AD AD53040

a
FEATURES
500 MHz Driver Operation
Driver Inhibit Function
100 ps Edge Matching
Guaranteed Industry Specifications
50 ⍀ Output Impedance
>1.5 V/ns Slew Rate
Variable Output Voltages for ECL, TTL and CMOS
High Speed Differential Inputs for Maximum Flexibility
Ultrasmall 20-Lead SOP Package with Built-In Heat Sink
APPLICATIONS
Automatic Test Equipment
Semiconductor Test Systems
Board Test Systems
Instrumentation and Characterization Equipment
PRODUCT DESCRIPTION
The AD53040 is a complete high speed pin driver designed for
use in digital or mixed-signal test systems. Combining a high
speed monolithic process with a unique surface mount package,
this product attains superb electrical performance while preserving optimum packaging densities and long-term reliability in an
ultrasmall 20-lead, SOP package with built-in heat sink.
Featuring unity gain programmable output levels of –3 V to
+8 V, with output swing capability of less than 100 mV to 9 V,
the AD53040 is designed to stimulate ECL, TTL and CMOS
logic families. The 500 MHz data rate capacity and matched
output impedance allows for real-time stimulation of these
digital logic families. To test I/O devices, the pin driver can
be switched into a high impedance state (Inhibit Mode), electrically removing the driver from the path. The pin driver leakage
current inhibit is typically 100 nA and output charge transfer
entering inhibit is typically less than 20 pC.
Ultrahigh Speed Pin Driver
with Inhibit Mode
AD53040
FUNCTIONAL BLOCK DIAGRAM
VCC
VEE
VCC
VEE
39nF
39nF
VH
VHDCPL
DATA
DATA
50V
DRIVER
VOUT
INH
INH
VLDCPL
VL
TVCC
AD53040
THERM
1.0mA/K
GND
GND
GND
GND
GND
The AD53040 transition from HI/LO or to inhibit is controlled
through the data and inhibit inputs. The input circuitry uses
high speed differential inputs with a common-mode range of
± 3 V. This allows for direct interface to precision differential
ECL timing or the simplicity of stimulating the pin driver from a
single ended TTL or CMOS logic source. The analog logic HI/LO
inputs are equally easy to interface. Typically requiring 10 µA of
bias current, the AD53040 can be directly coupled to the
output of a digital-to-analog converter.
The AD53040 is available in a 20-lead, SOP package with a
built-in heat sink and is specified to operate over the ambient
commercial temperature range of –25°C to +85°C.
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
World Wide Web Site: http://www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 1999
AD53040–SPECIFICATIONS
(All specifications are at TJ = +85ⴗC ⴞ 5ⴗC, +VS = +12 V ⴞ 3%, –VS = –7 V ⴞ
3% unless otherwise noted. All temperature coefficients are measured at TJ = +75ⴗC–95ⴗC). (A 39 nF capacitor must be connected between
VCC and VHDCPL and between VEE and VLDCPL.)
Parameter
Min
DIFFERENTIAL INPUT CHARACTERISTICS
Input Swing (Data to DATA, INH to INH)
Max (DATA, DATA) to Min (INH, INH)
Max (INH, INH) to Min (Data, DATA)
Bias Current
Typ
Max
Units
ECL
2
Volts
2
Volts
µA
VIN = –2 V, 0.0 V
± 10
Test Conditions
REFERENCE INPUTS
Bias Currents
–50
+50
µA
VL , V H = 5 V
OUTPUT CHARACTERISTICS
Logic High Range
–2
+8
Volts
–3
0.1
+5
9
Volts
Volts
DATA = H, VH = –2 V to +8 V
VL = –3 V (VH = –2 V to +6 V)
VL = –1 V (VH = +6 V to +8 V)
DATA = L, VL = –3 V to +5 V, VH = +6 V
VL = –0.05 V, VH = +0.05 V and
VL = –2 V, VH = +7 V
Logic Low Range
Amplitude (VH and VL)
Absolute Accuracy
VH Offset
VH Gain + Linearity Error
VL Offset
VL Gain + Linearity Error
Offset TC, VH or VL
Output Resistance
–100
± 0.3 ± 5
–100
45
± 0.3 ± 5
0.5
47
+100 mV
% of VH + mV
+100 mV
% of VL + mV
mV/°C
49
Ω
150
± 65
µA
mA
mA
35
dB
1.5
ns
Propagation Delay TC
2
ps/°C
Delay Matching, Edge to Edge
100
ps
Output Leakage
Dynamic Current Limit
Static Current Limit
PSRR, Drive Mode
DYNAMIC PERFORMANCE, DRIVE
(VH and VL )
Propagation Delay Time
–1.0
+1.0
DATA = H, VH = –2 V to +8 V, VL = –3 V
DATA = H, VH = –2 V to +8 V, VL = –3 V
DATA = L, VL = –3 V to +5 V, VH = +6 V
DATA = L, VL = –3 V to +5 V, VH = +6 V
VL, VH = 0 V, +5 V and –3 V, 0 V
DATA = H, VH = +3 V, VL = 0 V,
IOUT = 30 mA
VOUT = –3 V to +8 V
CBYP = 39 nF, VH = +7 V, VL = –2 V
Output to –3 V, VH = +8 V, VL = –1 V,
DATA = H and Output to +8 V, VH = +6 V,
VL = –3 V, DATA = L
VS = VS ± 3%
Measured at 50%, VH = +400 mV,
VL = –400 mV
Measured at 50%, VH = +400 mV,
VL = –400 mV
Measured at 50%, VH = +400 mV,
VL = –400 mV
Rise and Fall Time
1 V Swing
3 V Swing
5 V Swing
Rise and Fall Time TC
1 V Swing
3 V Swing
5 V Swing
Overshoot, Undershoot and Preshoot
0.8
1.7
2.4
ns
ns
ns
Measured 20%–80%, VL = 0 V, VH = 1 V
Measured 10%–90%, VL = 0 V, VH = 3 V
Measured 10%–90%, VL = 0 V, VH = 5 V
±1
±2
±3
± (1% +50 mV)
ps/°C
ps/°C
ps/°C
% of Step + mV
Measured 20%–80%, VL = 0 V, VH = 1 V
Measured 10%–90%, VL = 0 V, VH = 3 V
Measured 10%–90%, VL = 0 V, VH = 5 V
a. VL , VH = 0.0 V, 1.0 V
b. VL, VH = 0.0 V, 3.0 V
c. VL, VH = 0.0 V, 5.0 V
Settling Time
to 15 mV
to 4 mV
Delay Change vs. Pulsewidth
40
8
50
ns
µs
ps
VL = 0 V, VH = 0.5 V
VL = 0 V, VH = 0.5 V
VL = 0 V, VH = 2 V,
Pulsewidth = 2.5 ns/7.5 ns, 30 ns/100 ns
–2–
REV. B
AD53040
Parameter
Min
Units
Test Conditions
1.7
ns
5 V Swing
2.6
ns
Toggle Rate
500
MHz
4.0 ns Input, 10%/90% Output,
VL = 0 V, VH = 3 V
6.0 ns Input, 10%/90% Output,
VL = 0 V, VH = 5 V
VL = –1.8 V, VH = –0.8 V,
VOUT > 600 mV p-p
DYNAMIC PERFORMANCE, DRIVE
(VH and VL ) (Continued)
Minimum Pulsewidth
3 V Swing
DYNAMIC PERFORMANCE, INHIBIT
Delay Time, Active to Inhibit
Delay Time, Inhibit to Active
Typ
Max
2
5
ns
2
5
ns
I/O Spike
Output Capacitance
POWER SUPPLIES
Total Supply Range
Positive Supply
Negative Supply
Positive Supply Current
Negative Supply Current
Total Power Dissipation
Temperature Sensor Gain Factor
<200
5
mV, p-p
pF
Measured at 50%, VH = +2 V,
VL = –2 V
Measured at 50%, VH = +2 V,
VL = –2 V
VH = 0 V, VL = 0 V
Driver Inhibited
19
+12
–7
V
V
V
mA
mA
W
µA/K
RLOAD = 10 K, VSOURCE = +12 V
75
75
1.43
1.15
1.0
NOTES
Connecting or shorting the decoupling capacitors to ground will result in the destruction of the device.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS 1
Power Supply Voltage
+VS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +13 V
–VS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –8 V
+VS to –VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +20 V
Inputs
DATA, DATA, INH, INH . . . . . . . . . . . . . . . . +5 V, –3 V
DATA to DATA, INH to INH . . . . . . . . . . . . . . . . . . ± 3 V
VH, VL to GND . . . . . . . . . . . . . . . . . . . . . . . . . +9 V, –4 V
VH to VL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +11 V, 0 V
Outputs
VOUT Short Circuit Duration . . . . . . . . . . . . . . . . Indefinite2
VOUT Range in Inhibit Mode
VHDCPL . . . . . Do Not Connect Except for Capacitor to VCC
VLDCPL . . . . . Do Not Connect Except for Capacitor to VEE
THERM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +13 V, 0 V
Environmental
Operating Temperature (Junction) . . . . . . . . . . . . . . +175°C
Storage Temperature . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec)3 . . . . . . . . . . +260°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Absolute maximum limits apply
individually, not in combination. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
2
Output short circuit protection is guaranteed as long as proper heat sinking is
employed to ensure compliance with the operating temperature limits.
3
To ensure lead coplanarity (± 0.002 inches) and solderability, handling with bare
hands should be avoided and the device should be stored in environments at 24 °C
± 5°C (75°F ± 10°F) with relative humidity not to exceed 65%.
ORDERING GUIDE
Model
Package
Description
AD53040KRP 20-Lead Power SOIC Tube, 38 Pieces
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD53040 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. B
Shipment Method,
Quantity Per
Package
Shipping Container Option
–3–
RP-20
WARNING!
ESD SENSITIVE DEVICE
AD53040
PIN CONFIGURATION
PIN FUNCTION DESCRIPTIONS
Pin
Name
VCC
VEE
GND
Pin
Number
1, 2
8, 9
4, 6, 14,
16, 17
VL
15
VH
18
VOUT
5
VHDCPL
3
VLDCPL
7
INH, INH 10, 11
DATA,
DATA
13, 12
TVCC
19
THERM
20
Pin Functional Description
Positive Power Supply. Both pins
should be connected to minimize inductance and allow maximum speed of
operation. VCC should be decoupled to
GND with a low inductance 0.1 µF
capacitor.
Negative Power Supply. Both pins
should be connected to keep the inductance down and allow maximum speed
of operation. VEE should be decoupled
to GND with a low inductance 0.1 µF
capacitor.
VCC 1
20 THERM
VCC 2
19 TVCC
VHDCPL 3
18 VH
GND 4
AD53040
17 GND
VOUT 5
TOP VIEW
(Not to Scale)
16 GND
COPPER
SLUG UP
14 GND
GND 6
VLDCPL 7
VEE
8
VEE
9
15 VL
13 DATA
12 DATA
11 INH
INH 10
Table I. Pin Driver Truth Table
Device Ground. These pins should be
connected to the circuit board’s ground
plane at the pins.
Analog Input that sets the voltage level
of a Logic 0 of the driver. Determines
the driver output for DATA > DATA.
Analog input that sets the voltage level
of a Logic 1 of the driver. Determines
the driver output for DATA > DATA.
The Driver Output. The nominal output impedance is 50 Ω.
Internal supply decoupling for the
output stage. This pin is connected
to VCC through a 39 nF minimum
capacitors.
Internal supply decoupling for the
output stage. This pin is connected
to VEE through a 39 nF minimum
capacitors.
ECL compatible input that control the
high impedance state of the driver.
When INH > INH, the driver goes into
a high impedance state.
ECL compatible inputs that determines
the high and low state of the driver.
Driver output is high for DATA >
DATA.
Temperature Sensor Start-Up Pin. This
pin should be connected to VCC.
Temperature Sensor Output Pin. A
resistor (10K) should be connected
between THERM and VCC. The approximate die temperature can be determined by measuring the current
through the resistor. The typical scale
factor is 1 µA/K.
DATA
DATA
INH
INH
Output
State
0
1
0
1
1
0
1
0
0
0
1
1
1
1
0
0
VL
VH
Hi-Z
Hi-Z
Table II. Package Thermal Characteristics
–4–
Air Flow, FM
␪JC, ⴗC/W
␪JA, ⴗC/W
0
50
400
4
4
4
50
49
34
REV. B
AD53040
APPLICATION INFORMATION
Power Supply Distribution, Bypassing and Sequencing
The AD53040 draws substantial transient currents from its
power supplies when switching between states and careful design
of the power distribution and bypassing is key to obtaining specified performance. Supplies should be distributed using broad,
low inductance traces or (preferably) planes in a multilayered
board with a dedicated ground-plane layer. All of the device’s
power supply pins should be used to minimize the internal inductance presented by the part’s bond wires. Each supply must
be bypassed to ground with at least one 0.1 µF capacitor; chipstyle capacitors are preferable as they minimize inductance. One
or more 10 µF (or greater) Tantalum capacitors per board are
also advisable to provide additional local energy storage.
The AD53040’s current-limit circuitry also requires external
bypass capacitors. Figure 1 shows a simplified schematic of the
positive current-limit circuit. Excessive collector current in output transistor Q49 creates a voltage drop across the 10 Ω resistor, which turns on PNP transistor Q48. Q48 diverts the risingedge slew current, shutting down the current mirror and removing the output stage’s base drive. The VHDCPL pin should be
bypassed to the positive supply with a 0.039 µF capacitor, while
the VLDCPL pin (not shown) requires a similar capacitor to the
negative supply- these capacitors ensure that the AD53040
doesn’t current limit during normal output transitions up the its
full 9 V rated step size. Both capacitors must have minimumlength connections to the AD53040. Here again, chip capacitors
are ideal.
VPOS
10V610%
VHDCPL
Q48
RISING-EDGE SLEW
CONTROL CURRENT
LEVEL-SHIFTED
LOGIC DRIVE
VH
VNEG
Q49
Several points about the current-limit circuitry should be noted.
First, the limiting currents are not tightly controlled, as they are
functions of both absolute transistor VBES and junction temperature; higher dc output current is available at lower junction
temperatures. Second, it is essential to connect the VHDCPL
capacitor to the positive supply (and the VLDCPL capacitor to
the negative supply)—failure to do so causes considerable thermal stress in the current-limiting resistor(s) during normal supply sequencing and may ultimately cause them to fail, rendering
the part nonfunctional. Finally, the AD53040 may appear to
function normally for small output steps (less than 3 V or so) if
one or both of these capacitors is absent, but it will exhibit
excessive rise or fall times for steps of larger amplitude.
The AD53040 does not require special power-supply sequencing.
However, good design practice dictates that digital and analog
control signals not be applied to the part before the supplies are
stable. Violating this guideline will not normally destroy the
part, but the active inputs can draw considerable current until
the main supplies are applied.
Digital Input Range Restrictions
Total range amongst all digital signals (DATA, DATA, INH,
and INH) has to be less than or equal to 2 V to meet specified
timing. The device will function above 2 V with reduced performance up to the absolute maximum limit. This performance
degradation might not be noticed in all modes of operation. Of
all the six possible transitions (VH v VL, VL v VH, VH v INH,
INH v VH, VL v INH and INH v VL), there may be only one
that would show a degradation, usually in delay time. Taken to
the extreme, the driver may fail to achieve a proper output voltage, output impedance or may fail to fully inhibit.
An example of a scenario that would not work for the AD53040
is if the part is driven using 5 V single-ended CMOS. One pin of
each differential input would be tied to a +2.5 V reference level
and the logic voltages would be applied to the other. This would
meet the Absolute Maximum Rating of ± 3 V because the max
differential is ± 2.5 V. It is however possible, for example for
0.0 V to be applied to the INH input and +5 V to be applied to
the DATA input. This 5 V difference far exceeds the 2.0 V
limitation given above. Even using 3 V CMOS or TTL the
difference between logic high and logic low is greater than or
equal to 3 V which will not properly work. The only solution is
to use resistive dividers or equivalent to reduce the voltage levels.
OUT
5.12V
Q50
550mV
/DIV
Figure 1. Simplified Schematic of the AD53040 Output
Stage and Positive Current Limit Circuitry
–380mV
66.25ns
500ps/DIV
71.25ns
Figure 2. 5 V Output Swing
REV. B
–5–
AD53040
NOTE:
VLOW
VHIGH
1. 50V TERMINATION TO BE AS CLOSE TO RECEIVER
AS POSSIBLE. (END OF TRACE MARKED BY *). THROUGH
SMA CONNECTS BETWEEN MC10EL16 OUTPUTS AND DUT.
2. NO VIAS ALLOWED ON VOUT LINE.
3. SMA ON VOUT TO BE MOUNTED ON ITS SIDE FOR BEST
IMPEDANCE MATCH.
4. ONE DIMENSION OF BOARD TO BE 4-1/2 INCHES.
5. DUT PACKAGE IS TO BE CENTERED ON BOARD.
6. ALL RESISTORS AND NONELECTROLYTIC CAPS ARE
0805-SIZE SURFACE MOUNT.
7. SEE DATA SHEET FOR HIDDEN POWER AND GROUND PINS
ON LOGIC GATES.
8. ALL 100nF BYPASS CAPACITORS TO BE LOCATED CLOSE
TO PACKAGE.
9. PCB IS TO BE 4-LAYER WITH POWER GND ( ) AND –2V AS
INNER PLANES.
50V
DATA
J1
SMB
50V
R6
50V
2
SMB
U1
MC10EL16
1 8
C1
0.1mF
J4
+VS
C2
0.1mF
7
6
3
5
–5.2V
C21
0.1mF
C12
0.01mF
C19
0.1mF
50V
R4
50V
R3
50V
J3
R7
50V
THERM
TVCC
C14
0.1mF
1
50V 2
R5
50V
8
VOUT
U3
50V
AD53040
DATA
6
C22
0.1mF
IL–
SMB
R1
50V
R2
50V
INH
J6
JP1
–VS
1
TP GND
JP2
–2V
C15
0.1mF
1
C17
0.039mF
PWR
GND
+VS
C3
0.1mF
TP
JP3
1
P1
1
9
2
10
3
11
4
12
5
13
6
14
7
15
8
VOUT
G2L
50V
5
–5.2V
C13
0.01mF
J7
SIDESMB
G2H
VL
J5
7
3
IL+
VH
SMB
U2
MC10EL16
TEST_LD
+VS
TH
50V
C18
5pF
C16
0.039mF
HQG1
–2V
INH
J2
SMB
J8
SIDESMB
SMB
–VS
TP
VLOW
–2V
VHIGH
–VS
THERM
–5.2V
–VS
VEE
–5.2V
VCC
C9
0.1mF
C10
0.1mF
C11
0.1mF
GND
+VS
+
C4
1mF
C7
1mF
C6
1mF
C5
1mF
C8
0.1mF
DB15
Figure 3. Evaluation Board Schematic
–6–
REV. B
AD53040
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
20-Lead Thermally Enhanced Small Outline Package (PSOP)
(RP-20)
20
11
0.1890 (4.80) 0.4193 (10.65)
0.1791 (4.55) 0.3937 (10.00)
HEAT
SINK
0.2992 (7.60)
0.2914 (7.40)
C3003b–0–11/99
0.5118 (13.00)
0.4961 (12.60)
1
10
PIN 1
0.3340 (8.61)
0.3287 (8.35)
0.1043 (2.65)
0.0926 (2.35)
8°
0°
0.0201 (0.51)
SEATING 0.0500 (1.27)
0.0130 (0.33) PLANE
0.0057 (0.40)
0.0295 (0.75)
x 45°
0.0098 (0.25)
PRINTED IN U.S.A.
0.0118 (0.30) 0.0500
(1.27)
0.0040 (0.10)
BSC
STANDOFF
REV. B
–7–