十 速 科 技 tenx technology TM8713 4 Bit Microcontroller GENERAL DESCRIPTION The TM8713 is an embedded high-performance 4-bit microcomputer with LCD/LED driver. It contains all the necessary functions, such as 4-bit parallel processing ALU, ROM, RAM, I/O ports, timer, clock generator, dual clock operation, EL panel driver, LCD driver, look-up table, watchdog timer and key matrix scanning circuitry in a signal chip. FEATURES 1. Low power dissipation. 2. Powerful instruction set (135 instructions). Binary addition, subtraction, BCD adjust, logical operation in direct and index addressing mode. Single bit manipulation (set, reset, decision for branch). Various conditional branch. 16 working registers and manipulation. Table look-up. LCD driver data transfer. 3. LCD/LED driver output. 5 common outputs and 27 segment outputs (up to drive 135 LCD/LED segments). 1/2 Duty, 1/3 Duty, 1/4 Duty or 1/5 Duty for both LCD/LED drivers is selected by MASK option. 1/2 Bias or 1/3 Bias for LCD driver is selected by MASK option. Single instruction to turn off all segments. Segment outputs(SEG1~12,21~35) could be defined as CMOS or P_open drain type output by mask option. 4. Memory capacity. ROM capacity RAM capacity 1536 96 x 16 bits. x 4 bits. 5. Input/output ports. Port IOA 4 pins (with internal pull-low), muxed with SEG24~27. Port IOB 4 pins (with internal pull-low), muxed with SEG28~31. Port IOC 4 pins (with internal pull-low / low-level-hold), muxed with SEG32 ~ SEG35. IOC port had built-in input signal chattering prevention circuitry. 6. 8 level subroutine nesting. 7. Interrupt function. External factors Internal factors 3 2 (INT pin, Port IOC & KI input). (Pre-Divider, Timer1). 8. Built-in EL panel driver. tenx technology, inc. Rev.1.4 2001/9/4 TM8713 ELC, ELP (Muxed with SEG28, SEG29). 9. Built in Alarm, clock or single tone melody generator. BZB, BZ (Muxed with SEG30, SEG31). 10. Built in key matrix scanning function. K1~K12 (Shared with SEG1~SEG12). KI1~KI4 (Muxed with SEG32~SEG35). 11. One 6-bit programmable timer with programmable clock source. 12. Watch dog timer. 13. Built-in Voltage doubler, halver, tripler charge pump circuit. 14. Dual clock operation. slow clock oscillation can be defined as X’tal or external RC type oscillator by mask option. fast clock oscillation can be defined as internal R or external R type oscillator by mask option. 15. HALT function. 16. STOP function. BLOCK DIAGRAM B1-4 ELC,ELP BZ,BZB B-PORT EL DRIVER ALARM A1-4 A-PORT C1-4 KI1~KI4 SEG1-12,21-35 K1~K12 COM1-5 VDD1-3 LCD DRIVER C-PORT KEY-IN SEGMENT PLA 4 BITS DATA BUS FREQUENCY GENERATOR TABLE ROM 256(12-N) X 8 BITS ALU DATA RAM 96 X 4 BITS PRE-DIVIDER 6 BITS PRESET TIMER 1 8 LEVELS STACK INSTRUCTION DECODER OSCILLATOR CONTROL CIRCUIT 11 BITS PROGRAM COUNTER PROGRAM ROM 128N X 16 BITS CUP1,2 XTIN,OUT RESET N:1->12 INT 2 tenx technology, inc. Rev.1.4 2001/9/4 TM8713 PAD DIAGRAM 1 44 32 12 19 21 The substrate of chip should be connected to GND. PAD COORDINATE No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Name BAK XIN XOUT GND VDD1 VDD2 VDD3 CUP1 CUP2 COM1 COM2 COM3 COM4 COM5 SEG1(K1) SEG2(K2) SEG3(K3) SEG4(K4) SEG5(K5) SEG6(K6) SEG7(K7) SEG8(K8) X 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 207.50 322.50 437.50 552.50 667.50 782.50 1366.80 1481.80 1602.50 1602.50 Y 1399.10 1269.10 1154.10 1039.10 924.10 809.10 694.10 579.10 464.10 349.10 224.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 224.50 No 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 3 Name SEG9(K9) SEG10(K10) SEG11(K11) SEG12(K12) SEG21 SEG22 SEG23 SEG24/IOA1 SEG25/IOA2 SEG26/IOA3 SEG27/IOA4 SEG28/IOB1/ELC SEG29/IOB2/ELP SEG30/IOB3/BZB SEG31/IOB4/BZ SEG32/IOC1/KI1 SEG33/IOC2/KI2 SEG34/IOC3/KI3 SEG35/IOC4/KI4 RESET INT TEST X 1602.50 1602.50 1602.50 1602.50 1602.50 1602.50 1602.50 1602.50 1602.50 1602.50 1472.50 1357.50 1242.50 1127.50 1012.50 897.50 782.50 667.50 552.50 437.50 322.50 207.50 Y 344.70 464.10 579.10 694.10 809.10 924.10 1039.10 1154.10 1269.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 tenx technology, inc. Rev.1.4 2001/9/4 TM8713 PIN DESCRIPTION Name I/O Description BAK P VDD1,2,3 P RESET I INT I TESTA CUP1,2 I O XIN XOUT I O COM1~5 SEG1-12,2135 IOA1-4 IOB1-4 IOC1-4 ELC/ELP BZB/BZ K1~16 KI1~4 GND O O Power Back-up pin(+). . At Li Mode, connect a 0.1u capacitor to GND. LCD supply voltage and positive supply pins. . In Ag power mode, connect positive power to VDD1. . In Li or ExtV power mode, connect positive power to VDD2. Input pin for external reset request signal, built-in internal pull-down resistor. . Reset cycle time can be defined as “PH15/2” or “PH12/2” by mask option. . Reset Type can be defined as “Level reset” or “Pulse reset” by mask option. Input pin for external interrupt request signal. . Falling edge or rising edge triggered is defined by mask option. . Internal pull-down or pull-up resistor is defined by mask option. Test signal input pin. Switching pins for supply the LCD driving voltage to the VDD1,2,3 pins. . Connect the CUP1 and CUP2 pins with non-polarized electrolytic capacitor when chip operated in 1/2 or 1/3 bias mode. . In no BIAS mode application, leave these pins opened Time base counter frequency (clock specified. LCD alternating frequency. Alarm signal frequency) or system clock oscillation. . 32KHz Crystal oscillator. . In FAST ONLY mode option, connect an external resistor could compose a RC oscillator. Output pins for driving the common pins of the LCD or LED panel. Output pins for driving the LCD or LED panel segment. I/O I/O I/O O O O I P Input / Output port A. Input / Output port B. Input / Output port C. Output port for EL driver. Output port for alarm, clock or single tone melody generator Output port for key matrix scanning.(Shared with SEG1~SEG16) Input port for key matrix. Negative supply voltage. 4 tenx technology, inc. Rev.1.4 2001/9/4 TM8713 ABSOLOUTE MAXIMUM RATINGS (GND= 0V) Name Symbol Range Unit VDD1 -0.3 to 5.5 V VDD2 -0.3 to 5.5 V VDD3 -0.3 to 8.5 V Maximum Input Voltage Vin -0.3 to VDD1/2+0.3 V Maximum output Voltage Vout1 -0.3 to VDD1/2+0.3 V Vout2 -0.3 to VDD3+0.3 V Maximum Operating Temperature Topg -20 to +70 ℃ Maximum Storage Temperature Tstg -25 to +125 ℃ Maximum Supply Voltage POWER CONSUMPTION at Ta=-20℃ to 70℃,GND= 0V Name HALT mode Sym. Condition Min. IHALT1 Only 32.768KHz Crystal oscillator operating, Typ. Max. Unit 2 uA 2 uA without loading. Ag mode, VDD1=1.5V, BCF = 0 IHALT2 Only 32.768KHz Crystal oscillator operating, without loading. Li mode, VDD2=3.0V, BCF = 0 STOP mode ISTOP 1 uA Note : When RC oscillator function is operating, the current consumption will depend on the frequency of oscillation. INTERNAL RC FREQUENCY RANGE Option Mode BAK Min. Typ. Max. 250KHz 1.2V~1.5V 300KHz 350KHz 400KHz 2.4V~5.0V 200KHz 250KHz 300KHz 1.2V~1.5V 550KHz 650KHz 750KHz 2.4V~5.0V 400KHz 500KHz 600KHz 500KHz 5 tenx technology, inc. Rev.1.4 2001/9/4 TM8713 ALLOWABLE OPERATING CONDITIONS at Ta=-20℃ to 70℃,GND= 0V Name Supply Voltage Symb. Condition Min. Max. Unit VDD1 1.2 5.25 V VDD2 2.4 5.25 V VDD3 2.4 8.0 V Oscillator Start-Up Voltage VDDB Crystal Mode 1.3 V Voltage VDDB Crystal Mode 1.2 V Supply Voltage VDD1 Ag Mode 1.2 1.65 V Supply Voltage VDD2 EXT-V, Li Mode 2.4 5.25 V Input “H” Voltage Vih1 Ag Battery Mode Input “L” Voltage Vil1 Input “H” Voltage Vih2 Input “L” Voltage Vil2 Input “H” Voltage Vih3 Input “L” Voltage Vil3 Input “H” Voltage Vih4 Input “L” Voltage Vil4 Input “H” Voltage Vih5 Input “L” Voltage Vil5 or EXT-V Mode Input “H” Voltage Vih6 RC Mode Input “L” Voltage Vil6 Oscillator Sustain Operating Freq VDD1-0.7 VDD1+0.7 -0.7 Li Battery Mode 0.7 VDD2-0.7 VDD2+0.7 V V V -0.7 0.7 V OSCIN at Ag 0.8xVDD1 VDD1 V Battery Mode 0 0.2xVDD1 V VDD2 V 0.2xVDD2 V VDD2 V 0 0.2xVDD2 V 0.8xVDDO VDDO V 0 0.2xVDDO V OSCIN at Li Battery 0.8xVDD2 Mode 0 CFIN at Li Battery 0.8xVDD2 Fopg1 Crystal Mode 32 Fopg2 RC Mode 10 6 KHZ 1000 KHZ tenx technology, inc. Rev.1.4 2001/9/4 TM8713 ELECTRICAL CHARACTERISTICS at#1:VDD1=1.2V(Ag); at#2:VDD2=2.4V(Li): at#3:VDD2=4V(Ext-V); Input Resistance Name “L” Level Hold Tr(IOC) IOC Pull-Down Tr INT Pull-up Tr INT Pull-Down Tr RES Pull-Down R Symb. Condition Min. Typ. Max. Unit Rllh1 Vi=0.2VDD1,#1 10 40 100 Kohm Rllh2 Vi=0.2VDD2,#2 10 40 100 Kohm Rllh3 Vi=0.2VDD2,#3 5 20 50 Kohm Rmad1 Vi=VDD1,#1 200 500 1000 Kohm Rmad2 Vi=VDD2,#2 200 500 1000 Kohm Rmad3 Vi=VDD3,#3 100 250 500 Kohm Rintu1 Vi=VDD1,#1 200 500 1000 Kohm Rintu2 Vi=VDD2,#2 200 500 1000 Kohm Rintu3 Vi=VDD3,#3 100 250 500 Kohm Rintd1 Vi=GND,#1 200 500 1000 Kohm Rintd2 Vi=GND,#2 200 500 1000 Kohm Rintd3 Vi=GND,#3 100 250 500 Kohm Rres1 Vi=GND or VDD1,#1 5 20 50 Kohm Rres2 Vi=GND or VDD2,#2 5 20 50 Kohm Rres3 Vi=GND or VDD2,#3 5 20 50 Kohm DC Output Characteristics Name Output ”H” Voltage Output ”L” Voltage Symb. Condition Port Min. Typ. Max. Unit Voh1c Ioh=-200uA,#1 0.8 0.9 1.0 V Voh2c Ioh=-1mA,#2 1.5 1.8 2.1 V Voh3c Ioh=-3mA,#3 SEG1~12 2.5 3.0 3.5 V Vol1c Iol=400uA,#1 SEG13~35 0.2 0.3 0.4 V Vol2c Iol=2mA,#2 0.3 0.6 0.9 V Vol3c Iol=6mA,#3 0.5 1.0 1.5 V 7 tenx technology, inc. Rev.1.4 2001/9/4 TM8713 Segment Driver Output Characteristics Name Symb. Condition For Min. Typ. Max. Unit. Static Display Mode Output ”H” Voltage Voh1d Ioh=-1uA,#1 1.0 V Voh2d Ioh=-1uA,#2 2.2 V 3.8 V SEG-n Voh3d Ioh=-1uA,#3 Output ”L” Voltage Output ”H” Voltage Vol1d Iol=1uA,#1 0.2 V Vol2d Iol=1uA,#2 0.2 V Vol3d Iol=1uA,#3 0.2 V Voh1e Ioh=-10uA,#1 1.0 V Voh2e Ioh=-10uA,#2 2.2 V 3.8 V COM-n Voh3e Ioh=-10uA,#3 Output ”L” Voltage Vol1e Iol=10uA,#1 0.2 V Vol2e Iol=10uA,#2 0.2 V Vol3e Iol=10uA,#3 0.2 V 1/2 Bias Display Mode Output ”H” Voltage Voh12f Ioh=-1uA,#1,#2 Voh3f Output ”L” Voltage Output ”H” Voltage SEG-n Ioh=-1uA,#3 3.8 V 0.2 V Vol3f 0.2 V Iol=1uA,#3 Voh12g Ioh=-10uA,#1,#2 COM-n Vom12g Iol/h=+/-10uA,#1,#2 2.2 V 3.8 V 1.0 1.4 V 1.8 2.2 V Vol12g Iol=10uA,#1,#2 0.2 V Vol3g 0.2 V COM-n Vom3g Iol/h=+/-10uA,#3 Output ”L” Voltage V Vol12f Iol=1uA,#1,#2 Voh3g Ioh=-10uA,#3 Output ”M” Voltage 2.2 Iol=10uA,#3 1/3 Bias display Mode Output ”H” Voltage Output ”M1” Voltage Voh12i Ioh=-1uA,#1,#2 3.4 V Voh3i 5.8 V Ioh=-1uA,#3 Vom12i Iol/h=+/-10uA,#1,#2 1.0 1.4 V 1.8 2.2 V Vom22i Iol/h=+/-10uA,#1,#2 2.2 2.6 V Vom23i Iol/h=+/-10uA,#3 3.8 4.2 V SEG-n Vom13i Iol/h=+/-10uA,#3 Output ”M2” Voltage Output ”L” Voltage Vol12i Iol=1uA,#1,#2 0.2 V Vol3i Iol=1uA,#3 0.2 V 8 tenx technology, inc. Rev.1.4 2001/9/4 TM8713 Output ”H” Voltage Output ”M1” Voltage Voh12j Ioh=-10uA,#1,#2 3.4 V Voh3j 5.8 V Ioh=-10uA,#3 Vom12j Iol/h=+/-10uA,#1,#2 1.0 1.4 V 1.8 2.2 V Vom22j Iol/h=+/-10uA,#1,#2 2.2 2.6 V Vom23j Iol/h=+/-10uA,#3 3.8 4.2 V COM-n Vom13j Iol/h=+/-10uA,#3 Output ”M2” Voltage Output ”L” Voltage Vol12j Iol=10uA,#1,#2 0.2 V Vol3j Iol=10uA,#3 0.2 V 9 tenx technology, inc. Rev.1.4 2001/9/4 TM8713 TYPICAL APPLICATION CIRCUIT This application circuit is simply an example, and is not guaranteed to work. LCD Panel COM1~5, SEG1~12, SEG21~35 15P XIN 15P CUP1 32.768KHz Crystal 0.1u CUP2 XOUT VDD3 VDD2 RH VDD1 RT 0.1u 0.1u BAK RR 0.1u CX 1.5V GND TM8713 0.1u L ELP EL Plant RESET External INT. I/O Port 0.1u INT ELC IOA,IOB,IOC Choke Buzzer BZ(BZB) K1~12 KI1~KI4 Key Scaning Key Matrix Ag power mode, 1/3 Bias, 1/5 Duty 10 tenx technology, inc. Rev.1.4 2001/9/4