ETC TM6820

TM6820
tenx technology
4 Bit Microcontroller
GENERAL DESCRIPTION
The TM6820 is an embedded high-performance 4-bit microcomputer with LCD driver. It
contains all the necessary functions, such as 4-bit parallel processing ALU, ROM, RAM,
I/O ports, timer, clock generator, dual clock operation, Resistance to Frequency
Converter(RFC), EL panel driver, LCD driver, look-up table, watchdog timer and key matrix
scanning circuitry in a signal chip.
FEATURE
1. Low power dissipation.
2. Powerful instruction set (142 instructions).
Binary addition, subtraction, BCD adjust, logical operation in direct and index
addressing mode.
Single-bit manipulation (set, reset, decision for branch).
Various conditional branch.
16 working registers and manipulation.
Table look-up.
LCD driver data transfer.
3. Memory capacity.
ROM capacity
RAM capacity
2048
128
x 16 bits.
x 4 bits.
4. LCD driver output.
5 common outputs and 35 segment outputs (up to drive 175 LCD segments).
1/2 Duty, 1/3 Duty, 1/4 Duty or 1/5 Duty is selected by mask option.
1/2 Bias or 1/3 Bias is selected by mask option.
Single instruction to turn off all segments.
Segment outputs(SEG1~35) could be defined as CMOS or P_open drain output
type by mask option.
5. Input/output ports.
Port IOA
4 pins (with internal pull-low), muxed with SEG24~27.
Port IOB
4 pins (with internal pull-low), muxed with SEG28~31.
Port IOC
4 pins (with internal pull-low/low-level-hold), muxed with SEG32~35.
IOC port had built in the input signal chattering prevention circuitry.
6. 8 level subroutine nesting.
7. Interrupt function.
External factor 2
Internal factor 4
(INT pin, Port IOC).
(Pre-Divider, Timer1, Timer2 & RFC).
8. Built-in EL panel driver.
ELC, ELP (Muxed with SEG28, SEG29).
tenx technology, inc.
V1.4
10/08/01
TM6820
9. Built in Alarm, clock or single tone melody generator.
BZB, BZ (Muxed with SEG30, SEG31).
10. Built-in R to F Converter circuit.
CX, RR, RT, RH (Muxed with SEG24~SEG27).
11. Two 6-bit programmable timer with programmable clock source.
12. Watch dog timer.
13. Built-in Voltage doubler, tripler charge pump circuit.
14. Dual clock operation
slow clock oscillation can be defined as X’tal or external RC type oscillator by mask
option.
fast clock oscillation can be defined as 3.58MHz ceramic resonator, internal R or
external R type oscillator by mask option.
15. HALT function.
16. STOP function.
17. Built-in control circuitry to switch the internal operating voltage in order to perform the
low power consumption or provide a stable operating voltage.
18. Built-in Low Battery Detect function
19. Heavy Loading protection function
APPLICATION
Timer / Calendar / Calculator / Thermometer
2
tenx technology, inc.
V1.4
10/08/01
TM6820
BLOCK DIAGRAM
B1-4
ELC,ELP
BZ,BZB
A1-4
CX
RR,RT,RH
C1-4
COM1-5
SEG1-35
POWER
SWITCH
Lower Battery
Detect
LCD DRIVER
B-PORT
EL DRIVER
ALARM
C-PORT
A-PORT
RFC
VBAT
VL1-3
SEGMENT PLA
4 BITS DATA BUS
FREQUENCY
GENERATOR
INDEX ROM
256(16-N) X 8 BITS
ALU
DATA RAM
128 X 4 BITS
PRE-DIVIDER
6 BITS PRESET
TIMER 1 & 2
8 LEVELS STACK
INSTRUCTION
DECODER
OSCILLATOR
CONTROL
CIRCUIT
11 BITS PROGRAM
COUNTER
MASK ROM
128N X 16 BITS
CUP1,2
RESET
XTIN,OUT
N:1->16
TM6820 BLOCKDIAGRAM
INT
PAD DIAGRAM
1
50
40
10
(ROM)
30
20
3
tenx technology, inc.
V1.4
10/08/01
TM6820
The substrate of chip should be connected to GND.
PAD COORDINATE
No
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
Name
BAK
XIN
XOUT
GND
VL1
VL2
VL3
CUP1
CUP2
COM1
COM2
COM3
COM4
COM5
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
X
197.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
427.5
542.5
657.5
772.5
887.5
1002.5
1117.5
1232.5
1347.5
1462.5
1577.5
1692.5
Y
1602.5
1576.5
1446.5
1331.5
1216.5
1101.5
986,5
871.5
756.5
641.5
526.5
411.5
296.5
166.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
77.5
No
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
4
Name
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24/IOA1/CX
SEG25/IOA2/RR
SEG26/IOA3/RT
SEG27/IOA4/RH
SEG28/IOB1/ELC
SEG29/IOB2/ELP
SEG30/IOB3/BZB
SEG31/IOB4/BZ
SEG32/IOC1
SEG33/IOC2
SEG34/IOC3
SEG35/IOC4
RESET
INT
TEST
VBAT
X
1822.5
1822.5
1822.5
1822.5
1822.5
1822.5
1822.5
1822.5
1822.5
1822.5
1822.5
1822.5
1822.5
1822.5
1692.5
1577.5
1462.5
1347.5
1232.5
1117.5
1002.5
887.5
772.5
657.5
542.5
427.5
312.5
Y
77.5
207.5
322.5
437.5
552.5
667.5
782.5
897.5
1012.5
1127.5
1242.5
1357.5
1472.5
1602.5
1602.5
1602.5
1602.5
1602.5
1602.5
1602.5
1602.5
1602.5
1602.5
1602.5
1602.5
1602.5
1602.5
tenx technology, inc.
V1.4
10/08/01
TM6820
PIN DESCRIPTION
Name
I/O
Description
VBAT
BAK
P
P
VL1,2,3
P
RESET
I
INT
I
TESTA
CUP1,2
O
XIN
XOUT
I
O
COM1~5
SEG1-35
IOA1-4
IOB1-4
IOC1-4
CX
RR/RT/RH
ELC/ELP
BZB/BZ
O
O
I/O
I/O
I/O
I
O
O
O
Positive supply voltage.
Positive Back-up voltage.
Connected a 0.1u capacitor to GND.
LCD supply voltage.
Connect 0.1u capacitors between VL1,2,3 and GND.
Input pin for external reset request signal, built-in internal pull-down resistor.
. Reset cycle time can be defined as “PH15/2” or “PH12/2” by mask option.
. Reset Type can be defined as “Level reset” or “Pulse reset” by mask option..
Input pin for external INT request signal.
. Falling edge or rising edge triggered is defined by mask option.
. Internal pull-down or pull-up resistor is defined by mask option.
Test signal input pin.
Switching pins for supply the LCD driving voltage to the VL1,2,3 pins.
. Connect the CUP1 and CUP2 pins with non-polarized electrolytic capacitor when chip
operated in 1/2 or 1/3 bias mode.
. In no BIAS mode application, leave these pins opened.
Time base counter frequency (clock specified. LCD alternating frequency. Alarm signal
frequency) or system clock oscillation.
. 32KHz Crystal oscillator.
. In FAST mode, connect an external resistor could compose the RC oscillator(mask
option).
. In SLOW mode, connect an external resistor could compose the RC oscillator(mask
option).
Output pins for driving the common pins of the LCD panel.
Output pins for driving the LCD panel segment.
Input / Output port A. (Muxed with SEG24~SEG27)
Input / Output port B. (Muxed with SEG28~SEG31)
Input / Output port C. (Muxed with SEG32~SEG35)
1 input pin and 3 output pins for RFC application. (Muxed with SEG24~SEG27)
GND
P
Output port for EL panel driver. (Muxed with SEG28,SEG29)
Output port for alarm, clock or single tone melody generator.
(Muxed with SEG30~SEG31)
Negative supply voltage.
5
tenx technology, inc.
V1.4
10/08/01
TM6820
ABSOLOUTE MAXIMUM RATINGS
at Ta= -20 to 70℃,GND= 0V
Name
Symbol
Range
Unit
VBAT
-0.3 to 3.6
V
Maximum Input Voltage
Vin
-0.3 to VBAT +0.3
V
Maximum output Voltage
Vout
-0.3 to BAK,VL1/2/3+0.3
V
Maximum Operating Temperature
Topg
-20 to +70
℃
Maximum Storage Temperature
Tstg
-25 to +125
℃
Maximum Supply Voltage
POWER CONSUMPTION
at Ta=-20℃ to 70℃,GND= 0V
Name
HALT mode
STOP mode
Sym.
Condition
Only 32.768KHz Crystal oscillator operating,
IHALT1 without loading.
Ag mode, VBAT =1.5V, BCF = 0
Only 32.768KHz Crystal oscillator operating,
IHALT2 without loading.
Li mode, VBAT =3.0V, BCF = 0
ISTOP
Min.
Typ.
Max.
Unit
2
5
uA
2
5
uA
1
uA
Note : When RC oscillator function is operating, the current consumption will depend on the frequency of
oscillation.
6
tenx technology, inc.
V1.4
10/08/01
TM6820
ALLOWABLE OPERATING CONDITIONS
at Ta= -20 to 70℃,GND= 0V
Name
Symb.
Condition
Min.
Max.
Unit
BAK
Crystal Mode
1.3
V
BAK
Crystal Mode
1.0
V
Supply Voltage
VBAT
Ag Mode
1.2
1.8
V
Supply Voltage
VBAT
Li Mode
2.4
3.6
V
Oscillator Start-Up
Voltage
Oscillator Sustain
Voltage
Input “H” Voltage
Vih1
Input “L” Voltage
Vil1
Input “H” Voltage
Vih2
Input “L” Voltage
Vil2
Input “H” Voltage
Vih3
Input “L” Voltage
Vil3
Operating Freq
VBAT-0.7 VBAT+0.7
OSCIN
RC Mode
V
-0.7
0.7
V
0.8xBAK
BAK
V
0
0.2xBAK
V
0.8xBAK
BAK
V
0
0.2xBAK
V
Fopg1
Crystal Mode
32
Fopg2
RC Mode
10
KHZ
500
KHZ
ELECTRICAL CHARACTERISTICS
at#1:VBAT=1.2V(Ag);
at#2:VBAT=2.4V(Li):
Input Resistance
Name
Sym.
Condition
Min.
Typ.
Max.
Unit
“L” Level Hold Tr.(IOC)
Rllh1
Vi=0.2VBAT,#1
10
40
100
Kohm
Rllh2
Vi=0.2VBAT,#2
10
40
100
Kohm
Rmad1
Vi=VBAT,#1
200
500
1000
Kohm
Rmad2
Vi=VBAT#2
200
500
1000
Kohm
Rintu1
Vi=VBAT,#1
200
500
1000
Kohm
Rintu2
Vi=VBAT,#2
200
500
1000
Kohm
Rintd1
Vi=GND,#1
200
500
1000
Kohm
Rintd2
Vi=GND,#2
200
500
1000
Kohm
Rres1
Vi=GND or VBAT,#1
10
50
100
Kohm
Rres2
Vi=GND or VBAT,#2
10
50
100
Kohm
IOA/B/C Pull-Down Tr.
INT Pull-up Tr.
INT Pull-Down Tr.
RES Pull-Down R
7
tenx technology, inc.
V1.4
10/08/01
TM6820
DC Output Characteristics
Name
Symb.
Output ”H” Voltage
Output ”L” Voltage
Condition
Min.
Typ.
Max.
Unit
Voh1c Ioh=-200uA,#1
0.8
0.9
1.0
V
Voh2c Ioh=-1mA,#2
1.5
1.8
2.1
V
0.2
0.3
0.4
V
0.3
0.6
0.9
V
Vol1c
Iol=400uA,#1
Vol2c
Iol=2mA,#2
Port
SEG1~35
Analog Circuit Characteristics
(In operation mode)
(VBAT=3.0V for Li-B or 1.5V for Ag-B, GND=0V, fosc=32,768Hz,Ta=25℃)
Name
Internal
Symb.
Condition
Min.
Typ.
Max.
Unit
VL1
Connects a 1M Ω load resistance
0.95
1.05
1.15
V
V
Voltage
between GND and VL1 (No panel
load)
VL2
Connects a 1M Ω load resistance
2xVL1
2xVL1
between GND and VL2 (No panel
x0.9
+0.1
2xVL1
2xVL1
x0.9
+0.1
3xVL1
3xVL1
x0.9
+0.1
load)
VL3
1/2Bias Display Mode(VL3 connect to
VL2)
V
Connects a 1M Ω load resistance
between GND and VL3 (No panel
load)
1/3Bias Display Mode
Connects a 1M Ω load resistance
V
between GND and VL3 (No panel
load)
BLD voltage
BLD circuit
VBLD
Li-B
2.25
2.40
2.55
V
VBLD
Ag-B
1.10
1.20
1.30
V
100
us
TBLD
response time
8
tenx technology, inc.
V1.4
10/08/01
TM6820
TYPICAL APPLICATION CIRCUIT
This application circuit is simply an example, and is not guaranteed to work.
LCD Panel
COM1~5, SEG1~35
15P
XIN
15P
CUP1
32.768KHz
Crystal
0.1u
CUP2
XOUT
VBAT
VL3
RH
VL2
RT
1.5V
VL1
RR
0.1u
0.1u
0.1u
BAK
CX
0.1u
0.1u
GND
TM6820
0.1u
L
RESET
External INT.
ELP
EL Plant
INT
ELC
I/O Port
IOA,IOB,IOC
Choke
Buzzer
BZ(BZB)
Ag power mode, 1/3 Bias, 1/5 Duty
9
tenx technology, inc.
V1.4
10/08/01