5
mA
5
mA
Operating ambient
temperature
TA
–40 to +85
°C
Storage temperature
Tstg
–65 to +150
°C
Note Work out the rms with: [rms] = [Peak value] × Duty.
Caution Product quality may suffer if the absolute rating is exceeded for any parameter, even momentarily. In other words, an absolute maxumum rating is a value at which the possibility of psysical
damage to the product cannnot be ruled out. Care must therefore be taken to ensure that the
these ratings are not exceeded during use of the product.
Recommended Power Supply Voltage Range (TA = –40 to +85 °C)
Parameter
Power supply voltage
Symbol
VDD
Test Conditions
MIN.
TYP.
MAX.
Unit
fOSC = 300 to 500 kHz
1.8
3.0
3.6
V
fOSC = 500 kHz to 1 MHz
2.2
3.0
3.6
V
When using the POC circuit (mask option)
2.2
3.0
3.6
V
T A = –20 to +70 °C
fOSC = 300 to 500 kHz
Data Sheet U11281EJ3V0DS00
49
µPD6604
DC Characteristics (TA = –40 to +85 °C, VDD = 1.8 to 3.6 V)
Parameter
High-level input voltage
Low-level input voltage
Symbol
MAX.
Unit
VIH1
RESET
Test Conditions
0.8 VDD
MIN.
TYP.
VDD
V
VIH2
KI/O
0.65 VDD
VDD
V
VIH3
K I , S 0 , S1
0.65 VDD
VDD
V
VIL1
RESET
0
0.2 VDD
V
VIL2
KI/O
0
0.3 VDD
V
VIL3
K I , S 0 , S1
0
0.15 VDD
V
ILH1
KI
VI = VDD, pull-down resistor not incorporated
3
µA
ILH2
S 0, S 1
VI = VDD, pull-down resistor not incorporated
3
µA
Low-level input leakage
IUL1
KI
VI = 0 V
–3
µA
current
IUL2
KI/O
VI = 0 V
–3
µA
IUL3
S 0, S 1
VI = 0 V
–3
µA
High-level output voltage
VOH1
REM, LED, KI/O
IOH = –0.3 mA
Low-level output voltage
VOL1
REM, LED
IOL = 0.3 mA
High-level input
leakage current
0.8 VDD
V
0.3
V
VOL2
KI/O
IOL = 15 µA
High-level output current
IOH1
REM
VDD = 3.0 V, VOH = 1.0 V
–5
–9
mA
IOH2
KI/O
VDD = 3.0 V, VOH = 2.2 V
–2.5
–5
mA
Low-level output current
IOL1
KI/O
VDD = 3.0 V, VOL = 0.4 V
30
70
µA
VDD = 3.0 V, VOL = 2.2 V
100
220
Built-in pull-up resistor
R1
RESET
25
50
Built-in pull-down resistor
0.4
V
µA
100
kΩ
R2
RESET
2.5
5
15
kΩ
R3
K I , S 0 , S1
75
150
300
kΩ
250
500
kΩ
3.6
V
R4
KI/O
130
Data hold power supply
voltage
VDDOR
In STOP mode
0.9
Supply currentNote
IDD1
OPERATING
fOSC = 1.0 MHz, VDD = 3 V ± 10 %
0.5
1.0
mA
mode
fOSC = 455 kHz, VDD = 3 V ± 10 %
0.35
0.7
mA
IDD2
IDD3
HALT mode
STOP mode
fOSC = 1.0 MHz, VDD = 3 V ± 10 %
0.45
0.9
mA
fOSC = 455 kHz, VDD = 3 V ± 10 %
0.3
0.6
mA
VDD = 3 V ± 10 %
1.0
8.0
µA
VDD = 3 V ± 10 %, TA = 25 °C
0.1
1.0
µA
Note The POC circuit current and the current flowing in the built-in pull-up resistor are not included.
50
Data Sheet U11281EJ3V0DS00
µPD6604
AC Characteristics (TA = –40 to +85 °C, VDD = 1.8 to 3.6 V)
Parameter
Symbol
Command execution time
tCY
KI, S0, S1 high-level width
tH
Test Conditions
When canceling standby mode
RESET low-level width
MIN.
VDD = 2.2 to 3.6 V
MAX.
Unit
7.9
TYP.
27
µs
15.9
27
µs
10
µs
HALT mode
10
µs
STOP mode
Note
µs
10
µs
tRSL
Note 10 + 36/fOSC + oscillation growth time
Remark tCY = 8/fOSC (fOSC: System clock oscillator frequency)
POC Circuit (mask option Note 1) (TA = –20 to +70 °C)
Parameter
POC-detected
voltageNote 2
POC circuit current
Symbol
Test Conditions
VPOC
MIN.
0.9
IPOC
TYP.
MAX.
Unit
1.6
2.2
V
0.9
1.0
µA
Notes 1. Operates effectively under the conditions of T A = –20 to +70 °C, V DD = 2.2 to 3.6 V, and fOSC =
300 to 500 kHz.
2. Refers to the voltage with which the POC circuit cancels an internal reset. If VPOC < VDD , the internal
reset is canceled.
From the time of VPOC ≥ VDD until the internal reset takes effect, lag of up to 1 ms occurs. When the
period of VPOC ≥ VDD lasts less than 1 ms, the internal reset may not take effect.
System Clock Oscillation Circuit Characteristics (TA = –40 to +85 °C, VDD = 1.8 to 3.6 V)
Parameter
Oscillator frequency
Symbol
Test Conditions
fOSC
VDD = 2.2 to 3.6 V
MIN.
TYP.
MAX.
Unit
300
300
455
500
kHz
455
1000
kHz
Recommended Oscillation Circuit Constant (TA = –40 to +85 °C, VDD = 1.8 to 3.6 V) (Reference value)
Parameter
Symbol
Capacity of oscillation
capacitor
C
Oscillation resistance
R
Test Conditions
MIN.
TYP.
MAX.
Unit
22
27
33
pF
56
kΩ
An external circuit example
OSCIN
OSCOUT
R
C
Data Sheet U11281EJ3V0DS00
51
µPD6604
12. CHARACTERISTIC CURVE (REFERENCE VALUES)
fOSC vs VDD Characteristic Example
IDD vs VDD Characteristic Example
(C = 27 pF, TA = 25 °C)
(TA = 25 °C)
500
0.8
fOSC = 1 MHz OPERATING mode
fOSC = 1 MHz HALT mode
0.6
fOSC = 455 kHz OPERATING mode
fOSC = 455 kHz HALT mode
0.4
0.2
0
1.8
2.4
3.0
3.6
Oscillation frequency fOSC [kHz]
Power supply current IDD [mA]
1.0
480
460
R = 56 kΩ
440
420
400
4.2
0
1.8
2.4
3.0
3.6
4.2
Power supply voltage VDD [V]
Power supply voltage VDD [V]
IDD vs TA Characteristic Example
(C = 27 pF, VDD = 3.0 V)
IOL vs VOL Characteristic Example (REM, LED)
(TA = 25 °C, VDD = 3.0 V)
500
10
Low-level output current IOL [mA]
Oscillator frequency fOSC [kHz]
9
480
460
R = 56 kΩ
440
420
8
7
6
5
4
3
2
1
400
–50 –40 –30
–10
10
30
50
70
85 90
0.6
0
2.4
IOH vs VOH Characteristic Example (REM)
IOH vs VOH Characteristic Example (LED)
–10
–18
–9
–16
–14
–12
–10
–8
–6
–4
–2
0
VDD
3
(TA = 25 °C , VDD = 3.0 V)
–20
High-level output current IOH [mA]
High-level output current IOH [mA]
1.8
Low-level output voltage VOL [V]
(TA = 25 °C , VDD = 3.0 V)
–8
–7
–6
–5
–4
–3
–2
–1
VDD – 0.6 VDD – 1.2 VDD – 1.8 VDD – 2.4 VDD – 3
High-level output voltage VOH [V]
52
1.2
Operating temperature TA [°C]
0
VDD
VDD – 0.6 VDD – 1.2 VDD – 1.8 VDD – 2.4 VDD – 3
High-level output voltage VOH [V]
Data Sheet U11281EJ3V0DS00
µPD6604
IOL vs VOL Characteristic Example (KI/O)
IOH vs VOH Characteristic Example (KI/O)
(TA = 25 °C, VDD = 3.0 V)
High-level output current IOH [mA]
Low-level output current IOL [ µ A]
320
(TA = 25 °C, VDD = 3.0 V)
280
240
200
160
120
80
40
0
0.6
1.2
1.8
2.4
3
Low-level output voltage VOL [V]
–15
–14
–13
–12
–11
–10
–9
–8
–7
–6
–5
–4
–3
–2
–1
0
VDD
VDD – 0.6 VDD – 1.2 VDD – 1.8 VDD – 2.4 VDD – 3
High-level output voltage VOH [V]
Data Sheet U11281EJ3V0DS00
53
µPD6604
13. APPLIED CIRCUIT EXAMPLE
Example of Application to System
· Remote-control transmitter (40 keys; mode selection switch accommodated)
+
+
KI/O6
KI/O5
KI/O7
KI/O4
S0
KI/O3
S1/LED
KI/O2
REM
KI/O1
VDD
KI/O0
OSCOUT
KI3
OSCIN
KI2
GND
KI1
RESET
KI0
Mode selection switch
R
C
µ PD6604GS
Key matrix
8 × 5 = 40 keys
· Remote-control transmitter (48 keys accommodated)
+
+
KI/O6
KI/O5
KI/O7
KI/O4
S0
KI/O3
S1/LED
KI/O2
REM
KI/O1
VDD
KI/O0
OSCOUT
KI3
OSCIN
KI2
GND
KI1
RESET
KI0
R
C
µ PD6604GS
Key matrix
8 × 6 = 48 keys
Remark When the POC circuit of the mask option is used effectively, it is not necessary to connect the capacitor
enclosed in the dotted lines.
54
Data Sheet U11281EJ3V0DS00
µPD6604
14. PACKAGE DRAWINGS
(1) µ PD6604GS
20 PIN PLASTIC SOP (300 mil)
20
11
detail of lead end
P
1
10
A
H
I
G
J
L
C
D
M
M
B
K
N
E
F
NOTE
ITEM
Each lead centerline is located within 0.12 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
MILLIMETERS
INCHES
A
12.7±0.3
0.500±0.012
B
0.78 MAX.
0.031 MAX.
C
1.27 (T.P.)
0.050 (T.P.)
D
0.42 +0.08
–0.07
0.017 +0.003
–0.004
E
0.1±0.1
0.004±0.004
F
1.8 MAX.
0.071 MAX.
G
1.55±0.05
0.061±0.002
H
7.7±0.3
0.303±0.012
I
5.6±0.2
0.220 +0.009
–0.008
J
1.1
0.043
K
0.22 +0.08
–0.07
0.009 +0.003
–0.004
L
0.6±0.2
0.024 +0.008
–0.009
M
0.12
0.005
N
0.10
0.004
P
3° +7°
–3°
3° +7°
–3°
P20GM-50-300B, C-5
Remark The dimensions and materials of the ES model are the same as those of mass production model.
Data Sheet U11281EJ3V0DS00
55
µPD6604
(2) µ PD6604GS-GJG
20 PIN PLASTIC SHRINK SOP (300 mil)
20
11
detail of lead end
P
1
10
A
H
F
I
G
J
S
L
E
N
S
K
C
D
M
M
B
NOTE
ITEM
1. Controlling dimension
millimeter.
2. Each lead centerline is located within 0.12 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
MILLIMETERS
INCHES
A
6.7±0.3
0.264 +0.012
–0.013
B
0.575 MAX.
0.023 MAX.
C
0.65 (T.P.)
0.026 (T.P.)
D
0.32 +0.08
–0.07
0.013 +0.003
–0.004
E
0.125 ± 0.075
0.005 ± 0.003
F
2.0 MAX.
0.079 MAX.
G
1.7±0.1
0.067 +0.004
–0.005
H
I
8.1 ± 0.3
6.1 ± 0.2
0.319 ± 0.012
0.240 ± 0.008
J
1.0 ± 0.2
0.039 +0.009
–0.008
K
0.15 +0.10
–0.05
0.006 +0.004
–0.002
L
0.5 ± 0.2
0.020 +0.008
–0.009
M
0.12
0.005
N
0.10
0.004
P
3° +7°
–3°
3° +7°
–3°
P20GM-65-300B-3
Remark The dimensions and materials of the ES model are the same as those of mass production model.
56
Data Sheet U11281EJ3V0DS00
µPD6604
15. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 15-1. Soldering Conditions for Surface-Mount Type
µPD6604GS-×××
: 20-pin plastic SOP (300 mil)
µPD6604GS-×××-GJG : 20-pin plastic shrink SOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235 °C; time: 30 secs. max. (210 °C or higher);
count: no more than twice
IR35-00-2
VPS
Package peak temperature: 215 °C; time: 40 secs. max. (200 °C or higher);
VP15-00-2
count: no more than twice
Wave soldering
Solder bath temperature: 260 °C max.; time: 10 secs. max.; count: once
WS60-00-1
Preliminary heat temperature: 120 °C max. (Package surface temperature)
Partial heating
Pin temperature: 300 °C or less; time: 3 secs or less (for each side of the device)
—
Caution Using more than one soldering method should be avoided (except in the case of partial heating).
Data Sheet U11281EJ3V0DS00
57
µPD6604
APPENDIX A. DEVELOPMENT TOOLS
An emulator is provided for the µPD6604.
Hardware
• Emulator (EB-6133Note)
It is used to emulate the µPD6604.
Note This is a product of Naito Densei Machida Mfg. Co., Ltd. For details, consult Naito Densei Machida
Mfg. Co., Ltd. (044-822-3813).
Software
• Assembler (AS6133)
• This is a development tool for remote control transmitter software.
Part Number List of AS6133
Host Machine
PC-9800 series
OS
Supply Medium
Part Number
MS-DOSTM (Ver. 5.0 to Ver. 6.2)
3.5-inch 2HD
µS5A13AS6133
MS-DOS (Ver. 6.0 to Ver. 6.22)
3.5-inch 2HC
µS7B13AS6133
(CPU: 80386 or more)
IBM PC/ATTM compatible
PC DOSTM (Ver. 6.1 to Ver. 6.3)
Caution Although Ver.5.0 or later has a task swap function, this function cannot be used with this
software.
58
Data Sheet U11281EJ3V0DS00
µPD6604
APPENDIX B. FUNCTIONAL COMPARISON BETWEEN µPD6604 AND OTHER SUBSERIES
µPD6604
Item
µPD6133
1002 × 10 bits
µPD6600A
ROM capacity
1002 × 10 bits
RAM capacity
32 × 4 bits
32 × 5 bits
Stack
1 level (multiplexed with RF of RAM)
3 levels
(multiplexed with RAM)
Key matrix
8 × 6 = 48 keys
8 × 4 = 32 keys
S0 (S-IN) input
Read by P01 register (with function to release standby mode)
Read by left shift
instruction
S1/LED (S-OUT)
I/O (with function to release standby mode)
Output
Clock frequency
RC oscillation
Ceramic oscillation
Timer
512 × 10 bits
µPD6134
Ceramic oscillation
512 × 10 bits
• fX = 300 kHz to 1 MHz
• fX = 300 to 500 kHz (with POC circuit)
fX = 400 to 500 kHz
Clock
fX/8, fX /16
fX/8
Count start
Writing count value
Writing count value
and P1 register value
Frequency
• fX, f X/8, fX/12 (timer clock: fX/8)
• fX/2, f X/16, fX/24 (timer clock: fX/16)
• No carrier
fX/8, fX /12
Output start
Synchronized with timer
Not synchronized
with timer
Instruction execution time
8 µs (fX = 1 MHz)
16 µs (fX = 500 kHz)
Relative branch instruction
None
Provided
Left shift instruction
None
Provided
“MOV Rn, @R0” instruction
n = 1 to F
n = 0 to F
Standby mode
(HALT instruction)
HALT mode for timer only.
STOP mode for only releasing KI
(KI/O high-level output or KI/O0 high-level output)
HALT/STOP mode
set by P1 register
value
Relation between HALT
instruction execution and
status flag (F)
HALT instruction not executed when F = 1
HALT instruction
executed regardless
of status of F
Reset function by charging/
discharging capacitor
None
Provided
POC circuit
Mask option
Low level output to RESET pin on detection
Provided (low-voltage
detection circuit)
Low level output to
S-OUT pin on detection
Mask option
POC circuit only
(Circuits other than POC circuit are set by software.)
• Pull-down resistor
• Variable duty
• Hang-up detection
Supply voltage
• VDD = 1.8 to 3.6 V
• VDD = 2.2 to 3.6 V (with POC circuit)
VDD = 2.2 to 3.6 V
Operating temperature
• TA = –40 to +85 °C
• TA = –20 to +70 °C (with POC circuit)
TA = –20 to +70 °C
Package
• 20-pin plastic SOP
• 20-pin plastic shrink
SOP
• 20-pin plastic SOP
• 20-pin plastic SOP
• 20-pin plastic shrink
DIP
One-time PROM
µPD66P04B
µPD61P34B
µPD61P24
Carrier
Data Sheet U11281EJ3V0DS00
59
µPD6604
APPENDIX C. EXAMPLE OF REMOTE-CONTROL TRANSMISSION FORMAT
(in the case of NEC transmission format in command one-shot transmission mode)
Caution When using the NEC transmission format, please apply for a custom code at NEC.
(1) REM output waveform (From <2> on, the output is made only when the key is kept pressed.)
REM output
58.5 to 76.5 ms
<1>
108 ms
<2>
108 ms
Remark If the key is repeatedly pressed, the power consumption of the infrared light-emitting diode (LED) can
be reduced by sending the reader code and the stop bit from the second time.
(2) Enlarged waveform of <1>
<3>
REM output
9 ms
4.5 ms
Custom code
8 bits
13.5 ms
Leader code
Custom code'
8 bits
Data code
8 bits
18 to 36 ms
Data code
8 bits
Stop bit
1 bit
27 ms
58.5 to 76.5 ms
(3) Enlarged waveform of <3>
REM output
4.5 ms
9 ms
0.56 ms
1.125 ms 2.25 ms
0
1
13.5 ms
(4) Enlarged waveform of <2>
REM output
2.25 ms
9 ms
11.25 ms
Leader code
60
Data Sheet U11281EJ3V0DS00
0.56 ms
Stop bit
1
0
0
µPD6604
(5) Carrier waveform (Enlarged waveform of each code’s high period)
REM output
8.77 µ s
26.3 µ s
9 ms or 0.56 ms
Carrier frequency : 38 kHz
(6) Bit array of each code
C0 C1 C2 C3 C4 C5 C6 C7 C0' C1' C2' C3' C4' C5' C6' C7' D0 D1 D2 D3 D4 D5 D6 D7 D0 D1 D2 D3 D4 D5 D6 D7
=
=
=
=
=
=
=
=
C0 C1 C2 C3 C4 C5 C6 C7
or or or or or or or or
Co C1 C2 C3 C4 C5 C6 C7
Leader code
Custom code
Custom code'
Data code
Data code
Caution To prevent malfunction with other systems when receiving data in the NEC transmission
format, not only fully decode (make sure to check Data Code as well) the total 32 bits of the
16-bit custom codes (Custom Code, Custom Code’) and the 16-bit data codes (Data Code,
Data Code) but also check to make sure that no signals are present.
Data Sheet U11281EJ3V0DS00
61
µPD6604
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction
of the gate oxide and ultimately degrade the device operation. Steps must
be taken to stop generation of static electricity as much as possible, and
quickly dissipate it once, when it has occurred. Environmental control must
be adequate. When it is dry, humidifier should be used. It is recommended
to avoid using insulators that easily build static electricity. Semiconductor
devices must be stored and transported in an anti-static container, static
shielding bag or conductive material.
All test and measurement tools
including work bench and floor should be grounded. The operator should
be grounded using wrist strap. Semiconductor devices must not be touched
with bare hands. Similar precautions need to be taken for PW boards with
semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input
level may be generated due to noise, etc., hence causing malfunction. CMOS
device behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using a pull-up or pull-down
circuitry.
Each unused pin should be connected to VDD or GND with a
resistor, if it is considered to have a possibility of being an output pin. All
handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset
function have not yet been initialized. Hence, power-on does not guarantee
out-pin levels, I/O settings or contents of registers. Device is not initialized
until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
62
Data Sheet U11281EJ3V0DS00
µPD6604
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
NEC Electronics (Germany) GmbH
NEC Electronics Hong Kong Ltd.
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
Benelux Office
Eindhoven, The Netherlands
Tel: 040-2445845
Fax: 040-2444580
Hong Kong
Tel: 2886-9318
Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
Fax: 01-30-67 58 99
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics (France) S.A.
NEC Electronics Singapore Pte. Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 01908-670-290
Spain Office
Madrid, Spain
Tel: 91-504-2787
Fax: 91-504-2860
United Square, Singapore 1130
Tel: 65-253-8311
Fax: 65-250-3583
NEC Electronics Italiana s.r.l.
NEC Electronics (Germany) GmbH
Milano, Italy
Tel: 02-66 75 41
Fax: 02-66 75 42 99
Scandinavia Office
Taeby, Sweden
Tel: 08-63 80 820
Fax: 08-63 80 388
NEC Electronics (France) S.A.
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-2719-2377
Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division
Rodovia Presidente Dutra, Km 214
07210-902-Guarulhos-SP Brasil
Tel: 55-11-6465-6810
Fax: 55-11-6465-6829
J99.1
Data Sheet U11281EJ3V0DS00
63
µPD6604
MS-DOS is either a registered trademark or a trademark of Microsoft Corporation in the United
States and/or other countries.
PC/AT and PC DOS are trademarks of IBM Corp.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited
without governmental license, the need for which must be judged by the customer. The export or re-export of this product
from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
• The information in this document is current as of March, 1999. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4