TM6820 tenx technology 4 Bit Microcontroller GENERAL DESCRIPTION The TM6820 is an embedded high-performance 4-bit microcomputer with LCD driver. It contains all the necessary functions, such as 4-bit parallel processing ALU, ROM, RAM, I/O ports, timer, clock generator, dual clock operation, Resistance to Frequency Converter(RFC), EL panel driver, LCD driver, look-up table, watchdog timer and key matrix scanning circuitry in a signal chip. FEATURE 1. Low power dissipation. 2. Powerful instruction set (142 instructions). Binary addition, subtraction, BCD adjust, logical operation in direct and index addressing mode. Single-bit manipulation (set, reset, decision for branch). Various conditional branch. 16 working registers and manipulation. Table look-up. LCD driver data transfer. 3. Memory capacity. ROM capacity RAM capacity 2048 128 x 16 bits. x 4 bits. 4. LCD driver output. 5 common outputs and 35 segment outputs (up to drive 175 LCD segments). 1/2 Duty, 1/3 Duty, 1/4 Duty or 1/5 Duty is selected by mask option. 1/2 Bias or 1/3 Bias is selected by mask option. Single instruction to turn off all segments. Segment outputs(SEG1~35) could be defined as CMOS or P_open drain output type by mask option. 5. Input/output ports. Port IOA 4 pins (with internal pull-low), muxed with SEG24~27. Port IOB 4 pins (with internal pull-low), muxed with SEG28~31. Port IOC 4 pins (with internal pull-low/low-level-hold), muxed with SEG32~35. IOC port had built in the input signal chattering prevention circuitry. 6. 8 level subroutine nesting. 7. Interrupt function. External factor 2 Internal factor 4 (INT pin, Port IOC). (Pre-Divider, Timer1, Timer2 & RFC). 8. Built-in EL panel driver. ELC, ELP (Muxed with SEG28, SEG29). tenx technology, inc. V1.4 10/08/01 TM6820 9. Built in Alarm, clock or single tone melody generator. BZB, BZ (Muxed with SEG30, SEG31). 10. Built-in R to F Converter circuit. CX, RR, RT, RH (Muxed with SEG24~SEG27). 11. Two 6-bit programmable timer with programmable clock source. 12. Watch dog timer. 13. Built-in Voltage doubler, tripler charge pump circuit. 14. Dual clock operation slow clock oscillation can be defined as X’tal or external RC type oscillator by mask option. fast clock oscillation can be defined as 3.58MHz ceramic resonator, internal R or external R type oscillator by mask option. 15. HALT function. 16. STOP function. 17. Built-in control circuitry to switch the internal operating voltage in order to perform the low power consumption or provide a stable operating voltage. 18. Built-in Low Battery Detect function 19. Heavy Loading protection function APPLICATION Timer / Calendar / Calculator / Thermometer 2 tenx technology, inc. V1.4 10/08/01 TM6820 BLOCK DIAGRAM B1-4 ELC,ELP BZ,BZB A1-4 CX RR,RT,RH C1-4 COM1-5 SEG1-35 POWER SWITCH Lower Battery Detect LCD DRIVER B-PORT EL DRIVER ALARM C-PORT A-PORT RFC VBAT VL1-3 SEGMENT PLA 4 BITS DATA BUS FREQUENCY GENERATOR INDEX ROM 256(16-N) X 8 BITS ALU DATA RAM 128 X 4 BITS PRE-DIVIDER 6 BITS PRESET TIMER 1 & 2 8 LEVELS STACK INSTRUCTION DECODER OSCILLATOR CONTROL CIRCUIT 11 BITS PROGRAM COUNTER MASK ROM 128N X 16 BITS CUP1,2 RESET XTIN,OUT N:1->16 TM6820 BLOCKDIAGRAM INT PAD DIAGRAM 1 50 40 10 (ROM) 30 20 3 tenx technology, inc. V1.4 10/08/01 TM6820 The substrate of chip should be connected to GND. PAD COORDINATE No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Name BAK XIN XOUT GND VL1 VL2 VL3 CUP1 CUP2 COM1 COM2 COM3 COM4 COM5 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 X 197.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 427.5 542.5 657.5 772.5 887.5 1002.5 1117.5 1232.5 1347.5 1462.5 1577.5 1692.5 Y 1602.5 1576.5 1446.5 1331.5 1216.5 1101.5 986,5 871.5 756.5 641.5 526.5 411.5 296.5 166.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 77.5 No 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 4 Name SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24/IOA1/CX SEG25/IOA2/RR SEG26/IOA3/RT SEG27/IOA4/RH SEG28/IOB1/ELC SEG29/IOB2/ELP SEG30/IOB3/BZB SEG31/IOB4/BZ SEG32/IOC1 SEG33/IOC2 SEG34/IOC3 SEG35/IOC4 RESET INT TEST VBAT X 1822.5 1822.5 1822.5 1822.5 1822.5 1822.5 1822.5 1822.5 1822.5 1822.5 1822.5 1822.5 1822.5 1822.5 1692.5 1577.5 1462.5 1347.5 1232.5 1117.5 1002.5 887.5 772.5 657.5 542.5 427.5 312.5 Y 77.5 207.5 322.5 437.5 552.5 667.5 782.5 897.5 1012.5 1127.5 1242.5 1357.5 1472.5 1602.5 1602.5 1602.5 1602.5 1602.5 1602.5 1602.5 1602.5 1602.5 1602.5 1602.5 1602.5 1602.5 1602.5 tenx technology, inc. V1.4 10/08/01 TM6820 PIN DESCRIPTION Name I/O Description VBAT BAK P P VL1,2,3 P RESET I INT I TESTA CUP1,2 O XIN XOUT I O COM1~5 SEG1-35 IOA1-4 IOB1-4 IOC1-4 CX RR/RT/RH ELC/ELP BZB/BZ O O I/O I/O I/O I O O O Positive supply voltage. Positive Back-up voltage. Connected a 0.1u capacitor to GND. LCD supply voltage. Connect 0.1u capacitors between VL1,2,3 and GND. Input pin for external reset request signal, built-in internal pull-down resistor. . Reset cycle time can be defined as “PH15/2” or “PH12/2” by mask option. . Reset Type can be defined as “Level reset” or “Pulse reset” by mask option.. Input pin for external INT request signal. . Falling edge or rising edge triggered is defined by mask option. . Internal pull-down or pull-up resistor is defined by mask option. Test signal input pin. Switching pins for supply the LCD driving voltage to the VL1,2,3 pins. . Connect the CUP1 and CUP2 pins with non-polarized electrolytic capacitor when chip operated in 1/2 or 1/3 bias mode. . In no BIAS mode application, leave these pins opened. Time base counter frequency (clock specified. LCD alternating frequency. Alarm signal frequency) or system clock oscillation. . 32KHz Crystal oscillator. . In FAST mode, connect an external resistor could compose the RC oscillator(mask option). . In SLOW mode, connect an external resistor could compose the RC oscillator(mask option). Output pins for driving the common pins of the LCD panel. Output pins for driving the LCD panel segment. Input / Output port A. (Muxed with SEG24~SEG27) Input / Output port B. (Muxed with SEG28~SEG31) Input / Output port C. (Muxed with SEG32~SEG35) 1 input pin and 3 output pins for RFC application. (Muxed with SEG24~SEG27) GND P Output port for EL panel driver. (Muxed with SEG28,SEG29) Output port for alarm, clock or single tone melody generator. (Muxed with SEG30~SEG31) Negative supply voltage. 5 tenx technology, inc. V1.4 10/08/01 TM6820 ABSOLOUTE MAXIMUM RATINGS at Ta= -20 to 70℃,GND= 0V Name Symbol Range Unit VBAT -0.3 to 3.6 V Maximum Input Voltage Vin -0.3 to VBAT +0.3 V Maximum output Voltage Vout -0.3 to BAK,VL1/2/3+0.3 V Maximum Operating Temperature Topg -20 to +70 ℃ Maximum Storage Temperature Tstg -25 to +125 ℃ Maximum Supply Voltage POWER CONSUMPTION at Ta=-20℃ to 70℃,GND= 0V Name HALT mode STOP mode Sym. Condition Only 32.768KHz Crystal oscillator operating, IHALT1 without loading. Ag mode, VBAT =1.5V, BCF = 0 Only 32.768KHz Crystal oscillator operating, IHALT2 without loading. Li mode, VBAT =3.0V, BCF = 0 ISTOP Min. Typ. Max. Unit 2 5 uA 2 5 uA 1 uA Note : When RC oscillator function is operating, the current consumption will depend on the frequency of oscillation. 6 tenx technology, inc. V1.4 10/08/01 TM6820 ALLOWABLE OPERATING CONDITIONS at Ta= -20 to 70℃,GND= 0V Name Symb. Condition Min. Max. Unit BAK Crystal Mode 1.3 V BAK Crystal Mode 1.0 V Supply Voltage VBAT Ag Mode 1.2 1.8 V Supply Voltage VBAT Li Mode 2.4 3.6 V Oscillator Start-Up Voltage Oscillator Sustain Voltage Input “H” Voltage Vih1 Input “L” Voltage Vil1 Input “H” Voltage Vih2 Input “L” Voltage Vil2 Input “H” Voltage Vih3 Input “L” Voltage Vil3 Operating Freq VBAT-0.7 VBAT+0.7 OSCIN RC Mode V -0.7 0.7 V 0.8xBAK BAK V 0 0.2xBAK V 0.8xBAK BAK V 0 0.2xBAK V Fopg1 Crystal Mode 32 Fopg2 RC Mode 10 KHZ 500 KHZ ELECTRICAL CHARACTERISTICS at#1:VBAT=1.2V(Ag); at#2:VBAT=2.4V(Li): Input Resistance Name Sym. Condition Min. Typ. Max. Unit “L” Level Hold Tr.(IOC) Rllh1 Vi=0.2VBAT,#1 10 40 100 Kohm Rllh2 Vi=0.2VBAT,#2 10 40 100 Kohm Rmad1 Vi=VBAT,#1 200 500 1000 Kohm Rmad2 Vi=VBAT#2 200 500 1000 Kohm Rintu1 Vi=VBAT,#1 200 500 1000 Kohm Rintu2 Vi=VBAT,#2 200 500 1000 Kohm Rintd1 Vi=GND,#1 200 500 1000 Kohm Rintd2 Vi=GND,#2 200 500 1000 Kohm Rres1 Vi=GND or VBAT,#1 10 50 100 Kohm Rres2 Vi=GND or VBAT,#2 10 50 100 Kohm IOA/B/C Pull-Down Tr. INT Pull-up Tr. INT Pull-Down Tr. RES Pull-Down R 7 tenx technology, inc. V1.4 10/08/01 TM6820 DC Output Characteristics Name Symb. Output ”H” Voltage Output ”L” Voltage Condition Min. Typ. Max. Unit Voh1c Ioh=-200uA,#1 0.8 0.9 1.0 V Voh2c Ioh=-1mA,#2 1.5 1.8 2.1 V 0.2 0.3 0.4 V 0.3 0.6 0.9 V Vol1c Iol=400uA,#1 Vol2c Iol=2mA,#2 Port SEG1~35 Analog Circuit Characteristics (In operation mode) (VBAT=3.0V for Li-B or 1.5V for Ag-B, GND=0V, fosc=32,768Hz,Ta=25℃) Name Internal Symb. Condition Min. Typ. Max. Unit VL1 Connects a 1M Ω load resistance 0.95 1.05 1.15 V V Voltage between GND and VL1 (No panel load) VL2 Connects a 1M Ω load resistance 2xVL1 2xVL1 between GND and VL2 (No panel x0.9 +0.1 2xVL1 2xVL1 x0.9 +0.1 3xVL1 3xVL1 x0.9 +0.1 load) VL3 1/2Bias Display Mode(VL3 connect to VL2) V Connects a 1M Ω load resistance between GND and VL3 (No panel load) 1/3Bias Display Mode Connects a 1M Ω load resistance V between GND and VL3 (No panel load) BLD voltage BLD circuit VBLD Li-B 2.25 2.40 2.55 V VBLD Ag-B 1.10 1.20 1.30 V 100 us TBLD response time 8 tenx technology, inc. V1.4 10/08/01 TM6820 TYPICAL APPLICATION CIRCUIT This application circuit is simply an example, and is not guaranteed to work. LCD Panel COM1~5, SEG1~35 15P XIN 15P CUP1 32.768KHz Crystal 0.1u CUP2 XOUT VBAT VL3 RH VL2 RT 1.5V VL1 RR 0.1u 0.1u 0.1u BAK CX 0.1u 0.1u GND TM6820 0.1u L RESET External INT. ELP EL Plant INT ELC I/O Port IOA,IOB,IOC Choke Buzzer BZ(BZB) Ag power mode, 1/3 Bias, 1/5 Duty 9 tenx technology, inc. V1.4 10/08/01