AD ADM1041A

Secondary-Side Controller with
Current Share and Housekeeping
ADM1041A
INTERFACE AND INTERNAL FEATURES
FEATURES
SMBus interface (I2C-compatible)
Voltage-error amplifier
Differential current sense
Sense resistor or current transformer option
Overvoltage protection
Undervoltage protection
Overcurrent protection
Overtemperature protection
Start-up undervoltage blanking
Programmable digital debounce and delays
352-byte EEPROM available for field data
160-byte EEPROM for calibration
Ground continuity monitoring
Digital calibration via internal EEPROM
Supports SSI specification
Comprehensive fault detection
Reduced component count on secondary side
Standalone or microcontroller control
SECONDARY-SIDE FEATURES
Generates error signal for primary-side PWM
Output voltage adjustment and margining
Current sharing
Current-limit adjustment
OrFET control
Programmable soft-start slew rate
Standalone or microcontroller operation
Differential load voltage sense
AC mains undervoltage detection (ac sense)
Overvoltage protection
APPLICATIONS
Network servers
Web servers
Power supply control
OrFET
RS
VOUT
RLOAD
GND
VDD
VDD
BIAS
PWM
CONTROLLER
VDD
ADM1041A
VDD
THERMISTOR
VDD
OTP
VDD
FG
CBD
CS–/VLS
FD
SHRO
CS+
SHRS
VDD
VS +
VCMP
VS–
ICT
PULSE AC_OK
MON2 DC_OK
PSON
PEN
ADD0
CCMP
SCMP
SCL
SDA
GND
SHARE BUS
VOUT
VS +
VS–
MICROCONTROLLER
05405-001
OPTIONAL
ISOLATION BARRIER
Figure 1. Typical Application Circuit
Rev. 0
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Fax: 781.326.8703
© 2005 Analog Devices, Inc. All rights reserved.
ADM1041A
TABLE OF CONTENTS
General Description ......................................................................... 3
ISHARE Error Amplifier................................................................. 22
Sample Application Circuit Description ................................... 3
ISHARE Clamp ................................................................................ 22
Specifications..................................................................................... 6
SHARE_OK Detector ................................................................ 23
Absolute Maximum Ratings.......................................................... 13
Pulse/ACSENSE2............................................................................. 24
Thermal Characteristics ............................................................ 13
Pulse ............................................................................................. 24
ESD Caution................................................................................ 13
ACSENSE.......................................................................................... 24
Pin Configuration and Function Descriptions........................... 14
OrFET Gate Drive ...................................................................... 25
Terminology ................................................................................ 16
Oscillator and Timing Generators ............................................... 27
Theory of Operation ...................................................................... 18
Logic I/O and Monitor Pins...................................................... 27
Power Management.................................................................... 18
SMBus Serial Port....................................................................... 30
Gain Trimming and Configuration ......................................... 18
Microprocessor Support............................................................ 30
Differential Remote Sense Amplifier....................................... 19
Broadcasting................................................................................ 30
Set Load Voltage ......................................................................... 19
SMBus Serial Interface............................................................... 30
Load Overvoltage (OV) ............................................................. 19
General SMBus Timing ............................................................. 31
Local Voltage Sense .................................................................... 19
SMBus Protocols for RAM and EEPROM.............................. 33
Local Overvoltage Protection (OVP) ...................................... 19
SMBus Read Operations ........................................................... 35
Local Undervoltage Protection (UVP) .................................... 19
SMBus Alert Response Address (ARA) .................................. 36
False UV Clamp.......................................................................... 19
Support for SMBus 1.1............................................................... 36
Voltage Error Amplifier............................................................. 20
Layout Considerations............................................................... 36
Main Voltage Reference ............................................................. 20
Power-Up Auto-Configuration ................................................ 36
Current-Sense Amplifier ........................................................... 20
Extended SMBus Addressing.................................................... 37
Current Sensing .......................................................................... 21
Backdoor Access......................................................................... 37
Current-Transformer Input ...................................................... 21
Register Listing ............................................................................... 38
Current-Sense Calibration ........................................................ 21
Detailed Register Descriptions ..................................................... 39
Current-Limit Error Amplifier................................................. 21
Manufacturing Data................................................................... 48
Overcurrent Protection ............................................................. 22
Microprocessor Support ................................................................ 49
Current Share .............................................................................. 22
Test Name Table.............................................................................. 51
Current-Share Offset.................................................................. 22
Outline Dimensions ....................................................................... 53
ISHARE Drive Amplifier ................................................................ 22
Ordering Guide .......................................................................... 53
Differential Sense Amplifier ..................................................... 22
REVISION HISTORY
7/05—Revision 0: Initial Version
Rev. 0 | Page 2 of 56
ADM1041A
GENERAL DESCRIPTION
The ADM1041A is manufactured with a 5 V CMOS process
and combines digital and analog circuitry. An internal
EEPROM provides added flexibility for trimming timing and
voltage and selecting various functions. Programming is done
via an SMBus serial port that also allows communication
capability with a microprocessor or microcontroller.
The usual configuration using this IC is on a one-per-output
voltage rail. Output from the IC can be wire-OR’ed together or
bused in parallel and read by a microprocessor. A key feature on
this IC is support for an OrFET circuit when higher efficiency
or power density is required.
SAMPLE APPLICATION CIRCUIT DESCRIPTION
Figure 1 shows a sample application circuit using the
ADM1041A. The primary side is not detailed and the focus is
on the secondary side of the power supply.
The ADM1041A controls the output voltage from the power
supply to the designed programmed value. This programmed
value is determined during power supply design and is digitally
adjusted via the serial interface. Digital adjustment of the
current sense and current limit is also calibrated via the serial
interface, as are all of the internal timing specifications.
Another key feature of the ADM1041A is its control of an
OrFET. The OrFET causes lower power dissipation across the
OR'ing diode. The main function of the OrFET is to disconnect
the power supply from the load in the event of a fault occurring
during steady state operation, for example, if a filter capacitor or
rectifier fails and causes a short. This eliminates the risk of
bringing down the load voltage that is supplied by the redundant configuration of other power supplies. In the case of a
short, a reverse voltage is generated across the OrFET. This
reverse voltage is detected by the ADM1041A and the OrFET is
shut down via the FG pin. This intervention prevents any
interruption on the power supply bus. The ADM1041A can
then be interrogated via the serial interface to determine why
the power supply has shut down.
This application circuit also demonstrates how temperature can
be monitored within a power supply. A thermistor is connected
between the VDD and MON2 pins. The thermistor’s voltage
varies with temperature. The MON2 input can be programmed
to trip a flag at a voltage corresponding to an overheating power
supply. The resulting action may be to turn on an additional
cooling fan to help regulate the temperature within the power
supply.
RSENSE
OPTOCOUPLER
AC PULSE
SENSE
ERROR
AMP
The control loop consists of a number of elements, notably the
inputs to the loop and the output of the loop. The ADM1041A
takes the loop inputs and determines what, if any, adjustments
DIFF CURRENT
SENSE
OrFET
CONTROL
CURRENT
SHARE
SHARE
BUS
SOFT
START
DIFF LOAD AND LOCAL
VOLTAGE SENSE
VOLT, TEMP MONITOR
AND FAULT DETECTION
ADM1041A
are needed to maintain a stable output. To maintain a stable
loop, the ADM1041A uses three main inputs:
•
•
•
LOAD
PWM +
PRIMARY
DRIVER
EEPROM AND
RAM AND TRIM
(μC OR STANDALONE
OPERATION)
SMBus
μC
05405-002
The ADM1041A is a secondary-side and management IC specifically designed to minimize external component counts and to
eliminate the need for manual calibration or adjustment on the
secondary-side controller. The principle application of this IC is
to provide voltage control, current share, and housekeeping
functions for single output in N+1 server power supplies.
Figure 2. Application Block Diagram
Remote voltage sense
Load current sense
Current sharing information
Differences Between the ADM1041A and ADM1041
For all new designs, it is recommended to use the ADM1041A.
In this example, a resistor divider senses the output current as a
voltage drop across a sense resistor (RS) and feeds a portion
into the ADM1041A. Remote local voltage sense is monitored
via VS+ and VS− pins. Finally, current sharing information is fed
back via the share bus. These three elements are summed
together to generate a control signal (VCMP), which closes the
loop via an optocoupler to the primary side PWM controller.
The parts differ as follows:
• The ADM1041 allows the internal VREF voltage reference to
be accessed at Pin 18. This is not accessible using the
ADM1041A.
• The ADM1041A has longer VDDOK debounce and VDDOV
debounce than the ADM1041.
• The GND_OK Disable bit (Register 11h) does not disable
when using the ADM1041. It does disable when using the
ADM1041A.
Rev. 0 | Page 3 of 56
Figure 3. ADM1041A Diagram, Part 1
Rev. 0 | Page 4 of 56
05405-003
CURRENT
TRANSFORMER
TRANSFORMER
CURRENTSENSE
CONFIGURATON
CCMP
ICT
ACSENSE2
9
4
8
10
PULSE
ACSENSE1
1.5V
40kΩ
GAIN = 10
TRIM
HYSTERESIS
SELECT
ACSENSE
CURRENT SENSE
5.3kΩ
5.3kΩ
0.525V
REG 17h b7
SET GAIN
1 mSec
R
CLK Q
1 Sec
CLK Q
R
R
IRS/
ICT
SQ
R
SQ
SET
CURRENT
SHARE
AC SENSE
AC_OK
PULSEOK
3
VREF
SET CURRENTLIMIT LEVEL
CURRENT
SHARE
OFFSET
(VSHARE,
IOUT = 0)
2
9R
CURRENT-LIMIT
ERROR AMP
R
CS–/FS /VLS
VREF VDD
CS+
CURRENT
6
SHAREOK
FD
REVERSEOK
CURRENT SHARE
50mV
POLARITY
50mV
50kΩ
DIFFERENTIAL
SENSE
ISHARE DRIVE
AMPLIFIER
ISHARE
CLAMP
50kΩ
50kΩ
50kΩ
60μA
ORFET CONTROL
ISHARE ERROR
AMPLIFIER
OrFET OK
TO VOLTAGE ERROR AMP
VREF
REVERSE
VOLTAGE
DETECTOR
PENOK
LOADVOK
V = VOUT + 10V
20
23
24
22
19
VDD
12V
DRAIN
R2
R1
REMOTE
–VE SENSE
1N4148
SHARE BUS
VOUT
GAIN = (R1 + R2)/R2
VS– /SHRS–
SHRS+
SHRO
SCMP
FG
SOURCE
GATE
ADM1041A
Figure 4. ADM1041A Diagram, Part 2
Rev. 0 | Page 5 of 56
ALL POTENTIOMETERS (
ARE DIGITALLY
PROGRAMMBALE
THROUGH REGISTERS
XX
STANDARD I/O PIN
XX
HIGH VOLTAGE
ANALOG I/O PIN
05405-004
3.
2.
1.
NOTES:
REMOTE
SENSE
FROM
LOAD
4.4V
4.0V
2.0V
7
GND
0.2V
SET
LOAD
VOLTAGE
35kΩ
35kΩ
AUXILIARY
REFERENCE
10μs–20μs
gndok_dis
GNDOK
GROUND
MONITOR
OVP
UVLHI
UVLLO
POR
MAIN
BAND GAP
SET UVP
THRESHOLD
SET OVP
THRESHOLD
SET UV CLAMP
THRESHOLD
×1.3
35kΩ
35kΩ
VOLTAGE SENSE
6.0V–6.5V
20
)
1
2
20
21
VS–
VDD
VLS
VS–
VS+
Q
R Q
S
R Q
S
VREF
1.25V
UVP
OVP
VDDOV
VDDOK
LOADVOK
POWER MANAGEMENT
INTREFOK
REFERENCE
MONITOR
EXTREFOK
1.25V
INTERNAL
REFERENCE 2.5V
1.5V
FALSE UV
CLAMP
SET LOAD
OVERVOLTAGE
GENERAL
LOGIC
PEN
CBD
DC_OK
AC_OK
CLOCK
PSON
MON4
MON3
MON2
MON1
MON5
15
13
12
11
17
18
16
17
16
10
9
18
CS
LOGIC AND GPIO
VOLTAGE
ERROR AMP
5
14
1.25V
2.5V
3V
70μA
SCL
PEN
STATUS
(READ
REGISTERS)
CONFIGURE
I/Os
CONTROL
LINES SERIAL
INTERFACE
CONFIGURE
(WRITE
REGISTERS)
PWRON
CONTROL
REGISTERS
VDDOV
VDDOK
RESET
SHAREOK
AC_OK
PENOK
UVP
OVP
OCP
SHAREOK
OCP
ORFETOK
AC_OK
PENOK
1.25V
1V
1.5V
VREF
CAPTURE
SOFT-START
RAMP UP
VOLTAGE ERROR AMP
ORFETOK
OCPF
CURRENT SHARE
DIFF. VOLTAGE SENSE
CURRENT LIMIT
SCL/
AC_OKLink
SDA/
PSONLINK
ADD0
PEN
CBD/ALERT
DC_OK
AC_OK
PSON
MON4
MON3
MON2
MON1
OTP/
MON5
VCMP
ADM1041A
ADM1041A
SPECIFICATIONS
TA = –40 to +85°C, VDD = 5 V ± 10%, unless otherwise noted.
Table 1.
Parameter
SUPPLIES
VDD
IDD, Current Consumption
Peak IDD, during EEPROM Erase Cycle 1, 2
UNDERVOLTAGE LOCKOUT, VDD
Start-Up Threshold
Stop Threshold
Hysteresis
POWER BLOCK PROTECTION
VDD Overvoltage
VDD Overvoltage Debounce
Open Ground
VDDOK Debounce
POWER-ON RESET
DC Level
DIFFERENTIAL LOAD VOLTAGE SENSE INPUT,
(VS−, VS+)
VS− Input Voltage
VS+ Input Voltage
VS− Input Resistance
VS+ Input Resistance
VNOM Adjustment Range
Set Load Voltage Trim Step
Min
Typ
Max
Unit
4.5
5.0
6
5.5
10
40
V
mA
mA
4
3.7
4.3
4
0.3
4.5
4.2
V
V
V
5.8
300
0.1
250
6.2
500
0.2
400
6.5
700
0.35
500
V
μs
V
μs
1.5
2.2
2.75
V
0.5
VDD – 2
1.7 to 2.3
0.10 to 0.14
1.74 to 3.18
V
V
kΩ
kΩ
V
%
mV
Set Load Overvoltage Trim Range
Set Load Overvoltage Trim Step
105 to 120
0.09
1.6
%
%
mV
Recover from Load OV False to FG True
100
200
300
400
2
μs
μs
μs
μs
μs
Operate Time from Load OV to FG False
Test Conditions/Comments
See Figure 9.
35
500
Rev. 0 | Page 6 of 56
Latching
VGND positive with respect to VS−
VDDOK
VDD rising
See Figure 6. VNOM = (VS+ – VS−); VNOM
is typically 2 V
Voltage on Pin 20
Voltage on Pin 21
1.7 V ≤ VNOM ≤ 2.3 V typ
8 bits, 255 steps
Reg 19h[7:0]. See Table 34
1.7 V ≤ VNOM ≤ 2.3 V min
8 bits, 255 step/s
Reg 08h[7:0]. See Table 17.
VS+ = 2.24 V
Reg 03h[1:0] = 00. See Table 12.
Reg 03h[1:0] = 01. See Table 12.
Reg 03h[1:0] = 10. See Table 12.
Reg 03h[1:0] = 11. See Table 12.
ADM1041A
Parameter
LOCAL VOLTAGE SENSE, VLS,
AND FALSE UV CLAMP
Input Voltage Range 3
Stage Gain
False UV Clamp, VLS, Input Voltage Nominal,
and Trim Range
Clamp Trim Step
Clamp Trim Step
Min
Typ
Max
Unit
Test Conditions/Comments
See Figure 9.
(VDD – 2)
V
Set by external resistor divider.
At VLS = 1.8 V
1.3
2.3
1.3
1.85
2.1
V
0.2
3.1
Local Overvoltage
Nominal and Trim Range
OV Trim Step
OV Trim Step
1.9
Noise Filter, for OVP Function Only
Local Undervoltage
Nominal and Trim Range
UV Trim Step
UV Trim Step
5
1.3
Noise Filter, for UVP Function Only
VOLTAGE ERROR AMPLIFIER, VCMP
Reference Voltage VREF_SOFT_START
Temperature Stability2
Long-Term Voltage Stability2
Soft-Start Period Range
Set Soft-Start Period
Unity Gain Bandwidth, GBW
Transconductance
Source Current
Sink Current
DIFFERENTIAL CURRENT SENSE INPUT,
CS−, CS+
Common-Mode Range
External Divider Tolerance Trim Range
(With Respect to Input)
External Divider Tolerance Trim Step Size
(With Respect to Input)
2.4
%
mV
2.85
0.15
3.7
1.7
V
%
mV
25
2.1
0.18
3.1
VRANGE
8 bits, 255 steps Reg 0Ah[7:0].
See Table 19.
μs
V
%
mV
300
600
μs
1.49
1.51
V
μV/°C
%
ms
μs
ms
ms
ms
MHz
mA/V
μA
μA
VRANGE
8 bits, 255 steps, Reg 09h[7:0]. See
Table 18.
−5
V
mV
See Figure 15.
TA = 25°C
−40°C ≤ TA ≤ 85°C
Over 1,000 hr, TJ = 125°C
Ramp is 7 bit, 127 steps
Reg 10h[3:2] = 00. See Table 25.
Reg 10h[3:2] = 01. See Table 25.
Reg 10h[3:2] = 10. See Table 25.
Reg 10h[3:2] = 11. See Table 25.
See Figure 11.
At IVCMP = ±180 μA
At VVCMP > 1 V
At VVCMP < VDD − 1 V
Reg 17h[7] = 0. See Table 18.
ISENSE mode. See Figure 13.
Set by external divider
Reg 16h[5:3] = 000. See Table 31.
−10
−20
5
10
20
20
39
78
mV
mV
mV
mV
mV
μV
μV
μV
Reg 16h[5:3] = 001. See Table 31.
Reg 16h[5:3] = 010. See Table 31.
Reg 16h[5:3] = 100. See Table 31.
Reg 16h[5:3] = 101. See Table 31.
Reg 16h[5:3] = 110. See Table 31.
VCM = 2.0 V
8 bits, 255 steps
Reg 14h[7:0]. See Table 29.
±100
±0.2
0
1.9
250
250
VRANGE
8 bits, 255 steps, Reg 18h[7:0].
See Table 33.
40
300
10
20
40
1
2.7
0
3.5
(VDD – 2)
Rev. 0 | Page 7 of 56
ADM1041A
Parameter
DC Offset Trim Range (with Respect to Input)
Min
DC Offset Trim Step Size
(with respect to input)
Typ
−8
−15
−30
8
15
30
30
50
120
Max
Unit
mV
mV
mV
mV
mV
mV
μV
μV
μV
CURRENT SENSE CALIBRATION
Total Current Sense Error2
(Gain and Offset)
Gain Range (ISENSE)
Gain Setting 1 (Reg 16h[2:0] = 000)
Gain Setting 2 (Reg 16h[2:0] = 001)
Gain Setting 3 (Reg 16h[2:0] = 010)
Gain Setting 4 (Reg 16h[2:0] = 100)
Gain Setting 5 (Reg 16h[2:0] = 101)
Gain Setting 6 (Reg 16h[2:0] = 110)
Full Scale (No Offset)
Attenuation Range
Current Share Trim Step (at SHRO)
±3
±6
%
%
65
85
110
135
175
230
2.0
65 to 99
0.4
8
+5
V/V
V/V
V/V
V/V
V/V
V/V
V
%
%
mV
%
Gain Accuracy2, 4, 40 mV at CS+, CS−
−5
Gain Accuracy2, 4, 20 mV at CS+, CS−
−5
±1
+5
%
Gain Accuracy2, 4, 40 mV at CS+, CS–
−2.5
±0.5
+2.5
%
SHARE BUS OFFSET
Current Share Offset Range
1.25
V
Zero Current Offset Trim Step
0.4
5.5
%
mV
Gain Setting 0
4.5
V/V
Gain Setting 1
2.57
V/V
CURRENT TRANSFORMER SENSE INPUT, ICT
CT Input Sensitivity
CT Input Sensitivity
Input Impedance2
Source Current
Source Current Step Size
Reverse Current for Extended SMBus
Addressing (Source Current) 5
0.45
0.79
20
3.5
0.5
1.0
50
2.0
170
5
0.68
1.20
7
Rev. 0 | Page 8 of 56
V
V
kΩ
μA
nA
mA
Test Conditions/Comments
Reg 17h[2:0] = 000. See Table 32 .
Reg 17h[2:0] = 001. See Table 32.
Reg 17h[2:0] = 010. See Table 32.
Reg 17h[2:0] = 100. See Table 32.
Reg 17h[2:0] = 101. See Table 32.
Reg 17h[2:0] = 110. See Table 32.
VCM = 2.0 V, VDIFF = 0 V
8 bits, 255 steps
Reg 15h[7:0]. See Table 30.
VCSCM = 2.0V, 0°C ≤ TA ≤ 85°C,
SHRS = SHRO = 2 V. Gain = 230x.
Chopper on
Chopper off
Max input voltage range at CS+, CS−
34 mV – 44.5 mV. Gain = 65×.
26 mV – 34 mV. Gain = 85×.
20 mV – 26 mV. Gain = 110×.
16 mV – 20 mV. Gain = 135×.
12 mV – 16 mV. Gain = 175×.
9.5 mV – 12 mV. Gain = 230×
VZO = 0
Reg 06h[7:1]. See Table 15.
SHRS = SHRO = 1 V
7 bits, 127 steps ISHARE slope
0 V ≤ VCSCM ≤ 0.3 V. Gain = 65×.
VCSCM = input common mode.
VCSCM = 2.0 V, 0°C ≤ TA ≤ 85°C.
Gain = 135×
VCSCM = 2.0 V, 0°C ≤ TA ≤ 85°C.
Gain = 65×
See Figure 13.
Reg 17h[7] = 1. See Table 32.
Reg 17h[5] = 1. See Table 32.
0 ≤ VTRIM ≤ 1.25 V
8 bits, 255 steps, VCT = 1.0 V
Reg 05h[7:0]. See Table 14.
Reg 17h[7] = 1. See Table 32.
Reg 06h = FEh. See Table 15.
Reg 17h[5] = 0, VSHARE = 2 V.
See Table 31
Reg 17h[5] = 1. See Table 32.
Reg 15h = 05h, approx 1 μA.
See Table 30. VSHARE = 2 V.
Gain setting = 4.5
Gain setting = 2.57
See Current-Transformer Input
Section.
15 steps Reg 15h[3:0]. See Table 30.
See Figure 38 and the Absolute
Maximum Ratings section.
ADM1041A
Parameter
CURRENT LIMIT ERROR AMPLIFIER
Current Limit Trim Range2
Current Limit Trim Step
Current Limit Trim Step
Transconductance
Output Source Current
Output Sink Current
CURRENT SHARE DRIVER
Output Voltage 6
Short Circuit Source Current
Source Current
Sink Current
CURRENT SHARE DIFFERENTIAL SENSE
AMPLIFIER
VS– Input Voltage
VSHRS Input Voltage
Input Impedance2
Gain
CURRENT SHARE ERROR AMPLIFIER
Transconductance, SHRS to SCMP
Output Source Current
Output Sink Current
Input Offset Voltage
Min
105
Capture Threshold
FET OR GATE DRIVE
Output Low Level (On)
Output Leakage Current
REVERSE VOLTAGE COMPARATOR, FS, FD
Common-Mode Range
Max
Unit
130
%
%
mV
1.1
26.5
100
200
40
40
300
(VDD – 0.4)
60
65
100
1.0
100
200
40
40
50
40
Share OK Window Comparator Threshold
(Share Drive Error)
CURRENT LIMIT
Current Limit Control Lower Threshold
Current Limit Control Upper Threshold
CURRENT SHARE CAPTURE
Current Share Capture Range
Typ
V
mA
mA
100
μA
0.5
VDD – 2
V
V
kΩ
V/V
Voltage on Pin 20
Voltage on Pin 23
VSHRS = 0.5 V, VS− = 0.5 V
300
μA/V
μA
μA
mV
ISCMP = ±20 μA
VSCMP > 1 V
VSCMP < VDD – 1 V
Master/slave arbitration
60
mV
mV
mV
mV
1.3
1
2
3
4
1.0
−5
0.25
2.0
2.0 ≤ VSHARE ≤ 2.8 V typ, 5 bits, 31 steps.
Reg 04h[7:3]. See Table 13.
ICCMP = ±20 μA. See Figure 12.
VCCMP = >1 V
VCCMP = <VDD – 1 V
See Figure 15
RL = 1 kΩ, VSHRS ≤ VDD – 2 V
55
15
±100
±200
±300
±400
0.7
1.4
2.1
2.8
0.6
μA/V
μA
μA
Test Conditions/Comments
See Figure 13
After ISHARE calibration
3.5
V
V
1.3
2.6
3.9
5.2
1.4
%
%
%
%
V
0.4
0.8
+5
V
V
μA
(VDD – 2)
V
Rev. 0 | Page 9 of 56
Current at which VOUT does not drop
by more than 5%
VSHARE = 2.0 V
See Figure 15
SHRS = 2 V ± SHRTHRESH
Reg 04h[1:0] = 00. See Table 13.
Reg 04h[1:0] = 01. See Table 13.
Reg 04h[1:0] = 10. See Table 13.
Reg 04h[1:0] = 11. See Table 13.
Figure 10
VCCMP = 0.7 V, VS+ = 1.5 V
VS+ = 0 V, VSCMP = 0 V
VSCMP = 3.5 V.
Reg 10h[5:4] = 00. See Table 25.
Reg 10h[5:4] = 01. See Table 25.
Reg 10h[5:4] = 10. See Table 25.
Reg 10h[5:4] = 11. See Table 25.
Open-drain N-channel FET
IIO = 5 mA
IIO = 10 mA
VCS− = FS
Voltage set by CS resistor divider.
Voltage on CS− pin, TA = 25°C.
ADM1041A
Parameter
Reverse Voltage Detector Turn-Off Threshold
Min
Typ
Max
Unit
100
150
200
250
mV
mV
mV
mV
20
30
40
50
mV
mV
mV
mV
kΩ
kΩ
Reverse Voltage Detector Turn-On Threshold
FD Input Impedance
FS Input Impedance
ACSENSE1/ACSENSE2 COMPARATOR
500
20
Reg 12h[2] = 0
Reg 0Dh[3:2] = 00. See Table 22 .
Reg 12h[2] = 1
Reg 0Eh[7:6] = 00. See Table 23.
AC or Bulk Sense
Threshold Voltage
Threshold Adjust Range
1.25
1.10
1.40
V
V
Threshold Trim Step
0.8
10
%
mV
Hysteresis Adjust Range
Hysteresis Trim Step
200−550
50
mV
mV
Noise Filter
PULSE-IN
Threshold Voltage
PULSE_OK On Delay
PULSE_OK Off Delay
OSCILLATOR
OCP
OCP Threshold Voltage2
0.6
0.8
−5
0.3
OCP Shutdown Delay Time (Continuous
Period in Current Limit)
OCP Fast Shutdown Delay Time
MON1, MON2, MON3, MON4
Sense Voltage
Hysteresis
OVP Noise Filter
UVP Noise Filter
OTP (MON5)
Sense Voltage Range
OTP Trim Step
Hysteresis
Test Conditions/Comments
VCS− = 2 V for threshold specs
Reg 03h[7:6] = 00. See Table 12.
Reg 03h[7:6] = 01. See Table 12.
Reg 03h[7:6] = 10. See Table 12.
Reg 03h[7:6] = 11. See Table 12.
VCS− = 2 V for threshold specs
Reg 03h[5:4] = 00. See Table 12.
Reg 03h[5:4] = 01. See Table 12.
Reg 03h[5:4] = 10. See Table 12.
Reg 03h[5:4] = 11. See Table 12.
1
0.525
1
1
0.5
ms
1.2
+5
V
μs
s
%
0.7
V
1
s
2
3
4
s
s
s
ms
0
1.21
1.2
100
1.25
0.1
1.29
5
300
25
600
2.2
2.45
Min: DAC = 0
Max: DAC = Full Scale
1.10 ≤ VTRIM ≤ 1.4 V
5 bits, 31 steps
Reg 0Ch[7:3]. See Table 21.
VACSENSE > 1 V, RTHEVENIN = 909R
200 ≤ VTRIM ≤ 550 mV. 7 steps
Reg 0Ch[2:0]. See Table 21.
Unless otherwise specified
Force CCMP for drop in VCMP
Reg 11h[2] = 0. See Table 26.
Reg 12h[4:3] = 00. See Table 27.
Reg 12h[4:3] = 01. See Table 27.
Reg 12h[4:3] = 10. See Table 27.
Reg 12h[4:3] = 11. See Table 27.
Reg 11h[2] = 1. See Table 26.
VCCMP = 1.5 V
V
V
μs
μs
Reg 0Fh[4:2] = 01x or 10x. See Table 24.
24
100
130
160
Rev. 0 | Page 10 of 56
V
mV
μA
2.1 ≤ VTRIM ≤ 2.45 V
4 bits, 15 steps, Reg 0Bh[7:4].
See Table 20.
VOTP = 2 V
ADM1041A
Parameter
OVP Noise Filter
Min
5
UVP Noise Filter
300
PSON 7
Input Low Level 8
Input High Level8
Debounce
PEN7, DC_OK7, CBD, AC_OK
Open-Drain N-Channel Option
Output Low Level = On8
Open-Drain P-Channel
Output High Level = On8
Leakage Current
DC_OK7
DC_OK, On Delay (Power-On and OK Delay)
Max
25
Unit
μs
600
μs
0.8
V
V
ms
ms
ms
ms
2.0
80
0
40
160
2.4
−5
0.4
V
+5
V
μA
400
200
800
1600
2
0
1
4
DC_OK, Off Delay (Power-Off Early Warning)
SMBus, SDL/SCL
Input Voltage Low8
Input Voltage High8
Output Voltage Low8
Pull-Up Current
Leakage Current
ADD0, HARDWIRED ADDRESS BIT
ADD0 Low Level8
ADD0 Floating
ADD0 High8
SERIAL BUS TIMING
Clock Frequency
Glitch Immunity, tSW
Bus Free Time, tBUF
Start Setup Time, tSU;STA
Start Hold Time, tHD;STA
SCL Low Time, tLOW
SCL High Time, tHIGH
SCL, SDA Rise Time, tR
SCL, SDA Fall Time, tF
Data Setup Time, tSU;DAT
Data Hold Time, tHD;DAT
EEPROM RELIABILITY
Endurance 9
Data Retention 10
Typ
ms
ms
ms
ms
ms
ms
ms
ms
0.8
2.2
0.4
350
+5
100
−5
0.4
VDD/2
VDD − 0.5
Test Conditions/Comments
Reg 0Fh[4:2] = 010 or 100.
See Table 24.
Reg 0Fh[4:2] = 011 or 101.
See Table 24.
Reg 0Eh[4:2] = 00x. See Table 23.
Reg 0Fh[1:0] = 00. See Table 24.
Reg 0Fh[1:0] = 01. See Table 24.
Reg 0Fh[1:0] = 10. See Table 24.
Reg 0Fh[1:0] = 11. See Table 24.
ISINK = 4 mA
VOH_PEN
ISOURCE = 4 mA
Reg 0Fh[7:5] = 00x. See Table 24.
Reg 0Eh[1:0] = 00. See Table 23.
Reg 0Eh[1:0] = 01. See Table 23.
Reg 0Eh[1:0] = 10. See Table 23.
Reg 0Eh[1:0] = 11. See Table 23.
Reg 10h[7:6] = 00. See Table 25.
Reg 10h[7:6] = 01. See Table 25.
Reg 10h[7:6] = 10. See Table 25.
Reg 10h[7:6] = 11. See Table 25.
V
V
V
μA
μA
VDD = 5 V, ISINK = 4 mA
V
V
V
Floating
See Figure 5
400
50
4.7
4.7
4
4.7
4
1000
300
250
300
100
100
250
Rev. 0 | Page 11 of 56
kHz
ns
μs
μs
μs
μs
μs
ns
ns
ns
ns
k cycles
Years
ADM1041A
1
This specification is a measure of IDD during an EEPROM page erase cycle. The current is a dynamic. Refer to Figure 29 for a typical IDD plot during an EEPROM page
erase.
2
This specification is not production tested, but is supported by characterization data at initial product release.
3
Four external divider resistors are the same ratio, which is selected to produce 2.0 V nominal at Pin 21 while at zero load current. Recommended values are
RTOP
RBOTTOM
3.3 V
680R
1K
5.0 V
1K.5
1K
12 V
5K1
1K
4
Chopper off.
The maximum specification here is the maximum source current of Pin 8 as specified by the Absolute Maximum Ratings.
6
All internal amplifiers accept inputs with common range from GND to VDD − 2 V. The output is rail-to-rail, but the input is limited to GND to VDD − 2 V. See Figure 6.
7
These pins can be configured as open-drain N-channel or P-channel, (except PSON) and as normal or inverted logic polarity.
8
A logic true or false is defined strictly according to the signal name. Low and high refer to the pin or signal voltages.
9
Endurance is qualified to 100,000 cycles as per JEDEC Std. 22, Method A117, and measured at −40°C, +25°C, and +85°C. Typical endurance at +25°C is 250,000 cycles.
10
Retention lifetime equivalent at junction temperature (TJ) = 55°C as per JEDEC Std. 22, Method A117. Retention lifetime based on an activation energy of 0.6 V.
Derates with junction temperature.
5
tLOW
tR
tF
tHD:STA
SCL
tHD:STA
tHD:DAT
tHIGH
tSU:STA
tSU:DAT
tSU:STO
tBUF
S
S
P
Figure 5. Serial Bus Timing Diagram
SHRO
VA
VA = VDD – 0.4V
R1
SHRS+
VB
VB = VDD – 2V
R1
SHRS–
R1 + R2 ≥ 1kΩ
05405-006
P
Figure 6. Amplifier Inputs and Outputs
Rev. 0 | Page 12 of 56
05405-005
SDA
ADM1041A
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage (Continuous), VDD
Data Pins SDA, SCL, VDATA
Continuous Power at 25°C, PD-QSOP24
Operating Temperature, TAMB
Junction Temperature, TJ
Storage Temperature, TSTG
Lead Temperature
(Soldering, 10 Seconds), TL
ESD Protection on All Pins, VESD
Thermal Resistance, Junction to Air, θJA
ICT Source Current1
1
Rating
6.5 V
VDD + 0.5 V,
GND − 0.3 V
450 mW
−40°C to +85°C
150°C
−60°C to +150°C
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
24-lead QSOP: θJA = 150°C/W
2 kV
150°C/W
7 mA
This is the maximum current that can be sourced out from Pin 8 (ICT pin).
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 13 of 56
ADM1041A
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
VDD 1
24 SHRO
23 SHRS+
VLS/CS–/FS 2
22 SCMP
CS+ 3
21 VS+
CCMP 4
20 VS–/SHRS–
VCMP 5
GND 7
ICT 8
PULSE/ACSENSE1/MON1 9
ACSENSE2/MON2 10
CBD/ALERT 11
PEN 12
ADM1041A
19 FG
TOP VIEW
(Not to Scale) 18 AC_OK/OTP/MON5
17 DC_OK/MON4
16 PSON/MON3
15 ADD0
14 SDA/PSONLINK
13 SCL/AC_OKLink
05405-007
FD 6
Figure 7. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1
2
Mnemonic
VDD
VLS/CS–/FS
3
CS+
4
CCMP
5
VCMP
6
FD
7
GND
8
ICT
9
PULSE/ACSENSE1/
MON1
Description
Positive Supply for the ADM1041A. Normal range is 4.5 V to 5.5 V. Absolute maximum rating is 6.5 V.
Inverting Differential Current Sense Input, Local Voltage Sense Pin, and OrFET Source. These three functions
are served by a common divider. The local voltage sense input is used for local overvoltage and undervoltage
sensing. This pin also provides an input to the false UV clamp that prevents shutdown during an external load
overvoltage condition. When supporting an OrFET circuit, this pin represents the FET source and is the
inverting input of a differential amplifier looking for the presence of a reverse voltage across the FET, which
might indicate a failure mode.
Noninverting Differential Current Sense Input. The differential sensitivity of CS+ and CS– is normally around 10
mV to 40 mV at the input to the ADM1041A. Nulling any external divider offset is achieved by injecting a
trimmable amount of current into either the inverting or noninverting input of the second stage of the
current sense amplifier. A compensation circuit is used to ensure the amount of current for zero-offset tracks
the common-mode voltage. Nulling of any amplifier offset is done in a similar manner except that it does not
track the common-mode voltage.
Current Error Amplifier Compensation. This pin is the output of the current limit transconductance error
amplifier. A series resistor and a capacitor to ground are required for loop compensation.
Voltage Error Amplifier Compensation. This is the output of a voltage error transconductance amplifier.
Compensate with a series capacitor and resistor to ground. An external emitter-follower or buffer is typically
used to drive an optocoupler. Output voltage positioning may be obtained by placing a second resistor
directly to ground. Refer to Analog Devices applications notes on voltage positioning.
A divider from the OrFET drain is connected here. A differential amplifier is then used to detect the presence
of a reverse voltage across the FET, which indicates a fault condition and causes the OrFET gate to be pulled
low.
Ground. This pin is double bonded for extra reliability. If the ground pin goes positive with respect to the
remote sense return (VS–) for a sustained period indicating that the negative remote sense line is
disconnected, PEN is disabled.
Input for Current Transformer. The sensitivity of this pin is suitable for the typical 0.5 V to 1 V signal that is
normally available. If this function is enabled, the CS+ amplifier is disabled. This pin is also used for extended
SMBus addressing, that is, pulled below ground to allow additional SMBus addresses.
Pulse Present, AC/Bulk Sense 1, or Monitor 1 Input.
PULSE: This tells the OrFET circuit that the voltage from the power transformer is normal. A peak hold allows
the OrFET circuit to pass through the pulse skipping that occurs with very light loads, but turns off the circuit
about one second after the last pulse is recognized.
ACSENSE1: This sense function also uses the peak voltage on this pin to measure the bulk capacitor voltage. If
too low, AC_OK and DC_OK can warn of an imminent loss of power. Threshold level and hysteresis can be
trimmed. When not selected, ACSENSE1 defaults to true.
MON1: When MON1 is selected for this pin, its input is compared against a 1.25 V comparator that could be
used for monitoring a postregulated output; includes overvoltage, undervoltage, and overtemperature
conditions.
Rev. 0 | Page 14 of 56
ADM1041A
Pin No.
10
Mnemonic
ACSENSE2/MON2
11
CBD/ALERT
12
PEN
13
SCL/AC_OKLink
14
SDA/PSONLINK
15
ADD0
16
PSON/MON3
17
DC_OK/MON4
18
AC_OK/OTP/
MON5
19
FG
20
VS–/SHRS–
21
VS+
22
SCMP
Description
AC/Bulk Sense Input 2 or Monitor 2 Input.
ACSENSE2: This alternative ACSENSE input can be used when the ACSENSE source must be different from that used
for the OrFET. It also allows dc and optocoupled signals that are not suitable for the OrFET control.
MON2: When MON2 is selected for this pin, its input is compared against a 1.25 V comparator that could be
used for monitoring a postregulated output; includes overvoltage, undervoltage, and overtemperature
conditions.
CBD: The crowbar drive pin allows implementation of a fast shutdown in case of a load overvoltage fault. The
pin can be configured as an open-drain N-channel or P-channel and is suitable for driving a sensitive gate SCR
crowbar. An external transistor is required if a high gate current is needed. Either polarity may be selected.
ALERT: This pin can be configured to provide an ALERT function in microprocessor-supported applications
where any of several ICs in a redundant system that detects a problem can interrupt and shut down the
power supply. An alternative use is as a general-purpose logic output signal.
Power Enable. This pin can be configured as an open-drain N-channel or P-channel that typically drives the
PEN optocoupler. Providing that the PSON pin has been asserted to turn the output on, and that there are no
faults, this pin drives an optocoupler on enabling the primary PWM circuit. Either polarity may be selected.
SCL: SMBus Serial Clock Input.
AC_OKLink: In nonmicroprocessor applications, this pin can be programmed to give the status of ACSENSE to all
the ICs on the same bus. The main effect is to turn on undervoltage blanking whenever the sense circuit
monitoring ac or bulk dc detects a low voltage.
SDA: SMBus Serial Data Input and Output.
PSONLINK: In non-microprocessor applications, this pin can be programmed to provide the PSON status to
other ICs. This allows just one IC to be the PSON interface to the host system, or the PSONLINK itself can be the
PSON interface.
Chip Address Pin. There are three addresses possible using this pin, which are achieved by tying ADD0 to
ground, tying to VDD, or being left to float. One address bit is available via programming at the
device/daughter card level, so the total number of addressable ICs can be increased to six.
PSON: In nonmicroprocessor configurations, this is power supply on. As a standard I/O, this pin is rugged
enough for direct interface with a customer’s system. Either polarity may be selected.
MON3: When MON3 is selected for this pin, its input is compared against a 1.25 V comparator that could be
used for monitoring a postregulated output; includes overvoltage, undervoltage, and overtemperature
conditions.
DC_OK: This pin is the output of a general-purpose digital I/O that can be configured as open-drain
N-channel or open-drain P-channel suitable for wire-OR'ing with other ICs and direct interfacing with a
customer’s system. Either polarity may be selected.
MON4: When MON4 is selected for this pin, its input is compared against a 1.25 V comparator that could be
used for overtemperature protection and for monitoring a postregulated output; includes overvoltage,
undervoltage, and overtemperature conditions.
Buffered Output, Overtemperature Protection, or Monitor 5.
AC_OK: This option can be configured as N-channel or P-channel and as normal or inverted polarity. At
system level, a true AC_OK is used to indicate that the primary bulk voltage is high enough to support the
system and, when false, that dc output is about to fail.
MON5: A further option is to configure this as an analog input, MON5, with a flexible hysteresis and
trimmable 2.5 V reference. This makes the pin particularly suitable for overtemperature protection (OTP)
sensing. Since hysteresis uses a switched 100 μA current source, hysteresis can be adjusted via the source
impedance of the external circuit. It can also be used for OVP and UVP functions.
FET Gate Enable. When supporting an OrFET circuit, this is the gate drive pin. Because the open-drain voltage
on the chip is limited to VDD, an external level shifter is required to drive the higher gate voltages suitable for
the OrFET. This pin is configured as an open-drain N-channel. Either output polarity, low = on or low = off,
may be selected.
This pin is used as the ground input reference for the current share and load voltage sense circuits. It should
be tied to ground at the common remote sense location. The input impedance is about 35 kΩ to ground.
This pin is the positive remote load voltage sense input and is normally divided down from the power supply
output voltage to 2.0 V at no-load using an external voltage divider. The input impedance is high.
Output of the Current Share Transconductance Error Amplifier. Compensation is a series capacitor and
resistor to ground. While VDD is normal and PEN is false, this pin is clamped to ground. When the converter is
enabled (PEN true) and the clamp is released, the compensation capacitor charges, providing a slow walk-in.
The error amplifier input has a built-in bias so that all slaves in a parallel supply system do not compete with
the master for control of the share bus.
Rev. 0 | Page 15 of 56
ADM1041A
Pin No.
23
Mnemonic
SHRS+
24
SHRO
Description
Current Share Sense. This is the noninverting input of a differential sense amplifier looking at the voltage on
the share bus. For testing purposes, this pin is normally connected to SHRO. Calibration always expects this
pin to be at 2.0 V with respect to SHRS–/VS–. If a higher share voltage is required, a resistor divider from SHRO
or an additional gain stage, must be used.
Current Share Output. This output is capable of driving the share bus of several power supplies between 0 V
and VDD – 0.4 V (10 kΩ bus pull-down in each supply). Where a higher share bus voltage is required, an
external amplifier is necessary. The current share output from the supply, when bused with the share output
of other power supplies working in parallel, allows each of the supplies to contribute essentially equal
currents to the load.
Table 4. Default Pin States During EEPROM Download
Pin No.
11
Mnemonic
CBD
12
PEN
17
18
19
DC_OK
AC_OK
FG
State
High impedance (Hi-Z) at power-up and until the end of the EEPROM download (approximately 20 ms).
This pin is reconfigured at the end of the EEPROM download.
High impedance (Hi-Z) at power-up and until the end of the EEPROM download (approximately 20 ms).
This pin is reconfigured at the end of the EEPROM download.
Active low (low if DC_OK true) at power-up. This pin is reconfigured during the EEPROM download.
Active low (low if DC_OK true) at power-up. This pin is reconfigured during the EEPROM download.
High impedance (Hi-Z) at power-up and until the end of the EEPROM download (approximately 20 ms).
This pin is reconfigured at the end of the EEPROM download.
TERMINOLOGY
Table 5.
Mnemonic
POR
UVL
CVMode
CCMode
UVP
OVP
OCP
OTP
UVB
Description
Power-On Reset. When VDD is initially applied to the ADM1041A, the POR function clears all latches and puts
the logic into a state that allows a clean start-up.
Undervoltage Lockout. This is used on VDD to prevent spurious modes of operation that might occur if VDD
is below a specific voltage.
Constant Voltage Mode. This is the normal mode of operation of the power supply main output. The output
voltage remains constant over the whole range of current specified.
Constant Current Mode. This mode of operation occurs when the output is overloaded until or unless a
shutdown event is triggered. The output current control level remains constant down to 0 V.
Undervoltage Protection. If the output being monitored is detected as going under voltage, the UVP function
sends a fault signal. After a delay, PEN goes false, the output is disabled, and either latch-off or an autorestart
occurs, depending on the mode selected. The DC_OK output also goes false immediately to show that the
output is out of tolerance.
Overvoltage Protection. If the output being monitored is detected as going over voltage, the OVP function
latches and sends a fault signal, PEN goes false, and CBD goes true. The DC_OK output also goes false
immediately. OVP faults are always latching and require the cycling of PSON or VDD or SMBus command to
reset the latch.
Overcurrent Protection. If the output being monitored is detected as going over current for a certain time,
the OCP function sends out a fault signal that triggers a shutdown that can be latched or allowed to
autorestart, depending on the mode selected. Prior to shutting down, the DC_OK output goes false warning
the system that output is going to be lost. The latch is the same one used for OVP. For autorestart, the OCP
timeout period is configurable.
Overtemperature Protection. If the temperature being sensed is detected as going over the selected limit, the
OTP function sends out a fault signal that triggers a shutdown that can be latched or allowed to auto-restart
depending on the mode selected. Prior to shutting down, the DC_OK output goes false warning the system
that output is going to be lost. The latch is the same one used for OVP.
Undervoltage Blanking. The UVP function is blanked (disabled) during power-up or if the ACSENSE function is
false (ac line voltage is low). When in constant current mode, UVB is disabled. The status of ACSENSE must be
known to the IC, either by virtue of the on-board ACSENSE or communicated by the SMBus with the help of
an external microprocessor or by using AC_OKLink. When in constant-current mode, due to an overload, UVB
is applied for the overcurrent ride-through period.
Rev. 0 | Page 16 of 56
ADM1041A
Mnemonic
DC_OK
AC_OK
DC_OK on delay
DC_OK off delay
Debounce Digital Noise
Filter
ACSENSE1
Pulse OK
AC Hysteresis
ACSENSE2
Soft-Start
VDD–OVP
VDD–UVL
Auto Restart Mode
VREF–MON
GND–MON
Description
The DC_OK function advises the system on the status of the power supply. When it is false, the system is
assured of at least 1 ms of operation if ac power is lost for any reason. Other turn-off modes provide more
warning time. This pin is an open-drain output. It can be configured as a P-channel pull-up or an N-channel
pull-down. It may also be configured as positive or negative (inverted) logic.
The AC_OK function advises the system whether or not sufficient bulk voltage is present to allow reliable
operation. The system may choose to shut down if this pin is false. The power supply normally tries to
maintain normal operation as long as possible, although DC_OK goes false when only a millisecond or so of
operation time is left. This pin is an open-drain output. It can be configured as a P-channel pull-up or an Nchannel pull-down. It may also be configured as positive or negative (inverted) logic.
The DC_OK output is kept false for typically 100 ms to 900 ms during power-up.
When the system is to be shut down in response to PSON going low, or in response to an OCP or OTP event, a
signal is first sent to the DC_OK output to go false as a warning that power is about to be lost. PEN is signaled
false typically 2 ms later (configurable).
All of the inputs to the logic core are first debounced or digitally filtered to improve noise immunity. The
debounce period for OV events is in the order of 16 μs, for UV events it is 450 μs, and for PSON it is typically
80 ms (configurable).
A voltage from the secondary of the power transformer, which can provide an analog of the bulk supply, is
rectified and lightly filtered and measured by the ac sense function. At start-up, if this voltage is adequate,
this function signals the end-user system that it is okay to start. If a brown-out occurs or ac power is removed,
this function can provide early warning that power is about to be lost and allow the system to shut down in
an orderly manner. While ACSENSE is low, UVB is enabled, which means undervoltage protection is not
initiated. If ac power is so low that the converter cannot continue to operate, other protection circuits on the
primary side normally shut down the converter. When an adequate voltage level is resumed, a power-up
cycle is initiated.
As well as providing ACSENSE, the preceding connection to the transformer is used to gate the operation of
the OrFET circuit. If the output of the transformer is good, the OrFET circuit allows gate drive to the OrFET.
ACSENSE Hysteresis. Configurable voltage on the ACSENSE input allows the ACSENSE upper and lower
threshold to be adjusted to suit different amounts of low frequency ripple present on the bulk capacitor.
An alternate form of ac sense can be accepted by the ADM1041A. This may in the form of an opto-coupled
signal from the primary side where the actual level sensing might be done. As with the above, while ac is low
and UVB is disabled, AC_OK is false and DC_OK is true. Any brownout protection that might be required on
the primary is done on the primary side.
At start-up, the voltage reference to the voltage error amplifier is brought up slowly in approximately 127
steps to provide a controlled rate of rise of the output voltage.
An OVP fault on the auxiliary supply to the ADM1041A causes a standard OVP operation (see the OVP
function in this table).
A UVL fault on the auxiliary supply to the IC causes a standard UVP operation (see the UVP function in this
table).
In this mode, the housekeeping circuit attempts to restart the supply after an undervoltage event at about 1
second intervals. No other fault can initiate auto-restart.
The internal precision reference is monitored by a separate reference for overvoltage and allows truly
redundant OVP. The externally available reference is also monitored for an undervoltage that would indicate
a short on the pin.
The internal ground is constantly monitored against the VS- pin. If the chip ground goes positive with respect
to this pin, it indicates that the chip ground is open-circuit either inside the ADM1041A or the external wiring.
The ADM1041A would be latched off, similar to an OV event.
Rev. 0 | Page 17 of 56
ADM1041A
THEORY OF OPERATION
POWER MANAGEMENT
This block contains VDD undervoltage lockout circuitry and a
power-on/reset function. It also provides precision references
for internal use and a buffered reference voltage, VREF. Overloading, shorting to ground, or shorting to VDD do not effect
the internal references. See Figure 8.
VDDOK is true only when all the following conditions are met:
ground is negative with respect to VS−, INTREF and EXTREF
are operating normally, VDD > UVLHI, and VDD < VDD OVP
threshold.
During power-on, VREF does not come up until VDD exceeds the
upper UVL threshold. Housekeeping components in this block
include reference voltage monitors, a VDD overvoltage monitor,
and a ground fault detector.
The various gain settings and configurations throughout the
ADM1041A are digitally set up via the SMBus after it has been
loaded onto its printed circuit board. There is no need for
external trim potentiometers. An initial adjustment process
should be carried out in a test system. Other adjustments such
as current sense and voltage calibration should be carried out in
the completed power supply.
The ground fault detector monitors ADM1041A ground with
respect to the remote sense pin VS−. If GND becomes positive
with respect to VS−, an on-chip signal, VDDOK, goes false.
GAIN TRIMMING AND CONFIGURATION
VDD 1
INTERNAL
REFERENCE
2.5V
MAIN
BAND GAP
1.25V
EXTREFOK
REFERENCE
MONITOR
INTREFOK
AUXILIARY
REFERENCE
2.0V
POR
4.0V
UVLLO
RESET
S
4.4V
VDDOK
UVLHI
6.0V–6.5V
R
Q
S
Q
R
Q
OVP
VDDOV
300μs ≥ 500μs ≥ 700μs
GNDOK
05405-008
0.2V
VS– 20
GROUND
MONITOR
GND 7
gndok_dis
Figure 8. Block Diagram of Power Management Section
Rev. 0 | Page 18 of 56
ADM1041A
DIFFERENTIAL REMOTE SENSE AMPLIFIER
LOCAL OVERVOLTAGE PROTECTION (OVP)
This amplifier senses the load voltage and is the main voltage
feedback input. A differential input is used to compensate for
the voltage drop on the negative output cable of the power
supply. An external voltage divider should be designed to set the
VS+ pin to approximately 2.0 V with respect to VS–. The
amplifier gain is 1.0. See Figure 9.
This is the main overvoltage detection for the power supply. It is
detected locally so that only the faulty power supply shuts down
in the event of an OVP condition in an N + 1 redundant power
system. This occurs only after a load OV event. The local OVP
threshold may be trimmed via the SMBus. See Figure 9.
SET LOAD VOLTAGE
This is the main undervoltage detection for the power supply. It
is also detected locally so that a faulty power supply can be
detected in an N+1 redundant power system. The local UVP
threshold may be trimmed via the SMBus. See Figure 9.
LOCAL UNDERVOLTAGE PROTECTION (UVP)
The load voltage may be trimmed via the SMBus by a trim stage
at the output of the differential remote sense amplifier. The
voltage at the output of the trimmer is 1.50 V when the voltage
loop is closed. See Figure 9.
FALSE UV CLAMP
LOAD OVERVOLTAGE (OV)
If a faulty power supply causes an OVP condition on the system
bus, the control loop in the good power supplies is driven to
zero output. Therefore, a clamp is required to prevent the good
power supplies from indicating an undervoltage, and to ensure
they must recover quickly after the faulty power supply has shut
down. The false UV clamp achieves this by clamping the output
voltage just above the local UVP threshold. It may be trimmed
via the SMBus. The OCPF signal disables the clamp during
overcurrent faults. See Figure 9.
A comparator at the output of the load voltage trim stage
detects load overvoltage. The load OV threshold can be
trimmed via the SMBus. The main purpose is to turn off the
OrFET when the load voltage rises to an intermediate overvoltage level that is below the local OVP level. This circuit is
nonlatching. See Figure 9.
LOCAL VOLTAGE SENSE
This amplifier senses the output voltage of the power supply just
before the OrFET. Its input is derived from one of the pins used
for current sensing and is set to 2.0 V by an external voltage
divider. The amplifier gain is 1.3. See Figure 9.
V S–
21
REMOTE
SENSE
FROM
LOAD
35kΩ
35kΩ
70μA
20
35kΩ
V S+
CURRENT LIMIT
35kΩ
SET LOAD
VOLTAGE
25kΩ
DIFF. VOLTAGE SENSE
CURRENT SHARE
1V
3V
VOLTAGE
ERROR AMP
CAPTURE
VCMP
5
SET LOAD
OVERVOLTAGE
LOADVOK
VLS 2
VREF
1.5V
1.25V
×1.3
OCPF
SOFTSTART
RAMP UP
FALSE UV
CLAMP
SET UV CLAMP
THRESHOLD
SET OVP
THRESHOLD
OVP
TO
GENERAL
LOGIC
UVP
TO
GENERAL
LOGIC
1.5V
NOTE:
ALL POTENTIOMETERS (
05405-009
SET UVP
THRESHOLD
) ARE DIGITALLY PROGRAMMABLE THROUGH REGISTERS.
Figure 9. Block Diagram of Voltage-Sense Amplifier
Rev. 0 | Page 19 of 56
ADM1041A
70
VOLTAGE ERROR AMPLIFIER
60
CURRENT (μA)
50
40
30
20
0
05405-010
10
0
1
2
VOLTAGE (V)
3
4
Figure 10. Current Limit
MAIN VOLTAGE REFERENCE
A 1.5 V reference is connected to the inverting input of the
voltage error amplifier. This 1.5 V reference is the output
voltage of the soft-start circuit. Under closed-loop conditions,
the voltage at the noninverting input is also controlled to 1.5 V.
During start-up, the output voltage should be ramped up in a
linear fashion at a rate that is independent of the load current.
This is achieved by digitally ramping up the reference voltage by
using a counter and a DAC. The ramp rate is configurable via
the SMBus. See Figure 13.
2.75
2.50
2.25
2.00
GM (mA/V)
1.75
1.50
1.25
1.00
0.75
CURRENT-SENSE AMPLIFIER
05405-011
0.50
0.25
0
1
10
100
1k
10k
100k
BANDWIDTH
1M
10M
100M
10M
100M
Figure 11. VCMP Transconductance
220
200
180
160
120
100
80
60
40
05405-012
GM (μA/V)
140
20
0
This is a high gain transconductance amplifier that takes its
input from the load voltage trim stage described previously. The
amplifier requires only the output pin for loop compensation,
which typically consists of a series RC network-to-common. A
parallel resistor may be added to common to reduce the openloop gain and thereby provide some output voltage droop as
output current increases. The output of the amplifier is typically
connected to an emitter follower that drives an optocoupler,
which in turn controls the duty of the primary side PWM. The
emitter follower should have a high gain to minimize loading
effects on the amplifier. Alternatively, an op amp voltage
follower may be used. See Figure 11.
1
10
100
1k
10k
100k
BANDWIDTH
1M
Figure 12. CCMP and SCMP Transconductance
This is a two-stage differential amplifier that achieves low offset
and accuracy. The amplifier has the option to be chopped to
reduce offset or left as a linear amplifier without chopping.
Refer to the Register Listing for more details. The amplifier’s
gain can be selected from three ranges. It is followed by a trim
stage and then by a low gain buffer stage that can be configured
with a gain of 1.0 or 2.1. The result is a total of six overlapping
gain ranges (65 to 230), one of which must be selected via the
SMBus. This gives ample adjustment to compensate for the
poor initial tolerance of the resistance wires typically used for
current sensing. It also allows selecting a higher sensitivity for
better efficiency or a lower sensitivity for better accuracy (lower
offset). The amplifier offset voltage is trimmed to zero in a
once-off operation via the SMBus and uses a voltage-controlled
current source at the output of the first gain stage. A second
controlled current source is used to trim out the additional
offset due to the mismatch of the external divider resistors. This
offset trim is dynamically adjusted according to the commonmode voltage present at the top of the voltage dividers. Six
ranges are selectable according to the magnitude and polarity of
this offset component. Because the offset compensation circuit
itself has some inaccuracies, the best overall current-sense
accuracy is obtained by using more closely matched external
dividers and then selecting a low compensation range. See
Figure 13.
Rev. 0 | Page 20 of 56
ADM1041A
CURRENT SENSING
Current is typically sensed by a low value resistor in series with
the positive output of the power supply, positioned just before
the OrFET or diode. For high voltages (12 V and higher), this
resistor is usually placed in the negative load. A pair of closely
matched voltage dividers connected to Pins 2 and 3 divide the
common-mode voltage down to approximately 2.0 V. The
divider ratio must be the same as used in the local and remote
voltage-sense circuits. Alternatively, current may be sensed by a
current transformer (CT) connected to Pin 8. The ADM1041A
must be configured via the SMBus to select one or the other.
See Figure 13.
CURRENT-TRANSFORMER INPUT
The ADM1041A can also be configured to sense current by
using a CT connected to Pin 8. In this case, the resistive current
sense is disabled. A separate single-ended amplifier has two
possible sensitivities that are selected via the SMBus. If the CT
option is selected, the gain of the 1.0, 2.1 buffer that follows the
gain trim stage is no longer configurable and is fixed at 1.0.
The share driver amplifier has a total of 100 mV positive offset
built into it. To use the device in CT mode, it is necessary to
compensate for this additional 100 mV offset. This is achieved
by adding in a positive offset on the CT input. This also allows
any negative amplifier offsets in the CT chain to be nulled out.
This offset cancellation is achieved by sourcing a current
through a resistance on the ICT pin. The resistor value is 40 kΩ
and so for 100 mV of offset cancellation a current of 2.5 μA is
required. It is possible to fine trim this current via Register 15h,
Bits 4–0, step size 170 nA. For example, 2.5 μA ≈ 15 × 170 nA;
so the code for Register 15h is decimal 15 or 0Fh. Refer to the
Current Transformer parameter in the Specifications table for
more details. See Figure 13.
CURRENT-SENSE CALIBRATION
Regardless of which means is used to sense the current, the end
result of the calibration process should produce the standard
current share signal between Pins 20 and 23, that is, 2.0 V at
100% load, excluding any additional share signal offset that
might be configured.
CURRENT-LIMIT ERROR AMPLIFIER
This is a low gain transconductance amplifier that takes its
input from one of the calibrated current stages described
previously. The amplifier requires only the output pin for loop
compensation, which typically consists of a series RC networkto-common. A trimmable reference provides a wide range of
adjustment for the current limit. When the current signal
reaches the reference voltage, the output of the error amplifier
comes out of saturation and begins to drive a controlled current
source. The control threshold is nominally 1.0 V. This current
flows through a resistor in series with the trimmed voltage loop
signal and thereby attempts to increase the voltage signal above
the 1.5 V reference for that loop. The closed voltage loop reacts
by reducing the power supply’s output voltage and this results in
constant current operation. See Figure 13.
OrFET GATE
CURRENT
OrFET SOURCE
VREF
REG 17h b7
VDD
CURRENTSHARE
OFFSET
(VSHARE,
IOUT = 0)
GAIN = 10
C S+
3
TO CURRENTSHARE DRIVE
AMPLIFIER
2
CS–/FS
9R
CURRENT
LIMIT TO
VOLTAGE
ERROR AMP
IRS/ICT
R
SET
CURRENT
SHARE
ICT
TRANSFORMER
CURRENTSENSE
CONFIGURATION
8
40kΩ
VREF
CURRENT
ERROR AMP
SET CURRENTLIMIT LEVEL
SET GAIN
CCMP
4
1.25V
OCP
0.5V
OCP
COMPARATOR
Figure 13. Current Sense
Rev. 0 | Page 21 of 56
05405-013
CURRENT
TRANSFORMER
ADM1041A
OVERCURRENT PROTECTION
DIFFERENTIAL SENSE AMPLIFIER
When the current limit threshold is reached, the OCP comparator detects when the current error amplifier comes out of
saturation. Its threshold is nominally 0.5 V. This starts a timer
that, when it times out, causes an OCP condition to occur and
the power supply to shut down. If the current limit disappears
before the time has expired, the timer is reset. The time period
is configurable via the SMBus. Undervoltage blanking is applied
during the timer operation. See Figure 15.
This amplifier has unity gain and senses the difference between
the share bus voltage and the remote voltage sense negative pin.
When the power supply is the master, it forms a closed loop
with the ISHARE drive amplifier described previously, and
therefore it causes the share bus voltage between Pins 20 and 23
to equal the current-share signal at the noninverting input of
the ISHARE drive amplifier. When the power supply is a slave, the
output of the differential-sense amplifier exceeds the internal
current share signal, which causes the ISHARE drive amplifier to
be driven into cutoff. Because it is not possible to trim out
negative offsets in the op amps in the current-share chain, a
50 mV voltage source is used to provide a known fixed positive
offset. The share bus offset controlled current source must be
trimmed via the SMBus to take out the resulting overall offset.
See Figure 15.
CURRENT SHARE
The current-share method is the master–slave type, which
means that the power supply with the highest output current
automatically becomes the master and controls the share bus
signal. All other power supplies become slaves, and the share
bus signal causes them to increase their output voltages slightly
until their output currents are almost equal to that of the
master. This scheme has two major advantages. A failed master
power supply simply allows one of the slaves to become the new
master. A short-circuited share signal disables current sharing,
but all power supplies default to their normal voltage setting,
allowing a certain degree of passive sharing. Because this chip
uses a low voltage process, an external bidirectional amplifier is
needed for most existing share bus signal levels. The voltage
between Pins 20 and 23 is always controlled to 2.0 V full scale,
ignoring any offset. By connecting Pins 20 and 23 together, the
chip can produce a 2.0 V share signal directly without any
external circuits. To improve accuracy, the share signal is
referenced to the remote voltage sense negative (VS-) pin.
3V
2V
VSHARE
1V
0
20
40 60
IOUT
80 100%
05405-015
OFFSET
0
Figure 14. Load Share Characteristic
CURRENT-SHARE OFFSET
ISHARE ERROR AMPLIFIER
This is a low gain transconductance amplifier that measures the
difference between the internal current share voltage and the
signal voltage on the external share bus. If two power supplies
have almost identical current-share signals, a 50 mV voltage
source on the inverting input helps arbitrate which power
supply becomes the master and prevents hunting between
master and slave roles. The amplifier requires only the output
pin for loop compensation, which typically consists of a series
RC network to common. When the power supply is a slave, the
output of the error amplifier comes out of saturation and begins
to drive a controlled current sink. The control threshold is
nominally 1.0 V. This current flows from a resistor in series
with the trimmed voltage loop signal and thereby attempts to
decrease the voltage signal below the 1.5 V reference for that
loop. The closed voltage loop reacts by increasing the power
supply’s output voltage until current share is achieved. The
maximum current sink is limited so that the power supply
voltage can be increased only a small amount, which is usually
limited to be within the customer’s specified voltage regulation
limit. This small voltage increase also limits the control range of
the current-share circuit and is called the capture range. The
capture range may be set via the SMBus to one of four values,
from 1% to 4% nominal. See Figure 15.
ISHARE CLAMP
To satisfy some customer specifications, the current-share
signal can be offset by a fixed amount by using a trimmable
current generator and a series resistor. The offset is added
on top of the 2.0 V full-scale, current-share output signal.
See Figure 15.
ISHARE DRIVE AMPLIFIER
This amplifier is a buffer with enough current source capability
to drive the current-share circuits of several slave power
supplies. It has negligible current sink capability. Refer to the
Differential Sense Amplifier section.
This clamp keeps the current share-loop compensation
capacitor discharged when the current share is not required to
operate. The clamp is released during power-up when the
voltage reference and therefore the output voltage of the power
supply has risen to either 75% or 88% of its final value. This is
configurable via the SMBus. When the clamp is released, the
current share loop slowly walks in the current share and helps
to avoid output voltage spikes during hot swapping. See
Figure 15.
Rev. 0 | Page 22 of 56
ADM1041A
SHARE_OK DETECTOR
Incorrect current sharing is a useful early indicator that there is
some sort of noncatastrophic problem with one of the power
supplies in a parallel system. Two comparators are used to
detect an excessive positive or negative error voltage at the input
of the ISHARE error amplifier, which indicates that the current
share loop has lost control. One of four possible error levels
must be configured via the SMBus. See Figure 15.
TO VOLTAGE ERROR AMP
ISHARE ERROR
AMPLIFIER
VREF
SCMP
VDD
22
CURRENTSHARE
OFFSET
(VSHARE,
IOUT = 0)
ISHARE
CLAMP
ISHARE DRIVE
AMPLIFIER
FROM
CURRENT
SENSE
+12V
SHRO
24
9R
GAIN = (R1 + R2)/R2
SHARE BUS
1N4148
R
DIFFERENTIAL
SENSE
SHAREOK
R1
60μA
23
SHRS+
R2
20
SET CURRENTLIMIT LEVEL
50mV
50mV
VS–/SHRS–
GAIN = (R1+R2)/R2
REMOTE
–VE SENSE
70μA
CURRENT LIMIT
DIFF. VOLTAGE SENSE
CURRENT SHARE
1V
3V
VCMP
CAPTURE
5
VOLTAGE
ERROR AMP
VREF
SOFTSTART
RAMP UP
Figure 15. Current-Share Circuit and Soft Start
Rev. 0 | Page 23 of 56
05405-014
VREF
CURRENTERROR AMP
ADM1041A
PULSE/ACSENSE2
The ac sense function monitors the amplitude of the incoming
pulse and, if sufficiently high, generates a flag to indicate that
the ac, or strictly speaking, the voltage on the bulk capacitor, is
okay. Because the envelope of the pulse has a considerable
amount of 100 Hz ripple, hysteresis is available on this input
pin. Internally there is a 20 μA to 80 μA current sink. With a
909R external Thevenin resistance, this current range translates
to a voltage hysteresis of 200 mV to 500 mV. The internal
hysteresis current is turned off when the voltage exceeds the
reference on the comparator. This form of hysteresis allows
simple scaling to be implemented by changing the source
impedance of the pulse-conditioning circuit. Some trimming
of hysteresis and threshold voltage is provided. The ac sense
function can be configured to be derived from ACSENSE2 rather
than ACSENSE1. This allows a separate dc input from various
locations to be used to generate AC_OK for better flexibility
or accuracy.
When configured, PULSE and ACSENSE monitor the output of
the power main transformer. See Figure 16.
PULSE
Providing the output of the pulse function (PULSE_OK) is
high, the FET in the OR’ing circuit can be turned on. If the
pulses stop for any reason, about 1 second later the PULSE_OK
goes low and the OrFET drive is disabled. This delay allows
passage of all expected pulse skipping modes that might occur
in no load or very light load situations. See Figure 16.
ACSENSE
This is rarely used to measure the ac input to the supply
directly. ACSENSE1 or ACSENSE2 are usually used to measure,
indirectly, the voltage across the bulk capacitor so that the
system can be signaled that power is normal. Also if power is
actually lost, ACSENSE represents when just enough energy is left
for an orderly shutdown of the power supply. See Figure 16.
TO OrFET SOURCE
TO CURRENTSENSE RESISTOR
AND OrFET GATE
0.525V
S
9
PULSE
ACSENSE1
5.3kΩ
R
CLK
Q
1 SEC
Q
PULSEOK
R
SELECT
ACSENSE
AC_OK
1.5V
S
5.3kΩ
R
TRIM
HYSTERESIS
Figure 16. Pulse In and ACSENSE Circuit
Rev. 0 | Page 24 of 56
CLK
Q
1 mS
Q
R
05405-016
ACSENSE2 10
ADM1041A
OrFET GATE DRIVE
When configured, this block provides a signal to turn on/off
an OrFET used in the output of paralleled power supplies. The
gate drive voltage of one of these FETs is typically 6 V to 10 V
above the output voltage. Because the output voltage of the
ADM1041A is limited, an external transistor needs to be used.
The block diagram shows an example of this approach.
See Figure 21.
Figure 19 and Figure 20 show the OrFET turn-off time and
turn-on time when the FG pin polarity is inverted. As can be
seen, to turn off the OrFET, the VFG pin now transitions from
high to low. Also, its corresponding turn-on event occurs from
a low-to-high transition. The circuit in Figure 21 is used to
generate these plots.
The FG output is an open-drain, N-channel MOSFET and is
normally high, which holds the OrFET off. When all the startup conditions are correct, Pin 19 is pulled low, which allows the
OrFET to turn on. The logic can also be configured as inverted
if a noninverting drive circuit is used.
Second, if a rectifier or filter capacitor fails during steady state
operation, it detects the resulting reverse voltage across the
OrFET’s on-resistance and turns off the OrFET before a voltage
dip appears on the bus. The internal threshold can be
configured from 100 mV to 250 mV (negative), which is also
scaled up by the external voltage dividers. A slightly larger filter
capacitor may be used on the voltage divider at Pin 6 to speed
up this function.
Figure 17 shows the typical response time of the ADM1041A to
such an event. In the plot, VFD is ramped down and the response
time of the FG pin to a reverse voltage event on the FD pin is
seen. This simulates the rectifier or filter capacitor failure
during steady-state operation. When the FD voltage is below
1.9 V (2 V minus 100 mV threshold), the FG pin reacts. As can
be seen, the response time is approx 330 nsecs. This extremely
fast turn-off is vital in an n+1 power supply system
configuration. It ensures that the damaged power supply
removes itself from the system quickly. Figure 18 shows the
equivalent response time to turn on the OrFET. As can be seen,
there is a delay of approximately 500 ns before the FG pin
ramps down to turn on the OrFET, allowing the power supply
to contribute to the system. This propagation delay is due
mainly to internal amplifier response limitations. The circuit in
Figure 21 is used to generate these plots. In this case, the
resistor to VDD from the FG pin is 2 kΩ.
Rev. 0 | Page 25 of 56
TTOTAL = 330ns
TDELAY = 218ns T = 112ns
05405-017
64%
Figure 17. OrFET Turn-Off Time (Default Polarity)
TTOTAL = 506ns
05405-018
A differential amplifier monitors the voltage across the OrFET
and has two major functions. First, during start-up, it allows the
OrFET to turn on with almost 0 V across it to avoid voltage
glitches on the bus. This applies to a hot bus or a cold bus. The
internal threshold can be configured from 20 mV to 50 mV
(negative), which is scaled up by the external voltage dividers.
Figure 18. OrFET Turn-On Time (Default Polarity)
ADM1041A
TTOTAL = 618ns
64%
TDELAY = 506ns
05405-020
05405-019
TTOTAL = 222ns
T = 112ns
Figure 20. OrFET Turn-On Time (Inverse Polarity)
Figure 19. OrFET Turn- Off Time (Inverse Polarity)
CURRENT
VOUT
SOURCE
GATE
V = VOUT +10V
6
VDD
FD
PULSEOK
19
FG
LOADOK
PENOK
REVERSEOK
OrFET OK
RESET
VOLTAGE
DETECTOR
POLARITY
VREF
05405-021
2
FS
Figure 21. OrFET Gate Drive Circuit
Rev. 0 | Page 26 of 56
DRAIN
ADM1041A
OSCILLATOR AND TIMING GENERATORS
An on-board oscillator is used to generate timing signals. Some
trimming of the oscillator is provided to adjust for variations in
processing.
All timing generated from the oscillator is expected to meet the
same tolerances as the oscillator. Because individual delay
counters are generally two to three bits, the worst error is one
clock period into these counters, which is 25% of the nominal
delay period. None of these tolerances are extremely critical.
MON1
This is the alternative analog comparator function for the
Pulse/ACSENSE1 pin (Pin 9). The threshold is 1.25 V. When
MON1 is selected, ACSENSE1 defaults to true.
MON2
This is the alternative analog comparator function for the
ACSENSE2 pin (Pin 10). The threshold is 1.25 V. When MON2 is
selected, ACSENSE2 defaults to true.
PEN
LOGIC I/O AND MONITOR PINS
Apart from pins required for the various key analog functions, a
number of pins are used for logic level I/O signals. If the logic
I/O function is not required, the pins may be reconfigured as
general-purpose comparators for analog level monitoring
(MON) and may be additionally configured to have typical
OVP and UVP properties, either positive-going or negativegoing, depending on whether a positive supply output or a
negative supply output is being monitored. The status of all
protection and monitoring comparators is held in registers that
can be read by a microprocessor via the SMBus. Certain control
bits may be written to via the SMBus.
CBD/ALERT
This pin can be used either as a crowbar driver or as an SMBus
alert signal to indicate that a fault has occurred. It is typically
configured to respond to a variety of status flags, as detailed in
Registers 1Ah and 1Bh. The primary function of this pin is as a
crowbar driver, and as such it should be configured to respond
to the OV fault status flag. It can be configured to respond to
any or all of a variety of fault status flags, including a microprocessor writable flag, and can be configured as latching or
nonlatching. It may also be configured as an open-drain
N-channel or P-channel MOSFET and as positive or negative
(inverted) logic. A pull-up or pull-down resistor is required.
This pin may be wire-OR’ed with the same pin on other
ADM1041A’s in the power supply.
The alternative function is an SMBus alert output that can be
used as an interrupt to a microprocessor. If a fault occurs, the
microprocessor can then query the ADM1041A(s) about the
fault status. This is intended to avoid continuously polling the
ADM1041A(s).
This is the power enable pin that turns the PWM converter on
and can be configured as active high or low. This might drive an
opto-isolator back to the primary side or connect to the enable
pin of a secondary-side post regulator.
PSON
This pin is usually connected to the customer’s PSON signal
and, when asserted, causes the ADM1041A to turn on the
power output. It can be configured as active high or low.
Alternatively, a microprocessor can communicate the PSON
function to the ADM1041A using the SMBus, or the PSONLINK
signal may be used. When the PSON pin is not used as such, it
can be configured as an analog input, MON3.
MON3
This is the alternative analog comparator function for the PSON
pin (Pin 16). The threshold is 1.25 V. When MON3 is selected,
PSON defaults to off.
DC_OK (POWER-OK, POWER Good, Etc.)
This output is true when all dc output voltages are within
tolerance and goes false to signify an imminent loss of power.
(Timing is programmable, see the register description). It
can be configured as an open-drain, N-channel or P-channel
MOSFET and as positive or negative (inverted) logic. A pull-up
or pull-down resistor is required. This pin may be wire-OR’ed
with the same pin on other ADM1041As in the power supply.
When the DC_OK pin is not used as such, it can be configured
as an analog input, MON4.
MON4
This is the alternative analog comparator function for the
DC_OK pin (Pin 17). The threshold is 1.25 V.
Routinely, the microprocessor needs to gather other data
from the ADM1041A(s), which can include the fault status,
so the ALERT function may not be used. Also, the simplest
microprocessors may not have an interrupt function. This
allows the CBD/ALERT pin to be used for other functions.
Rev. 0 | Page 27 of 56
ADM1041A
AC_OK
In Figure 22, MON2 and MON3 are configured to monitor a
negative 12 V rail. MON2 is configured as negative-going OVP,
and MON3 is configured as positive-going UVP. The 5 V power
rail is used for bias voltage.
This output is true when either ACSENSE1 or ACSENSE2 is true
(configurable). It can be configured as an open-drain,
N-channel or P-channel MOSFET and as positive or negative
(inverted) logic. A pull-up or pull-down resistor is required.
This pin can be wire-OR’ed with the same pin on other
ADM1041As in the power supply. When the AC_OK pin is not
used as such, it can be configured as an analog input, MON5, or
as a voltage reference.
+5V
1
VCC
MON2 10
MON5
This is the alternative analog comparator function for the
AC_OK pin (Pin 18). The threshold is 2.5 V, and it has a
100 μA current source that allows hysteresis to be controlled by
adjusting the external source resistance. It is ideal for an OTP
sensing circuit using a thermistor as part of a voltage divider.
The OTP condition can be configured to latch off the power
supply (similar to OVP) or to allow an autorestart (soft OTP).
See Figure 22.
MON3 16
–12V
MON5 18
05405-022
THERMISTOR
7
Figure 22. Example of MON Pin Configuration
OCP
2.5V
2.5V
OCP
18
OTP/
MON5
9
MON1
MON5
1.25V
1.5V
MON1
OVP
OVP
10 MON2
MON2
UVP
UVP
16 MON3
GENERAL
LOGIC
17 MON4
ACOK
ORFETOK
ORFETOK
SHAREOK
SHAREOK
RESET
RESET
VDDOK
VDDOK
VDDOV
VDDOV
PENOK
PENOK
MON4
16 PSON
PSON
CLOCK
AC_OK
DC_OK
CBD
CONTROL
REGISTERS
PEN
18 AC_OK
17 DC_OK
11 CBD/ALERT
12 PEN
CONFIGURE
PWRON
I/Os
CONFIGURE
STATUS
(WRITE
(READ
REGISTERS) REGISTERS)
SDA/
CONTROL
SERIAL
LINES
INTERFACE
PEN
SCL
CS
Figure 23. Block Diagram of Protection and General Logic
Rev. 0 | Page 28 of 56
14 PS LINK
ON
13 SCL/
AC_OKLink
15 ADD0
05405-023
ACOK
MON3
CONFIG
Figure 24. General Logic
Rev. 0 | Page 29 of 56
0.5V
OCP
curr_lim_dis
05405-024
COMP
(4)
FROM OUTPUT
OF CURRENTERROR AMP
rsm
PSON3/
MON3
(12)
CONFIG
mn3s
ACSENSE2/
MON2
(10)
mn2s
CONFIG
mn1s
ACSENSE1/
MON1
(9)
OCPF
up_pson_m
mov5
80ms
UV BLANK
450μs
UV DEBOUNCE
selcbd2<2>
selcbd1<2>
ovfault
selcbd1<7>
selcbd2<6>
selcbd1<6>
vddov
local ov
selcbd2<7>
vddok
mfg1
selcbd2<5>
mfg2
selcbd2<4>
mfg3
selcbd2<3>
uvfault
ocpto
selcbd1<4>
acsns
selcbd1<3>
mfg4
m_cbd_w
opt(mov5)
ocpf
mfg5
selcbd2<1>
orfetok
selcbd1<1>
NOT USED
selcbd2<0>
FAULT
FAULTB
SDA/
PSONLINK
(14)
SCL/
AC_OKLink
(13)
SOFTSTART
RAMP
m_cbd_cir
DC_OK ON DELAY
m_shr_clmp
VREF
1.5V
VOLTAGE
ERROR AMP
m_dcok_r
por
D
R
S
Q
cbdlm
DRIVER
VCMP
(5)
DRIVER
polcbd
DC_OK/
MON4
(17)
PEN
(12)
SCMP
(22)
error_amp
inv input
GM
DRIVER
polpen
clamp
poldcok, mn4s0
m_penok_r
75%/88%
SOFTSTART VOUT
DAC
scmp_in
300μs, 10ms, 20ms, 40ms
ssr1s1, ssrs0
set_cshare_clamp
200, 400, 800, 1600ms
POKTS1, POKTS0
gatepen
R
S Q
shareok
R Q
S Q
vddok
gateramp
sda_out
sda_in
scl_in
selcbd1<0>
acsok
selcbd1<5>
ovfault
ocfault
uvfault
uvbm
i2cmb
mov4
penon
uvok
psonlink
m_psonok_r
acsns
mov3
mov2
mov1
OCP RIDETHROUGH
128, 256, 384, 512μs,
OR 1, 2, 3, 4SEC
softotp
OCP
DISABLE
localuv
muv5
muv4
muv3
muv2
muv1
R
ocpts2, ocpts1, ocpts0
dcokoff_delay
Q S
psonts1.psonts0
m_acsns_w
0, 40, 80, 160ms
DC_OK OFF DELAY
0, 1, 2, 4ms
1 SECOND
softotp
mov5
m_pson_r
m_pson_w
DEBOUNCE
1ms
restartb
ACSENSE
acsns_hyst
acsns_thresh
acss
CBD/
ALERT
(11)
ADM1041A
ADM1041A
SMBus SERIAL PORT
Interfacing
The programming and microprocessor interface for the
ADM1041A is a standard SMBus serial port, which consists of a
clock line and a data line. The more rigorous requirements of
the SMBus standard are specified in order to give the greatest
noise immunity. The ADM1041A operates in slave mode only.
If a microprocessor is not used, these pins can be configured to
perform the PSONLINK and AC_OKLink functions. Note that
this port is not intended to be connected to the customer’s
SMBus (or I2C bus). Continuous SMBus activity or an external
bus fault interferes with the interpart communication, possibly
preventing proper operation and proper fault reporting. If the
customer needs status and control functions via the SMBus, it is
recommended that a microprocessor with a hardware SMBus
(I2C) port be used for this interface. The microprocessor should
access the ADM1041As via a second SMBus port, which may be
emulated in software (subset of the full protocol).
The microprocessor must access the ADM1041A(s) via their
on-board SMBus (I2C) port. Because this port is also used to
configure the ADM1041A(s), the software must include a
routine that avoids SMBus activity during configuration. The
simplest interface is for the microprocessor to have an SMBus
(I2C) port implemented in hardware, but this may be more
expensive. An alternative is to emulate the bus in software and
to use two general-purpose logic I/O pins. Only a simple subset
of the SMBus protocol need be emulated because the
ADM1041A always operates as a slave device.
MICROPROCESSOR SUPPORT
The ADM1041A has many features that allow it to operate with
the aid of a microprocessor. There are several reasons why a
microprocessor might be used:
•
To provide unusual logic and/or timing requirements,
particularly for fault conditions.
•
To drive one or more LEDs, including flashing, according
to the status of the power supply.
•
To replace other discrete circuits such as multiple OTP,
extra output monitoring, fan speed control, and failure
detection, and combine the status of these circuits with the
status of the ADM1041As.
•
To free up some pins on the ADM1041As. This could
reduce the BOM and therefore the cost.
•
To interface to an external SMBus (or I2C) for more
detailed status reporting. The SMBus port in the
ADM1041A is not intended for this purpose.
•
Configuring for a Microprocessor
Except during initial configuration, all ADM1041A registers
that need to be accessed are high speed CMOS devices that do
not involve EEPROM. Table 43, the Microprocessor Support
table describes the various registers, bits, and flags that can be
read and written to.
Note that for the microprocessor to gain control of the PSON
and ACSENSE functions, Reg12h (Table 27) must be configured.
A separate configuration bit is allocated to each signal. The
microprocessor can then write to the signal as though the
signal originated within the ADM1041A itself.
BROADCASTING
In a power supply with multiple outputs, it is recommended
that all outputs rise together. Because the SMBus is relatively
slow, writing sequentially to the PSON signal in each
ADM1041A, for instance, causes a significant delay in the
output rise of the last chip to be written. The ADM1041A
avoids this problem by allocating a common broadcast address
that all chips can respond to. To avoid data collisions, this
feature should be used only for commands that do not initiate a
reply.
SMBus SERIAL INTERFACE
To allow EEPROM space in ADM1041A(s) or in the
microprocessor to be used for FRU (VPD) data. A simple
or complex microprocessor can be used according to the
amount of additional functionality required. Note that the
microprocessor is not intended to access or modify the
EEPROM address space that is used for the configuration
of the ADM1041A(s).
Control of the ADM1041A is carried out via the SMBus. The
ADM1041A is connected to this bus as a slave device under the
control of a master device.
The ADM1041A has a 7-bit serial bus slave address. When the
device is powered up, it does so with a default serial bus
address. The default power-on SMBus address for the device is
1010XXX binary, the three lowest address bits (A2 to A0) being
defined by the state of the address pin, ADD0, and Bit 1 of
Configuration Register 4 (ADD1). Because ADD0 has three
possible states (tied to VDD, tied to GND, or floating) and
Config4 < 1 > can be high or low, there are a total of six possible
addresses, as shown in Table 6.
Rev. 0 | Page 30 of 56
ADM1041A
GENERAL SMBus TIMING
The SMBus specification defines specific conditions for
different types of read and write operations. General SMBus
read and write operations are shown in the timing diagrams of
Figure 25, Figure 26, and Figure 27, and described in the
following sections.
If the operation is a write operation, the first data byte after the
slave address is a command byte. This tells the slave device what
to expect next. It may be an instruction, such as telling the slave
device to expect a block write, or it may be a register address
that tells the slave where subsequent data is to be written.
The general SMBus protocol operates as follows.
Because data can flow in only one direction as defined by the
R/W bit, it is not possible to send a command to a slave device
during a read operation. Before doing a read operation, it might
first be necessary to perform a write operation to tell the slave
what sort of read operation to expect and/or the address from
which data is to be read.
The master initiates data transfer by establishing a start
condition, defined as a high-to-low transition on the serial data
line, SDA, while the serial clock line, SCL, remains high. This
indicates that a data stream follows. All slave peripherals
connected to the serial bus respond to the start condition and
shift in the next 8 bits, consisting of a 7-bit slave address (MSB
first), plus an R/W bit, which determines the direction of the
data transfer, that is, whether data is written to or read from the
slave device (0 = write, 1 = read).
When all data bytes have been read or written, stop conditions
are established. In write mode, the master pulls the SDA line
high during the tenth clock pulse to assert a stop condition. In
read mode, the master device releases the SDA line during the
low period before the ninth clock pulse, but the slave device
does not pull it low. This is known as No Acknowledge. The
master then takes the data line low during the low period before
the tenth clock pulse, then high during the tenth clock pulse to
assert a stop condition.
The peripheral whose address corresponds to the transmitted
address responds by pulling the data line low during the low
period before the ninth clock pulse, known as the Acknowledge
bit, and holding it low during the high period of this clock
pulse. All other devices on the bus remain idle while the
selected device waits for data to be read from or written to it. If
the R/W bit is a 0, then the master writes to the slave device. If
the R/W bit is a 1, the master reads from the slave device.
Note: If it is required to perform several read or write
operations in succession, the master can send a repeat start
condition instead of a stop condition to begin a new operation.
Data is sent over the serial bus in sequences of nine clock
pulses, eight bits of data, followed by an Acknowledge bit from
the slave device. Data transitions on the data line must occur
during the low period of the clock signal and remain stable
during the high period, because a low-to-high transition when
the clock is high may be interpreted as a stop signal.
19
9
1
9
SCLK
A6
SDATA
A5
A4
A3
A2
A1
A0
R/W
D7
D6
D5
D4
D3
D2
D1
ACK. BY
ADM1041A
START BY
MASTER
D0
ACK. BY
ADM1041A
FRAME 2
ADDRESS POINTER REGISTER BYTE
FRAME 1
SERIAL BUS ADDRESS BYTE
1
9
SCLK (CONTINUED)
D7
D6
D5
D4
D3
D2
D1
D0
ACK. BY
ADM1041A
STOP BY
MASTER
FRAME 3
DATA BYTE
Figure 25. Writing a Register Address to the Address Pointer Register, then Writing Data to the Selected Register
Rev. 0 | Page 31 of 56
05405-025
SDATA (CONTINUED)
ADM1041A
1
9
1
9
SCLK
A5
A4
A3
A2
A1
A0
R/W
D7
D6
D5
D4
D3
D2
D1
ACK. BY
ADM1041A
START BY
MASTER
D0
ACK. BY
ADM1041A
FRAME 1
SERIAL BUS ADDRESS BYTE
STOP BY
MASTER
FRAME 2
ADDRESS POINTER REGISTER BYTE
05405-026
A6
SDATA
Figure 26. Writing to the Address Pointer Register Only
1
9
1
9
SCLK
A6
A5
A4
A3
A2
A1
A0
R/W
D7
D6
D5
D4
D3
D2
D1
ACK. BY
ADM1041A
START BY
MASTER
D0
ACK. BY
ADM1041A
FRAME 1
SERIAL BUS ADDRESS BYTE
FRAME 2
DATA BYTE FROM ADM1041
STOP BY
MASTER
05405-027
SDATA
Figure 27. Reading Data from a Previously Selected Register
Table 6. Device SMBus Addresses
ADD1 Bit 1
0
0
0
1
1
1
X
1
ADD0 Pin
GND
VDD
NC
GND
VDD
NC
X
A2
0
0
1
0
0
1
X
A1
0
0
0
1
1
0
X
A0
0
1
0
0
1
1
X
Target Device
0
1
4
2
3
5
All Devices
ADDRESS
1010 000X
1010 001X
1010 100X
1010 010X
1010 011X
1010 101X
1010 111X
HEX READ
A0
A2
A8
A4
A6
AA
AE
HEX WRITE
A1
A3
A9
A5
A7
AB
ADD1 is low by default. To access the additional three addresses it is necessary to set Config 4 < 1 > high and then perform a power cycle to allow the new address to
be latched after the EEPROM download. Refer to the section on Extended SMBUS Addressing for more details.
Rev. 0 | Page 32 of 56
ADM1041A
SMBus PROTOCOLS FOR RAM AND EEPROM
The SMBus specification defines several protocols for different
types of read and write operations. The protocols used in the
ADM1041A are described and illustrated in this section. The
following abbreviations are used in the diagrams:
S
P
R
W
A
A
Start
Stop
Read
Write
Acknowledge
No Acknowledge
1
2
3
4
5
COMMAND A2h
SLAVE
S
W A
A
(PAGE ERASE)
ADDRESS
6
7
8
9
10
11 12
EEPROM
EEPROM
ADDRESS
ADDRESS
ARBITRARY
A
A
A P
HIGH BYTE
LOW BYTE
DATA
(80h OR 81h)
(00h TO FFh)
05405-028
The ADM1041A contains volatile registers (RAM) and
nonvolatile EEPROM. RAM occupies the address locations
from 00h to 7Fh, while EEPROM occupies the address locations
from 8000h to 813Fh.
Figure 28. EEPROM Page Erase Operation
Page erasure takes approximately 20 ms. If the EEPROM is
accessed before erasure is complete, the SMBus responds with
No Acknowledge.
Figure 29 shows the peak IDD supply current during an
EEPROM page erase operation. Decoupling capacitors of 10 μF
and 100 nF are recommended on VDD.
The ADM1041A uses the following SMBus write protocols.
SMBus Erase EEPROM Page Operations
05405-029
EEPROM memory can be written to only if it is effectively
unprogrammed. Before writing to one or more locations that
are already programmed, the page containing those locations
must be erased. EEPROM ERASE is performed by sending a
page erase command byte (A2h) followed by the page location
of the item to be erased. (There is no need to set an erase bit in
an EEPROM control/status register.)
The EEPROM consists of 16 pages of 32 bytes each; the register
default EEPROM consists of 1 page of 32 bytes starting at
8100h.
SMBus Write Operations
EEPROM Location
8000h to 801Fh
8020h to 803Fh
8040h to 805Fh
8060h to 807Fh
8080h to 809Fh
80A0h to 80BFh
80C0h to 80DFh
80E0h to 80FFh
8100h to 811Fh
8120h to 813Fh
8140h to 815Fh
8160h to 817Fh
8180h to 819Fh
81A0h to 81BFh
81C0h to 81DFh
81E0h to 81FFh
Description
Available FRU
Available FRU
Available FRU
Available FRU
Available FRU
Available FRU
Available FRU
Available FRU
Configuration Boot Registers
ADI Registers
Available FRU
Available FRU
Available FRU
Available FRU
Available FRU
ADI Registers
Send Byte
In this operation, the master device sends a single command
byte to a slave device, as follows:
1.
The master device asserts a start condition on SDA.
2.
The master sends the 7-bit slave address followed by the
write bit (low).
3.
The addressed slave device asserts ACK on SDA.
4.
The master sends a command code.
5.
The slave asserts ACK on SDA.
6.
The master asserts a stop condition on SDA and the
transaction ends.
In the ADM1041A, the send byte protocol is used to write a
register address to RAM for a subsequent single-byte read from
the same address or block read or write starting at that address.
This is illustrated in Figure 30.
The EEPROM page address consists of the EEPROM address
high byte, 80h for FRU or 81h for register default, and the three
MSBs of the low byte. The lower five bits of the EEPROM
address of the low byte are ignored during an erase operation.
Rev. 0 | Page 33 of 56
1
2
3
4
5 6
RAM
SLAVE
W A ADDRESS A P
S
ADDRESS
(00h TO 7Fh)
05405-030
Table 7. EEPROM Page Layout
Page No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Figure 29. EEPROM Page Erase Peak IDD Current
Figure 30. Setting a RAM Address for Subsequent Read
ADM1041A
•
Write a single byte of data to EEPROM. In this case, the
command byte is the high byte of the EEPROM address,
80h or 81h. The first data byte is the low byte of the
EEPROM address and the second data byte is the actual
data. Bit 1 of EEPROM Register 3 must be set. This is
illustrated in Figure 33.
Write Byte/Word
1
In this operation, the master device sends a command byte and
one or two data bytes to the slave device, as follows:
1.
The master device asserts a start condition on SDA.
2.
The master sends the 7-bit slave address followed by the
write bit (low).
3.
The addressed slave device asserts ACK on SDA.
4.
The master sends a command code.
5.
The slave asserts ACK on SDA.
6.
The master sends a data byte.
7.
The slave asserts ACK on SDA.
8.
The master sends a data byte (or asserts stop at this point).
9.
The slave asserts ACK on SDA.
10. The master asserts a stop condition on SDA to end the
transaction.
In the ADM1041A, the write byte/word protocol is used for
the following three purposes. The ADM1041A knows how to
respond by the value of the command byte.
Write a single byte of data to RAM. Here, the command
byte is the RAM address from 00h to 7Fh and the (only)
data byte is the actual data, as shown in Figure 31.
2
3
4
5
RAM
SLAVE
W A ADDRESS A
S
ADDRESS
(00h TO 7Fh)
6
7 8
DATA
A P
Figure 31. Single-Byte Write to RAM
Set up a 2-byte EEPROM address for a subsequent read or
block read. In this case, the command byte is the high byte
of the EEPROM address (80h). The (only) data byte is the
low byte of the EEPROM address, as shown in Figure 32.
1
S
2
3
SLAVE
W A
ADDRESS
4
5
6
7 8
EEPROM
EEPROM
ADDRESS
ADDRESS
A
A P
HIGH BYTE
LOW BYTE
(80h OR 81h)
(00h TO FFh)
05405-032
•
4
5
6
8
9 10
DATA
A P
7
Figure 33. Single-Byte Write to EEPROM
If it is required to read data from the ADM1041A immediately
after setting up the address, the master can assert a repeat start
condition immediately after the final ACK and carry out a
single-byte read, block read, or block write operation without
asserting an intermediate stop condition.
Block Write
In this operation, the master device writes a block of data to a
slave device. Programming an EEPROM byte takes
approximately 350 μs, which limits the SMBus clock for
repeated or block write operations. The start address for a block
write must have been set previously. In the case of the
ADM1041A, this is done by a send byte operation to set a RAM
address or by a write byte/ word operation to set an EEPROM
address.
1.
The master device asserts a start condition on SDA.
2.
The master sends the 7-bit slave address followed by the
write bit (low).
3.
The addressed slave device asserts ACK on SDA.
4.
The master sends a command code that tells the slave
device to expect a block write. The ADM1041A command
code for a block read is A0h (10100000).
5.
The slave asserts ACK on SDA.
6.
The master sends a data byte that tells the slave device how
many data bytes are to be sent. The SMBus specification
allows a maximum of 32 data bytes to be sent in a block
write.
7.
The slave asserts ACK on SDA.
8.
The master sends N data bytes.
9.
The slave asserts ACK on SDA after each data byte.
10. The master asserts a stop condition on SDA to end the
transaction.
Figure 32. Setting an EEPROM Address
If it is required to read data from the EEPROM immediately after setting up the address, the master can assert a
repeat start condition immediately after the final ACK and
carry out a single-byte read or a block read without
asserting an intermediate stop condition.
1
S
2
3
4
5
6
7
8
9
10
COMMAND A0h
BYTE
SLAVE
W A
A
A DATA 1 A DATA 2 A DATA N A P
(BLOCK WRITE)
COUNT
ADDRESS
Rev. 0 | Page 34 of 56
Figure 34. Block Write to EEPROM or RAM
05405-034
1
3
EEPROM
EEPROM
ADDRESS
ADDRESS
SLAVE
W A
A
A
S
HIGH BYTE
LOW BYTE
ADDRESS
(80h OR 81h)
(00h TO FFh)
05405-031
•
2
05405-033
If it is required to read data from the RAM immediately after
setting up the address, the master can assert a repeat start
condition immediately after the final ACK and carry out a
single-byte read, block read, or block write operation without
asserting an intermediate stop condition.
ADM1041A
Block Read
In this operation, the master device reads a block of data from a
slave device. The start address for a block read must previously
have been set. In the case of the ADM1041A, this is done by a
send byte operation to set a RAM address or by a write
byte/word operation to set an EEPROM address. The block read
operation itself consists of a send byte operation that sends a
block read command to the slave, immediately followed by a
repeat start, and a read operation that reads out multiple data
bytes, as follows:
When performing a block write to EEPROM, the page that
contains the location to be written should not be writeprotected (Register 03h) prior to sending the above SMBus
packet. Block writes are limited to within a 32-byte page
boundary and cannot cross into the next page.
SMBus READ OPERATIONS
The ADM1041A uses the following SMBus read protocols.
Receive Byte
In this operation, the master device receives a single byte from a
slave device, as follows:
1.
The master device asserts a start condition on SDA.
The master device asserts a start condition on SDA.
2.
2.
The master sends the 7-bit slave address followed by the
read bit (high).
The master sends the 7-bit slave address followed by the
write bit (low).
3.
The addressed slave device asserts ACK on SDA.
3.
The addressed slave device asserts ACK on SDA.
4.
4.
The master receives a data byte.
The master sends a command code that tells the slave
device to expect a block read. The ADM1041A command
code for a block read is A1h (10100001).
5.
The master asserts NO ACK on SDA.
5.
The slave asserts ACK on SDA.
6.
The master asserts a stop condition on SDA and the
transaction ends.
6.
The master asserts a repeat start condition on SDA.
7.
In the ADM1041A, the receive byte protocol is used to read a
single byte of data from a RAM or EEPROM location whose
address has been set previously by a send byte or write byte/
word operation. This is illustrated in Figure 35.
The master sends the 7-bit slave address followed by the
read bit (high).
8.
The slave asserts ACK on SDA.
9.
The master receives a byte count data byte that tells it how
many data bytes are to be received. The SMBus
specification allows a maximum of 32 data bytes to be
received in a block read.
2
4
5 6
DATA
A P
3
SLAVE
S
R A
ADDRESS
10. The master asserts ACK on SDA.
Figure 35. Single-Byte Read from EEPROM or RAM
11. The master receives N data bytes.
12. The master asserts ACK on SDA after each data byte.
13. The slave does not acknowledge after the Nth data byte.
14. The master asserts a stop condition on SDA to end the
transaction.
1
2
3
4
5 6
7
8
9
10
11
12
13 14
COMMAND A1h
BYTE
SLAVE
SLAVE
S
W A
A S
A DATA 1 A DATA N A P
R A
(BLOCK READ)
COUNT
ADDRESS
ADDRESS
Figure 36. Block Read from EEPROM or RAM
Rev. 0 | Page 35 of 56
05405-036
1
05405-035
1.
ADM1041A
When using the SMBus interface, a write always consists of the
ADM1041A SMBus interface address byte, followed by the
internal address register byte, and then the data byte. There are
two cases for a read.
In the first case, if the internal address register is known to be at
the desired address, read the ADM1041A with the SMBus
interface address byte, followed by the data byte read from the
ADM1041A. The internal address pointer increments if a block
mode operation is in progress; data values of 0 are returned if
the register address limit of 7Fh is exceeded or if unused
registers in the address range 00h to 7Fh are accessed. If the
address register is pointing at EEPROM memory, that is 8000h,
and the address reaches its limit of 80FFh, it does not roll over
to Address 8100h on the next access.
Additional accesses do not increment the address pointer, all
reads return 00h, and all writes complete normally but do not
change any internal register or EEPROM location. If the address
register is pointing at EEPROM memory, that is 81xxh, and the
address reaches its limit of 813Fh, it does not roll over to
Address 8140h on the next access.
Additional accesses do not increment the address pointer, all
reads return 00h, and all writes complete normally but do not
change any internal register or EEPROM location. Note that for
byte reads, the internal address does not auto-increment.
In the second case, if the internal address register value is
unknown, write to the ADM1041A with the SMBus interface
address byte, followed by the internal address register byte.
Then restart the serial communication with a read consisting of
the SMBus interface address byte, followed by the data byte read
from the ADM1041A.
SMBus ALERT RESPONSE ADDRESS (ARA)
The ADM1041A CBD/ALERT pin can be configured to
respond to a variety of fault signals and can be used as an
interrupt to a microprocessor. The pins from several
ADM1041As may be wire-OR’ed. When the SMBus master
(microprocessor) detects an alert request, it normally needs to
read the alert status of each device to identify the source of the
alert.
If more than one device asserts an alert, all alerting devices try
to respond with their slave addresses, but an arbitration process
ensures that only the lowest slave address is received by the
master. If the slave device has its alert configured as latching, it
sends a command via the SMBus to clear the latch. The master
should then check if the alert line is still asserted, and, if so,
repeat the ARA call to service the next alert. Note that an
alerting slave does not respond to an ARA call unless it is
configured in SMBus mode (not AC_OKLink/PSONLINK) and
up_pson_m is set. The ADM1041A supports the SMBus (ARA)
function.
SUPPORT FOR SMBus 1.1
SMBus 1.1 optionally adds a CRC8 frame check sequence to
check if transmissions are received correctly. This is particularly
useful for long block read/write EEPROM operations, when the
SMBus is heavily loaded or in a noisy environment. The CRC8
frame can be used to guarantee reliability of the EEPROM.
LAYOUT CONSIDERATIONS
Noise coupling into the digital lines (greater than 150 mV),
overshoot greater than VCC, and undershoot less than GND
may prevent successful SMBus communication with the
ADM1041A. SMBus No Acknowledge is the most common
symptom, causing unnecessary traffic on the bus. Although the
SMBus maximum frequency of communication is rather low
(400 kHz max), care still needs to be taken to ensure proper
termination within a system with multiple parts on the bus and
long printed circuit board traces. A 5.1 kΩ resistor can be added
in series with the SDA and SCL lines to help filter noise and
ringing. Minimize noise coupling by keeping digital traces out
of switching power supply areas and ensure that digital lines
containing high speed data communications cross at right
angles to the SDA and SCL lines.
POWER-UP AUTO-CONFIGURATION
After power-up or reset, the ADM1041A automatically reads
the content of a 32-byte block of EEPROM memory that starts
at 8100h and transfers the contents into the appropriate trimlevel and control registers (00h to 1Bh). In this way, the
ADM1041A can be preconfigured with the desired operating
characteristics without the host system having to download the
data over the SMBus. This does not preclude the possibility of
modifying the configuration during normal operation.
Figure 37 shows a block diagram of the EEPROM download at
power-up or power-on reset.
The SMBus ARA provides an easier method to locate the source
of a such an alert. When the master receives an alert, it can send
a general call address (0001100) over the bus. The device asserting the alert responds by returning its own slave address to the
master.
RAM
CONFIGURATION
REGISTERS
EEPROM
POWER UP
Figure 37. EEPROM Download
Rev. 0 | Page 36 of 56
DIGITAL
TRIM
POTS
DIGITAL
TIMING
CONTROL
05405-037
Notes on SMBus Read Operations
The SMBus interface of the ADM1041A cannot load the
SMBUS if no power is applied to the ADM1041A. This
requirement allows a power supply to be disconnected from the
ac supply while still installed in a power subsystem.
ADM1041A
EXTENDED SMBus ADDRESSING
BACKDOOR ACCESS
It is possible to use more than three ADM1041As in a single
power supply. The first time the device is powered up, Bit 1 of
Configuration Register 1 (ADD1) is 0. This means that only
three device addresses are initially available as defined by
ADD0; if there are more than three devices in a system, two or
more of them have duplicate addresses. See Figure 38.
After SCL and SDA have been configured as AC_OKLink and
PSONLINK, it may be desired to recover the SMBus access to
the ADM1041A. Changes may be necessary to the internal
configuration or trim bits. This is achieved by holding the SCL
and SDA pins at 0 V (ground) while cycling VDD. SCL and SDA
then revert to SMBus operation. See Figure 38.
To overcome this, the ICT pin has additional functionality.
Taking ICT below GND temporarily disables the SMBus
function of the device. Thus, if the ICT pin of all devices in
which ADD1 is to remain 0 are taken negative, the ADD1 bits
of all other devices can be set to 1 via the SMBus. Each device
then has a unique address. Internal diodes clamp the negative
voltage to about 0.6 V, and care should be taken to limit the
current to less than approximately 5 mA on each ICT input to
prevent the possibility of damage or latch-up. The suggested
current is 3 mA. One example of a suitable circuit is given in
Figure 38. The ADM1041As can then be configured and
trimmed. If required, AC_OKLink and PSONLINK must be
configured last. If ICT is used for its intended purpose as a
current transformer input, care must be taken with the circuit
design to allow the extended SMBus addressing to work.
VDD
N/C 15 ADD0
ICT 8
AC_OKLink
SCL 13
PSONLINK
SDA 14
DEVICE 5
ICT 8
ADD1 = 1
SCL 13
VDD
15 ADD0
SDA 14
DEVICE 4
SDA/PSONLINK
ICT 8
The SDA pin normally carries data in and out of the
ADM1041A during programming/configuration or while
reading/writing by a microprocessor. If a microprocessor is not
used, this pin can be configured as PSONLINK and can be
connected to the same pin on other ADM1041As in the power
supply. If a fault is detected in any ADM1041A, causing it to
shut down, it uses this pin to signal the other ADM1041As to
also shut down. If an auto-restart has been configured, it also
causes all ADM1041As to turn on together.
SCL 13
15 ADD0
SDA 14
DEVICE 3
4kΩ
ICT 8
SCL 13
N/C 15 ADD0
SDA 14
2.4mA
SCL/AC_OKLink
DEVICE 2
The SCL pin normally provides a clock signal into the
ADM1041A during programming/configuration or while
reading/writing by a microprocessor. If a microprocessor is not
used, this pin can be configured as AC_OKLink, and can be
connected to the same pin on other ADM1041As in the power
supply. This allows a single ADM1041A to be used for ac
sensing and helps to synchronize the start-up of multiple
ADM1041As.
EXTENDED
SMBus
ADDRESSING
4kΩ
ICT 8
ADD1 = 0
–12V
SCL 13
VDD
15 ADD0
SDA 14
DEVICE 1
4kΩ
ICT 8
SCL 13
15 ADD0
SDA 14
BACKDOOR
Figure 38. Extended SMBus Addressing and Backdoor Access
Rev. 0 | Page 37 of 56
05405-038
DEVICE 0
ADM1041A
REGISTER LISTING
Table 8.
Register Address
00h/2Ah
Name
Status1/Status1 Mirror Latched
01h/2Bh
Status2/Status2 Mirror Latched
02h/2Ch
Status3/Status3 Mirror Latched
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
20h–29h
2Ah
Calibration Bits
Current Sense CC
Current Share Offset
Current Share Slope
EEPROM_lock
Load OV Fine
Local UVP Trim
Local OVP Trim
OTP Trim
ACSNS Trim
Config1
Config2
Config3
Config4
Config5
Config6
Config7
Current Sense Divider Error Trim
Current Sense Amplifer Offset Trim
Current Sense Options 1
Current Sense Options 2
UV Clamp Trim
Load VoltageTrim
Sel CBD/SMBAlert1
Sel CBD/SMBAlert2
Manufacturer’s ID
Revision Register
Reserved for Manufacturer
Status1 Mirror Latched
2Bh
Status2 Mirror Latched
2Ch
Status3 Mirror Latched
2Dh–2Eh
8000h–81FFh
Reserved for Manufacturer
EEPROM
Power-On Value
XXh—Depends on status of ADM1041A at
power-up.
XXh—Depends on status of ADM1041A at
power-up.
XXh—Depends on status of ADM1041A at
power-up.
From EEPROM Register 8103h
From EEPROM Register 8104h
From EEPROM Register 8105h
From EEPROM Register 8106h
From EEPROM Register 8107h
From EEPROM Register 8108h
From EEPROM Register 8109h
From EEPROM Register 810Ah
From EEPROM Register 810Bh
From EEPROM Register 810Ch
From EEPROM Register 810Dh
From EEPROM Register 810Eh
From EEPROM Register 810Fh
From EEPROM Register 8110h
From EEPROM Register 8111h
From EEPROM Register 8112h
From EEPROM Register 8113h
From EEPROM Register 8114h
From EEPROM Register 8115h
From EEPROM Register 8116h
From EEPROM Register 8117h
From EEPROM Register 8118h
From EEPROM Register 8119h
From EEPROM Register 811Ah
From EEPROM Register 811Bh
41h—Hardwired by manufacturer
Xh—Hardwired by Manufacturer
XXh—Depends on status of ADM1041A at
power-up.
XXh—Depends on status of ADM1041A at
power-up.
XXh—Depends on status of ADM1041A at
power-up.
Rev. 0 | Page 38 of 56
Factory EEPROM Value
00h
00h
00h
FEh
20h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
XXh – Factory Cal Value
XXh – Factory Cal Value
XXh – Factory Cal Value
XXh – Factory Cal Value
00h
00h
00h
00h
ADM1041A
DETAILED REGISTER DESCRIPTIONS
Table 9. Register 00h, Status1. Power-On Default XXh (refer to the logic schematic in Figure 24 and to Table 43.)
Bit No.
7
6
5
4
3
2
1
0
Name
OV Fault
UV Fault
OCP Timeout
Mon1 Flag
Mon2 Flag
Mon3 Flag
Mon4 Flag
Mon5 Flag
R/W
R
R
R
R
R
R
R
R
Description
1= Overvoltage fault has occurred.
1= Undervoltage fault has occurred.
1= Overcurrent has occured and timed out (ocpf is in the Status3 Register).
1= MON1 flag.
1= MON2 flag.
1= MON3 flag.
1= MON4 flag.
1= MON5 flag.
Table 10. Register 01h, Status2. Power-On Default XXh (refer to the logic schematic in Figure 24 and to Table 43.)
Bit No.
7
6
5
4
3
2
1
0
Name
Share_OK
OrFET_OK
REVERSE_OK
VDD_OK
GND_OK
Intref_OK
Extrefok_OK
VDDOV
R/W
R
R
R
R
R
R
R
R
Description
1= Current share is within limits.
1= OR’ing MOSFET is on.
1= Reverse OK—reverse voltage across the ORing MOSFET is within limits.
1= VDD is within limits.
1= Connection of GND pin is good.
1= Internal voltage reference is within limits.
1= External voltage reference is within limits.
1= VDD is above its OV threshold.
Table 11. Register 02h, Status3. Power-On Default XXh (refer to the logic schematic in Figure 24 and to Table 43.)
Bit No.
7
6
5
4
3
2
1
0
Name
m_acsns_r
m_pson_r
m_penok_r
m_psonok_r
m_DC_OK_r
ocpf
PULSE_OK
fault
R/W
R
R
R
R
R
R
R
R
Description
Reflects the status on ACSENSE1/ACSENSE2.
Reflects the status of PSON.
Reflects the status of PEN.
Status of PSONLINK.
Status of DC_OK.
1= An overcurrent has occured, direct from comparator.
1= Pulses are present at the PULSE pin.
1= Fault latch.
Table 12. Register 03h, Calibration Bits. Power-On Default from EEPROM Register 8103h During Power-Up
Bit No.
7–6
Name
Reverse Voltage Off Threshold
R/W
R/W
5–4
Reverse Voltage On Threshold
R/W
3
2
PEN_GATE
Gate Ramp
R/W
R/W
Description
Reverse Voltage Detector Turn-Off Threshold:
b7
b6
Function
0
0
100 mV
0
1
150 mV
1
0
200 mV
1
1
250 mV
Reverse Voltage Detector Turn On Threshold:
b5
b4
Function
0
0
20 mV
0
1
30 mV
1
0
40 mV
1
1
50 mV
Gate pen option. When set, PEN is gated by AC_OK.
Gate ramp option. When set, soft start is gated by AC_OK.
Rev. 0 | Page 39 of 56
ADM1041A
Bit No.
1–0
Name
Load OV Recover
R/W
R/W
Description
b1
b0
0
0
0
1
1
0
1
1
Function
Add 100 μs delay
Add 200 μs delay
Add 300 μs delay
Add 400 μs delay
Table 13. Register 04h, Current-Sense CC. Power-On Default from EEPROM Register 8104h During Power-Up
Bit No.
7–3
Name
Current-Limit Trim
R/W
R/W
2
1–0
Reserved
Share OK Threshold
R/W
R/W
Description
This register contains the current-sense trim level setting at which current limiting starts. Five
bits. Setting all bits to 1 results in maximum current limit (130%).
Don’t Care. This should be set to “0” for normal operation.
b1
b0
Function
0
0
±100 mV
0
1
±200 mV
1
0
±300 mV
1
1
±400 mV
Table 14. Register 05h, Current Share Offset. Power-On Default from EEPROM Register 8105h During Power-Up
Bit No.
7–0
Name
Current Share Offset
R/W
R/W
Description
This register contains the current-share offset trim level. Writing 00h corresponds to the
minimum offset. FFh corresponds to maximum offset. See the Current Limit Error Amplifier
section in the Table 1 for more information.
Table 15. Register 06h, Current Share Slope. Power-On Default from EEPROM Register 8106h During Power-Up
Bit No.
7–1
Name
Current Share Slope
R/W
R/W
0
Reserved
R/W
Description
This register contains current share slope trim level. Increasing this results in a steeper slope
for the current share. This register is normally written to during the user calibration. It is used
with Reg15h for trimming the current share.
Don’t Care.
Table 16. Register 07h, EEPROM_lock. Power-On Default from EEPROM Register 8107h During Power-Up
Bit No.
7
6
5
4
3
2
1
0
Name
Reserved
Lock6
Lock5
Lock4
Lock3
Lock2
Lock1
Lock0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Description
Don’t Care
Locks 8140h–817Fh
Locks 8120h–813Fh
Locks 8100h–811Fh
Locks 80C0h–80FFh
Locks 8080h–80BFh
Locks 8040h–807Fh
Locks 8000h–803Fh
Available FRU.
ADI cal registers, locked by manufacturer.
ADM1041A configuration boot registers.
Available FRU.
Available FRU.
Available FRU.
Available FRU.
Table 17. Register 08h, Load OV Fine. Power-On Default from EEPROM Register 8108h During Power-Up
Bit No.
7–0
Name
Load OV Trim
R/W
R/W
Description
Load OV Trim. This range is programmable from 105% to 120% of the nominal load voltage. 00h
corresponds to 105%. Each LSB results in an increase of 1.6 mV.
Table 18. Register 09h, Local UVP Trim. Power-On Default from EEPROM Register 8109h During Power-Up
Bit No.
7–0
Name
local_uvp
R/W
R/W
Description
This register contains the local undervoltage settings. This can be programmed from 1.3 V to
2.1 V when the nominal voltage is 2 V. Each LSB increases the UV clamp setting by 3.1 mV. See
the Local Overvoltage specifications in Table 1.
Rev. 0 | Page 40 of 56
ADM1041A
Table 19. Register 0Ah, Local OVP Trim. Power-On Default from EEPROM Register 810Ah During Power-Up
Bit No.
7–0
Name
Local OVP
R/W
R/W
Description
Local OVP Trim. This range is programmable so that the Local OVP flag can be set when 1.9 V to
2.85 V appears at the VLS pin when the nominal voltage is 2 V. Each LSB corresponds typically to
an increase of 3.7 mV. See the Local Overvoltage specifications in Table 1.
Table 20. Register 0Bh, OTP Trim. Power-On Default from EEPROM Register 810Bh During Power-Up
Bit No.
7–4
Name
OTP Trim
R/W
R/W
3–1
0
Reserved
Soft OTP
R/W
R/W
Description
OTP Threshold Trim. Each LSB corresponds typically to an increase of 27 mV. See the OTP
specifications in Table 1.
Don’t Care
Configure Soft OTP Option
0 = mon5 +ve ov = ov
1 = mon5 +ve ov = softotp
Table 21. Register 0Ch, ACSENSE Trim. Power-On Default from EEPROM Register 810Ch During Power-Up
Bit No.
7–3
2–0
Name
AC SENSE
Threshold
AC SENSE
Hysteresis
R/W
R/W
Description
ACSENSE Threshold Trim Settings. Each LSB corresponds to 14 mV increase in the AC SENSE
threshold. The range is 1.10 V to 1.45 V.
ACSENSE Hysteresis Trim Settings. Each LSB corresponds to 50 mV increase in the AC SENSE
hysteresis. The range is 200 V to 550 mV.
R/W
Table 22. Register 0Dh, Config1. Power-On Default from EEPROM Register 810Dh During Power-Up
Bit No.
7
Name
PS ON
R/W
R/W
6
5
4
Reserved
Reserved
Undervoltage Blanking
R/W
R/W
R/W
3–1
Mon 1 / ACSENSE 1
R/W
0
i2c_mb
R/W
Description
0 = Internal PSON.
1 = Support via SMBus. Selects PSON from config6 < 1 > = m_pson_w.
Don’t Care.
Don’t Care.
Undervoltage Blanking Mode.
1: Blanking-hold period starts from recovery of AC_OK.
0: Blanking-hold period starts following SCL = 0, while i2c_mb = 1.
b3
b2 b1 option
Mon1 Flag ov
uv
0
0
0
iopin = ACSNS1
(true = high)
0
0
1
iopin = ACSNS1
(true = high)
0
1
0
+ve ov
iopin < 1.15 V 0
0
0
iopin > 1.25 V 1
1
0
0
1
1
+ve uv
iopin < 1.25 V 0
0
1
iopin > 1.35 V 1
0
0
1
0
0
–ve ov
iopin < 1.25 V 0
1
0
iopin > 1.35 V 1
0
0
1
0
1
–ve uv
iopin < 1.15 V 0
0
0
iopin > 1.25 V 1
0
1
1
1
0
flag
iopin < 1.15 V 0
0
0
iopin > 1.25 V 1
0
0
1
1
1
flag
iopin < 1.15 V 1
0
0
iopin > 1.25 V 0
0
0
0 = Pins are configured as SDA/SCL (default).
1 = SCL pin is configured as AC_OKLink output.
SDA pin is configured as PSONLINK output.
Rev. 0 | Page 41 of 56
ADM1041A
Table 23. Register 0Eh, Config2. Power-On Default from EEPROM Register 810Eh During Power-Up
Bit No.
7–5
4–2
1–0
Name
MON 2 / ACSENSE2
MON 3 / PS ON
DC OK On Delay
R/W
R/W
R/W
R/W
Description
b7
0
0
0
b6
0
0
1
b5
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
b4
0
0
0
b3
0
0
1
b2
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
option
iopin = ACSENSE2
iopin = ACSENSE2
+ve ov
iopin < 1.15 V
iopin > 1.25 V
+ve uv
iopin < 1.25 V
iopin > 1.35 V
−ve ov
iopin < 1.25 V
iopin > 1.35 V
−ve uv
iopin < 1.15 V
iopin > 1.25 V
flag
iopin < 1.15 V
iopin > 1.25 V
flag
iopin > 1.25 V
iopin > 1.25 V
Ov
Mon2 Flag
(true = high)
(true = high)
0
0
1
1
0
0
1
0
0
1
1
0
0
0
1
0
0
0
1
0
1
0
0
0
uv
option
iopin = PSON
iopin = PSON
+ve ov
iopin < 1.15 V
iopin > 1.25 V
+ve uv
iopin < 1.25 V
iopin > 1.35 V
−ve ov
iopin < 1.25 V
iopin > 1.35 V
−ve uv
iopin < 1.15 V
iopin > 1.25 V
flag
iopin < 1.15 V
iopin > 1.25 V
flag
iopin < 1.15 V
iopin > 1.25 V
ov
Mon3 Flag
(true = low)
(true = high)
0
0
0
1
1
0
0
0
1
1
0
0
0
1
0
1
0
0
0
0
0
1
0
1
0
0
0
1
0
0
1
0
0
0
0
0
uv
DC_OKon_delay
b1
0
0
1
1
b0
0
1
0
1
option
400 ms
200 ms
800 ms
1600 ms
Rev. 0 | Page 42 of 56
0
0
1
0
0
0
0
1
0
0
0
0
ADM1041A
Table 24. Register 0Fh, Config3. Power-On Default from EEPROM Register 810Fh During Power-Up
Bit No.
7–5
4–2
1–0
Name
MON 4 / DC OK
MON 5 / AC OK
PS_ON TIME
R/W
R/W
Description
b7
b6
0
0
0
0
0
1
option
iopin = DC_OK
iopin = DC_OK
+ve ov
iopin < 1.15 V
iopin > 1.25 V
0
1
1
+ve uv
iopin < 1.25 V
iopin > 1.35 V
1
0
0
−ve ov
iopin < 1.25 V
iopin > 1.35 V
1
0
1
−ve uv
iopin < 1.15 V
iopin > 1.25 V
1
1
0
flag
iopin < 1.15 V
iopin > 1.25 V
1
1
1
flag
iopin < 1.15 V
iopin > 1.25 V
b4
b3
b2
option
0
0
0
iopin = AC_OK
0
0
1
iopin = AC_OK
0
1
0
+ve ov
iopin < vdac
iopin > vdac
0
1
1
+ve uv
iopin < vdac
iopin > vdac
1
0
0
−ve ov
iopin < vdac
iopin > vdac
1
0
1
−ve uv
iopin < vdac
iopin > vdac
1
1
0
flag
iopin < vdac
iopin > vdac
1
1
1
Reserved
PS_ON debounce time:
b1
b0
option
0
0
80 ms
1
0
0 ms (no debounce)
1
0
40 ms
1
1
160 ms
R/W
R/W
b5
0
1
0
Mon4 Flag
ov
uv
0
1
0
1
0
1
0
1
0
1
0
0
Mon5 Flag
0
1
0
0
1
0
0
0
0
0
0
0
ov
0
0
1
0
0
0
0
1
0
0
0
0
uv
0
1
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
0
1
0
1
0
0
0
0
0
1
0
0
Table 25. Register 10h, Config4. Power-On Default from EEPROM Register 8110h During Power-Up
Bit No.
7–6
Name
DC_OK Off Delay
R/W
R/W
5–4
Current SHARE Capture
R/W
Description
DC_OK off delay (power-off warn delay)
b7
b6
option
0
0
2 ms
0
1
0 ms
1
0
1 ms
1
1
4 ms
b5
b4
option
0
0
1%
0
1
2%
1
0
3%
1
1
4%
Rev. 0 | Page 43 of 56
ADM1041A
Bit No.
3–2
Name
Soft Start
R/W
R/W
1
0
Address
Trim Lock
R/W
R/W
Description
Soft-Start Step
b3
b2
Rise Time
0
0
300 μs
0
1
10 ms
1
0
20 ms
1
1
40 ms
EEPROM programmable second address bit.
When this bit is set, the trim registers including this register are not writable via SMBus. To
make registers writable again, the trim-lock bit in the EEPROM must first be erased and the
value downloaded using either power-up or test download.
Table 26. Register 11h, Config5. Power-On Default from EEPROM Register 8111h During Power-Up
Bit No.
7
6
5
4–3
2
1
0
Name
Current Limit Disable
PEN Polarity
CBD Polarity
Reserved
OCP Ridethrough
GND_OK Disable
CBD Latch Mode
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Description
Mask effect of OCP to general logic (status flag still gets asserted) when curr_lim_dis = 1.
Sets polarity of PEN output.
Sets polarity of CBD output.
Don’t Care.
Set this bit to 1 when OCP ridethrough is required. A small delay still exists. Refer to Reg 12h.
Disable GROUND_OK input to power management debounce logic.
Select CBD latch mode. 0 = nonlatching; 1 = latching.
Table 27. Register 12h, Config6. Power-On Default from EEPROM Register 8112h During Power-Up
Bit No.
7
Name
Restart Mode
R/W
R/W
6
Micro AC OK
R/W
5
Micro AC SENSE
R/W
4–3
OCP Ridethrough
R/W
2
AC Sense Mode
R/W
1
0
Micro PS_ON
Current Share Clamp
R/W
R/W
Description
Restart mode (rsm). When rsm = 1, the circuit attempts to restart the supply after an
undervoltage or overcurrent at about 1-second intervals.
Latch mode. When rsm = 0, UV and OC faults latch the output off. Cycling PSON or removing
the supply to the IC is then required to reset the latch and permit a restart.
Configure microprocessor to control/gate signal from AC_IN_OK to AC_S_OK. See Table 43.
0 = Standalone.
1 = Microprocessor support mode.
Microproccessor control of ACSENSE. See Table 43.
OCP ridethrough (Reg 11h[2] = 0)
OCP ridethrough (Reg11h[2] = 1)
b4
b3
Period
b4
b3
Period
0
0
1 second
0
0
128 μs
0
1
2 seconds
0
1
256 μs
1
0
3 seconds
1
0
384 μs
1
1
4 seconds
1
1
512 μs
ACSENSE mode. 0 means AC_OK is derived from ACSENSE1, whereas 1 means AC_OK is derived
from ACSENSE2.
Microprocessor control of pson. See Table 43.
0 = 75%. Set current share clamp release threshold.
1 = 88%.
Table 28. Register 13h, Config7. Power-On Default from EEPROM Register 8113h During Power-Up
Bit No.
7
6
5
4
Name
PEN Polarity
CBD Polarity
DC_OK Polarity
AC_OK Polarity
R/W
R/W
R/W
R/W
R/W
Description
Sets polarity of PEN output.
Sets polarity of CBD output.
Sets polarity of DC_OK output.
Sets polarity of AC_OK output.
Rev. 0 | Page 44 of 56
ADM1041A
Bit No.
3
Name
FG Polarity
R/W
R/W
2
Micro Share Clamp
R/W
1
Micro CBD Write
R/W
0
Micro CBD Clear
R/W
Description
Sets polarity of OrFET gate control (FG pin): 0 = inverted (low = on); 1 = normal (low =
off).
Allow the microprocessor to directly control the share clamp. 0 = normal share clamp
operation, that is, not clamped; 1 = assert share clamp, that is, clamped. See Table 43.
Allow the microprocessor to write directly to CBD as a possible way of adding an
additional port. This might be a blinking LED or a fail signal to the system. See Table 43.
Microprocessor clear of CBD latch (if configured as latching) folowing an SMBAlert.
See Table 43.
Table 29. Register 14h, Current-Sense Divider Error Trim 1. Power-On Default from EEPROM Register 8114h During Power-Up
Bit No.
7–0
Name
Current Sense Offset Trim
R/W
R/W
Description
Trim-out offset due to external resistor divider tolerances (for common-mode
correction). This register is normally written to during the user calibration.
Table 30. Register 15h, Current Sense Amp Offset Trim 2. Power-On Default from EEPROM Register 8115h During Power-Up
Bit No.
7–0
Name
Current Sense DC offset Trim
R/W
R/W
Description
Trim-out current sense amplifier offset (dc offset correction). Increasing this results in
more offset for the current sense. This register is normally written to during the user
calibration. It is used with Reg06H.
Table 31. Register 16h, Current-Sense Options 1. Power-On Default from EEPROM Register 8116h During Power-Up
Bit No.
7–6
Name
Reserved
R/W
R/W
Description
Don’t Care
5–3
Divider Trim
R/W
2–0
Current-Sense Gain
R/W
External Divider Tolerance Trim Range (Common-Mode Trim Range).
b5
b4
b3
Range
External Resistor Tolerance
0
0
0
−5 mV
−0.25%
0
0
1
−10 mV
−0.50%
0
1
0
−20 mV
−1.00%
1
0
0
+5 mV
+0.25%
1
0
1
+10 mV
+0.50%
1
1
0
+20 mV
+1.00%
Gain Selector
b2
b1
b0
Gain
Range
0
0
0
65x
34.0 mV to 44.5 mV
0
0
1
85x
26.0 mV to 34.0 mV
0
1
0
110x
20.0 mV to 26.0 mV
1
0
0
135x
16.0 mV to 20.0 mV
1
0
1
175x
12.0 mV to 16.0 mV
1
1
0
230x
9.5 mV to 12.0 mV
Rev. 0 | Page 45 of 56
ADM1041A
Table 32. Register 17h, Current-Sense Option 2. Power-On Default from EEPROM Register 8117h During Power-Up
Bit No.
7
Name
Current Sense Mode
R/W
R/W
6
Chopper Enable
R/W
5
CT Range
R/W
4
Ground Offset
R/W
3
Reserved
R/W
2–0
Diff Sense Trim
R/W
Description
0 = Current sense with external resistor.
1 = Current transformer.
When chopper = 1, current-sense amplifier is configured as a chopper amplifier.
Otherwise, current-sense amplifier is continuous time amplifier.
Gain
Range
0 = 4.5
0.45 V–0.68 V
1 = 2.57
0.79 V–1.20 V
0: ground offset = 100 mV; ISHARE error amp, offset = 50 mV.
1: ground offset = 0; ISHARE error amp offset = 0.
Don’t Care.
Internal Sense Amp Offset Trim Range for Differential Current Sense
b2
b1
b0
Range
0
0
0
−8 mV
0
0
1
−15 mV
0
1
0
−30 mV
1
0
0
+8 mV
1
0
1
+15 mV
1
1
0
+30 mV
Gain
−1
−2
−4
+1
+2
+4
Table 33. Register 18h, UV Clamp Trim. Power-On Default from EEPROM Register 8118h During Power-Up
Bit No.
Name
R/W
Description
7–0
False UV Clamp
R/W
This register contains the false UV clamp settings. This can be programmed from 1.3 V to 2.1 V
when the nominal voltage is 2 V. Each LSB increases the UV Clamp setting by 3.1 mV.
Table 34. Register 19h, Load Voltage Trim. Power-On Default from EEPROM Register 8119h During Power-Up
Bit No.
7–0
Name
Load Voltage Trim
R/W
R/W
Description
This register contains the load voltage trim settings and is normally written to during the user
to set the output voltage.
Table 35. Register 1Ah, Sel CBD/SMBAlert1. Power-On Default From EEPROM Register 811Ah During Power-Up
Bit No.
Name
R/W
7
6
5
4
3
2
1
0
selcbd1 <7>
selcbd1 <6>
selcbd1 <5>
selcbd1 <4>
selcbd1 <3>
selcbd1 <2>
selcbd1 <1>
Selcbd1 <0>
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Description
This register allows the user to set the CBD/Alert pin when certain flag conditions occur. These
bits are set up in an OR function so that any one flag can set the CBD/Alert pin. This register is
used with Register 1Bh.
Overvoltage Fault
uvfault
OCP Timeout (ridethrough timed out, ocpf flag)
acsnsb (inverted)
ocpf
otp (MON5 OV)
orfetokb (inverted)
Share_OKb (inverted)
Rev. 0 | Page 46 of 56
ADM1041A
Table 36. Register 1Bh, Sel CBD/SMBAlert2. Power-On Default from EEPROM Register 811Bh During Power-Up
Bit No.
Name
R/W
7
6
5
4
3
2
1
0
selcbd2 <7>
selcbd2 <6>
selcbd2 <5>
selcbd2 <4>
selcbd2 <3>
selcbd2 <2>
selcbd2 <1>
selcbd2 <0>
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Description
This register allows the user to set the CBD/Alert pin when certain flag conditions occur. These
bits are set up in an OR function so that any one flag can set the CBD/Alert pin. This register is
used with Register 1Ah.
VDDOK b (inverted)
MON 1 flag
MON 2 flag
MON 3 flag
MON 4 flag
Micro CBD write. Microprocessor control of CBD
Mon5 flag
Not used.
Table 37. Register 1Ch, Manufacturer’s ID. Power-On Default 41h.
Bit No.
7–0
Name
Manufacturer’s ID
Code
R/W
R
Description
This register contains the manufacturer’s ID code for the device. It is used by the manufacturer
for test purposes and should not be read from or written to in normal operation.
Table 38. Register 1Dh, Revision Register. Power-On Default 01h.
Bit No.
7–4
3–0
Name
Major Revision Code
Minor Revision Code
R/W
R
R
Description
These 4 bits denote the generation of the device.
These 4 bits contain the manufacturer’s code for minor revisions to the device: Rev 0 = 0h,
Rev 1 = 1h, and so on.
This register is used by the manufacturer for test purposes. It should not be read from or
written to in normal operation.
Table 39. Register 2Ah, Status1 Mirror Latched. Power-On Default 00h.
These flags are cleared by a register read, provided the fault no longer persists. See also Table 43. Note that latched bits are clocked on a
low-to-high transmission only. Also note that these register bits are cleared when read via the SMBus, except if the fault is still present. It
is recommended to read the register again after the faults disappear to ensure reset.
Bit No.
7
6
5
4
3
2
1
0
Name
OV Fault Latch
UV Fault Latch
OCP Timeout Latch
Mon1 Flag Latch
Mon2 Flag Latch
Mon3 Flag Latch
Mon4 Flag Latch
Mon5 Flag Latch
R/W
R
R
R
R
R
R
R
R
Description
Overvoltage fault has occurred.
Undervoltage fault has occurred.
Overcurrent has occured and timed out (ocpf is in Status3 register).
MON1 flag.
MON2 flag.
MON3 flag.
MON4 flag.
MON5 flag.
Rev. 0 | Page 47 of 56
ADM1041A
Table 40. Register 2Bh, Status2 Mirror Latched. Power-On Default 00h.
These flags are cleared by a register read, provided the fault no longer persists. See also Table 43. Note that latched bits are clocked on a
low-to-high transmission only. Also note that these register bits are cleared when read via the SMBus, except if the fault is still present. It
is recommended to read the register again after faults disappear to ensure reset.
Bit No.
7
6
5
4
3
2
1
0
Name
Share_OK Latch
OrFET OK Latch
Reverse OK Latch
VDDOK Latch
GND OK Latch
intrefok Latch
extrefok Latch
VDDOV Latch
R/W
R
R
R
R
R
R
R
R
Description
Share_OK fault
ORFET fault
Reverse_OK fault
VDD OK fault
GND_OK fault
Internal reference fault
External reference fault
VDD OK fault
Table 41. Register 2Ch, Status3 Mirror Latched. Power-On Default 00h
These flags are cleared by a register read, provided the fault no longer persists. See also Table 43. Note that latched bits are clocked on a
low-to-high transmission only. Also note that these register bits are cleared when read via the SMBus, except if the fault is still present. It
is recommended to read the register again after the faults disappear to ensure reset.
Bit No.
7
6
5
4
3
2
1
0
Name
m_acsns_r Latch
m_pson_r Latch
m_penok_r Latch
m_psonok_r Latch
m_DC_OK_r Latch
OCP Latch
PULSE_OK Latch
Fault
R/W
R
R
R
R
R
R
R
R
Description
AC_OK fault
PSON fault
PEN fault
PSONLINK fault
DC_OK fault
OCP fault
Pulse fault
Fault latch
MANUFACTURING DATA
Table 42.
Register
Register 81F0h
Register 81F1h
Register 81F2h
Register 81F3h
Register 81F4h
Register 81F5h
Register 81F6h
Register 81F7h
Register 81F8h
Register 81F9h
Register 81FAh
Register 81FBh
Register 81FCh
Register 81FDh
Register 81FEh
Register 81FFh
Description
PROBE1_BIN
PROBE2_BIN
FT_BIN
PROBE1_CHKSUM
PROBE2_CHKSUM
FT_CHKSUM
QUAL_PART_ID
Probe 1 cell current data (integer)
Probe 1 cell current data (two decimal places)
Probe 2 cell current data (integer)
Probe 2 cell current data (two decimal places)
Final test cell current data (integer)
Final test cell current data (two decimal places)
Probe X coordinate
Probe Y coordinate
Wafer number
Rev. 0 | Page 48 of 56
ADM1041A
MICROPROCESSOR SUPPORT
Possible ways to turn the ADM1041A on or off in response to a system request or a fault include the following:
•
Daisy-chaining other ADM1041A PSON pins to the PEN pin, which is controlled by PSON on one ADM1041A.
•
Use a microprocessor to control the PSON, the system interface, and any shutdowns due to faults.
•
Connect all AC_OKLink pins together and connect all PSONLINK pins together. These pins must be configured appropriately.
Flags appended with _L are latched (Registers 2Ah/2Bh/2Ch). The latch is reset when the flag is read, except when the fault is still present.
It is advisable to continue reading the flag(s) until the fault(s) have cleared.
Table 43.
Mnemonic
m_pson_r
Micro PS_ON
m_acsns_r
Micro AC SENSE
Micro Share Clamp
Micro CBD Write
Micro CBD Clear
Mon5 Flag
Mon4 Flag
Mon3 Flag
Mon2 Flag
Mon1 Flag
OCP Timeout
UV Fault
OV Fault
Description
Allows the microprocessor to read the state of PSON. This allows only one
ADM1041A to be configured as the PSON interface to the host system.
Allows the microprocessor to write to control the PSON function of each
ADM1041A. When in microprocessor support mode, the principle
configuration for controlling power-on/power-off is as follows. One
ADM1041A is configured as the interface to the host system through the
standard PSON pin. This pin is configured not to write through to the PSON
debounce block. The microprocessor polls the status of this ADM1041A by
reading m_pson_r. Debouncing is done by the microprocessor. If m_pson_r
changed state, the microprocessor writes the new state to m_pson_w in all
ADM1041As on the SMBus. If a fault occurs on any output, the SMBAlert
interrupt requests microprocessor attention. If this means turning all
ADM1041As off, this is done by writing a zero to the m_pson_w bit.
Allows the microprocessor to read the state of ACSENSE1/ACSENSE2. This allows
one ADM1041A to be configured as the interface to the host power supply.
Allows the microprocessor to write to control the ACSENSE function of each
ADM1041A. When in microprocessor support mode the principle configuration
for controlling AC_OK, undervoltage blanking, PEN gating, and RAMP/SS
gating is as follows. One ADM1041A is configured to be the interface with the
host power supply AC monitoring circuitry. This ADM1041A can be configured
so that the acsns signal is written through or would not be written through.
Regardless, the microprocessor monitors m_acsns_r and write to m_acsns_w
as appropriate. Because it is possible to sense but not to write through, it is
possible to configure a second ADM1041A to monitor a second ac or bulk
voltage.
Allows the μP to write directly to m_shr_clmp to control when the ISHARE
clamp is released. During a hot-swap insertion, there may be a need to delay
the release of the ISHARE clamp. This allows the designer an option over the
default release at 75% or 88% of the reference ramp (soft start).
Allows the microprocessor to write directly to CBD as a possible way of adding
an additional output port. This might be for blinking LEDs or as a fault signal to
the system.
Allows the microprocessor to clear the CBD latch following an SMBalert. If CBD
is configured to be latching, there may be circumstances that lead to
CBD/SMBAlert being set by, for example, one of the MON flags, but does not
lead to PSON being cycled and CBD being reset. In this case, the
microprocessor needs to write directly to CBD to reset the latch.
This flag indicates the status of the MON5 pin.
This flag indicates the status of the MON4 pin.
This flag indicates the status of the MON3 pin.
This flag indicates the status of the MON2 pin.
This flag indicates the status of the MON1 pin.
If this flag is high, an overcurrent has occurred and timed out.
If this flag is high, an undervoltage has been sensed
If this flag is high, an overvoltage has been sensed.
Rev. 0 | Page 49 of 56
Register
02h
Bit
6
Read/Write
Read-only
12h
1
Read/Write
02h
7
Read-only
12h
5
Read/Write
13h
2
Read/Write
13h
1
Read/Write
13h
0
Read/Write
00h
00h
00h
00h
00h
00h
00h
00h
0
1
2
3
4
5
6
7
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
ADM1041A
Mnemonic
VDDOV
Extrefok_OK
Intrefok_OK
GND_OK
VDD_OK
REVERSE_OK
OrFET_OK
Share_OK
Fault
PULSE_OK
ocpf
m_DC_OK_r
m_psonok_r
m_penok_r
m_pson_r
m_acsns_r
Mon5 Flag Latch
Mon4 Flag Latch
Mon3 Flag Latch
Mon2 Flag Latch
Mon1 Flag Latch
OCP Timeout Latch
UV Fault Latch
OV Fault Latch
VDDOV Latch
extrefok Latch
intrefok Latch
GND OK Latch
VDDOK Latch
Reverse OK Latch
OrFET OK Latch
Share_OK Latch
Fault
PULSE_OK Latch
OCP Latch
m_DC_OK_r Latch
m_psonok_r Latch
m_penok_r Latch
m_pson_r Latch
m_acsns_r Latch
Description
If this flag is high, a VDD overvoltage has been sensed.
If this flag is low, the externally available reference on Pin 18 is overloaded.
If this flag is low, the internal reference has no integrity.
If this flag is low, ground (Pin 7) is open (either pin to PCB or pin to bond wires).
If this flag is low, VDD is below its UVL or the power mangement block has a
problem, a reference voltage, a ground fault, or a VDD overvoltage fault.
If this flag is low, the OrFET has an excessive reverse voltage.
If this flag is low, either PULSE_OK, penok, loadvok, or reverseok is false.
If this flag is low, the current-share accuracy is out of limits.
Fault latch. If this flag is high, either an ovfault, uvfault, or ocp has occured.
Pulses are present at ACSENSE 1.
If this flag is high, an overcurrent has been sensed and the ocp timer has
started.
This flag indicates the status of the DC_OK pin.
This flag indicates the status of the PSONLINK pin.
This flag indicates the status of the PEN pin.
This flag indicates the status of the PSON pin.
This flag indicates the status of the ACSENSE1/ACSENSE2 pin.
Latched status of MON5 flag.
Latched status of MON4 flag.
Latched status of MON3 flag.
Latched status of MON2 flag.
Latched status of MON1 flag.
Latched OCP timeout.
Latched uvfault.
Latched ovfault.
Latched vddov fault.
Latched extref fault.
Latched intref fault.
Latched gnd fault.
Latched VDD fault.
Latched reverse voltage fault.
Latched orfet fault.
Latched share fault.
Latched fault.
Latched pulse fault.
Latched ocpf fault.
Latched DC_OK fault.
Latched PSONLINKfault.
Latched PEN fault.
Latched PSON fault.
Latched ACSENSE fault.
Rev. 0 | Page 50 of 56
Register
01h
01h
01h
01h
01h
Bit
0
1
2
3
4
Read/Write
Read only
Read-only
Read-only
Read-only
Read-only
01h
01h
01h
02h
02h
02h
5
6
7
0
1
2
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
02h
02h
02h
02h
02h
2Ah
2Ah
2Ah
2Ah
2Ah
2Ah
2Ah
2Ah
2Bh
2Bh
2Bh
2Bh
2Bh
2Bh
2Bh
2Bh
2Ch
2Ch
2Ch
2Ch
2Ch
2Ch
2Ch
2Ch
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
Read-only
ADM1041A
TEST NAME TABLE
This table is an ADI internal reference. It is a cross reference for the ADI test program.
Table 44.
Specification
Supplies
VDD
IDD, Current Consumption
Peak IDD, during EEPROM Erase Cycle
UNDERVOLTAGE LOCKOUT, VDD
Start-Up Threshold
Stop Threshold
Hysteresis
POWER BLOCK PROTECTION
VDD Overvoltage
VDD Overvoltage Debounce
Open Ground
Debounce
POWER-ON RESET
DC Level
DIFFERENTIAL LOAD VOLTAGE SENSE I
VS− Input Voltage
VS+ Input Voltage
VS− Input Resistance
VS+ Input Resistance
VNOM Adjustment Range
Set Load Voltage Trim Step
Minimum Set Load Overvoltage Trim
Range
Set Load Overvoltage Trim Step
Recover Load OV False to FG True
Time from Load OV to FG False
LOCAL VOLTAGE SENSE, VLS, AND
FALSE UNDERVOLTAGE CLAMP
Input Voltage Range
Stage Gain
False UV Clamp, VLS Input Voltage
Nominal, and Trim Range
Clamp Trim Step
LOCAL OVERVOLTAGE
Nominal and Trim Range
OV Trim Step
OV Trim Step
Noise Filter, for OVP Function Only
LOCAL UNDERVOLTAGE
UV Trim Step
UV Trim Step
Noise Filter, for UVP Function Only
VOLTAGE ERROR AMPLIFIER
Reference Voltage
Temperature Coefficient
Long-Term Voltage Stability
Soft-Start Period Range
Test Name
VDD
IDD
VDD (ON)
VDD (OFF)
VDDHYS
VOVP
TDFILTER
VGND
TDEBOUNCE
VPOR
VDVCM
VDVIN_MAX
VDVINRN
VDVINRP
VDVADJ
VDVTRIM
VDVLOV
VLOVTRIM
TLOADOV_FALSE
TLOADOV_TRUE
VLS_RANGE
ACLAMP
VCLMPTRIM
VCLMPSTEP
VLSOV
VLSOVSTEP
VLSOVSTEP
TNFOVP
VLSUV
VLSUVSTEP
VLSUVSTEP
TNFUVP
VCMP
VREF_VCMP
TCV
VSTAB
TSSRANGE
Specification
VOLTAGE ERROR AMPLIFIER (CONT.)
Set Soft-Start Period
Unity Gain Bandwidth
Transconductance
Source Current
Sink Current
DIFFERENTIAL CURRENT-SENSE INPUT,
Cs – Cs+
Common-Mode Range,
External Divider Tolerance Trim
Range (with respect to input)
External Divider Tolerance Trim Step
DC Offset Trim Range (os_dc_range)
DC Offset Trim Step Size
Total Offset Temperature Drift
Gain Range (Isense_range)
Gain Setting 1 (16h, B2–0 = 000)
Gain Setting 2 (16h, B2–0 = 001)
Gain Setting 3 (16h, B2–0 = 010)
Gain Setting 4 (16h, B2–0 = 100)
Gain Setting 5 (16h, B2–0 = 101)
Gain Setting 6 (16h, B2–0 = 110)
CURRENT-SENSE CALIBRATION
Full Scale (No Offset)
Current Share Trim Step (At SHRO),
Cal. Accuracy, 20 mV at CS+, CS−
Cal. Accuracy, 40 mV at CS+, CS–
Cal. Accuracy, 40 mV at CS+, CS−
SHARE BUS OFFSET
Current Share Offset Range
Zero Current Offset Trim Step
CURRENT TRANSFORMER SENSE INPUT
Gain Setting 0
Gain Setting 1
CT Input Sensitivity (Gain Set 0)
CT Input Sensitivity (Gain Set 1)
Input Impedance
Source Current
Source Current Step Size
Reverse Current for Extended SMBus
CURRENT-LIMIT ERROR AMPLIFIER
Current Limit Trim Range
Current Limit Trim Step
Current Limit Trim Step
Transconductance
Output Source Current
Output Sink Current
Rev. 0 | Page 51 of 56
Test Name
TSS
GBW
G mVCMP
ISOURCE_VCMP
ISINK_VCMP
VCM_RANGE
VOS_DIV_RANGE
VOS_DIV_STEP
VOS_DC_RANGE
VOS_DC_STEP
TDRIFT
Isense_range
G65X
G85X
G110X
G135X
G175X
G230X
VSHR
VSHRSTEP
TolCSHR
TolCSHR
TolCSHR
VZO
VZOSTEP
ICT
GCT_X4
GCT_X2
VCT_X4
VCT_X2
RIN_CT
ISOURCE_CT
ISTEP_CT
IREV
CLIM
CLIMSTEP
CLIMSTEP
GmCCMP
ISOURCE_CCMP
ISINK_CCMP
ADM1041A
Specification
CURRENT-SHARE DRIVER
Output Voltage
Short-Circuit Source Current
Source Current
Sink Current
I SHARE DIFFERENTIAL SENSE
Input Impedance
Gain
CURRENT-SHARE ERROR AMPLIFIER
Transconductance, SHRS to SCM
Output Source Current
Output Sink Current
Input Offset Voltage
Share OK Window Comp Threshold
CURRENT LIMIT
Lower Threshold
Upper Threshold
CURRENT-SHARE CAPTURE
Current Share Capture Range
Capture Threshold
FET OR GATE DRIVE
Output Low Level (On)
Output Leakage Current
REVERSE VOLTAGE COMPARATOR
Input Impedance
Reverse Turn-Off Threshold
Reverse Turn-On Threshold
ACSENSE1/ACSENSE2 COMPARATOR
Threshold Voltage
Threshold Adjust Range
Threshold Trim Step
Hysteresis Voltage
Hysteresis Adjust Range
Hysteresis Trim Step
Noise Filter
PULSE-IN
Threshold Voltage
Pulseok on delay
Pulseok off delay
OCP
OCP Threshold Voltage
OCP Shutdown Delay Time
OCP Fast Shutdown Delay Time
Test Name
VSHRO_1K
ISHRO_SHORT
ISHRO_SOURCE
ISHRO_SINK
RIN_SHR_DIFF
GSHR_DIFF
GmSCMP
ISOURCE_SCMP
ISINK_SCMP
VIN_SHR_OFF
VSHR_THRES
VCLIM_THRES_MIN
VCLIM_THRES_MAX
SHRCAPT_RANGE
VSHR_CAPT_THRES
VLO_FET
IOL_FET
RFS, RFD
VRVD_THRES_OFF
VRVD_THRES_ON
VSNSADJ_THRES
VSNSADJ_RANGE
VSNSADJ_STEP
VSNSHST
VSNSHYS_RANGE
VSNSHYS_STEP
TNFSNS
VPULSEMIN
TPULSEON
TPULSEOFF
VOCP_THRES
TOCP_SLOW
TOCP_FAST
Specification
MON1, MON2, MON3, MON4
Sense Voltage
Hysteresis
OVP Noise Filter
UVP Noise Filter
OTP (MON5)
Sense Voltage Range
OTP Trim Step
Hysteresis
OVP Noise Filter
UVP Noise Filter
PSON
Input Low Level
Input High Level
Debounce
PEN, DC_OK, CBD, AC_OK
Open-Drain N-Channel Option
Output Low Level = On
Open-Drain P-Channel Option?
Output High Level = On
Leakage Current
DC_OK, Off Delay
SMBus, SDL/SCL
Input Voltage Low
Input Voltage High
Output Voltage Low
Pull-Up Current
Leakage Current
SERIAL BUS TIMING
Clock Frequency
Glitch Immunity
Bus Free Time
Start Setup Time
Start Hold Time
SCL Low Time
SCL Low Time
SCL High Time
SCL, SDA Rise Time
SCL, SDA Fall Time
Data Setup Time
Data Hold Time
Rev. 0 | Page 52 of 56
Test Name
VMON1
VMON1_HST
TNFOVP_MON1
TNFUVP_MON1
VOTP_RANGE
VOTP_STEP
IOTP_HST
TNFOVP_OTP
TNFUVP_OTP
VIL_PSON
VIH_PSON
TNF_PSON
VOL_PEN
VOH_PEN
IOH_PEN
TDCOK_OFF
VIL
VIH
VOL
IPULLUP
ILEAK
fSCLK
tSW
tBUF
tSU;STA
tHD;STA
tLOW
tLOW
tHIGH
tr
tf
tSU;DAT
tHD;DAT
ADM1041A
OUTLINE DIMENSIONS
0.341
BSC
24
13
0.154
BSC
1
0.236
BSC
12
PIN 1
0.069
0.053
0.065
0.049
0.010
0.004
0.025
BSC
COPLANARITY
0.004
0.012
0.008
SEATING
PLANE
0.010
0.006
8°
0°
0.050
0.016
COMPLIANT TO JEDEC STANDARDS MO-137AE
Figure 39. 24-Lead Shrink Small Outline Package [QSOP]
(RQ-24)
Dimensions shown in inches
ORDERING GUIDE
Model
ADM1041AARQZ 1
ADM1041AARQZ-REEL1
ADM1041AARQZ-REEL71
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
24-Lead QSOP
24-Lead QSOP
24-Lead QSOP
Z = Pb-free part
Rev. 0 | Page 53 of 56
Package Option
RQ-24
RQ-24
RQ-24
ADM1041A
NOTES
Rev. 0 | Page 54 of 56
ADM1041A
NOTES
Rev. 0 | Page 55 of 56
ADM1041A
NOTES
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent
Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05405–0–7/05(0)
Rev. 0 | Page 56 of 56