PC925L0NSZ0F Series PC925L0NSZ0F Series High Speed, 2.5A Output, Gate Drive DIP 8 pin ∗OPIC Photocoupler ■ Description ■ Agency approvals/Compliance PC925L0NSZ0F Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing lead form option. Peak output current is 2.5A, Input-output isolation voltage(rms) is 5kV and High speed response (tPHL, tPLH : MAX. 0.5μs). 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC925L) 2. Package resin : UL flammability grade (94V-0) ■ Applications 1. IGBT/MOSFET gate drive for inverter control ■ Features 1. 8 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Built-in direct drive circuit for MOSFET / IGBT drive (IO(peak) : 2.5A) 4. High speed response (tPHL, tPLH : MAX. 0.5μs) 5. Wide operating supply voltage range (VCC=15 to 30 V) 6. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN. −15kV/μs, CML : MIN. 15kV/μs) 7. Long creepage distance type (wide lead-form type only : MIN. 8mm) 8. High isolation voltage between input and output (Viso(rms) : 5kV) 9. Lead-free and RoHS directive compliant * "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D4-A09301EN Date Sep. 01. 2006 © SHARP Corporation PC925L0NSZ0F Series ■ Internal Connection Diagram 8 7 6 5 1 2 3 Interface 4 N.C. Anode Cathode N.C. GND VO VO VCC 5 6 7 8 Amp. 1 2 3 4 ■ Truth table VO Terminal output High level Low level Tr1 ON OFF Tr2 OFF ON ■ Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC925L0NSZ0F] SHARP mark "S" 8 1.2±0.3 0.6±0.2 7 6 SHARP mark "S" 5 Rank mark 2 3 9.66±0.30 5 Rank mark 6.5±0.3 4 1 Date code Primary side mark 2 3 9.66±0.30 ±0.30 4 Date code Primary side mark 7.62±0.30 0.5 TYP. 7.62 3.25±0.05 3.5±0.5 2.54±0.25 0.6±0.2 6 0.26±0.10 1 7 PC925L 6.5±0.3 PC925L 8 Epoxy resin 0.26±0.10 0.5±0.1 θ θ : 5˚ TYP. 2.54±0.25 3.5±0.5 1.2±0.3 2. SMT Gullwing Lead-Form [ex. PC925L0NIP0F] 1.0+0.4 −0 Epoxy resin 0.35±0.25 Input ON OFF 1.0+0.4 −0 10.0+0 −0.5 θ Product mass : approx. 0.55g Product mass : approx. 0.51g Sheet No.: D4-A09301EN 2 PC925L0NSZ0F Series (Unit : mm) 3. Wide SMT Gullwing Lead-Form [ex. PC925L0NUP0F] 1.2±0.3 0.6±0.2 7 8 5 Rank mark PC925L 6.5±0.3 SHARP mark "S" 6 Date code 1 2 3 4 Primary side mark 9.66±0.30 0.26±0.10 0.25±0.25 3.5±0.5 7.62±0.30 2.54±0.25 Epoxy resin 0.75±0.25 10.16±0.50 12.0MAX. 0.75±0.25 Product mass : approx. 0.55g Plating material : Pd (Au flash) Sheet No.: D4-A09301EN 3 PC925L0NSZ0F Series Date code (3 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production Mark A.D. A 2002 B 2003 C 2004 D 2005 E 2006 F 2007 H 2008 J 2009 K 2010 L 2011 M 2012 N : 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C : 3rd digit Week of production Week Mark 1st 1 2nd 2 3rd 3 4th 4 5, 6th 5 repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan or Indonesia China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Rank mark With or without. Sheet No.: D4-A09301EN 4 PC925L0NSZ0F Series ■ Absolute Maximum Ratings Parameter *1 Forward current Reverse voltage Input *2 Peak forward current Supply voltage *3 Peak output current Output Output voltage *4 Output power dissipation *5 Total power dissipation *6 Isolation voltage Operating temperature Storage temperature *7 Soldering temperature Symbol Rating IF 25 VR 5 IFM 1 VCC 35 IO(PEAK) 2.5 VCC VO PO 250 Ptot 295 Viso(rms) 5 Topr −40 to +100 Tstg −55 to +125 Tsol 270 (Ta=25˚C) Unit mA V A V A V mW mW kV ˚C ˚C ˚C *1 When ambient temperature goes above 70˚C, the power dissipation goes down at 0.3mA/˚C (Refer to Fig.10). *2 Pulse width≤1μs, 300pps *3 Pulse width≤10μs, Duty ratio : 0.002 *4 When ambient temperature goes above 70˚C, the power dissipation goes down at 4.8mA/˚C (Refer to Fig.11). *5 When ambient temperature goes above 70˚C, the power dissipation goes down at 5.4mA/˚C (Refer to Fig.12). *6 AC for 1min, 40 to 60%RH, f=60Hz *7 For 10s Sheet No.: D4-A09301EN 5 PC925L0NSZ0F Series (Unless otherwise specified : Ta=−+40 to +100˚C, IF(ON)=7 to 16mA, VCC=15 to 30V, VF(OFF)=−3V to 0.8V) Parameter Symbol Condition MIN. *13 TYP. MAX. Unit 1.2 1.8 V Forward voltage VF IF=10mA − Reverse current IR 10 VR=5V − − μA 60 150 pF Terminal capacitance Ct Ta=25˚C, V=0, f=1MHz − *8 VO=(VCC−4V), IF(ON) 0.5 1.5 A − High level output current IOH *9 VO=(VCC−15V), IF(ON) 2 A − − *8 VO=2.5V, VF(OFF) 0.5 1.5 A − Low level output current IOL *9 VO=15V, VF(OFF) 2 A − − V IO=−0.1A, IF(ON) VCC−4 VCC−3 High level output voltage VOH − 0.1 0.5 V Low level output voltage VOL IO=0.1A, VF(OFF) − *10 2.5 5 mA High level supply current ICCH IF(ON) − *10 2.5 5 mA Low level supply current ICCL VF(OFF) − VUVLO+ 11 12.3 13.5 V UVLO threshold VUVLO− VO>5V, IF=10mA 9.5 10.7 12 V 1.6 V UVLO Hysteresis UVLOHYS − − *11 5 mA "Low→High" threshold input current IFLH VO>5V, IO=0 − − Isolation resistance RISO Ta=25˚C, DC=500V, 40 to 60%RH 5×1010 1011 − Ω 0.1 0.3 0.5 "Low→High" propagation time tPLH μs "High→Low" propagation time tPHL 0.1 0.3 0.5 μs *12 0.3 Distortion of pulse width RG=10Ω, CG=10nF, − − μs ΔtW 0.35 Propagation delay skew tPSK f=10kHz, Duty ratio 50% −0.35 − μs 0.1 Rise time tr − − μs 0.1 Fall time tf − − μs 0.8 UVLO Turn on delay tUVLO ON VO>5V, IF=10mA − − μs 0.6 UVLO Turn off delay tUVLO OFF VO>5V, IF=10mA − − μs Instantaneous common mode rejection Ta=25˚C, VCM=1.5kV(p−p), 15 kV/μs |CMH| − − voltage (High level output) IF=10 to 16mA, VCC=30V, VOH>15V Ta=25˚C, VCM=1.5kV(p−p), Instantaneous common mode rejection − kV/μs |CML| 15 − voltage (Low level output) VF=0, VCC=30V, VOL<1V Transfer characteristics Response time Output Input ■ Electro-optical Characteristics*8 *7 It shall connect a by-pass capacitor of 0.1μF or more between VCC (Pin No. 8) and GND (Pin No. 5) near the device, when it measures the transfer characteristics and the output side characteristics. *8 Pulse width≤50μs, Duty ratio : 0.005 *9 Pulse width≤10μs, Duty ratio : 0.002 *10 Output pin is open. *11 IFLH is the value of forward current when output becomes from "L" to "H" *12 Distortion of pulse width ΔtW=|tPHL-tPLH| *13 All typical values are at Ta=25˚C, VCC=30V Sheet No.: D4-A09301EN 6 PC925L0NSZ0F Series ■ Model Line-up Lead Form Package Model No. Through-Hole Sleeve 50 pcs/sleeve PC925L0NSZ0F SMT Gullwing Wide SMT Gullwing Taping 1 000 pcs/reel PC925L0NIP0F PC925L0NUP0F Sheet No.: D4-A09301EN 7 PC925L0NSZ0F Series Fig.1 Test Circuit for High Level Output Current Fig.2 Test Circuit for Low Level Output Current 8 8 2 2 7 PC925L IF 6 7 IOH A 3 5 5 Fig.4 Test Circuit for Low Level Output Voltage Fig.3 Test Circuit for High Level Output Voltage 8 2 7 8 2 IO PC925L 7 PC925L VCC VCC 6 6 VOH V 3 V VOL 3 5 8 2 Fig.6 Test Circuit for UVLO Threshold A ICC 8 2 7 PC925L IOL 5 Fig.5 Test Circuit for High Level / Low Level Supply Current IF VCC A 6 3 IF IOL PC925L VCC 7 VCC PC925L IF 6 6 3 V VO>5V 3 5 VCC Variable 5 Sheet No.: D4-A09301EN 8 PC925L0NSZ0F Series Fig.7 Test Circuit for "Low→High" Input Threshold Current 8 2 7 PC925L IF Variable VCC 6 V VO 3 5 Fig.8 Test Circuit for Response Time 50% 8 VIN wave form 2 VIN 7 10kHz Duty ratio 50% PC925L 6 3 VOUT tPHL tPLH VCC RG 90% CG 50% 10% 5 VOUT wave form tr tf Fig.9 Test Circuit for Instantaneous Common Mode Rejection Voltage VCM (Peak) 8 A SW B VCM wave form 2 GND 7 PC925L VCC 6 V VO 3 5 + CMH, VO wave form SW at A, IF=10 to 16mA − CML, VO wave form SW at B, IF=0 VCM VOH VOL GND Sheet No.: D4-A09301EN 9 PC925L0NSZ0F Series Fig.11 Power Dissipation vs. Ambient Temperature 30 300 25 250 Output power dissipation PO (mW) Forward current IF (mA) Fig.10 Forward Currenet vs. Ambient Temperature 20 15 10 5 0 −50 −40 −25 0 25 50 70 75 100 200 150 100 50 0 −50 −40 −25 125 Ambient temperature Ta (˚C) 25 50 70 75 100 125 Ambient temperature Ta (˚C) Fig.13 Forward Current vs. Forward Voltage Fig.12 Total Power Dissipation vs. Ambient Temperature 100 350 300 295 Ta=25˚C Forward current IF (mA) Total power dissipation Ptot (mW) 0 250 200 150 100 Ta=0˚C Ta=50˚C 10 Ta=100˚C Ta=−40˚C 1 50 0 −50 −40 −25 0.1 0 25 50 70 75 100 125 1 1.2 1.4 Ambient temperature Ta (˚C) Fig.14 High Level Output Voltage Drop vs. Ambient Temperature High level output voltage drop VOH−VCC (V) High level output voltage drop VOH−VCC (V) 2 0 IF=10mA, IO=0.1A, VCC=30V −1 −1.5 −2 −2.5 −3 −3.5 −4 −40 1.8 Fig.15 High Level Output Voltage Drop vs. Supply Voltage 0 −0.5 1.6 Forward voltage VF (V) −20 0 20 40 60 80 −0.5 −1 −1.5 −2 −2.5 −3 −3.5 −4 15 100 Ambient temperature Ta (˚C) Ta=25˚C, IF=10mA, IO=0.1A 20 25 30 Supply voltage VCC (V) Sheet No.: D4-A09301EN 10 PC925L0NSZ0F Series Fig.16 Low Level Output Voltage vs. Ambient Temperature 0.2 0.25 IF=0mA, IO=0.1A, VCC=30V Low level output voltage VOL (V) Low level output voltage VOL (V) 0.25 Fig.17 Low Level Output Voltage vs. Supply Voltage 0.15 0.1 0.05 0 −40 0 −20 20 40 60 80 0.2 Ta=25˚C, VF=0.8mA, IO=0.1A 0.15 0.1 0.05 0 15 100 20 Ambient temperature Ta (˚C) Fig.19 High Level Supply Current vs. Supply Voltage 3.5 IF=16mA, VCC=30V High level supply current ICCH (mA) High level supply current ICCH (mA) 3 2.5 2 1.5 1 0.5 0 −40 0 −20 20 40 60 80 3 Ta=25˚C, IF=16mA 2.5 2 1.5 1 0.5 0 15 100 20 Ambient temperature Ta (˚C) 3.5 IF=0mA, VCC=30V 2.5 2 1.5 1 0.5 0 −40 −20 0 20 40 60 30 Fig.21 Low Level Supply Current vs. Supply Voltage Low level supply current ICCL (mA) High level supply current ICCL (mA) 3 25 Supply voltage VCC (V) Fig.20 Low Level Supply Current vs. Ambient Temperature 3.5 30 Supply voltage VCC (V) Fig.18 High Level Supply Current vs. Ambient Temperature 3.5 25 80 3 2.5 2 1.5 1 0.5 0 15 100 Ambient temperature Ta (˚C) Ta=25˚C, IF=0mA 20 25 30 Supply voltage VCC (V) Sheet No.: D4-A09301EN 11 PC925L0NSZ0F Series Fig.22 "Low→High" Relative Threshold Input Current vs. Ambient Temperature Fig.23 "Low→High" Relative Threshold Input Current vs. Supply Voltage 140 140 130 120 110 100 90 80 −40 0 −20 20 40 60 80 130 120 110 100 90 80 −40 100 0 −20 Ambient temperature Ta (˚C) 20 40 60 80 100 Supply voltage VCC (V) Fig.25 Relative UVLO Threshold vs. Ambient Temperature Fig.24 Output Voltage vs. Supply Voltage (UVLO Threshold) 120 20 Ta=25˚C IF=10mA 18 115 Relative UVLO threshold (%) 16 Output voltage VO (V) 100% at VCC=30V Ta=25˚C 100% at Ta=25˚C Relative threshold input current (%) Relative threshold input current (%) VCC=30V 14 12 10 8 6 4 100% at Ta=25˚C IF=10mA VO>5V 110 105 VUVLO+ 100 95 VUVLO− 90 85 2 80 −40 0 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 −20 0 20 40 60 80 100 Ambient temperature Ta (˚C) Supply voltage VCC (V) Fig.26 Propagation Delay Time vs. Ambient Temperature Propagation delay time tPLH, tPHL (μs) 0.5 VCC=30V RL=10Ω CG=10nF 0.45 0.4 tPHL Ta=−40˚C Ta=25˚C Ta=100˚C 0.35 0.3 Ta=−40˚C 0.25 tPLH 0.2 Ta=100˚C 0.15 Ta=25˚C 0.1 0.05 Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. 0 7 8 9 10 11 12 13 14 15 16 Forward current IF (mA) Sheet No.: D4-A09301EN 12 PC925L0NSZ0F Series ■ Design Considerations ● Recommended Operating Conditions Parameter Input current (ON) Input voltage (OFF) Supply voltage Operating temperature Symbol IF(ON) VF(OFF) VCC Topr MIN. 7 −3 15 −40 MAX. 16 0.8 30 100 Unit mA V V ˚C ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, please certainly connect a by-pass capacitor of 0.1μF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. ● Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. Please decide the input current which become 2 times of MAX. IFLH. Sheet No.: D4-A09301EN 13 PC925L0NSZ0F Series ● Recommended Foot Print (reference) SMT Gullwing Lead-form 1.7 2.54 2.54 2.54 8.2 2.2 (Unit : mm) Wide SMT Gullwing Lead-form 1.7 2.54 2.54 2.54 10.2 2.2 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D4-A09301EN 14 PC925L0NSZ0F Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering : Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak (package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARPʼs double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270̊C and within 10s. Preheating is within the bounds of 100 to 150̊C and 30 to 80s. Please donʼt solder more than twice. Hand soldering Hand soldering should be completed within 3 s when the point of solder iron is below 400̊C. Please donʼt solder more than twice. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D4-A09301EN 15 PC925L0NSZ0F Series ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D4-A09301EN 16 PC925L0NSZ0F Series ■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12 ±2 5.8 10.8 520 (Unit : mm) 6.7 Sheet No.: D4-A09301EN 17 PC925L0NSZ0F Series ● Tape and Reel package 1. SMT Gullwing Lead-Form Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F J D E G MA X. H H A B C I 5˚ K Dimensions List A B 16.0±0.3 7.5±0.1 H I ±0.1 10.4 0.40±0.05 C 1.75±0.10 J 4.2±0.1 D 12.0±0.1 K 10.2±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b φ330 17.5±1.5 e f φ23±1 2.0±0.5 f a b (Unit : mm) c d φ100±1 φ13.0±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D4-A09301EN 18 PC925L0NSZ0F Series ● Tape and Reel package 2. Wide SMT Gullwing Lead-Form Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F J D E G MA X. H H A B C I 5˚ K Dimensions List A B 24.0±0.3 11.5±0.1 H I ±0.1 12.4 0.40±0.05 C 1.75±0.10 J 4.05±0.10 D 12.0±0.1 K 10.0±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g a Dimensions List a b φ330 25.5±1.5 e f ±1 φ23 2.0±0.5 f b (Unit : mm) c d ±1 φ100 φ13.0±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D4-A09301EN 19 PC925L0NSZ0F Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E251] Sheet No.: D4-A09301EN 20