LMX2505 PLLatinum™ Dual Frequency Synthesizer System with Integrated VCOs General Description Features LMX2505 is a highly integrated, high performance, low power frequency synthesizer system optimized for dualband Japan PDC mobile handsets. Using a proprietary digital phase locked loop technique, LMX2505 generates very stable, low noise local oscillator signals for up and down conversion in wireless communications devices. n Small Size 5.0 mm X 5.0 mm X 0.75 mm 28-Pin LLP Package n RF Synthesizer System Two Integrated VCOs Integrated Loop Filter Low Spurious, Low Phase Noise Fractional-N RF PLL Based on 10-Bit Delta Sigma Modulator Frequency Resolution Down to 20 kHz n Supports Various Reference Frequencies 12.6/14.4/25.2/26.0 MHz n Fast Lock Time: 300 µs n Low Current Consumption 10 mA at 2.8 V in PDC800 Mode n 2.5 V to 3.3 V Operation n Digital Filtered Lock Detect Output n Hardware and Software Power Down Control LMX2505 includes dual voltage controlled oscillators (VCOs) for the upper and lower Japan PDC frequency bands, a loop filter, and a fractional-N RF PLL based on a delta sigma modulator. In concert these blocks form a closed loop RF synthesizer system. The RF synthesizer system supports two frequency bands: PDC1500 and PDC800. Serial data is transferred to the device via a three-wire MICROWIRE interface (DATA, LE, CLK). Operating supply voltage ranges from 2.5 V to 3.3 V. LMX2505 features low current consumption: 10 mA at 2.8 V when operating in the PDC800 mode. LMX2505 is available in a 28-pin leadless leadframe package (LLP). Applications n Japan PDC Systems at 800 MHz and 1500 MHz Frequency Bands. Functional Block Diagram 20067107 FastLock™ is a trademark of National Semiconductor Corporation. TRI-STATE ® is a registered trademark of National Semiconductor Corporation. PLLatinum™ is a trademark of National Semiconductor Corporation. © 2004 National Semiconductor Corporation DS200671 www.national.com LMX2505 PLLatinum Dual Frequency Synthesizer System with Integrated VCOs April 2004 LMX2505 Connection Diagram 28-Pin 5x5 LLP (LQ) Package 20067102 NOTE: Analog ground connected through exposed die attached pad. Pin Descriptions Pin Number Name I/O 1 OSCin I 2 GND — Ground for digital circuitry 3 VDD — Supply voltage for analog circuitry 4 GND — Ground for analog circuitry 5 NC — Do not connect to any node on the printed circuit board. 6 NC — Do not connect to any node on the printed circuit board. 7 VDD — Supply voltage for RF analog circuitry 8 NC — Do not connect to any node on the printed circuit board. 9 L1 — RF2 VCO tank pin. An external inductor is required between pins L1 and L2 to set the resonant frequency of RF2 VCO (PDC800). 10 L2 — RF2 VCO tank pin. An external inductor is required between pins L1 and L2 to set the resonant frequency of RF2 VCO (PDC800). 11 NC — Do not connect to any node on the printed circuit board. 12 NC — Do not connect to any node on the printed circuit board. 13 VDD — Supply voltage for RF analog circuitry 14 RF1out O RF output of RF1 VCO for PDC1500 15 VDD — Supply voltage for RF analog circuitry 16 RF2out O RF output of RF2 VCO for PDC800 17 VDD — Supply voltage for analog circuitry 18 GND — Ground for digital circuitry 19 VCC — Supply voltage for digital circuitry 20 GND — Ground for digital circuitry 21 VCC — Supply voltage for digital circuitry 22 LE I MICROWIRE Latch Enable 23 DATA I MICROWIRE Data 24 CLK I MICROWIRE Clock 25 CE I Chip enable control pin 26 BS I Band select control pin 27 LD O Lock detect pin 28 VCC — Supply voltage for digital circuitry www.national.com Description Reference frequency input 2 Part Number RF1 Min. (MHz) LMX2505LQX1321 1270.22 RF1 Max. RF1 (MHz) Center (MHz) ~ 1394.95 1321 LMX2505LQ1321 1270.22 1394.95 ~1321 RF2 Min. RF2 Max. (MHz) (MHz) Package Marking Supplied As 633.15 768.0 25051321 4500 units on tape and reel 633.15 768.0 25051321 1000 units on tape and reel Part Number Description 20067103 Typical Application Circuit (Note 1) 20067104 Note 1: Refer to RF2 VCO Tuning Range vs. External Inductance plot to aid in selecting the appropriate external inductance, PCB trace and L1, for the desired frequency range. 3 www.national.com LMX2505 Ordering Information LMX2505 Absolute Maximum Ratings (Notes 2, 3, Recommended Operating Conditions 4) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Parameter Symbol Supply Voltage VCC, VDD -0.5 to 3.6 V Voltage on any pin to GND VI V Storage Temperature TSTG Range Ratings -0.3 to VDD+0.3 V -65 to 150 ˚C Symbol Min Typ Max Unit Ambient Temperature TA -30 25 Supply Voltage (to GND) VCC, VDD 2.5 Units -0.3 to VCC+0.3 Parameter 85 ˚C 3.3 V Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, refer to the Electrical Characteristics section. The guaranteed specifications apply only for the conditions listed. Note 3: This device is a high performance RF integrated circuit with an ESD rating < 2 kV and is ESD sensitive. Handling and assembly of this device should be done at ESD protected workstations. Note 4: GND = 0 V. Electrical Characteristics (VIN = 2.8 V, refer to Typical Application Circuit; Limits in standard typeface are for TA = 25 ˚C; Limits in boldface type apply over the operating temperature range from -20 ˚C ≤ TA ≤ 75 ˚C unless otherwise noted.) Symbol Parameter Condition Min Typ Max Units OB_CRL [1:0] = 11 11.5 13.0 13.3 mA OB_CRL [1:0] = 00 10.0 11.5 11.8 mA OB_CRL [1:0] = 11 16.0 17.5 17.8 mA OB_CRL [1:0] = 00 14.2 15.6 15.9 mA 20 µA 14.4 26.0 MHz 0.5 VCC Vp-p 1394.95 MHz ICC PARAMETERS ICC + IDD ICC + IDD IPD Supply Current (Note 5) Supply Current (Note 6) Power Down Current CE = LOW or RF_PD = 1 REFERENCE OSCILLATOR PARAMETERS fOSCin Reference Oscillator Input Frequency 12.6/14.4/25.2/26.0 MHz are (Note 7) supported. VOSCin Reference Oscillator Input Sensitivity 12.6 RF1 VCO for PDC1500 fRF1out Frequency Range (Note 8) RF1 VCO for PDC1500 PRF1out Output Power OB_CRL [1:0] = 11 -5 -2 1 dBm OB_CRL [1:0] = 10 -7 -4 -1 dBm Lock Time 1270.22 OB_CRL [1:0] = 01 -10 -7 -4 dBm OB_CRL [1:0] = 00 -13 -10 -7 dBm Full frequency span within each band in High Speed Mode. 300 (Note 9) µs Between bands High Speed Mode. 300 (Note 9) µs Full frequency span within each band in Normal Mode. 500 (Note 9) µs 375 (Note 10) µs 500 (Note 9) µs 400 (Note 10) µs Between bands in Normal Mode. RMS Phase Error www.national.com 1.3 4 degrees Symbol Parameter Condition Min Typ Max Units @ 25 kHz offset -95 -93 -91 dBc/Hz @ 50 kHz offset -106 -103 -101 dBc/Hz @ 100 kHz offset -115 -113 -111 dBc/Hz -135 -133 dBc/Hz 2nd Harmonic Suppression -25 dBc 3rd Harmonic Suppression -20 dBc -45 dBc @ 25 kHz -60 dBc @ -69 dBc -75 dBc RF1 VCO for PDC1500 L(f)RF1out Phase Noise when RF1 VCO for PDC1500 is activated in Normal Mode. @ 1 MHz offset Spurious Tones @ ≤ 25 kHz offset @ < offset ≤ 50 kHz 50 kHz < offset ≤ 100 kHz offset > 100 kHz RF2 VCO for PDC800 fRF2out Frequency Range (Note 8) RF2 VCO for PDC800 768 MHz PRF2out Output Power OB_CRL [1:0] = 11 -6 -3 0 dBm OB_CRL [1:0] = 10 -9 -6 -3 dBm Lock Time 633.15 OB_CRL [1:0] = 01 -11 -8 -5 dBm OB_CRL [1:0] = 00 -15 -12 -9 dBm Full frequency span within each band in High Speed Mode. 300 (Note 9) µs Between bands High Speed Mode. 300 (Note 9) µs Full frequency span within each band in Normal Mode. 500 (Note 9) µs 375 (Note 10) µs 500 (Note 9) µs 400 (Note 10) µs Between bands in Normal Mode. L(f)RF2out RMS Phase Error 1.3 @ 25 kHz offset Phase Noise when RF2 VCO for PDC800 is activated in Normal Mode. -95 -93 -91 dBc/Hz @ 50 kHz offset -106 -103 -101 dBc/Hz @ 100 kHz offset -115 -113 -111 dBc/Hz -135 -133 dBc/Hz -25 dBc @ 1 MHz offset 2nd Harmonic Suppression 3rd Harmonic Suppression Spurious Tones @ ≤ 25 kHz offset @ 25 kHz @ 50 kHz @ offset < offset ≤ 50 kHz < offset ≤ 100 kHz > 100 kHz 5 degrees -20 dBc -45 dBc -60 dBc -69 dBc -75 dBc www.national.com LMX2505 Electrical Characteristics (VIN = 2.8 V, refer to Typical Application Circuit; Limits in standard typeface are for TA = 25 ˚C; Limits in boldface type apply over the operating temperature range from -20 ˚C ≤ TA ≤ 75 ˚C unless otherwise noted.) (Continued) LMX2505 Electrical Characteristics (VIN = 2.8 V, refer to Typical Application Circuit; Limits in standard typeface are for TA = 25 ˚C; Limits in boldface type apply over the operating temperature range from -20 ˚C ≤ TA ≤ 75 ˚C unless otherwise noted.) (Continued) Symbol Parameter Condition Min Typ Max Units 0.8 VCC VCC V 0.8 VDD VDD V -0.3 0.2 VCC V -0.3 0.2 VDD V DIGITAL INTERFACE (DATA, CLK, LE, LD, CE, BS) VIH VIL High-Level Input Voltage Low-Level Input Voltage IIH High-Level Input Current -10 10 µA IIL Low-Level Input Current -10 10 µA Input Capacitance Rise/Fall Time VOH VOL High-Level Output Voltage 3 pF 30 ns VCC - 0.4 V VDD - 0.4 V Low-Level Output Voltage Output Capacitance 0.4 V 5 pF MICROWIRE INTERFACE TIMING tCS Data to Clock Set Up Time 50 ns tCH Data to Clock Hold Time 10 ns tCWH Clock Pulse Width HIGH 50 ns tCWL Clock Pulse Width LOW 50 ns tES Clock to Latch Enable Set Up Time 50 ns tEW Latch Enable Pulse Width 50 ns Note 5: RF PLL and VCO in PDC800 mode. Note 6: RF PLL and VCO in PDC1500 mode. Note 7: The reference frequency must also be programmed using the OSC_FREQ control bit. For other reference frequencies, please contact National Semiconductor. Note 8: For other frequency ranges, please contact National Semiconductor. Note 9: Lock time is defined as the time difference between the beginning of the frequency transition and the point at which the frequency remains within +/-1 kHz of the final frequency. Note 10: Lock time is defined as the time difference between the beginning of the frequency transition and the point at which the frequency remains within +/-3 kHz of the final frequency. Note 11: All limits are guaranteed. All electrical characteristics having room temperature limits are tested during production with TA = 25 ˚C or correlated using Statistical Quality Control (SQC) methods. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control. Microwire Interface Timing Diagram 20067101 www.national.com 6 LMX2505 Typical Performance Characteristics (Note 12) RF2 VCO Tuning Range vs. External Inductance (Note 13) VIN = 2.8 V 20067111 Note 12: Typical performance characteristics do not guarantee specific performance limits. For guaranteed specifications, refer to the Electrical Characteristics section. Note 13: The frequency range is defined as the difference between the highest frequency and the lowest frequency of a given unit. For a chosen external inductance, the typical frequency range equals the difference between the Typical Maximum Frequency and the Typical Minimum Frequency. Typical frequency range may be assumed on any unit with that chosen external inductance, even if the unit has worst case Maximum Frequency or worst case Minimum Frequency. 7 www.national.com LMX2505 Functional Description GENERAL The LMX2505 is a highly integrated frequency synthesizer system for Japan PDC wireless communication systems. The LMX2505 supports dual band operation for 800 MHz and 1500 MHz. 20067110 where Ctotal is the total capacitance of the VCO, including the parasitic capacitance and the nominal self-tuning capacitance. Note, the external inductance consists of the PCB traces and lumped element inductor. The output frequency tuning range can be optimized for the specific application by selecting the appropriate external inductance. Refer to RF2 VCO Tuning Range vs. External Inductance plot to aid in selecting the appropriate external inductance. Care should be taken to ensure proper frequency coverage when choosing the tolerance of the lumped element inductor. For the 1500 MHz band, the internal bonding-wires provide the necessary inductance to set the VCO center frequency. The LMX2505 includes all functional blocks for the RF PLL including RF VCOs, frequency dividers, PFDs, and loop filters. Only external passive elements for the RF2 VCO tank and supply bypassing are required to complete the RF synthesizer. The LMX2505 uses a patent pending Fractional-N synthesizer architecture based on a delta sigma modulator to support fine frequency resolution. Four of the most common reference frequencies for PDC applications, 12.6 MHz, 14.4 MHz, 25.2 MHz and 26.0 MHz, are supported. The unique feature of this architecture is its low spurious modulation effect. The use of a fractional synthesizer based on delta sigma modulator allows for fast lock-up and system set-up times, which reduces system power consumption. The loop filter is included in the circuit to minimize the external noise coupling and reduce the form factor applicable to the board level application. Only one of the two RF VCOs is activated at a given time, and each output is provided through its own output pin. RF_PLL SECTION Frequency Selection 20067105 The divide ratio can be calculated using the following equations: fVCO = {8 x RF_B + RF_A + (RF_FN / FD)} x (fOSC / R) where (RF_A < RF_B) for PDC1500 fVCO = {4 x RF_B + RF_A + (RF_FN / FD)} x (fOSC / R) where (RF_A < RF_B) for PDC800 fVCO: Output frequency of voltage controlled oscillator (VCO) FIGURE 1. External Inductor Connection In real implementation, the inductance of Lfixed and Lexternal can vary from its nominal value. The LMX2505 utilizes a built-in tracking algorithm to compensate for variations up to ± 15% and tunes the VCO to the required frequency. During the frequency acquisition period, the loop bandwidth is extended to achieve the frequency lock. After the frequency lock, the loop bandwidth of the PLL is set to the nominal value and the phase lock is achieved. The transition between the two operating modes is very smooth and extremely fast to meet the stringent PDC requirements for lock time and phase noise. RF_B: Preset divide ratio of binary 4-bit programmable counter (2 ≤ RF_B ≤ 15) RF_A: Preset divide ratio of binary 3-bit swallow counter (0 ≤ RF_A ≤ 7 for PDC1500 and 0 ≤ RF_A ≤ 3 for PDC800) RF_FN: Preset numerator of binary 10-bit modulus counter (0 ≤ RF_FN < FD) FD: Preset denominator for modulus counter (FD = fOSC/(R X fCH) where fCH is the channel spacing) fOSC: Reference oscillator frequency R: Internal reference oscillator frequency divider (1 for 12.6 MHz and 14.4 MHz, 2 for 25.2 MHz and 26.0 MHz) The denominator, FD, in the above equation is dependent on the channel spacing and reference oscillator frequency. The channel spacing will change based on the Rx/Tx and BS bits. Table 6 in the R0 Register section summarizes the values of FD. POWER DOWN MODE The LMX2505 includes the power down mode to reduce the power consumption. The LMX2505 enters the power down mode either by taking the CE pin LOW or by setting the RF_PD bit in the R0 register. If the CE pin is set LOW, the circuit is powered down regardless of the register values. When the CE pin is HIGH, the RF_PD bit controls power to the RF circuitry. Data can be written to the registers even when the CE pin is set LOW. The following truth table summarizes the power down logic. VCO Frequency Tuning The center frequency of the RF VCOs is determined by the resonant frequency of the tank circuit, illustrated in Figure 1. With an internal fixed bonding-wire inductor and an external inductance, the center frequency of the VCO is given as follows: www.national.com TABLE 1. Power Down Modes 8 CE Pin RF_PD Bit Mode HIGH 0 Active HIGH 1 Not Active LOW 0 Not Active LOW 1 Not Active on the LD pin. When the PLL is not locked, the LD pin remains LOW. After obtaining phase lock, the LD pin will have a logical HIGH level. The LD output is always LOW when the LD register bit is 0 and in power down mode. (Continued) BAND SELECT MODE The BS pin and BS bit can be used to select one of the two RF VCO outputs. When using the BS pin, the BS bit must be set to 0, and when using the BS bit, the BS pin must be tied to ground. When using the BS pin, the state of the input must exceed the minimum band select set up time prior to the LE signal transition. The truth table summarizing the band select logic is as follows: TABLE 3. Lock Detect Modes TABLE 2. Band Select Modes LD Bit Mode 0 Disable (GND) 1 Enable TABLE 4. Lock Detect Logic BS Pin BS Bit Mode HIGH 0 PDC1500 LOW 0 PDC800 LOW 1 PDC1500 RF PLL Section LD Output Locked HIGH Not Locked LOW LOCK DETECT MODE The LD output can be used to indicate the lock status of the PLL. Bit 6 in Register R1 determines the signal that appears 20067108 FIGURE 2. Lock Detect Timing Diagram Waveform (Notes 14, 15, 16, 17, 18) Note 14: LD output becomes LOW when the phase error is larger than tW2. Note 17: tW1 is 5 ns for PDC1500 and 10 ns for PDC800. tW2 is 10 ns for both bands. Note 15: LD output becomes HIGH when the phase error is less than tW1 for four or more consecutive cycles. Note 18: The lock detect comparison occurs with every 64th cycle of fR and fN. Note 16: Phase Error is measured on leading edge. Only errors greater than tW1 and tW2 are labeled. 9 www.national.com LMX2505 Functional Description LMX2505 Functional Description (Continued) 20067109 FIGURE 3. Lock Detect Flow Diagram MICROWIRE INTERFACE The programmable register set is accessed via the MICROWIRE serial interface. The interface is comprised of three signal pins: CLK, DATA, and LE (Latch Enable). Serial data is clocked into the 24-bit shift register on the rising edge of the clock. The last bits decode the internal control register address. When the latch enable (LE) transitions from LOW to HIGH, data stored in the shift registers is loaded into the corresponding control register. The data is loaded MSB first. HIGH SPEED LOCK-UP MODE Two frequency-locking modes are provided: a Normal mode and a High Speed mode for faster lock times. The HS bit in register R0 controls the locking mode. TABLE 5. Lock-up Modes HS Bit Mode 0 Normal mode 1 High Speed mode www.national.com 10 LMX2505 Programming Description GENERAL PROGRAMMING INFORMATION The serial interface has a 24-bit shift register to store the incoming data bits temporarily. The incoming data is first loaded into the shift register from MSB to LSB. The data is shifted at the rising edge of the clock signal. When the latch enable signal transitions from LOW to HIGH, the data stored in shift register is transferred to the proper register depending on the address bit setting. The selection of the particular register is determined by the control bits indicated in boldface text. At initial start-up, the MICROWIRE loading requires three default words (registers R2, loaded first, to R0, loaded last). After the device has been initially programmed, the RF VCO frequency can be changed using a single register (R0). The control register content map describes how the bits within each control register are allocated to the specific control functions. Register COMPLETE REGISTER MAP MSB SHIFT REGISTER BIT LOCATION 23 22 21 20 19 R0 (Default) RX/ TX RF_ PD HS 0 BS R1 (Default) SPI_ DEF 0 0 1 0 0 1 0 1 0 0 0 0 0 0 1 0 LD OB_ CRL [1:0] R2 (Default) 1 1 0 0 1 0 0 0 0 1 1 1 1 0 0 0 0 0 0 18 17 16 15 14 RF_B [3:0] 13 12 11 10 9 LSB 8 RF_A [2:0] 7 6 5 4 3 2 1 0 0 0 OSC_ FREQ [1:0] 0 1 0 0 1 1 0 RF_FN [9:0] R3 1 0 0 0 0 1 1 0 1 0 0 0 0 0 0 0 0 0 0 1 1 0 1 1 R4 0 0 0 0 0 0 1 1 1 0 1 0 0 0 1 1 0 0 1 0 0 1 1 1 R5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 NOTE: R0 control register will be used when hot start frequency change. NOTE: Boldface text represent address bits. 11 www.national.com (Continued) R0 REGISTER The R0 register address bits (R0 [1:0]) are “00”. The Rx/Tx bit selects between receive and transmit modes and, in conjunction with the band select bit (BS), the channel spacing to be synthesized. The RF_PD bit selects the power down mode of the RF PLL and selected VCO. The HS bit selects between normal and high speed locking mode. The BS bit determines which of the two internal VCOs (PDC800 or PDC1500) is active. The RF N counter consists of the 4-bit programmable counter (RF_B counter), the 3-bit swallow counter (RF_A counter) and the 10-bit delta sigma modulator (RF_FN counter). The equations for calculating the counter values are presented below. R0 REGISTER MSB Register LMX2505 Programming Description 23 R0 (Default) RX/ TX SHIFT REGISTER BIT LOCATION 22 21 20 19 18 17 16 15 14 13 12 11 10 9 LSB 8 7 6 5 4 3 Data Field RF_ PD HS 0 BS RF_B [3:0] RF_A [2:0] RF_FN [9:0] Functions RX/TX RX/TX Mode 0 = Rx 1 = Tx RF_PD Power Down of RF Synthesizer 0 = RF synthesizer on (Active mode) 1 = RF synthesizer powered down HS Locking Mode 0 = Normal Mode 1 = High Speed Mode BS Band Select 1 = RF1 VCO (PDC1500) 0 = RF2 VCO (PDC800) RF_B [3:0] RF_B Counter 4-bit programmable counter 0 ≤ RF_B ≤ 15 for both bands RF_A [2:0] RF_A Counter 3-bit swallow counter 0 ≤ RF_A ≤ 7 for PDC1500 0 ≤ RF_A ≤ 3 for PDC800 RF_FN [9:0] RF_FN Counter 10-bit modulus counter 0 ≤ RF_FN < FD See Table 6 for FD values. 0 Symbol Functions RF N Divider N = 8 x RF_B + RF_A + RF_FN/FD (PDC1500) N = 4 x RF_B + RF_A + RF_FN/FD (PDC800) Modulus Counter RF_FN Programmable Counter RF_B Swallow Counter RF_A www.national.com 1 12 0 Address Field Name Counter Name 2 0 LMX2505 Programming Description (Continued) PULSE SWALLOW FUNCTION fVCO = {8 x RF_B + RF_A + (RF_FN / FD)} x fOSC / R where (RF_A < RF_B) for PDC1500 fVCO = {4 x RF_B + RF_A + (RF_FN / FD)} x fOSC / R where (RF_A < RF_B) for PDC800 fVCO: Output frequency of voltage controlled oscillator (VCO) RF_B: Preset divide ratio of binary 4-bit programmable counter (2 ≤ RF_B ≤ 15) RF_A: Preset divide ratio of binary 3-bit swallow counter (0 ≤ RF_A ≤ 7 for PDC1500 and 0 ≤ RF_A ≤ 3 for PDC800) RF_FN: Preset numerator of binary 10-bit modulus counter (0 ≤ RF_FN < FD) FD: Preset denominator for modulus counter (FD = fOSC/(R x fCH) where fCH is the channel spacing) fOSC: Reference oscillator frequency R: Internal reference oscillator frequency divider OSC_FREQ [1:0] Reference Oscillator Frequency (MHz) R Divider 00 12.6 1 01 14.4 1 10 25.2 2 11 26.0 2 The value of the denominator (FD) is depended on the channel spacing and reference oscillator frequency. Table 6 summarizes the denominator values based on the settings of the Rx/Tx, BS, and OSC_FREQ [1:0] bits. TABLE 6. Demonimator Values Rx/Tx BS OSC_FREQ [1:0] Reference Oscillator Frequency (MHz) R fCH (kHz) Denominator (FD) 0 0 00 12.6 1 25.0 504 0 0 01 14.4 1 25.0 576 0 0 10 25.2 2 25.0 504 0 0 11 26.0 2 25.0 520 0 1 00 12.6 1 25.0 504 0 1 01 14.4 1 25.0 576 0 1 10 25.2 2 25.0 504 0 1 11 26.0 2 25.0 520 1 0 00 12.6 1 20.0 630 1 0 01 14.4 1 20.0 720 1 0 10 25.2 2 20.0 630 1 0 11 26.0 2 20.0 650 1 1 00 12.6 1 22.22 567 1 1 01 14.4 1 22.22 648 1 1 10 25.2 2 22.22 567 1 1 11 26.0 2 22.22 585 13 www.national.com (Continued) R1 REGISTER The R1 register address bits (R1 [1:0]) are “01”. The SPI_DEF bit allows for the programming of words R3 to R5. Under most circumstances, the SPI_DEF bit should be set to 1. The LD bit sets the function of the lock detect pin. Enabling the lock detect function provides a digital lock detect output of the active RF synthesizer at the LD pin. The OB_CRL [1:0] bits determine the power level of the RF output buffer. The power level can be adjusted to best meet the system requirement. The reference frequency selection bits, OSC_FREQ [1:0], are used to set the reference clock and R divider for use with one of the following reference frequencies: 12.6 MHz, 14.4 MHz, 25.2 MHz or 26.0 MHz. The LMX2505 uses the OSC_FREQ bits along with the BS and RX/TX bits to determine the correct divide ratios needed to meet the required channel spacing for the mode of operation selected. Refer to Table 6 for a summary of denominator values. R1 REGISTER MSB Register LMX2505 Programming Description 23 R1 (Default) SPI_ DEF www.national.com SHIFT REGISTER BIT LOCATION 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 LSB 7 6 5 4 3 2 Data Field 0 0 1 0 0 1 0 1 0 0 0 0 Address Field 0 0 0 1 0 LD OB_ CRL [1:0] OSC_ FREQ [1:0] Name Functions SPI_DEF Default Register Selection 0 = OFF (Use values set in R0 to R5) 1 = ON (Use default values set in R0 to R2) LD Lock Detect 0 = Disable (GND) 1 = Enable OB_CRL [1:0] Output Buffer Control PDC1500, PDC800 00 = -10 dBm, -12 dBm 01 = -7 dBm, -8 dBm 10 = -4 dBm, -6 dBm 11 = -2 dBm, -3 dBm OSC_FREQ [1:0] Reference Frequency Selection 00 = 12.6 MHz 01 = 14.4 MHz 10 = 25.2 MHz 11 = 26.0 MHz 14 1 0 1 LMX2505 Programming Description (Continued) R2 REGISTER The R2 register address bits (R2 [1:0]) are “10”. R2 REGISTER Register MSB 23 R2 (Default) 1 SHIFT REGISTER BIT LOCATION 22 21 20 19 18 17 16 15 14 13 12 11 10 9 LSB 8 7 6 5 4 3 2 Data Field 1 0 0 1 0 0 0 0 1 1 1 0 Address Field 1 1 0 0 0 0 0 0 0 0 1 1 0 R3 REGISTER The R3 register address bits (R3 [2:0]) are “011”. This register is only written to if the SPI_DEF bit is set to 0. R3 REGISTER Register MSB 23 R3 1 SHIFT REGISTER BIT LOCATION 22 21 20 19 18 17 16 15 14 13 12 11 10 9 LSB 8 7 6 5 4 3 Data Field 0 0 0 0 1 1 0 1 0 0 2 1 0 Address Field 0 0 0 0 0 0 0 0 1 1 0 1 2 1 1 R4 REGISTER The R4 register address bits (R4 [3:0]) are “0111”. This register is only written to if the SPI_DEF bit is set to 0. R4 REGISTER Register MSB 23 R4 0 SHIFT REGISTER BIT LOCATION 22 21 20 19 18 17 16 15 14 13 12 11 10 9 LSB 8 7 6 5 4 Data Field 0 0 0 0 0 1 1 1 0 3 0 Address Field 1 0 0 0 1 1 0 0 1 0 0 1 1 1 R5 REGISTER The R5 register address bits (R5 [4:0]) are “01111”. This register is only written to if the SPI_DEF bit is set to 0. Register R5 REGISTER MSB R5 0 23 SHIFT REGISTER BIT LOCATION 22 21 20 19 18 17 16 15 14 13 12 11 10 9 LSB 8 7 6 5 Data Field 0 0 0 0 0 0 0 0 0 4 3 2 1 0 Address Field 0 15 0 0 0 0 0 0 0 0 0 1 1 1 1 www.national.com LMX2505 PLLatinum Dual Frequency Synthesizer System with Integrated VCOs Physical Dimensions inches (millimeters) unless otherwise noted 28-Pin Leadless Leadframe Package (LLP) NSC Package Number LQA28A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. National Semiconductor Americas Customer Support Center Email: [email protected] Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: [email protected] Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: [email protected] National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: [email protected] Tel: 81-3-5639-7560 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.