INTEGRATED CIRCUITS DATA SHEET 74HC1G14; 74HCT1G14 Inverting Schmitt-trigger Product specification File under Integrated Circuits, IC06 1998 Aug 05 Philips Semiconductors Product specification Inverting Schmitt-trigger FEATURES • Wide operating voltage range: 2.0 to 6.0 V • Symmetrical output impedance • High noise immunity • Low power dissipation • Balanced propagation delays 74HC1G14; 74HCT1G14 QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf = 6.0 ns. TYP. SYMBOL 15 ns CI input capacitance 1.5 1.5 pF CPD power dissipation capacitance 20 22 pF notes 1 and 2 Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; DESCRIPTION The 74HC1G/HCT1G14 is a high-speed Si-gate CMOS device. The 74HC1G/HCT1G14 provides the inverting buffer function with Schmitt-trigger action. These devices are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The standard output currents are 1⁄2 compared to the 74HC/HCT14. FUNCTION TABLE See note 1. INPUT inA OUTPUT outY L H H L fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; ∑ (CL × VCC2 × fo) = sum of outputs. 2. For HC1G the condition is VI = GND to VCC. For HCT1G the condition is VI = GND to VCC − 1.5 V. PINNING PIN SYMBOL DESCRIPTION 1 n.c. not connected 2 inA data input 3 GND ground (0 V) 4 outY data output 5 VCC DC supply voltage Note 1. H = HIGH voltage level; L = LOW voltage level. 1998 Aug 05 HCT1G 10 – Astable multivibrators • Output capability: standard. UNIT HC1G propagation CL = 15 pF delay inA to outY VCC = 5 V – Wave and pulse shapers – Monostable multivibrators CONDITIONS tPHL/tPLH • Very small 5 pins package • Applications PARAMETER 2 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 ORDERING AND PACKAGE INFORMATION PACKAGES OUTSIDE NORTH AMERICA TEMPERATURE RANGE 74HC1G14GW −40 to +125 °C 74HCT1G14GW PINS PACKAGE MATERIAL CODE MARKING 5 SC-88A plastic SOT353 HF 5 SC-88A plastic SOT353 TF handbook, halfpage n.c 1 inA 2 GND 5 VCC handbook, halfpage 2 14 3 4 outY inA outY 4 MNA023 MNA022 Fig.1 Pin configuration. Fig.2 Logic symbol. handbook, halfpage 2 handbook, halfpage inA 4 outY MNA025 MNA024 Fig.3 IEC logic symbol. 1998 Aug 05 Fig.4 Logic diagram. 3 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 RECOMMENDED OPERATING CONDITIONS 74HC1G SYMBOL 74HCT1G PARAMETER UNIT MIN. TYP. MAX. MIN. TYP. MAX. VCC DC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 − VCC 0 − VCC V VO output voltage 0 − VCC 0 − VCC V Tamb operating ambient temperature range −40 +25 +125 −40 +25 +125 °C CONDITIONS see DC and AC characteristics per device LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC DC supply voltage −0.5 +7.0 V ±IIK DC input diode current VI < −0.5 or VI > VCC + 0.5 V; note 1 − 20 mA ±IOK DC output diode current VO < −0.5 or VO > VCC + 0.5 V; note 1 − 20 mA ±IO DC output source or sink current standard outputs −0.5 V < VO < VCC + 0.5 V; note 1 − 12.5 mA ±ICC DC VCC or GND current for types with standard outputs note 1 − 25 mA Tstg storage temperature range −65 +150 °C PD power dissipation per package − 200 mW 5 pins plastic SC-88A for temperature range: −40 to +125 °C above +55 °C derate linearly with 2.5 mW/K Note 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 Aug 05 4 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 DC CHARACTERISTICS FOR THE 74HC1G Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb (°C) SYMBOL −40 to +85 PARAMETER MIN. VOH VOH VOL HIGH-level output voltage; all outputs HIGH-level output voltage; standard outputs LOW-level output voltage; all outputs TEST CONDITIONS TYP.(1) −40 to +125 MAX. MIN. UNIT VCC (V) MAX. OTHER 1.9 2.0 − 1.9 − V 2.0 4.4 4.5 − 4.4 − V 4.5 5.9 6.0 − 5.9 − V 6.0 4.13 4.32 − 3.7 − V 4.5 VI = VIH or VIL; −IO = 2.0 mA 5.63 5.81 − 5.2 − V 6.0 VI = VIH or VIL; −IO = 2.6 mA − 0 0.1 − 0.1 V 2.0 VI = VIH or VIL; IO = 20 µA − 0 0.1 − 0.1 V 4.5 − 0 0.1 − 0.1 V 6.0 VI = VIH or VIL; −IO = 20 µA LOW-level output voltage; standard outputs − 0.15 0.33 − 0.4 V 4.5 VI = VIH or VIL; IO = 2.0 mA − 0.16 0.33 − 0.4 V 6.0 VI = VIH or VIL; IO = 2.6 mA II input leakage current − − 1.0 − 1.0 µA 6.0 VI = VCC or GND ICC quiescent supply current − − 10 − 20 µA 6.0 VI = VCC or GND; IO = 0 VOL Note 1. All typical values are measured at Tamb = 25 °C. DC CHARACTERISTICS FOR THE 74HC1G14 Voltages are referenced to GND (ground = 0 V). Tamb (°C) SYMBOL VT+ VT− VH −40 to +85 PARAMETER positive-going threshold negative-going threshold hysteresis (VT+ − VT−) −40 to +125 UNIT VCC (V) MIN. TYP.(1) 0.7 1.09 1.5 0.7 1.5 V 2.0 1.7 2.36 3.15 1.7 3.15 V 4.5 2.1 3.12 4.2 2.1 4.2 V 6.0 0.3 0.60 0.9 0.3 0.9 V 2.0 0.9 1.53 2.0 0.9 2.0 V 4.5 MAX. MIN. MAX. 1.2 2.08 2.6 1.2 2.6 V 6.0 0.2 0.48 1.0 0.2 1.0 V 2.0 0.4 0.83 1.4 0.4 1.4 V 4.5 0.6 1.04 1.6 0.6 1.6 V 6.0 Note 1. All typical values are measured at Tamb = 25 °C. 1998 Aug 05 TEST CONDITIONS 5 WAVEFORMS see Figs 5 and 6 see Figs 5 and 6 see Figs 5 and 6 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 DC CHARACTERISTICS FOR THE 74HCT1G Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb (°C) SYMBOL TEST CONDITIONS −40 to +85 PARAMETER TYP.(1) MIN. −40 to +125 MAX. MIN. UNIT VCC (V) MAX. OTHER VOH HIGH-level output voltage; all outputs 4.4 4.5 − 4.4 − V 4.5 VI = VIH or VIL; −IO = 20 µA VOH HIGH-level output voltage; standard outputs 4.13 4.32 − 3.7 − V 4.5 VI = VIH or VIL; −IO = 2.0 mA VOL LOW-level output voltage; all outputs − 0 0.1 − 0.1 V 4.5 VI = VIH or VIL; IO = 20 µA VOL LOW-level output voltage; standard outputs − 0.15 0.33 − 0.4 V 4.5 VI = VIH or VIL; IO = 2.0 mA II input leakage current − − 1.0 − 1.0 µA 5.5 VI = VCC or GND ICC quiescent supply current − − 10.0 − 20.0 µA 5.5 VI = VCC or GND; IO = 0 ∆ICC additional supply current per input − − 500 − 850 µA 4.5 to 5.5 VI = VCC − 2.1 V; IO = 0 Note 1. All typical values are measured at Tamb = 25 °C. DC CHARACTERISTICS FOR THE 74HCT1G14 Voltages are referenced to GND (ground = 0 V). Tamb (°C) SYMBOL −40 to +85 PARAMETER MIN. VT+ positive-going threshold TYP.(1) TEST CONDITIONS −40 to +125 MAX. MIN. UNIT VCC (V) MAX. 1.2 1.55 1.9 1.2 1.9 V 4.5 1.4 1.80 2.1 1.4 2.1 V 5.5 0.76 1.2 0.5 1.2 V 4.5 VT− negative-going threshold 0.5 0.6 0.90 1.4 0.6 1.4 V 5.5 VH hysteresis (VT+ − VT−) 0.4 0.80 − 0.4 − V 4.5 0.4 0.90 − 0.4 − V 5.5 Note 1. All typical values are measured at Tamb = 25 °C. 1998 Aug 05 6 WAVEFORMS see Figs 5 and 6 see Figs 5 and 6 see Figs 5 and 6 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 AC CHARACTERISTICS FOR 74HC1G14 GND = 0 V; tr = tf = 6.0 ns; CL = 50 pF. Tamb (°C) SYMBOL −40 to +85 PARAMETER MIN. TYP.(1) tPHL/tPLH propagation delay inA to outY TEST CONDITIONS −40 to +125 MAX. MIN. UNIT VCC (V) MAX. − 25 155 − 190 ns 2.0 − 12 31 − 38 ns 4.5 − 11 26 − 32 ns 6.0 WAVEFORMS see Figs 12 and 13 Note 1. All typical values are measured at Tamb = 25 °C. AC CHARACTERISTICS FOR 74HCT1G14 GND = 0 V; tr = tf = 6.0 ns; CL = 50 pF. Tamb (°C) SYMBOL −40 to +85 PARAMETER MIN. tPHL/tPLH propagation delay inA to outY − TYP.(1) 17 −40 to +125 MAX. MIN. − 43 Note 1. All typical values are measured at Tamb = 25 °C. 1998 Aug 05 TEST CONDITIONS 7 UNIT VCC(V) MAX. 51 ns 4.5 WAFEFORMS see Figs 12 and 13 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 TRANSFER CHARACTERISTIC WAVEFORMS handbook, halfpage handbook, halfpage VO VI VT+ VH VT− VO MNA027 VH VT+ VT− MNA026 Fig.6 The definitions of VT+, VT− and VH; where VT+ and VT− are between limits of 20% and 70%. Fig.5 Transfer characteristic. MNA028 100 MNA029 1.0 handbook, halfpage handbook, halfpage ICC (mA) ICC (µA) 0.8 0.6 50 0.4 0.2 0 0 1.0 0 Fig.7 VI (V) 2.0 0 Typical HC1G14 transfer characteristics; VCC = 2.0 V. 1998 Aug 05 Fig.8 8 2.5 VI (V) 5.0 Typical HC1G14 transfer characteristics; VCC = 4.5 V. Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 MNA030 1.6 MNA031 2.0 handbook, halfpage handbook, halfpage ICC (mA) ICC (mA) 1.0 0.8 0 0 0 Fig.9 3.0 VI (V) 2.5 0 6.0 Typical HC1G14 transfer characteristics; VCC = 6.0 V. VI (V) 5.0 Fig.10 Typical HCT1G14 transfer characteristics; VCC = 4.5 V. MNA032 3.0 handbook, halfpage ICC (mA) handbook, halfpage inA INPUT VM(1) 2.0 tPHL outY OUTPUT tPLH VM(1) 1.0 MNA033 0 0 3.0 VI (V) 6.0 (1) HC1G: VM = 50%; VI = GND to VCC. HCT1G: VM = 1.3 V; VI = GND to 3.0 V. Fig.11 Typical HCT1G14 transfer characteristics; VCC = 5.5 V. 1998 Aug 05 Fig.12 The input (inA) to output (outY) propagation delays. 9 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 VCC handbook, halfpage PULSE GENERATOR VI VO D.U.T. RT CL 50 pF MNA034 Definitions for test circuit: CL = load capacitance including jig and probe capacitance (See “AC characteristics for 74HC1G14” and “AC characteristics for 74HCT1G14” for values). RT = termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.13 Load circuitry for switching times. 1998 Aug 05 10 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 APPLICATION INFORMATION The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula: MNA036 200 handbook, halfpage average ICC (µA) 150 Pad = fi × (tr × ICCa + tf × ICCa) × VCC Where: Pad = additional power dissipation (µW) positive-going edge fi = input frequency (MHz) tr = input rise time (ns); 10% to 90% 100 tf = input fall time (ns); 90% to 10% ICCa = average additional supply current (µA). 50 Average ICCa differs with positive or negative input transitions, as shown in Fig.14 and Fig.15. negative-going edge HC1G/HCT1G14 used in relaxation oscillator circuit, see Fig.14 and Fig.16. 0 0 2.0 4.0 VCC (V) 6.0 Note to the application information: 1. All values given are typical unless otherwise specified. Fig.14 Average ICC for HC1G Schmitt-trigger devices; linear change of VI between 0.1VCC to 0.9VCC. MNA058 200 average ICC (µA) handbook, halfpage R handbook, halfpage 150 positive-going edge 100 C MNA035 negative-going edge 50 1 1 For HC1G: f = --- ≈ ----------------------T 0.8 × RC 0 0 2 4 VCC (V) 6 1 1 For HCT1G: f = --- ≈ --------------------------T 0.67 × RC Fig.15 Average ICC for HCT1G Schmitt-trigger devices; linear change of VI between 0.1VCC to 0.9VCC. 1998 Aug 05 Fig.16 Relaxation oscillator using the HC1G/HCT1G14. 11 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 PACKAGE OUTLINE Plastic surface mounted package; 5 leads SOT353 D E B y X A HE 5 v M A 4 Q A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E (2) e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT353 1998 Aug 05 REFERENCES IEC JEDEC EIAJ SC-88A 12 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all SO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 1998 Aug 05 13 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Aug 05 14 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 NOTES 1998 Aug 05 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 245106/00/01/pp16 Date of release: 1998 Aug 05 Document order number: 9397 750 03652