BAT60J SMALL SIGNAL SCHOTTKY DIODE FEATURES AND BENEFITS n n n n n A VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP EXTREMELY FAST SWITCHING SURFACE MOUNTED DEVICE K 60 DESCRIPTION Schottky barrier diode encapsulated in a SOD-323 small SMD package. This device is intended for use in portable equipments. It is suited for DC to DC converters, step-up conversion and power management. SOD-323 ABSOLUTE RATINGS (limiting values) Symbol VRRM Value Unit 10 V Repetitive peak reverse voltage Peak forward current δ = 0.11 3 A IFSM Surge non repetitive forward current tp=10ms 5 A Ptot Power Dissipation Ta=25°C 310 mW Tstg Storage temperature range - 65 to +150 °C IF * : Parameter Tj Maximum operating junction temperature * 150 °C TL Maximum temperature for soldering during 10s 260 °C Value Unit 400 °C/W dPtot 1 < thermal runaway condition for a diode on its own heatsink dTj Rth( j − a ) THERMAL RESISTANCE Symbol Rth (j-a) Parameter Junction to ambient (*) (*) Mounted on epoxy board with recommended pad layout. May 2000 - Ed: 4A 1/5 BAT60J STATIC ELECTRICAL CHARACTERISTICS Symbol VF * IR ** Tests Conditions Forward voltage drop Reverse leakage current Tests conditions Typ. Max. Unit IF = 10 mA 0.28 0.32 V IF = 100 mA 0.35 0.40 IF = 1 A 0.53 0.58 Tj = 25°C VR = 5 V 1 3 Tj = 25°C VR = 8 V 1.3 4 Tj = 80°C VR = 8 V 73 150 Tj = 25°C Pulse test: * tp = 380µs, δ < 2% ** tp = 5ms, δ < 2% To evaluate the conduction losses the following equation: P = 0.38 x IF(AV) + 0.17 IF2(RMS) 2/5 Min. µA BAT60J Fig. 1: Average forward power dissipation versus average forward current. Fig. 2-1: Peak forward current versus ambient temperature (δ = 0.11). PF(av)(W) IF(A) 0.35 δ = 0.05 δ = 0.1 δ = 0.2 3.2 δ = 0.5 2.8 0.30 2.4 δ=1 0.25 2.0 0.20 1.6 0.15 1.2 0.10 T IF(av) (A) 0.00 0.0 0.1 0.2 0.3 0.4 δ=tp/T 0.5 T 0.8 0.05 0.4 tp 0.6 0.7 Fig. 2-2: Average forward current versus ambient temperature (δ = 0.5). 0.0 δ=tp/T 0 25 50 75 100 125 150 Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). IF(av)(A) 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 Tamb(°C) tp IM(A) 3.0 2.5 Ta=25°C 2.0 Ta=50°C Ta=75°C 1.5 1.0 T IM 0.5 t δ=tp/T 0 tp 25 50 75 t(s) δ=0.5 Tamb(°C) 100 125 150 Fig. 4: Relative variation of thermal impedance junction to ambient versus pulse duration (Epoxy printed circuit board FR4 with recommended pad layout). 0.0 1E-3 1E-2 1E-1 1E+0 Fig. 5: Reverse leackage current versus reverse voltage applied (typical values). IR(mA) Zth(j-a)/Rth(j-a) 1E+1 1E+0 δ = 0.5 Tj=150°C 1E+0 δ = 0.2 δ = 0.1 1E-1 Tj=80°C 1E-1 1E-2 Single pulse T 1E-2 Tj=25°C 1E-3 t(s) 1E-3 1E-4 1E-3 1E-2 1E-1 δ=tp/T 1E+0 1E+1 tp 1E+2 VR(V) 1E-4 0 1 2 3 4 5 6 7 8 9 10 3/5 BAT60J Fig. 6: Reverse leackage current versus junction temperature (typical values). Fig. 7: Junction capacitance versus reverse voltage applied (typical values). IR[Tj] / IR[Tj=25°C] C(pF) 1E+5 100 F=1MHz Tj=25°C VR=8V 1E+4 1E+3 1E+2 1E+1 1E+0 VR(V) Tj(°C) 1E-1 0 25 50 75 100 125 150 Fig. 8-1: Forward voltage drop versus forward current (High level). 10 1 10 Fig. 8-2: Forward voltage drop versus forward current (Low level). IFM(A) IFM(A) 1E+1 1.0 0.9 Tj=150°C (Typical values) 0.8 0.7 Tj=150°C (Typical values) 0.6 Tj=25°C (Maximum values) 1E+0 Tj=25°C (Maximumvalues) Tj=80°C (Typical values) 0.5 0.4 0.3 Tj=80°C (Typical values) 0.2 0.1 VFM(V) 1E-1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Fig. 9: Thermal resistance junction to ambient versus copper surface (epoxy printed circuit board FR4, copper thickness: 35µm). Rth(j-a) (°C/W) 600 IF=0.75A 550 500 450 400 350 300 250 200 150 100 S(Cu) (mm ) 0 4/5 10 20 30 40 50 60 70 80 90 100 0.0 0.0 VFM(V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 BAT60J PACKAGE MECHANICAL DATA SOD-323 DIMENSIONS H A1 REF. Millimeters Min. b A E A D c Q1 L Max. Inches Min. 1.17 Max. 0.046 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 MARKING n Type Marking Package Weight Base qty Delivery mode BAT60J 60 SOD-323 0.005 g. 3000 Tape & reel Epoxy meets UL94V-0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 2000 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 5/5