ETC HZB6.8MWA

HZB6.8MWA
Silicon Planar Zener Diode for Surge Absorb
ADE-208-971A (Z)
Rev.1
Nov. 2001
Features
• HZB6.8MWA has two devices in a monolithic, and can absorb surge.
• CMPAK package is suitable for high density surface mounting.
Ordering Information
Type No.
Laser Mark
Package Code
HZB6.8MWA
68M
CMPAK
Pin Arrangement
3
1. Cathode
2. Cathode
3. Anode
2
1
(Top View)
HZB6.8MWA
Absolute Maximum Ratings
(Ta = 25°C)
Item
Symbol
Value
Unit
Power dissipation
Pd *
200
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
Note: Two device total, See Fig.2.
Electrical Characteristics *1
(Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Zener voltage
VZ
6.47

7.00
V
IZ = 5 mA, 40 ms pulse
Reverse current
IR


2
µA
VR = 3.5 V
Capacitance
C


130
pF
VR = 0 V, f = 1 MHz
rd


30
Ω
IZ = 5 mA

30


kV
C = 150 pF, R = 330 Ω, Both forward
and reverse direction 10 pulse
Dynamic resistance
2,
ESD-Capability * *
3
Notes: 1. Per one device.
2. Failure criterion ; IR > 2 µA at VR = 3.5 V.
3. Between cathode and anode
Rev.1, Nov. 2001, page 2 of 5
HZB6.8MWA
Main Characteristic
10-2
Zener Current IZ (A)
10-3
10-4
10-5
10-6
Ta=75°C
Ta=25°C
10-7
Ta=-25°C
10-8
0
1
2
3
4
5
6
7
8
Zener Voltage VZ (V)
Fig.1 Zener current vs. Zener voltage
250
Power Dissipation Pd (mW)
0.8mm
1.0mm
200
Cu Foil
Printed circuit board
25 × 62 × 1.6t mm
Material:
Glass Epoxy Resin+Cu Foil
150
100
50
0
0
50
100
150
200
Ambient Temperature Ta (°C)
Fig.2 Power Dissipation vs. Ambient Temperature
Rev.1, Nov. 2001, page 3 of 5
HZB6.8MWA
Package Dimensions
As of July, 2001
0.1
0.3 +– 0.05
(0.65) (0.65)
(0.2)
1.3 ± 0.2
0.9 ± 0.1
0.1
0.3 +– 0.05
+ 0.1
0.16 – 0.06
2.1 ± 0.3
0.1
0.3 +– 0.05
(0.425) 1.25 ± 0.1
2.0 ± 0.2
(0.425)
Unit: mm
0 – 0.1
Hitachi Code
JEDEC
JEITA
Mass (reference value)
Rev.1, Nov. 2001, page 4 of 5
CMPAK
—
Conforms
0.006 g
HZB6.8MWA
Disclaimer
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Sales Offices
Hitachi, Ltd.
Semiconductor & Integrated Circuits
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: (03) 3270-2111 Fax: (03) 3270-5109
URL
http://www.hitachisemiconductor.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Hitachi Europe Ltd.
Electronic Components Group
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 585200
Hitachi Asia Ltd.
Hitachi Tower
16 Collyer Quay #20-00
Singapore 049318
Tel : <65>-538-6533/538-8577
Fax : <65>-538-6933/538-3877
URL : http://semiconductor.hitachi.com.sg
Hitachi Europe GmbH
Electronic Components Group
Dornacher Straße 3
D-85622 Feldkirchen
Postfach 201, D-85619 Feldkirchen
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Asia Ltd.
(Taipei Branch Office)
4/F, No. 167, Tun Hwa North Road
Hung-Kuo Building
Taipei (105), Taiwan
Tel : <886>-(2)-2718-3666
Fax : <886>-(2)-2718-8180
Telex : 23222 HAS-TP
URL : http://www.hitachi.com.tw
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon Hong Kong
Tel : <852>-(2)-735-9218
Fax : <852>-(2)-730-0281
URL : http://semiconductor.hitachi.com.hk
Copyright © Hitachi, Ltd., 2001. All rights reserved. Printed in Japan.
Colophon 5.0
Rev.1, Nov. 2001, page 5 of 5