ETC BAR63JFILM

BAR63J
®
PIN DIODE
FEATURES AND BENEFITS
n
n
n
Pin diode for high speed switching of RF signal
Low forward voltage
Very low capacitance
A
35
K
DESCRIPTION
Single pin diode in SOD-323 package. This diode
is intended to be used in mobile phone to switch
the RF signal.
SOD-323
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
VR
Continuous reverse voltage
50
V
IF
Continuous forward current
100
mA
250
mW
- 65 to +150
°C
Ptot
Power Dissipation
Tstg
Storage temperature range
Ts < 55°C
Tj
Maximum junction temperature
150
°C
TL
Maximum temperature for soldering
260
°C
Value
Unit
550
°C/W
THERMAL RESISTANCE
Symbol
Rth (j-a)
Parameter
Junction to ambient (see note 1)
Note 1: Epoxy board with recommended pad layout.
April 2003 - Ed: 2B
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BAR63J
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Tests Conditions
Min.
VF
Forward voltage drop
Tamb = 25°C
IF = 100 mA
IR
Continuous reverse current
Tamb = 25°C
VR = 50 V
Reverse avalanche breakdown
voltage
IR = 5 µA
VBR
Typ.
Max. Unit
0.95
1.2
V
50
nA
50
V
ELECTRICAL CHARACTERISTICS
Symbol
Ct
Parameter
Tests Conditions
Diode capacitance
rf
Forward resistance
Ls
Series inductance
trr
Charge carrier life time
Min.
Typ.
Max.
VR = 0 V
F = 1 MHz
0.4
VR = 5 V
F = 1 MHz
0.21
0.3
IF = 5 mA
F = 100 MHz
1.8
2
IF = 10 mA
Fig. 1: Forward current versus ambient temperature (epoxy board with recommended pad layout).
IR = 10 mA
IR = 6 mA
Unit
pF
Ohm
1.8
nH
125
nS
Fig. 2: Average forward power dissipation versus
average forward current.
IF(mA)
PF(AV)(mW)
110
120
δ = 0.1
100
100
δ = 0.2 δ = 0.5
δ = 0.05
90
δ=1
80
80
70
60
60
50
40
40
30
20
20
Tamb(°C)
0
0
2/4
IF(AV)(mA)
10
0
25
50
75
100
125
150
0
25
50
75
100
125
BAS70-07
Fig. 3: Junction capacitance versus reverse
voltage applied (typical values).
Fig. 4: Forward resistance versus forward current
(typical values).
RF(W)
C(fF)
10.0
500
F=100MHz
Tj=25°C
F=1MHz
VOSC=30mVRMS
Tj=25°C
450
400
350
300
1.0
250
200
150
100
50
VR(V)
IF(mA)
0
0.1
0
5
10
15
20
25
30
Fig. 5: Thermal resistance junction to ambient versus copper surface under each lead (printed circuit
board, epoxy FR4, Cu=35µm).
0.1
1.0
100.0
Fig. 6: Insertion losses from antenna to receiver at
VBIAS = 0V and 2.7V.
Aplac
Rth(j-a)(°C/W)
10.0
7.62 User: ST Microelectronics May 31 2002
0.00
600
550
- 7.50
500
- 15.00
450
@900MHz
400
SOD package
- 22.50
350
S(mm²)
100.000k
5
10
15
20
25
30
35
40
45
14.39
1.500G
3.000G
f/Hz
4.500G
6.000G
SOD 323 0v
SOD 323 2.7v
50
Fig. 7: Insertion losses from transceiver to receiver at VBIAS = 0V and 2.7V.
Aplac
0.66
isolation dB
- 30.00
300
0
insertion losses
dB
Fig. 8: Insertion losses from transceiver to antenna at VBIAS = 0V and 2.7V.
7.62 User: ST Microelectronics May 31 2002
Aplac
0.00
0.00
- 7.50
- 7.50
7.62 User: ST Microelectronics May 31 2002
- 15.00
- 15.00
@900MHz
SOD package
isolation dB
Vbias 0v
19.84
@900MHz
SOD package
- 22.50
- 22.50
isolation dB
Vbias 2.7v
14.97
insertion losses
dB
0.88
isolation dB
19.35
- 30.00
- 30.00
100.000k
100.000k
1.500G
SOD 323 0v
SOD 323 2.7v
3.000G
f/Hz
4.500G
1.500G
6.000G
3.000G
f/Hz
4.500G
6.000G
SOD 323 0v
SOD 323 2.7v
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BAR63J
PACKAGE MECHANICAL DATA
SOD-323
DIMENSIONS
H
A1
REF.
b
Millimeters
Min.
A
E
A
D
c
Q1
L
Max.
Inches
Min.
1.17
Max.
0.046
A1
0
0.1
0
0.004
b
0.25
0.44
0.01
0.017
c
0.1
0.25
0.004
0.01
D
1.52
1.8
0.06
0.071
E
1.11
1.45
0.044
0.057
H
2.3
2.7
0.09
0.106
L
0.1
0.46
0.004
0.02
Q1
0.1
0.41
0.004
0.016
MARKING
Type
Marking
Package
Weight
Base qty
Delivery mode
BAR63J
35
SOD-323
0.005g
3000
Tape & reel
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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