PC4D10SNIP0F Series PC4D10SNIP0F Series High Speed 10Mb/s, High CMR Mini-flat 2-channel Package ∗OPIC Photocoupler ■ Description ■ Agency approvals/Compliance PC4D10SNIP0F Series contains a LED optically coupled to an OPIC. It is packaged in a 8 pin mini-flat (2-ch output). Input-output isolation voltage(rms) is 3.75 kV. High speed response (TYP. 10Mb/s) and CMR is MIN. 10kV/μs. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC4D10S) 2. Approved by VDE, DIN EN60747-5-2(∗) (as an option), file No. 40009162 (as model No. PC4D10S) 3. Package resin : UL flammability grade (94V-0)) (∗) ■ Features DIN EN60747-5-2 : successor standard of DIN VDE0884. ■ Applications 1. 2-ch output, 8 pin Mini-flat package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN. 10kV/μs, CML : MIN. −10kV/μs) 4. High speed response (tPHL : TYP. 50ns, tPLH : TYP. 48ns) 5. Isolation voltage between input and output (Viso(rms) : 3.75kV) 6. Lead-free and RoHS driective compliant 1. Programmable controller 2. Inverter * "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A09201EN Date Sep. 1. 2006 © SHARP Corporation PC4D10SNIP0F Series ■ Internal Connection Diagram 8 1 2 7 2 3 6 4 5 1 Amp. 3 4 Anode 1 Cathode 1 Cathode 2 Anode 2 5 6 7 8 GND VO2 VO1 VCC Amp. ■ Truth table Channel Input H L H L 1 2 LED ON OFF ON OFF Output L H L H ■ Outline Dimensions (Unit : mm) 5 3.937±0.127 Primary side mark 1 2 3 5 4 Primary side mark 1 2 3 4 1.27±0.05 0.406±0.076 Rank mark 6 4D10S 4 1.27±0.05 7 Date code Rank mark Date code 5.080±0.127 0.305MIN. 3.175±0.127 0.203±0.102 3.175±0.127 0.200±0.025 5.080±0.127 VDE Identification mark 0.406±0.076 0.200±0.025 4D10S 8 SHARP mark "S" 0.305MIN. Product mass : approx. 0.15g 0.203±0.102 6 5.994±0.203 7 5.994±0.203 8 SHARP mark "S" 2. Mini-flat Package (VDE option) [ex. PC4D10SYIP0F] 3.937±0.127 1. Mini-flat Package [ex. PC4D10SNIP0F] Product mass : approx. 0.15g Plating material : Pd (Au flush) Sheet No.: D2-A09201EN 2 PC4D10SNIP0F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production Mark A.D. A 2002 B 2003 C 2004 D 2005 E 2006 F 2007 H 2008 J 2009 K 2010 L 2011 M 2012 N : Mark P R S T U V W X A B C : 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D repeats in a 20 year cycle Country of origin Japan Rank mark With or without. Sheet No.: D2-A09201EN 3 PC4D10SNIP0F Series ■ Absolute Maximum Ratings Parameter Symbol *1 Forward current IF Reverse voltage VR Input Power dissipation P1 Supply voltage VCC Output collector voltage VO Output Output collector current IO *1 Output collector power dissipation PC Operating temperature Topr Storage temperature Tstg *2 Isolation voltage Viso(rms) *3 Soldering temperature Tsol Rating 20 5 40 7 7 50 60 −40 to +85 −55 to +125 3.75 270 (Ta=25˚C) Unit mA V mW V V mA mW ̊C ̊C kV ̊C *1 No delating required up to 85˚C *2 40 to 60%RH, AC for 1minute, f=60Hz *3 For 10s ■ Electro-optical Characteristics Forward voltage Reverse current Terminal capacitance Low level output voltage High level output current Low level supply current High level supply current "High→Low" input threshold current Isolation resistance Floating capacitance "High→Low" propagation delay time "Low→High" propagation delay time *6 Distortion of pulse width Rise time Fall time Propagation delay skew Instantaneous common mode rejection voltage (High level output) Instantaneous common mode rejection voltage (Low level output) *5 Transfer characteristics Response time *5 Output Input Parameter (Unless otherwise specified Ta=−40 to 85˚C) Symbol VF IR Ct VOL IOH ICCL ICCH IFHL RISO Cf Condition Ta=25˚C, IF=10mA IF=10mA Ta=25̊C, VR=5V Ta=25̊C, V=0, f=1MHz IOL=13mA, VCC=5.5V, VE=2V, IF=5mA VCC=VO=5.5V, IF=250μA VCC=5.5V, IF=10mA VCC=5.5V, IF=0 VCC=5V, VO=0.6V, RL=350Ω Ta=25̊C, DC500V, 40 to 60%RH Ta=25̊C, V=0, f=1MHz tPHL tPLH ΔtW tr tf tPSK CMH CML Ta=25˚C VCC=5V, IF=7.5mA, RL=350W, CL=15pF IF=0, VO(Min)=2V, IF=7.5mA, VO(MAX)=0.8V Ta=25˚C Ta=25̊C, VCC=5V, VCM=1kV(P-P), RL=350Ω MIN. 1.4 1.3 − − − − − − − 5×1010 − − 25 − 25 − − − − TYP.*4 1.5 − − 60 0.4 0.02 13 10 2.5 1011 0.6 − 48 − 50 3.5 20 10 − MAX. 1.75 1.8 10 150 0.6 100 21 15 5 − − 100 75 100 75 35 − − 40 Unit 10 20 − kV/μs −10 −20 − kV/μs V μA pF V μA mA mA mA Ω pF ns ns ns ns ns ns ns ns *4 All typical values at VCC=5V, Ta=25˚C *5 It shall connect a by-pass capacitor of 0.01μF or more between VCC (pin ➇) and GND (pin ➄) near the device, when it measures the transfer characteristics and the output side characteristics *6 Distortion of pulse width Δtw= | tPHL−tPLH | Sheet No.: D2-A09201EN 4 PC4D10SNIP0F Series Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time Input 47Ω Amp. 3.75mA 0mA 350Ω 2 7 3 6 4 IF 8 tPHL VO CL VCC=5V 1 0.1μF IF 7.5mA 5V 90% VO 5 Amp. tPLH Output 1.5V 10% *CL contains probe and wiring capacity. VOL tr tf Timing diagram Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage 1kV IF 350Ω 2 7 3 6 4 5 A VO VCM VCC=5V B 8 Amp. 0.1μF 1 GND VO CL Amp. + 5V CMH SW=at A, IF=0 − VO(MIN.) VO(MAX.) VO VOL CML SW=at B, IF=7.5mA VCM GND *CL contains probe and wiring capacity. Timing diagram Fig.3 Forward Current vs. Ambient Temperature Fig.4 Output Collector Power Dissipation vs. Ambient Temperature 100 Collector power dissipation PC (mW) Forward current IF (mA) 25 20 15 10 5 0 −40 −25 0 25 50 75 85 100 80 60 40 20 0 −40 −25 125 0 25 50 75 85 100 125 Ambient temperature Ta (C) Ambient temperature Ta (C) Sheet No.: D2-A09201EN 5 PC4D10SNIP0F Series Fig.5 Forward Current vs. Forward Voltage Fig.6 High Level Output Current vs. Ambient Temperature 100 High level output current IOH (nA) 100 000 Forward current IF (mA) Ta=25˚C Ta=0˚C Ta=50˚C 10 Ta=100˚C Ta=−40˚C 1 0.1 1 1.2 1.4 1.6 1.8 VCC=VO=5V IF=0 10 000 1 000 100 10 1 −60 2 −40 −20 Forward voltage VF (V) Fig.7 Low Level Output Voltage vs. Ambient Temperature Output voltage VO (V) Low level output voltage VOL (V) IOL=16mA 12.8mA 9.6mA 0.4 6.4mA 0.3 80 100 4 3 2 RL=350Ω 0.2 RL=1kΩ 1 0.1 RL=4kΩ 0 −40 −20 0 20 40 60 80 0 100 1 Fig.9 Input Threshold Current vs. Ambient Temperature 100 Propagation delay time tPLH, tPHL (ns) VCC=5V VO=0.6V RL=1kΩ 3 4 5 Fig.10 Propagation Delay Time vs. Forward Current 5 4 2 Forward current IF (mA) Ambient temperature Ta (C) Input threshold current IFHL (mA) 60 Ta=25˚C VCC=5V 5 0.5 RL=4kΩ RL=350Ω 3 2 1 0 −60 40 6 VCC=5.5V 0.7 IF=5mA 0 −60 20 Fig.8 Output Voltage vs. Forward Current 0.8 0.6 0 Ambient temperature Ta (C) VCC=5V CL=15pF RL=350Ω 80 60 tPLH 40 tPHL 20 0 −40 −20 0 20 40 60 80 5 100 7 9 11 13 15 Forward current IF (mA) Ambient temperature Ta (C) Sheet No.: D2-A09201EN 6 PC4D10SNIP0F Series Fig.11-a Propagation Delay Time vs. Ambient Temperature Fig.11-b Propagation Delay Time vs. Ambient Temperature 80 100 RL=350Ω VCC=5V IF=7.5mA CL=15pF Propagation delay time tPLH, tPHL (ns) Propagation delay time tPLH, tPHL (ns) 100 60 tPHL 40 tPLH 20 0 −60 −40 −20 0 20 40 60 80 80 60 tPLH 40 tPHL 20 0 −60 100 −40 −20 Ambient temperature Ta (C) 80 RL=4kΩ Pulse width distrrion Δtw (ns) VCC=5V IF=7.5mA CL=15pF tPLH 100 80 60 40 −40 −20 0 20 40 40 60 80 100 60 80 100 VCC=5V IF=7.5mA CL=15pF 40 RL=4kΩ 20 RL=1kΩ 0 tPHL 20 −60 20 Fig.12 Pulse width Distortion vs. Ambient Temperature 140 Propagation delay time tPLH, tPHL (ns) 0 Ambient temperature Ta (C) Fig.11-c Propagation Delay Time vs. Ambient Temperature 120 RL=1kΩ VCC=5V IF=7.5mA CL=15pF 60 80 −20 −60 100 Ambient temperature Ta (C) RL=350Ω −40 −20 0 20 40 60 Ambient temperature Ta (C) Fig.13 Rise Time / Fall Time vs. Ambient Temperature Rise time tr, Fall time tf (ns) 50 40 VCC=5V IF=7.5mA CL=15pF RL=350Ω 30 tr 20 10 tf 0 −60 −40 −20 0 20 40 60 80 Remarks : Please be aware that all data in the graph are just for reference and anot for guarantee. 100 Ambient temperature Ta (C) Sheet No.: D2-A09201EN 7 PC4D10SNIP0F Series ■ Design Considerations ● Recommended operating conditions Parameter Low level input current High level input current Supply voltage Fan out (TTL load) Output pull-up resitor Operating temperature Symbol IFL IFH VCC N RL Topr MIN. 0 8 4.5 − 330 −40 TYP. − − − − − − MAX. 250 15 5.5 5 4 000 +85 Unit μA mA V − Ω ˚C ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01μF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. ● Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. Please decide the input current which become 2 times of MAX. IFHL. ● Recommended foot print (reference) 1.9 0.64 1.27 1.27 1.27 7.49 (Unit : mm) Sheet No.: D2-A09201EN 8 PC4D10SNIP0F Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak (package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270̊C and within 10s. Preheating is within the bounds of 100 to 150̊C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400̊C. Please don't solder more than twice. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A09201EN 9 PC4D10SNIP0F Series ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A09201EN 10 PC4D10SNIP0F Series ● Tape and Reel package SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions E D J G I 5˚ MA X. H H A B C F K Dimensions List A B ±0.3 12.0 5.50±0.05 H I ±0.1 5.4 0.30±0.05 C 1.75±0.10 J 3.7±0.1 D 8.0±0.1 K 6.3±0.1 E 2.00±0.05 F 4.0±0.1 (Unit : mm) G φ1.55±0.05 Reel structure and Dimensions e d Dimensions List a b φ330 13.5±1.5 e f ±0.8 φ21.0 2.0TYP. c g (Unit : mm) c d φ100±1 φ13.0±0.2 g 2.0±0.5 f a b Direction of product insertion Pull-out direction [Packing : 1 500pcs/reel] Sheet No.: D2-A09201EN 11 PC4D10SNIP0F Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A09201EN [E256] 12