AD ADSP-2183KST-115

a
FEATURES
PERFORMANCE
19 ns Instruction Cycle Time from 26.32 MHz Crystal
@ 3.3 Volts
52 MIPS Sustained Performance
Single-Cycle Instruction Execution
Single-Cycle Context Switch
3-Bus Architecture Allows Dual Operand Fetches in
Every Instruction Cycle
Multifunction Instructions
Power-Down Mode Featuring Low CMOS Standby
Power Dissipation with 300 Cycle Recovery from
Power-Down Condition
Low Power Dissipation in Idle Mode
INTEGRATION
ADSP-2100 Family Code Compatible, with Instruction
Set Extensions
80K Bytes of On-Chip RAM, Configured as
16K Words On-Chip Program Memory RAM
16K Words On-Chip Data Memory RAM
Dual Purpose Program Memory for Both Instruction
and Data Storage
Independent ALU, Multiplier/Accumulator, and Barrel
Shifter Computational Units
Two Independent Data Address Generators
Powerful Program Sequencer Provides
Zero Overhead Looping
Conditional Instruction Execution
Programmable 16-Bit Interval Timer with Prescaler
128-Lead LQFP, 144-Ball Mini-BGA
SYSTEM INTERFACE
16-Bit Internal DMA Port for High Speed Access to
On-Chip Memory
4 MByte Memory Interface for Storage of Data Tables
and Program Overlays
8-Bit DMA to Byte Memory for Transparent
Program and Data Memory Transfers
I/O Memory Interface with 2048 Locations Supports
Parallel Peripherals
Programmable Memory Strobe and Separate I/O
Memory Space Permits “Glueless” System Design
Programmable Wait State Generation
Two Double-Buffered Serial Ports with Companding
Hardware and Automatic Data Buffering
Automatic Booting of On-Chip Program Memory from
Byte-Wide External Memory, e.g., EPROM, or
Through Internal DMA Port
Six External Interrupts
13 Programmable Flag Pins Provide Flexible System
Signaling
ICE-Port™ Emulator Interface Supports Debugging
in Final Systems
DSP Microcomputer
ADSP-2183
FUNCTIONAL BLOCK DIAGRAM
POWERDOWN
CONTROL
DATA ADDRESS
GENERATORS
DAG 1
PROGRAMMABLE
I/O
FLAGS
MEMORY
PROGRAM
SEQUENCER
PROGRAM
MEMORY
DAG 2
DATA
MEMORY
BYTE DMA
CONTROLLER
EXTERNAL
ADDRESS
BUS
PROGRAM MEMORY ADDRESS
DATA MEMORY ADDRESS
PROGRAM MEMORY DATA
DATA MEMORY DATA
EXTERNAL
DATA
BUS
ARITHMETIC UNITS
ALU
MAC
SHIFTER
SERIAL PORTS
SPORT 0 SPORT 1
TIMER
INTERNAL
DMA
PORT
DMA
BUS
ADSP-2100 BASE
ARCHITECTURE
GENERAL DESCRIPTION
The ADSP-2183 is a single-chip microcomputer optimized for
digital signal processing (DSP) and other high speed numeric
processing applications.
The ADSP-2183 combines the ADSP-2100 family base architecture (three computational units, data address generators and
a program sequencer) with two serial ports, a 16-bit internal
DMA port, a byte DMA port, a programmable timer, Flag I/O,
extensive interrupt capabilities, and on-chip program and
data memory.
The ADSP-2183 integrates 80K bytes of on-chip memory configured as 16K words (24-bit) of program RAM, and 16K words
(16-bit) of data RAM. Power-down circuitry is also provided to
meet the low power needs of battery operated portable equipment.
The ADSP-2183 is available in 128-lead LQFP, and 144-Ball
Mini-BGA packages.
In addition, the ADSP-2183 supports new instructions, which
include bit manipulations—bit set, bit clear, bit toggle, bit test—
new ALU constants, new multiplication instruction (x squared),
biased rounding, result free ALU operations, I/O memory transfers and global interrupt masking, for increased flexibility.
Fabricated in a high speed, double metal, low power, CMOS
process, the ADSP-2183 operates with a 19 ns instruction cycle
time. Every instruction can execute in a single processor cycle.
The ADSP-2183’s flexible architecture and comprehensive
instruction set allow the processor to perform multiple operations in parallel. In one processor cycle the ADSP-2183 can:
• Generate the next program address
• Fetch the next instruction
• Perform one or two data moves
• Update one or two data address pointers
• Perform a computational operation
ICE-Port is a trademark of Analog Devices, Inc.
REV. C
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
World Wide Web Site: http://www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2000
ADSP-2183
This takes place while the processor continues to:
• Receive and transmit data through the two serial ports
• Receive and/or transmit data through the internal DMA port
• Receive and/or transmit data through the byte DMA port
• Decrement timer
ARCHITECTURE OVERVIEW
The ADSP-2183 instruction set provides flexible data moves
and multifunction (one or two data moves with a computation)
instructions. Every instruction can be executed in a single processor cycle. The ADSP-2183 assembly language uses an algebraic syntax for ease of coding and readability. A comprehensive
set of development tools supports program development.
Figure 1 is an overall block diagram of the ADSP-2183. The
processor contains three independent computational units: the
ALU, the multiplier/accumulator (MAC) and the shifter. The
computational units process 16-bit data directly and have provisions to support multiprecision computations. The ALU performs a standard set of arithmetic and logic operations; division
primitives are also supported. The MAC performs single-cycle
multiply, multiply/add and multiply/subtract operations with
40 bits of accumulation. The shifter performs logical and arithmetic shifts, normalization, denormalization and derive
exponent operations. The shifter can be used to efficiently
implement numeric format control including multiword and
block floating-point representations.
The internal result (R) bus connects the computational units so
that the output of any unit may be the input of any unit on the
next cycle.
The ADSP-21xx family DSPs contain a shadow register that is
useful for single cycle context switching of the processor.
A powerful program sequencer and two dedicated data address
generators ensure efficient delivery of operands to these computational units. The sequencer supports conditional jumps, subroutine calls and returns in a single cycle. With internal loop
counters and loop stacks, the ADSP-2183 executes looped code
with zero overhead; no explicit jump instructions are required to
maintain loops.
Two data address generators (DAGs) provide addresses for
simultaneous dual operand fetches (from data memory and
program memory). Each DAG maintains and updates four
address pointers. Whenever the pointer is used to access data
(indirect addressing), it is post-modified by the value of one of
four possible modify registers. A length value may be associated
with each pointer to implement automatic modulo addressing
for circular buffers.
Efficient data transfer is achieved with the use of five internal
buses:
• Program Memory Address (PMA) Bus
• Program Memory Data (PMD) Bus
• Data Memory Address (DMA) Bus
• Data Memory Data (DMD) Bus
• Result (R) Bus
The two address buses (PMA and DMA) share a single external
address bus, allowing memory to be expanded off-chip, and the
two data buses (PMD and DMD) share a single external data
bus. Byte memory space and I/O memory space also share the
external buses.
Program memory can store both instructions and data, permitting the ADSP-2183 to fetch two operands in a single cycle,
one from program memory and one from data memory. The
ADSP-2183 can fetch an operand from program memory and
the next instruction in the same cycle.
Development System
The ADSP-2100 Family Development Software, a complete
set of tools for software and hardware system development,
supports the ADSP-2183. The assembler has an algebraic syntax
that is easy to program and debug. The linker combines object
files into an executable file. The simulator provides an interactive
instruction-level simulation with a reconfigurable user interface
to display different portions of the hardware environment.
The EZ-KIT Lite is a hardware/software kit offering a complete development environment for the ADSP-21xx family:
an ADSP-2189M evaluation board with PC monitor software
plus Assembler, Linker, Simulator and PROM Splitter software.
The ADSP-2189M evaluation board is a low-cost, easy to use
hardware platform on which you can quickly get started with
your DSP software design. The EZ-KIT Lite include the
following features:
• 35.7 MHz ADSP-2189M
• Full 16-bit Stereo Audio I/O with AD73322 CODEC
• RS-232 Interface
• EZ-ICE Connector for Emulator Control
• DSP Demo Programs
• Evaluation Suite of VisualDSP
The ADSP-218x EZ-ICE® Emulator aids in the hardware debugging of ADSP-218x systems. The ADSP-218x integrates on-chip
emulation support with a 14-pin ICE-Port interface. This interface provides a simpler target board connection requiring fewer
mechanical clearance considerations than other ADSP-2100
Family EZ-ICEs. The ADSP-218x device need not be removed
from the target system when using the EZ-ICE, nor are any
adapters needed. Due to the small footprint of the EZ-ICE
connector, emulation can be supported in final board designs.
The EZ-ICE performs a full range of functions, including:
• In-target operation
• Up to 20 breakpoints
• Single-step or full-speed operation
• Registers and memory values can be examined and altered
• PC upload and download functions
• Instruction-level emulation of program booting and execution
• Complete assembly and disassembly of instructions
• C source-level debugging
(See Designing An EZ-ICE-Compatible Target System section
of this data sheet for exact specifications of the EZ-ICE target
board connector.)
Additional Information
This data sheet provides a general overview of ADSP-2183
functionality. For additional information on the architecture and
instruction set of the processor, refer to the ADSP-2100 Family
User’s Manual, Third Edition. For more information about the
development tools, refer to the ADSP-2100 Family Development
Tools Data Sheet.
EZ-ICE and SoundPort are registered trademarks of Analog Devices, Inc.
–2–
REV. C
ADSP-2183
In addition to the address and data bus for external memory
connection, the ADSP-2183 has a 16-bit Internal DMA port
(IDMA port) for connection to external systems. The IDMA
port is made up of 16 data/address pins and five control pins.
The IDMA port provides transparent, direct access to the DSPs
on-chip program and data RAM.
An interface to low cost byte-wide memory is provided by the
Byte DMA port (BDMA port). The BDMA port is bidirectional
and can directly address up to four megabytes of external RAM
or ROM for off-chip storage of program overlays or data tables.
The byte memory and I/O memory space interface supports
slow memories and I/O memory-mapped peripherals with programmable wait state generation. External devices can gain
control of external buses with bus request/grant signals (BR,
BGH and BG). One execution mode (Go Mode) allows the
ADSP-2183 to continue running from on-chip memory. Normal
execution mode requires the processor to halt while buses are
granted.
The ADSP-2183 can respond to thirteen possible interrupts,
eleven of which are accessible at any given time. There can be
up to six external interrupts (one edge-sensitive, two levelsensitive and three configurable) and seven internal interrupts
generated by the timer, the serial ports (SPORTs), the Byte
DMA port and the power-down circuitry. There is also a master
RESET signal.
The ADSP-2183 provides up to 13 general-purpose flag pins.
The data input and output pins on SPORT1 can be alternatively
configured as an input flag and an output flag. In addition, eight
flags are programmable as inputs or outputs and three flags are
always outputs.
A programmable interval timer generates periodic interrupts. A
16-bit count register (TCOUNT) is decremented every n processor cycle, where n is a scaling value stored in an 8-bit register
(TSCALE). When the value of the count register reaches zero,
an interrupt is generated and the count register is reloaded from
a 16-bit period register (TPERIOD).
Serial Ports
The ADSP-2183 incorporates two complete synchronous serial
ports (SPORT0 and SPORT1) for serial communications and
multiprocessor communication.
Here is a brief list of the capabilities of the ADSP-2183
SPORTs. Refer to the ADSP-2100 Family User’s Manual, Third
Edition, for further details.
• SPORTs are bidirectional and have a separate, doublebuffered transmit and receive section.
• SPORTs can use an external serial clock or generate their
own serial clock internally.
• SPORTs have independent framing for the receive and transmit sections. Sections run in a frameless mode or with frame
synchronization signals, internally or externally generated.
Frame sync signals are active high or inverted, with either of
two pulsewidths and timings.
The two serial ports provide a complete synchronous serial interface with optional companding in hardware and a wide variety of
framed or frameless data transmit and receive modes of operation.
Each port can generate an internal programmable serial clock or
accept an external serial clock.
21xx CORE
ADSP-2183 INTEGRATION
2
POWER
DOWN
CONTROL
LOGIC
PROGRAM
SRAM
16kⴛ24
INSTRUCTION
REGISTER
DATA
ADDRESS
GENERATOR
#1
DATA
ADDRESS
GENERATOR
#2
DATA
SRAM
16kⴛ16
BYTE
DMA
CONTROLLER
8
PROGRAMMABLE
I/O
3
PROGRAM
SEQUENCER
FLAGS
PMA BUS
14
PMA BUS
DMA BUS
14
DMA BUS
14
MUX
EXTERNAL
ADDRESS
BUS
PMD BUS
24
PMD BUS
EXTERNAL
DATA
BUS
BUS
EXCHANGE
DMD BUS
DMD
BUS
MUX
24
16
INPUTREGS
REGS
INPUT
INPUTREGS
REGS
INPUT
INPUT REGS
ALU
ALU
MAC
MAC
SHIFTER
OUTPUT REGS
REGS
OUTPUT
OUTPUTREGS
REGS
OUTPUT
OUTPUT REGS
COMPANDING
CIRCUITRY
TIMER
16
TRANSMIT REG
TRANSMIT REG
RECEIVE REG
RECEIVE REG
SERIAL
PORT 0
SERIAL
PORT 0
R BUS
5
Figure 1. Block Diagram
REV. C
–3–
5
INTERNAL
DMA
PORT
16
4
INTERRUPTS
ADSP-2183
• SPORTs support serial data word lengths from 3 to 16 bits
and provide optional A-law and µ-law companding according
to CCITT recommendation G.711.
Pin
Name(s)
• SPORT receive and transmit sections can generate unique
interrupts on completing a data word transfer.
• SPORTs can receive and transmit an entire circular buffer of
data with only one overhead cycle per data word. An interrupt
is generated after a data buffer transfer.
• SPORT0 has a multichannel interface to selectively receive
and transmit a 24 or 32 word, time-division multiplexed,
serial bitstream.
• SPORT1 can be configured to have two external interrupts
(IRQ0 and IRQ1) and the Flag In and Flag Out signals. The
internally generated serial clock may still be used in this
configuration.
Pin Descriptions
The ADSP-2183 is available in a 128-lead LQFP package, and
Mini-BGA.
PIN FUNCTION DESCRIPTIONS
Pin
Name(s)
#
of
Pins
Input/
Output Function
Address
14
O
Address Output Pins for Program,
Data
24
I/O
RESET
IRQ2
1
1
I
I
Data I/O Pins for Program and
Data Memory Spaces (8 MSBs
Are Also Used as Byte Space
Addresses)
Processor Reset Input
Edge- or Level-Sensitive
Interrupt Request
IRQL0,
IRQL1
2
I
IRQE
1
I
BR
BG
BGH
PMS
DMS
BMS
IOMS
CMS
RD
WR
MMAP
BMODE
CLKIN,
XTAL
1
1
1
1
1
1
1
1
1
1
1
1
I
O
O
O
O
O
O
O
O
O
I
I
Level-Sensitive Interrupt
Requests
Edge-Sensitive Interrupt
Request
Bus Request Input
Bus Grant Output
Bus Grant Hung Output
Program Memory Select Output
Data Memory Select Output
Byte Memory Select Output
I/O Space Memory Select Output
Combined Memory Select Output
Memory Read Enable Output
Memory Write Enable Output
Memory Map Select Input
Boot Option Control Input
2
I
Clock or Quartz Crystal Input
Data, Byte, & I/O Spaces
#
of
Pins
Input/
Output Function
CLKOUT 1
SPORT0
5
SPORT1
5
O
I/O
I/O
IRD, IWR
IS
IAL
2
1
1
I
I
I
IAD
IACK
16
1
I/O
O
PWD
PWDACK
FL0, FL1,
FL2
PF7:0
EE
EBR
EBG
ERESET
EMS
EINT
ECLK
ELIN
ELOUT
GND
VDD
GND
VDD
1
1
I
O
3
8
1
1
1
1
1
1
1
1
1
11
6
22
11
O
I/O
*
*
*
*
*
*
*
*
*
Processor Clock Output.
Serial Port I/O Pins
Serial Port 1 or Two External
IRQs, Flag In and Flag Out
IDMA Port Read/Write Inputs
IDMA Port Select
IDMA Port Address Latch
Enable
IDMA Port Address/Data Bus
IDMA Port Access Ready
Acknowledge
Power-Down Control
Power-Down Control
Output Flags
Programmable I/O Pins
(Emulator Only*)
(Emulator Only*)
(Emulator Only*)
(Emulator Only*)
(Emulator Only*)
(Emulator Only*)
(Emulator Only*)
(Emulator Only*)
(Emulator Only*)
Ground Pins (LQFP)
Power Supply Pins (LQFP)
Ground Pins (Mini-BGA)
Power Supply Pins (Mini-BGA)
*These ADSP-2183 pins must be connected only to the EZ-ICE connector in
the target system. These pins have no function except during emulation, and
do not require pull-up or pull-down resistors.
Interrupts
The interrupt controller allows the processor to respond to the
eleven possible interrupts and reset with minimum overhead.
The ADSP-2183 provides four dedicated external interrupt
input pins, IRQ2, IRQL0, IRQL1 and IRQE. In addition,
SPORT1 may be reconfigured for IRQ0, IRQ1, FLAG_IN and
FLAG_OUT, for a total of six external interrupts. The ADSP2183 also supports internal interrupts from the timer, the byte
DMA port, the two serial ports, software and the power-down
control circuit. The interrupt levels are internally prioritized and
individually maskable (except power-down and reset). The
IRQ2, IRQ0 and IRQ1 input pins can be programmed to be
either level- or edge-sensitive. IRQL0 and IRQL1 are levelsensitive and IRQE is edge sensitive. The priorities and vector
addresses of all interrupts are shown in Table I.
–4–
REV. C
ADSP-2183
Table I. Interrupt Priority and Interrupt Vector Addresses
Source of Interrupt
Interrupt Vector
Address (Hex)
Reset (or Power-Up with PUCR = 1)
Power-Down (Nonmaskable)
IRQ2
IRQL1
IRQL0
SPORT0 Transmit
SPORT0 Receive
IRQE
BDMA Interrupt
SPORT1 Transmit or IRQ1
SPORT1 Receive or IRQ0
Timer
0000 (Highest Priority)
002C
0004
0008
000C
0010
0014
0018
001C
0020
0024
0028 (Lowest Priority)
Power-Down
The ADSP-2183 processor has a low power feature that lets
the processor enter a very low power dormant state through
hardware or software control. Here is a brief list of powerdown features. Refer to the ADSP-2100 Family User’s Manual,
Third Edition, “System Interface” chapter for detailed
information about the power-down feature.
• Quick recovery from power-down. The processor begins
executing instructions in as few as 300 CLKIN cycles.
• Support for an externally generated TTL or CMOS
processor clock. The external clock can continue running
during power-down without affecting the lowest power
rating and 300 CLKIN cycle recovery.
• Support for crystal operation includes disabling the oscillator to save power (the processor automatically waits 4096
CLKIN cycles for the crystal oscillator to start and stabilize), and letting the oscillator run to allow 300 CLKIN
cycle start-up.
Interrupt routines can either be nested, with higher priority
interrupts taking precedence, or processed sequentially. Interrupts can be masked or unmasked with the IMASK register.
Individual interrupt requests are logically ANDed with the bits
in IMASK; the highest priority unmasked interrupt is then
selected. The power-down interrupt is nonmaskable.
• Power-down is initiated by either the power-down pin
(PWD) or the software power-down force bit.
• Interrupt support allows an unlimited number of instructions to be executed before optionally powering down.
The power-down interrupt also can be used as a nonmaskable, edge-sensitive interrupt.
The ADSP-2183 masks all interrupts for one instruction cycle
following the execution of an instruction that modifies the
IMASK register. This does not affect serial port autobuffering
or DMA transfers.
• Context clear/save control allows the processor to continue where it left off or start with a clean context when
leaving the power-down state.
The interrupt control register, ICNTL, controls interrupt nesting and defines the IRQ0, IRQ1 and IRQ2 external interrupts to
be either edge- or level-sensitive. The IRQE pin is an external
edge-sensitive interrupt and can be forced and cleared. The
IRQL0 and IRQL1 pins are external level-sensitive interrupts.
• The RESET pin also can be used to terminate
power-down.
• Power-down acknowledge pin indicates when the
processor has entered power-down.
The IFC register is a write-only register used to force and clear
interrupts.
Idle
When the ADSP-2183 is in the Idle Mode, the processor
waits indefinitely in a low power state until an interrupt
occurs. When an unmasked interrupt occurs, it is serviced;
execution then continues with the instruction following the
IDLE instruction.
On-chip stacks preserve the processor status and are automatically maintained during interrupt handling. The stacks are
twelve levels deep to allow interrupt, loop and subroutine nesting.
The following instructions allow global enable or disable servicing of the interrupts (including power down), regardless of the
state of IMASK. Disabling the interrupts does not affect serial
port autobuffering or DMA.
Slow Idle
The IDLE instruction is enhanced on the ADSP-2183 to
let the processor’s internal clock signal be slowed, further
reducing power consumption. The reduced clock frequency,
a programmable fraction of the normal clock rate, is specified by a selectable divisor given in the IDLE instruction.
The format of the instruction is
ENA INTS;
DIS INTS;
When the processor is reset, interrupt servicing is enabled.
LOW POWER OPERATION
IDLE (n);
The ADSP-2183 has three low power modes that significantly
reduce the power dissipation when the device operates under
standby conditions. These modes are:
• Power-Down
• Idle
• Slow Idle
where n = 16, 32, 64 or 128. This instruction keeps the
processor fully functional, but operating at the slower clock
rate. While it is in this state, the processor’s other internal
clock signals, such as SCLK, CLKOUT and timer clock,
are reduced by the same ratio. The default form of the
instruction, when no clock divisor is given, is the standard
IDLE instruction.
The CLKOUT pin may also be disabled to reduce external
power dissipation.
REV. C
–5–
ADSP-2183
When the IDLE (n) instruction is used, it effectively slows down
the processor’s internal clock, and thus its response time, to
incoming interrupts. The one-cycle response time of the standard idle state is increased by n, the clock divisor. When an
enabled interrupt is received, the ADSP-2183 will remain in the
idle state for up to a maximum of n processor cycles (n = 16, 32,
64 or 128) before resuming normal operation.
If an external clock is used, it should be a TTL-compatible
signal running at half the instruction rate. The signal is connected to the processor’s CLKIN input. When an external clock
is used, the XTAL input must be left unconnected.
The ADSP-2183 uses an input clock with a frequency equal to
half the instruction rate; a 16.67 MHz input clock yields a 30 ns
processor cycle (which is equivalent to 33 MHz). Normally,
instructions are executed in a single processor cycle. All device
timing is relative to the internal instruction clock rate, which is
indicated by the CLKOUT signal when enabled.
When the IDLE (n) instruction is used in systems with an externally generated serial clock (SCLK), the serial clock rate may be
faster than the processor’s reduced internal clock rate. Under
these conditions, interrupts must not be generated at a faster
rate than can be serviced, due to the additional time the processor
takes to come out of the idle state (a maximum of n processor
cycles).
Because the ADSP-2183 includes an on-chip oscillator circuit,
an external crystal may be used. The crystal should be connected
across the CLKIN and XTAL pins, with two capacitors connected
as shown in Figure 3. Capacitor values are dependent on crystal
type and should be specified by the crystal manufacturer. A
parallel-resonant, fundamental frequency, microprocessor-grade
crystal should be used.
SYSTEM INTERFACE
Figure 2 shows a typical basic system configuration with the
ADSP-2183, two serial devices, a byte-wide EPROM and
optional external program and data overlay memories. Programmable wait state generation allows the processor to connect
easily to slow peripheral devices. The ADSP-2183 also provides
four external interrupts and two serial ports or six external interrupts and one serial port.
A clock output (CLKOUT) signal is generated by the processor
at the processor’s cycle rate. This can be enabled and disabled
by the CLKODIS bit in the SPORT0 Autobuffer Control
Register.
ADSP-2183
CLKIN
1/2x CLOCK
OR
CRYSTAL
CLKIN
XTAL
14
D23-16
SPORT1
SERIAL
DEVICE
SCLK1
RFS1 OR IRQ0
TFS1 OR IRQ1
DT1 OR FO
DR1 OR FI
24
SCLK0
RFS0
TFS0
DT0
DR0
IDMA PORT
SYSTEM
INTERFACE
OR
␮CONTROLLER 16
IRD
IWR
IS
IAL
IACK
IAD15-0
BYTE
MEMORY
Figure 3. External Crystal Connections
CS
A10-0
Reset
ADDR
RD
WR
D23-8
The RESET signal initiates a master reset of the ADSP-2183.
The RESET signal must be asserted during the power-up sequence to assure proper initialization. RESET during initial
power-up must be held long enough to allow the internal clock
to stabilize. If RESET is activated any time after power-up, the
clock continues to run and does not require stabilization time.
I/O
SPACE
(PERIPHERALS)
DATA
IOMS
CS
2048 LOCATIONS
A13-0
SPORT0
SERIAL
DEVICE
DATA
BMS
ADDR
D23-0
DATA
PMS
DMS
CMS
BR
BG
BGH
CLKOUT
A0-A21
D15-8
DATA23-0
XTAL
DSP
ADDR13-0
FL0-2
PF0-7
IRQ2
IRQE
IRQL0
IRQL1
A13-0
OVERLAY
MEMORY
TWO 8K
PM SEGMENTS
The power-up sequence is defined as the total time required for
the crystal oscillator circuit to stabilize after a valid VDD is applied to the processor, and for the internal phase-locked loop
(PLL) to lock onto the specific crystal frequency. A minimum of
2000 CLKIN cycles ensures that the PLL has locked, but does
not include the crystal oscillator start-up time. During this
power-up sequence the RESET signal should be held low. On
any subsequent resets, the RESET signal must meet the minimum pulsewidth specification, tRSP.
TWO 8K
DM SEGMENTS
PWD
PWDACK
Figure 2. ADSP-2183 Basic System Configuration
Clock Signals
The ADSP-2183 can be clocked by either a crystal or a TTLcompatible clock signal.
The RESET input contains some hysteresis; however, if you use
an RC circuit to generate your RESET signal, the use of an
external Schmidt trigger is recommended.
The CLKIN input cannot be halted, changed during operation
or operated below the specified frequency during normal operation. The only exception is while the processor is in the powerdown state. For additional information, refer to Chapter 9,
ADSP-2100 Family User’s Manual, Third Edition, for detailed
information on this power-down feature.
The master reset sets all internal stack pointers to the empty
stack condition, masks all interrupts and clears the MSTAT
register. When RESET is released, if there is no pending bus
request and the chip is configured for booting (MMAP = 0), the
boot-loading sequence is performed. The first instruction is
fetched from on-chip program memory location 0x0000 once
boot loading completes.
–6–
REV. C
ADSP-2183
Table II.
Memory Architecture
The ADSP-2183 provides a variety of memory and peripheral
interface options. The key functional groups are Program
Memory, Data Memory, Byte Memory and I/O.
Program Memory is a 24-bit-wide space for storing both
instruction opcodes and data. The ADSP-2183 has 16K words
of Program Memory RAM on chip and the capability of accessing up to two 8K external memory overlay spaces using the
external data bus. Both an instruction opcode and a data value
can be read from on-chip program memory in a single cycle.
Data Memory is a 16-bit-wide space used for the storage of
data variables and for memory-mapped control registers. The
ADSP-2183 has 16K words on Data Memory RAM on chip,
consisting of 16,352 user-accessible locations and 32 memorymapped registers. Support also exists for up to two 8K external
memory overlay spaces through the external data bus.
PMOVLAY Memory
A13
A12:0
0
Internal
Not Applicable
Not Applicable
1
External
Overlay 1
0
13 LSBs of Address
Between 0x2000
and 0x3FFF
2
External
Overlay 2
1
13 LSBs of Address
Between 0x2000
and 0x3FFF
This organization provides for two external 8K overlay segments
using only the normal 14 address bits. This allows for simple
program overlays using one of the two external segments in
place of the on-chip memory. Care must be taken in using this
overlay space because the processor core (i.e., the sequencer)
does not take the PMOVLAY register value into account. For
example, if a loop operation were occurring on one of the external overlays, and the program changes to another external overlay or internal memory, an incorrect loop operation could occur.
In addition, care must be taken in interrupt service routines as
the overlay registers are not automatically saved and restored on
the processor mode stack.
Byte Memory provides access to an 8-bit-wide memory space
through the Byte DMA (BDMA) port. The Byte Memory interface provides access to 4 MBytes of memory by utilizing eight
data lines as additional address lines. This gives the BDMA Port
an effective 22-bit address range. On power-up, the DSP can
automatically load bootstrap code from byte memory.
I/O Space allows access to 2048 locations of 16-bit-wide data.
It is intended to be used to communicate with parallel peripheral devices such as data converters and external registers or
latches.
For ADSP-2100 Family compatibility, MMAP = 1 is allowed.
In this mode, booting is disabled and overlay memory is disabled (PMOVLAY must be 0). Figure 5 shows the memory map
in this configuration.
Program Memory
The ADSP-2183 contains a 16K × 24 on-chip program RAM.
The on-chip program memory is designed to allow up to two
accesses each cycle so that all operations can complete in a
single cycle. In addition, the ADSP-2183 allows the use of 8K
external memory overlays.
PROGRAM MEMORY
ADDRESS
0x3FFF
INTERNAL 8K
(PMOVLAY = 0,
MMAP = 1)
0x2000
0x1FFF
The program memory space organization is controlled by the
MMAP pin and the PMOVLAY register. Normally, the ADSP2183 is configured with MMAP = 0 and program memory organized as shown in Figure 4.
8K EXTERNAL
0x0000
PROGRAM MEMORY
ADDRESS
Figure 5. Program Memory (MMAP = 1)
0x3FFF
8K INTERNAL
Data Memory
(PMOVLAY = 0,
MMAP = 0)
OR
The ADSP-2183 has 16,352 16-bit words of internal data
memory. In addition, the ADSP-2183 allows the use of 8K
external memory overlays. Figure 6 shows the organization of
the data memory.
EXTERNAL 8K
(PMOVLAY = 1 or 2,
MMAP = 0)
0x2000
0x1FFF
DATA MEMORY
8K INTERNAL
ADDRESS
0x3FFF
32 MEMORY–
MAPPED REGISTERS
0x0000
0x3FEO
0x3FDF
Figure 4. Program Memory (MMAP = 0)
INTERNAL
8160 WORDS
There are 16K words of memory accessible internally when the
PMOVLAY register is set to 0. When PMOVLAY is set to
something other than 0, external accesses occur at addresses
0x2000 through 0x3FFF. The external address is generated as
shown in Table II.
0x2000
8K INTERNAL
(DMOVLAY = 0)
OR
EXTERNAL 8K
(DMOVLAY = 1, 2)
0x1FFF
0x0000
Figure 6. Data Memory
REV. C
–7–
ADSP-2183
The CMS pin functions like the other memory select signals,
with the same timing and bus request logic. A 1 in the enable bit
causes the assertion of the CMS signal at the same time as the
selected memory select signal. All enable bits, except the BMS
bit, default to 1 at reset.
There are 16,352 words of memory accessible internally when
the DMOVLAY register is set to 0. When DMOVLAY is set to
something other than 0, external accesses occur at addresses
0x0000 through 0x1FFF. The external address is generated as
shown in Table III.
Byte Memory
Table III.
DMOVLAY
Memory
A13
A12:0
0
Internal
Not Applicable
Not Applicable
1
External 0
Overlay 1
13 LSBs of Address
Between 0x0000
and 0x1FFF
2
External 1
Overlay 2
13 LSBs of Address
Between 0x0000
and 0x1FFF
The byte memory space is a bidirectional, 8-bit-wide, external
memory space used to store programs and data. Byte memory is
accessed using the BDMA feature. The byte memory space
consists of 256 pages, each of which is 16K × 8.
The byte memory space on the ADSP-2183 supports read and
write operations as well as four different data formats. The byte
memory uses data bits 15:8 for data. The byte memory uses
data bits 23:16 and address bits 13:0 to create a 22-bit address.
This allows up to a 4 meg × 8 (32 megabit) ROM or RAM to be
used without glue logic. All byte memory accesses are timed by
the BMWAIT register.
This organization allows for two external 8K overlays using only
the normal 14 address bits.
Byte Memory DMA (BDMA)
The Byte memory DMA controller allows loading and storing of
program instructions and data using the byte memory space.
The BDMA circuit is able to access the byte memory space,
while the processor is operating normally and steals only one
DSP cycle per 8-, 16- or 24-bit word transferred.
All internal accesses complete in one cycle. Accesses to external
memory are timed using the wait states specified by the DWAIT
register.
I/O Space
The BDMA circuit supports four different data formats which
are selected by the BTYPE register field. The appropriate number of 8-bit accesses are done from the byte memory space to
build the word size selected. Table V shows the data formats
supported by the BDMA circuit.
The ADSP-2183 supports an additional external memory space
called I/O space. This space is designed to support simple connections to peripherals or to bus interface ASIC data registers.
I/O space supports 2048 locations. The lower eleven bits of the
external address bus are used; the upper 3 bits are undefined.
Two instructions were added to the core ADSP-2100 Family
instruction set to read from and write to I/O memory space.
The I/O space also has four dedicated 3-bit wait state registers, IOWAIT0-3, which specify up to seven wait states to be
automatically generated for each of four regions. The wait states
act on address ranges as shown in Table IV.
Table V.
Table IV.
Address Range
Wait State Register
0x000–0x1FF
0x200–0x3FF
0x400–0x5FF
0x600–0x7FF
IOWAIT0
IOWAIT1
IOWAIT2
IOWAIT3
BTYPE
Internal
Memory Space
Word Size
Alignment
00
01
10
11
Program Memory
Data Memory
Data Memory
Data Memory
24
16
8
8
Full Word
Full Word
MSBs
LSBs
Unused bits in the 8-bit data memory formats are filled with 0s.
The BIAD register field is used to specify the starting address
for the on-chip memory involved with the transfer. The 14-bit
BEAD register specifies the starting address for the external byte
memory space. The 8-bit BMPAGE register specifies the starting page for the external byte memory space. The BDIR register
field selects the direction of the transfer. Finally the 14-bit
BWCOUNT register specifies the number of DSP words to
transfer and initiates the BDMA circuit transfers.
Composite Memory Select (CMS)
The ADSP-2183 has a programmable memory select signal that
is useful for generating memory select signals for memories
mapped to more than one space. The CMS signal is generated
to have the same timing as each of the individual memory select
signals (PMS, DMS, BMS, IOMS) but can combine their
functionality.
BDMA accesses can cross page boundaries during sequential
addressing. A BDMA interrupt is generated on the completion
of the number of transfers specified by the BWCOUNT register.
The BWCOUNT register is updated after each transfer so it can
be used to check the status of the transfers. When it reaches
zero, the transfers have finished and a BDMA interrupt is generated. The BMPAGE and BEAD registers must not be accessed
by the DSP during BDMA operations.
When set, each bit in the CMSSEL register causes the CMS
signal to be asserted when the selected memory select is asserted. For example, to use a 32K word memory to act as both
program and data memory, set the PMS and DMS bits in the
CMSSEL register and use the CMS pin to drive the chip
select of the memory; use either DMS or PMS as the additional
address bit.
The source or destination of a BDMA transfer will always be
on-chip program or data memory, regardless of the values of
MMAP, PMOVLAY or DMOVLAY.
–8–
REV. C
ADSP-2183
When the BWCOUNT register is written with a nonzero value
the BDMA circuit starts executing byte memory accesses with
wait states set by BMWAIT. These accesses continue until the
count reaches zero. When enough accesses have occurred to create
a destination word, it is transferred to or from on-chip memory.
The transfer takes one DSP cycle. DSP accesses to external
memory have priority over BDMA byte memory accesses.
Table VI. Boot Summary Table
The BDMA Context Reset bit (BCR) controls whether the
processor is held off while the BDMA accesses are occurring.
Setting the BCR bit to 0 allows the processor to continue operations. Setting the BCR bit to 1 causes the processor to stop
execution while the BDMA accesses are occurring, to clear the
context of the processor and start execution at address 0 when
the BDMA accesses have completed.
MMAP
BMODE
Booting Method
0
0
BDMA feature is used in default mode
to load the first 32 program memory
words from the byte memory space.
Program execution is held off until all
32 words have been loaded.
0
1
IDMA feature is used to load any internal memory as desired. Program execution is held off until internal program
memory location 0 is written to.
1
X
Bootstrap features disabled. Program
execution immediately starts from
location 0.
Internal Memory DMA Port (IDMA Port)
The IDMA Port provides an efficient means of communication
between a host system and the ADSP-2183. The port is used to
access the on-chip program memory and data memory of the
DSP with only one DSP cycle per word overhead. The IDMA
port cannot, however, be used to write to the DSP’s memorymapped control registers.
BDMA Booting
When the BMODE and MMAP pins specify BDMA booting
(MMAP = 0, BMODE = 0), the ADSP-2183 initiates a BDMA
boot sequence when reset is released. The BDMA interface is
set up during reset to the following defaults when BDMA booting is specified: the BDIR, BMPAGE, BIAD and BEAD registers are set to 0, the BTYPE register is set to 0 to specify
program memory 24 bit words, and the BWCOUNT register is
set to 32. This causes 32 words of on-chip program memory to
be loaded from byte memory. These 32 words are used to set up
the BDMA to load in the remaining program code. The BCR
bit is also set to 1, which causes program execution to be held
off until all 32 words are loaded into on-chip program memory.
Execution then begins at address 0.
The IDMA port has a 16-bit multiplexed address and data bus
and supports 24-bit program memory. The IDMA port is
completely asynchronous and can be written to while the
ADSP-2183 is operating at full speed.
The DSP memory address is latched and then automatically
incremented after each IDMA transaction. An external device
can therefore access a block of sequentially addressed memory
by specifying only the starting address of the block. This increases throughput as the address does not have to be sent for
each memory access.
The ADSP-2100 Family Development Software (Revision 5.02
and later) fully supports the BDMA booting feature and can
generate byte memory space compatible boot code.
IDMA Port access occurs in two phases. The first is the IDMA
Address Latch cycle. When the acknowledge is asserted, a 14bit address and 1-bit destination type can be driven onto the bus
by an external device. The address specifies an on-chip memory
location; the destination type specifies whether it is a DM or
PM access. The falling edge of the address latch signal latches
this value into the IDMAA register.
The IDLE instruction can also be used to allow the processor to
hold off execution while booting continues through the BDMA
interface.
IDMA Booting
The ADSP-2183 can also boot programs through its Internal
DMA port. If BMODE = 1 and MMAP = 0, the ADSP-2183
boots from the IDMA port. IDMA feature can load as much onchip memory as desired. Program execution is held off until onchip program memory location 0 is written to.
Once the address is stored, data can either be read from or
written to the ADSP-2183’s on-chip memory. Asserting the
select line (IS) and the appropriate read or write line (IRD and
IWR respectively) signals the ADSP-2183 that a particular
transaction is required. In either case, there is a one-processorcycle delay for synchronization. The memory access consumes
one additional processor cycle.
The ADSP-2100 Family Development Software (Revision 5.02
and later) can generate IDMA compatible boot code.
Bus Request and Bus Grant
Once an access has occurred, the latched address is automatically incremented and another access can occur.
The ADSP-2183 can relinquish control of the data and address
buses to an external device. When the external device requires
access to memory, it asserts the bus request (BR) signal. If the
ADSP-2183 is not performing an external memory access, then
it responds to the active BR input in the following processor
cycle by:
Through the IDMAA register, the DSP can also specify the
starting address and data format for DMA operation.
Bootstrap Loading (Booting)
The ADSP-2183 has two mechanisms to allow automatic loading of the on-chip program memory after reset. The method for
booting after reset is controlled by the MMAP and BMODE
pins as shown in Table VI.
• three-stating the data and address buses and the PMS, DMS,
BMS, CMS, IOMS, RD, WR output drivers,
• asserting the bus grant (BG) signal, and
• halting program execution.
REV. C
–9–
ADSP-2183
If Go Mode is enabled, the ADSP-2183 will not halt program
execution until it encounters an instruction that requires an
external memory access.
• The syntax is a superset ADSP-2100 Family assembly language and is completely source and object code compatible
with other family members. Programs may need to be relocated to utilize on-chip memory and conform to the ADSP2183’s interrupt vector and reset vector map.
If the ADSP-2183 is performing an external memory access
when the external device asserts the BR signal, then it will not
three-state the memory interfaces or assert the BG signal until
the processor cycle after the access completes. The instruction
does not need to be completed when the bus is granted. If a
single instruction requires two external memory accesses, the
bus will be granted between the two accesses.
• Sixteen condition codes are available. For conditional jump,
call, return or arithmetic instructions, the condition can be
checked and the operation executed in the same instruction
cycle.
• Multifunction instructions allow parallel execution of an
arithmetic instruction with up to two fetches or one write to
processor memory space during a single instruction cycle.
When the BR signal is released, the processor releases the BG
signal, reenables the output drivers and continues program
execution from the point where it stopped.
DESIGNING AN EZ-ICE-COMPATIBLE SYSTEM
The bus request feature operates at all times, including when
the processor is booting and when RESET is active.
The ADSP-2183 has on-chip emulation support and an ICEPort, a special set of pins that interface to the EZ-ICE. These
features allow in-circuit emulation without replacing the target
system processor by using only a 14-pin connection from the
target system to the EZ-ICE. Target systems must have a 14-pin
connector to accept the EZ-ICE’s in-circuit probe, a 14-pin plug.
The BGH pin is asserted when the ADSP-2183 is ready to
execute an instruction, but is stopped because the external bus
is already granted to another device. The other device can release the bus by deasserting bus request. Once the bus is released, the ADSP-2183 deasserts BG and BGH and executes
the external memory access.
The ICE-Port interface consists of the following ADSP-2183 pins:
Flag I/O Pins
The ADSP-2183 has eight general purpose programmable input/output flag pins. They are controlled by two memory
mapped registers. The PFTYPE register determines the direction, 1 = output and 0 = input. The PFDATA register is used to
read and write the values on the pins. Data being read from a
pin configured as an input is synchronized to the ADSP-2183’s
clock. Bits that are programmed as outputs will read the value
being output. The PF pins default to input during reset.
EBR
EMS
ELIN
EBG
EINT
ELOUT
ERESET
ECLK
EE
These ADSP-2183 pins must be connected only to the EZ-ICE
connector in the target system. These pins have no function
except during emulation, and do not require pull-up or pulldown resistors. The traces for these signals between the ADSP2183 and the connector must be kept as short as possible, no
longer than three inches.
The following pins are also used by the EZ-ICE:
In addition to the programmable flags, the ADSP-2183 has five
fixed-mode flags, FLAG_IN, FLAG_OUT, FL0, FL1 and FL2.
FL0-FL2 are dedicated output flags. FLAG_IN and FLAG_OUT
are available as an alternate configuration of SPORT1.
BR
RESET
BG
GND
The EZ-ICE uses the EE (emulator enable) signal to take control of the ADSP-2183 in the target system. This causes the
processor to use its ERESET, EBR and EBG pins instead of the
RESET, BR and BG pins. The BG output is three-stated.
These signals do not need to be jumper-isolated in your system.
INSTRUCTION SET DESCRIPTION
The ADSP-2183 assembly language instruction set has an
algebraic syntax that was designed for ease of coding and readability. The assembly language, which takes full advantage of
the processor’s unique architecture, offers the following benefits:
The EZ-ICE connects to your target system via a ribbon cable
and a 14-pin female plug. The ribbon cable is 10 inches in
length with one end fixed to the EZ-ICE. The female plug is
plugged onto the 14-pin connector (a pin strip header) on the
target board.
• The algebraic syntax eliminates the need to remember cryptic
assembler mnemonics. For example, a typical arithmetic add
instruction, such as AR = AX0 + AY0, resembles a simple
equation.
• Every instruction assembles into a single, 24-bit word that can
execute in a single instruction cycle.
–10–
REV. C
ADSP-2183
Target Board Connector for EZ-ICE Probe
The EZ-ICE connector (a standard pin strip header) is shown
in Figure 7. You must add this connector to your target board
design if you intend to use the EZ-ICE. Be sure to allow enough
room in your system to fit the EZ-ICE probe onto the 14-pin
connector.
1
2
3
4
GND
BG
EBG
BR
5
6
7
8
EBR
EINT
KEY (NO PIN)
ELIN
9
10
11
12
ELOUT
ECLK
EE
EMS
13
14
ERESET
RESET
TOP VIEW
Figure 7. Target Board Connector for EZ-ICE
The 14-pin, 2-row pin strip header is keyed at the Pin 7 location—you must remove Pin 7 from the header. The pins must
be 0.025 inch square and at least 0.20 inch in length. Pin spacing should be 0.1 × 0.1 inches. The pin strip header must have
at least 0.15 inch clearance on all sides to accept the EZ-ICE
probe plug. Pin strip headers are available from vendors such as
3M, McKenzie, and Samtec.
Target Memory Interface
For your target system to be compatible with the EZ-ICE emulator, it must comply with the memory interface guidelines
listed below.
PM, DM, BM, IOM and CM
Design your Program Memory (PM), Data Memory (DM),
Byte Memory (BM), I/O Memory (IOM), and Composite
Memory (CM) external interfaces to comply with worst case
device timing requirements and switching characteristics as
specified in the DSP’s data sheet. The performance of the
EZ-ICE may approach published worst case specification for
some memory access timing requirements and switching
characteristics.
Restriction: All memory strobe signals on the ADSP-2183
(RD, WR, PMS, DMS, BMS, CMS and IOMS) used in your
target system must have 10 kΩ pull-up resistors connected
when the EZ-ICE is being used. The pull-up resistors are necessary because there are no internal pull-ups to guarantee their
state during prolonged three-state conditions resulting from
typical EZ-ICE debugging sessions. These resistors may be
removed at your option when the EZ-ICE is not being used.
Target System Interface Signals
When the EZ-ICE board is installed, the performance on some
system signals changes. Design your system to be compatible
with the following system interface signal changes introduced
by the EZ-ICE board:
• EZ-ICE emulation introduces an 8 ns propagation delay
between your target circuitry and the DSP on the RESET
signal.
• EZ-ICE emulation introduces an 8 ns propagation delay
between your target circuitry and the DSP on the BR signal.
• EZ-ICE emulation ignores RESET and BR when singlestepping.
• EZ-ICE emulation ignores RESET and BR when in Emulator Space (DSP halted).
• EZ-ICE emulation ignores the state of target BR in certain
modes. As a result, the target system may take control of the
DSP’s external memory bus only if bus grant (BG) is asserted
by the EZ-ICE board’s DSP.
Target Architecture File
The EZ-ICE software lets you load your program in its linked
(executable) form. The EZ-ICE PC program can not load
sections of your executable located in boot pages (by the
linker). With the exception of boot page 0 (loaded into PM
RAM), all sections of your executable mapped into boot pages
are not loaded.
Write your target architecture file to indicate that only PM
RAM is available for program storage, when using the EZ-ICE
software’s loading feature. Data can be loaded to PM RAM or
DM RAM.
Note: If your target does not meet the worst case chip specification for memory access parameters, you may not be able to
emulate your circuitry at the desired CLKIN frequency. Depending on the severity of the specification violation, you may
have trouble manufacturing your system as DSP components
statistically vary in switching characteristic and timing requirements within published limits.
REV. C
–11–
ADSP-2183–SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
K Grade
Parameter
VDD
TAMB
Supply Voltage
Ambient Operating Temperature
B Grade
Min
Max
Min
Max
Unit
3.0
0
3.6
+70
3.0
–40
3.6
+85
V
°C
ELECTRICAL CHARACTERISTICS
Parameter
VIH
VIL
VOH
Hi-Level Input Voltage1, 2
Lo-Level Input Voltage1, 3
Hi-Level Output Voltage1, 4, 5
VOL
Lo-Level Output Voltage1, 4, 5
IIH
Hi-Level Input Current3
IIL
Lo-Level Input Current3
IOZH
Three-State Leakage Current7
IOZL
Three-State Leakage Current7
IDD
Supply Current (Idle)9, 10
IDD
Supply Current (Dynamic)10, 12
CI
Input Pin Capacitance3, 6, 13
CO
Output Pin Capacitance6, 7, 13, 14
Test Conditions
Min
@ VDD = max
@ VDD = min
@ VDD = min
IOH = –0.5 mA
@ VDD = min
IOH = –100 µA6
@ VDD = min
IOL = 2 mA
@ VDD = max
VIN = VDD max
@ VDD = max
VIN = 0 V
@ VDD = max
VIN = VDD max8
@ VDD = max
VIN = 0 V8
@ VDD = 3.3
TAMB = +25°C
tCK = 19 ns11
tCK = 25 ns11
tCK = 30 ns11
tCK = 34.7 ns11
@ VDD = 3.3
TAMB = +25°C
tCK = 19 ns11
tCK = 25 ns11
tCK = 30 ns11
tCK = 34.7 ns11
@ VIN = 2.5 V
fIN = 1.0 MHz
TAMB = +25°C
@ VIN = 2.5 V
fIN = 1.0 MHz
TAMB = +25°C
2.0
K/B Grades
Typ
Max
Unit
0.4
V
V
2.4
V
VDD – 0.3
V
0.4
V
10
µA
10
µA
10
µA
8
µA
10
9
8
6
mA
mA
mA
mA
44
35
30
26
mA
mA
mA
mA
8
pF
8
pF
NOTES
1
Bidirectional pins: D0–D23, RFS0, RFS1, SCLK0, SCLK1, TFS0, TFS1, IAD0–IAD15, PF0–PF7.
12
Input only pins: RESET, IRQ2, BR, MMAP, DR0, DR1, PWD, IRQL0, IRQL1, IRQE, IS, IRD, IWR, IAL.
13
Input only pins: CLKIN, RESET, IRQ2, BR, MMAP, DR0, DR1, IS, IAL, IRD, IWR, IRQL0, IRQL1, IRQE, PWD.
14
Output pins: BG, PMS, DMS, BMS, IOMS, CMS, RD, WR, IACK, PWDACK, A0–A13, DT0, DT1, CLKOUT, FL2-0.
15
Although specified for TTL outputs, all ADSP-2183 outputs are CMOS-compatible and will drive to V DD and GND, assuming no dc loads.
16
Guaranteed but not tested.
17
Three-statable pins: A0–A13, D0–D23, PMS, DMS, BMS, IOMS, CMS, RD, WR, DT0, DT1, SCLK0, SCLK1, TFS0, TFS1, RFS0, RFS1, IAD0–IAD15, PF0–PF7.
18
0 V on BR, CLKIN Active (to force three-state condition).
19
Idle refers to ADSP-2183 state of operation during execution of IDLE instruction. Deasserted pins are driven to either V DD or GND.
10
Current reflects device operating with no output loads.
11
VIN = 0.4 V and 2.4 V. For typical figures for supply currents, refer to Power Dissipation section.
12
IDD measurement taken with all instructions executing from internal memory. 50% of the instructions are multifunction (types 1, 4, 5, 12, 13, 14), 30% are
1
type 2 and type 6, and 20% are idle instructions.
13
Applies to LQFP package type and Mini-BGA.
14
Output pin capacitance is the capacitive load for any three-stated output pin.
Specifications subject to change without notice.
–12–
REV. C
ADSP-2183
ABSOLUTE MAXIMUM RATINGS *
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V
Output Voltage Swing . . . . . . . . . . . . . . –0.5 V to VDD + 0.5 V
Operating Temperature Range (Ambient) . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (5 sec) LQFP . . . . . . . . . . . . . . . . . +280°C
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only; functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ESD SENSITIVITY
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADSP-2183 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
TIMING PARAMETERS
GENERAL NOTES
MEMORY TIMING SPECIFICATIONS
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results for
an individual device, the values given in this data sheet reflect
statistical variations and worst cases. Consequently, you cannot
meaningfully add up parameters to derive longer times.
The table below shows common memory device specifications
and the corresponding ADSP-2183 timing parameters, for your
convenience.
TIMING NOTES
Address Setup to
tASW
Write Start
Address Setup to
tAW
Write End
Address Hold Time tWRA
Switching Characteristics specify how the processor changes its
signals. You have no control over this timing—circuitry external
to the processor must be designed for compatibility with these
signal characteristics. Switching characteristics tell you what the
processor will do in a given circumstance. You can also use switching characteristics to ensure that any timing requirement of a
device connected to the processor (such as memory) is satisfied.
Timing Requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read
operation. Timing requirements guarantee that the processor
operates correctly with other devices.
Memory
Device
Specification
Data Setup Time
ADSP-2183 Timing
Timing
Parameter
Parameter Definition
tDW
Data Hold Time
tDH
OE to Data Valid
tRDD
Address Access Time tAA
A0–A13, xMS Setup before
WR Low
A0–A13, xMS Setup before
WR Deasserted
A0–A13, xMS Hold after
WR Deasserted
Data Setup before WR
High
Data Hold after WR High
RD Low to Data Valid
A0–A13, xMS to Data Valid
xMS = PMS, DMS, BMS, CMS, IOMS.
FREQUENCY DEPENDENCY FOR TIMING
SPECIFICATIONS
tCK is defined as 0.5tCKI. The ADSP-2183 uses an input clock
with a frequency equal to half the instruction rate: a 16.67 MHz
input clock (which is equivalent to 60 ns) yields a 30 ns processor cycle (equivalent to 33 MHz). tCK values within the range of
0.5tCKI period should be substituted for all relevant timing parameters to obtain the specification value.
Example: tCKH = 0.5tCK – 7 ns = 0.5 (34.7 ns) – 7 ns = 10.35 ns
REV. C
–13–
ADSP-2183
Parameter
Min
Max
38
15
15
100
Clock Signals and Reset
Timing Requirements:
tCKI
CLKIN Period
CLKIN Width Low
tCKIL
tCKIH
CLKIN Width High
Switching Characteristics:
CLKOUT Width Low
tCKL
tCKH
CLKOUT Width High
tCKOH
CLKIN High to CLKOUT High
0.5tCK – 7
0.5tCK – 7
0
Control Signals
Timing Requirement:
tRSP
RESET Width Low
5tCK1
20
Unit
ns
ns
ns
ns
ns
ns
ns
NOTE
1
Applies after power-up sequence is complete. Internal phase lock loop requires no more than 2000 CLKIN cycles assuming stable CLKIN (not including crystal
oscillator start-up time).
tCKI
tCKIH
CLKIN
tCKIL
tCKOH
tCKH
CLKOUT
tCKL
Figure 8. Clock Signals
Parameter
Min
Interrupts and Flag
Timing Requirements:
IRQx, FI, or PFx Setup before CLKOUT Low 1, 2, 3, 4
tIFS
tIFH
IRQx, FI, or PFx Hold after CLKOUT High 1, 2, 3, 4
Switching Characteristics:
Flag Output Hold after CLKOUT Low5
tFOH
tFOD
Flag Output Delay from CLKOUT Low5
Max
0.25tCK + 15
0.25tCK
Unit
ns
ns
0.5tCK – 7
0.5tCK + 6
ns
ns
NOTES
1
If IRQx and FI inputs meet t IFS and tIFH setup/hold requirements, they will be recognized during the current clock cycle; otherwise the signals will be recognized on
the following cycle. (Refer to Interrupt Controller Operation in the Program Control chapter of the User’s Manual for further information on interrupt servicing.)
2
Edge-sensitive interrupts require pulsewidths greater than 10 ns; level-sensitive interrupts must be held low until serviced.
3
IRQx = IRQ0, IRQ1, IRQ2, IRQL0, IRQL1, IRQE.
4
PFx = PF0, PF1, PF2, PF3, PF4, PF5, PF6, PF7.
5
Flag outputs = PFx, FL0, FL1, FL2, Flag_out4.
tFOD
CLKOUT
tFOH
FLAG
OUTPUTS
tIFH
IRQx
FI
PFx
tIFS
Figure 9. Interrupts and Flags
–14–
REV. C
ADSP-2183
Parameter
Min
Max
Unit
Bus Request–Bus Grant
Timing Requirements:
BR Hold after CLKOUT High1
tBH
BR Setup before CLKOUT Low1
tBS
0.25tCK + 2
0.25tCK + 17
Switching Characteristics:
tSD
CLKOUT High to xMS,
RD, WR Disable
xMS, RD, WR
tSDB
Disable to BG Low
BG High to xMS,
tSE
RD, WR Enable
tSEC
xMS, RD, WR
Enable to CLKOUT High
tSDBH
xMS, RD, WR
Disable to BGH Low2
BGH High to xMS,
tSEH
RD, WR Enable2
ns
ns
0.25tCK + 10
ns
0
ns
0
ns
0.25tCK – 4
ns
0
ns
0
ns
NOTES
xMS = PMS, DMS, CMS, IOMS, BMS.
1
BR is an asynchronous signal. If BR meets the setup/hold requirements, it will be recognized during the current clock cycle; otherwise the signal will be recognized on
the following cycle. Refer to the ADSP-2100 Family User’s Manual, Third Edition, for BR/BG cycle relationships.
2
BGH is asserted when the bus is granted and the processor requires control of the bus to continue.
tBH
CLKOUT
BR
tBS
CLKOUT
PMS, DMS
BMS, RD
WR
tSD
tSEC
BG
tSDB
tSE
BGH
tSDBH
tSEH
Figure 10. Bus Request–Bus Grant
REV. C
–15–
ADSP-2183
Parameter
Min
Max
Unit
0.5tCK – 8 + w
0.75tCK – 10.5 + w
ns
ns
ns
Memory Read
Timing Requirements:
RD Low to Data Valid
tRDD
A0–A13, xMS to Data Valid
tAA
tRDH
Data Hold from RD High
0
Switching Characteristics:
RD Pulsewidth
tRP
tCRD
CLKOUT High to RD Low
A0–A13, xMS Setup before RD Low
tASR
A0–A13, xMS Hold after RD Deasserted
tRDA
tRWR
RD High to RD or WR Low
0.5tCK – 5 + w
0.25tCK – 2
0.25tCK – 4
0.25tCK – 3
0.5tCK – 5
0.25tCK + 7
ns
ns
ns
ns
ns
w = wait states × tCK.
xMS = PMS, DMS, CMS, IOMS, BMS.
CLKOUT
A0 – A13
DMS, PMS,
BMS, IOMS,
CMS
tRDA
RD
tASR
tCRD
tRP
tRWR
D
tAA
tRDD
tRDH
WR
Figure 11. Memory Read
–16–
REV. C
ADSP-2183
Parameter
Min
Max
Unit
Memory Write
Switching Characteristics:
Data Setup before WR High
tDW
Data Hold after WR High
tDH
tWP
WR Pulsewidth
tWDE
WR Low to Data Enabled
A0–A13, xMS Setup before WR Low
tASW
tDDR
Data Disable before WR or RD Low
tCWR
CLKOUT High to WR Low
A0–A13, xMS, Setup before WR Deasserted
tAW
tWRA
A0–A13, xMS Hold after WR Deasserted
tWWR
WR High to RD or WR Low
0.5tCK – 7 + w
0.25tCK – 2
0.5tCK – 5 + w
0
0.25tCK – 4
0.25tCK – 4
0.25tCK – 2
0.75tCK – 9 + w
0.25tCK – 3
0.5tCK – 5
0.25 tCK + 7
w = wait states × tCK.
xMS = PMS, DMS, CMS, IOMS, BMS.
CLKOUT
A0–A13
DMS, PMS,
BMS, CMS,
IOMS
tWRA
WR
tASW
tWWR
tWP
tAW
tDH
tCWR
D
tWDE
tDW
RD
Figure 12. Memory Write
REV. C
–17–
tDDR
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ADSP-2183
Parameter
Min
Max
Unit
Serial Ports
Timing Requirements:
SCLK Period
tSCK
tSCS
DR/TFS/RFS Setup before SCLK Low
DR/TFS/RFS Hold after SCLK Low
tSCH
SCLKIN Width
tSCP
38
4
7
15
Switching Characteristics:
CLKOUT High to SCLKOUT
tCC
SCLK High to DT Enable
tSCDE
tSCDV
SCLK High to DT Valid
TFS/RFSOUT Hold after SCLK High
tRH
TFS/RFSOUT Delay from SCLK High
tRD
tSCDH
DT Hold after SCLK High
TFS (Alt) to DT Enable
tTDE
TFS (Alt) to DT Valid
tTDV
tSCDD
SCLK High to DT Disable
tRDV
RFS (Multichannel, Frame Delay Zero) to DT Valid
CLKOUT
tCC
ns
ns
ns
ns
0.25tCK
0
0.25tCK + 10
15
0
15
0
0
14
15
15
tCC
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tSCK
SCLK
tSCP
tSCS
tSCP
tSCH
DR
TFSIN
RFSIN
tRD
tRH
RFSOUT
TFSOUT
tSCDD
tSCDV
tSCDH
tSCDE
DT
tTDE
tTDV
TFS
ALTERNATE
FRAME MODE
tRDV
RFS
MULTICHANNEL MODE,
FRAME DELAY 0
(MFD = 0)
Figure 13. Serial Ports
–18–
REV. C
ADSP-2183
Parameter
Min
Max
Unit
IDMA Address Latch
Timing Requirements:
Duration of Address Latch1, 2
tIALP
IAD15–0 Address Setup before Address Latch End2
tIASU
tIAH
IAD15–0 Address Hold after Address Latch End2
tIKA
IACK Low before Start of Address Latch1
tIALS
Start of Write or Read after Address Latch End2, 3
10
5
2
0
3
NOTES
1
Start of Address Latch = IS Low and IAL High.
2
End of Address Latch = IS High or IAL Low.
3
Start of Write or Read = IS Low and IWR Low or IRD Low.
IACK
tIKA
IAL
tIALP
IS
tIASU
tIAH
IAD15–0
tIALS
IRD OR
IWR
Figure 14. IDMA Address Latch
REV. C
–19–
ns
ns
ns
ns
ns
ADSP-2183
Parameter
Min
Max
Unit
IDMA Write, Short Write Cycle
Timing Requirements:
IACK Low before Start of Write1
tIKW
Duration of Write1, 2
tIWP
tIDSU
IAD15–0 Data Setup before End of Write2, 3, 4
tIDH
IAD15–0 Data Hold after End of Write2, 3, 4
0
15
5
2
Switching Characteristic:
tIKHW
Start of Write to IACK High
ns
ns
ns
ns
15
ns
NOTES
1
Start of Write = IS Low and IWR Low.
2
End of Write = IS High or IWR High.
3
If Write Pulse ends before IACK Low, use specifications t IDSU, tIDH.
4
If Write Pulse ends after IACK Low, use specifications t IKSU, tIKH.
tIKW
IACK
tIKHW
IS
tIWP
IWR
tIDSU
IAD15–0
tIDH
DATA
Figure 15. IDMA Write, Short Write Cycle
–20–
REV. C
ADSP-2183
Parameter
Min
Max
Unit
IDMA Write, Long Write Cycle
Timing Requirements:
IACK Low before Start of Write1
tIKW
IAD15–0 Data Setup before IACK Low2, 3
tIKSU
tIKH
IAD15–0 Data Hold after IACK Low2, 3
0
0.5tCK + 10
2
Switching Characteristics:
Start of Write to IACK Low4
tIKLW
tIKHW
Start of Write to IACK High
ns
ns
ns
1.5tCK
15
ns
ns
NOTES
1
Start of Write = IS Low and IWR Low.
2
If Write Pulse ends before IACK Low, use specifications t IDSU, tIDH.
3
If Write Pulse ends after IACK Low, use specifications t IKSU, tIKH.
4
This is the earliest time for IACK Low from Start of Write. For IDMA Write Cycle relationships, please refer to the ADSP-21xx Family User’s Manual, Third Edition.
tIKW
IACK
tIKHW
tIKLW
IS
IWR
tIKSU
tIKH
DATA
IAD15–0
Figure 16. IDMA Write, Long Write Cycle
REV. C
–21–
ADSP-2183
Parameter
Min
Max
Unit
IDMA Read, Long Read Cycle
Timing Requirements:
IACK Low before Start of Read1
tIKR
tIRP
Duration of Read
0
15
Switching Characteristics:
IACK High after Start of Read1
tIKHR
tIKDS
IAD15–0 Data Setup before IACK Low
tIKDH
IAD15–0 Data Hold after End of Read2
IAD15–0 Data Disabled after End of Read2
tIKDD
tIRDE
IAD15–0 Previous Data Enabled after Start of Read
tIRDV
IAD15–0 Previous Data Valid after Start of Read
IAD15–0 Previous Data Hold after Start of Read (DM/PM1)3
tIRDH1
tIRDH2
IAD15–0 Previous Data Hold after Start of Read (PM2)4
ns
ns
15
0.5tCK – 7
0
10
0
15
2tCK – 5
tCK – 5
ns
ns
ns
ns
ns
ns
ns
ns
NOTES
1
Start of Read = IS Low and IRD Low.
2
End of Read = IS High or IRD High.
3
DM read or first half of PM read.
4
Second half of PM read.
IACK
tIKHR
tIKR
IS
tIRP
IRD
tIKDS
tIRDE
PREVIOUS
DATA
IAD15–0
tIKDH
READ
DATA
tIRDV
tIKDD
tIRDH
Figure 17. IDMA Read, Long Read Cycle
–22–
REV. C
ADSP-2183
Parameter
Min
Max
Unit
IDMA Read, Short Read Cycle
Timing Requirements:
IACK Low before Start of Read1
tIKR
Duration of Read
tIRP
0
15
Switching Characteristics:
tIKHR
IACK High after Start of Read1
IAD15–0 Data Hold after End of Read2
tIKDH
tIKDD
IAD15–0 Data Disabled after End of Read2
tIRDE
IAD15–0 Previous Data Enabled after Start of Read
tIRDV
IAD15–0 Previous Data Valid after Start of Read
ns
ns
15
0
10
0
15
NOTES
1
Start of Read = IS Low and IRD Low.
2
End of Read = IS High or IRD High.
IACK
tIKR
tIKHR
IS
tIRP
IRD
tIKDH
tIRDE
PREVIOUS
DATA
IAD15–0
tIRDV
tIKDD
Figure 18. IDMA Read, Short Read Cycle
REV. C
–23–
ns
ns
ns
ns
ns
ADSP-2183
OUTPUT DRIVE CURRENTS
Figure 19 shows typical I-V characteristics for the output drivers
of the ADSP-2183. The curves represent the current drive
capability of the output drivers as a function of output voltage.
PINT = internal power dissipation from Power vs. Frequency
graph (Figure 20).
(C × VDD2 × f ) is calculated for each output:
# of
Pins × C
100
75
Address, DMS
Data Output, WR
RD
CLKOUT
SOURCE CURRENT – mA
50
25
3.6V, –40°C
3.3V, +25°C
0
3.0V, +85°C
–25
× 10 pF
× 10 pF
× 10 pF
× 10 pF
8
9
1
1
×f
× 3.3 V
× 3.32 V
× 3.32 V
× 3.32 V
× 33.3 MHz
× 16.67 MHz
× 16.67 MHz
× 33.3 MHz
2
–50
3.3V, +25°C
–100
Total power dissipation for this example is PINT + 50.7 mW.
3.6V, –40°C
–125
2183 POWER, INTERNAL1, 3, 4
220
–150
205
–175
190
0
0.75
1.50
2.25
3.00
3.75
SOURCE VOLTAGE – V
4.50
184mW
175
5.25
VDD = 3.6V
160
Figure 19. Typical Drive Currents
150mW
145
130
1000
VDD = 3.3V
110mW
120mW
115
VDD = 3.0V
CURRENT (LOG SCALE) – ␮A
100 90mW
VDD = 3.6V
VDD = 3.3V
VDD = 3.0V
100
85 72mW
70
28
32
36
40
44
1/tCK – MHz
48
52
POWER, IDLE1, 2, 3
50
45
10
38mW
40
VDD = 3.6V
35
30mW
30 27mW
25
0
= 29.0 mW
= 16.3 mW
= 1.8 mW
= 3.6 mW
50.7 mW
3.0V, +85°C
–75
–200
0
25
55
TEMPERATURE – °C
85
15
32
36
40
44
1/tCK – MHz
48
52
POWER, IDLE n MODES3
32
30mW
30
IDLE
28
26
24
22
C = load capacitance, f = output switching frequency.
20
Example:
18
In an application where external data memory is used and no
other outputs are active, power dissipation is calculated as
follows:
Assumptions:
16
20mW
13.8mW
14
12
10
8
External data memory is accessed every cycle with 50% of the
address pins switching.
Each address and data pin has a 10 pF total load at the pin.
15mW
0
28
To determine total power dissipation in a specific application,
the following equation should be applied for each output:
C × VDD2 × f
•
•
24mW
VDD = 3.0V
5
POWER DISSIPATION
External data memory writes occur every other cycle with
50% of the data pins switching.
20mW
10
Figure 20. Power-Down Supply Current (Typical)
•
VDD = 3.3V
20
NOTES:
1. REFLECTS ADSP-2183 OPERATION IN LOWEST POWER MODE.
(SEE "SYSTEM INTERFACE" CHAPTER OF THE ADSP-2100 FAMILY
USER'S MANUAL FOR DETAILS.)
2. CURRENT REFLECTS DEVICE OPERATING WITH NO INPUT LOADS.
•
× VDD2
The application operates at VDD = 3.3 V and tCK = 30.0 ns.
Total Power Dissipation = PINT + (C × VDD2 × f )
IDLE (16)
IDLE (128)
11mW
13mW
10.6mW
28
32
36
40
44
1/tCK – MHz
48
52
VALID FOR ALL TEMPERATURE GRADES.
1POWER REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.
2IDLE REFERS TO ADSP-2183 STATE OF OPERATION DURING EXECUTION OF IDLE
INSTRUCTION. DEASSERTED PINS ARE DRIVEN TO EITHER VDD OR GND.
3TYPICAL POWER DISSIPATION AT 3.3V V
DD AND 25ⴗC EXCEPT WHERE SPECIFIED.
4I
DD MEASUREMENT TAKEN WITH ALL INSTRUCTIONS EXECUTING FROM INTERNAL
MEMORY. 50% OF THE INSTRUCTIONS ARE MULTIFUNCTION (TYPES 1,4,5,12,13,14),
30% ARE TYPE 2 AND TYPE 6, AND 20% ARE IDLE INSTRUCTIONS.
Figure 21. Power vs. Frequency
–24–
REV. C
ADSP-2183
is calculated. If multiple pins (such as the data bus) are disabled, the measurement value is that of the last pin to stop
driving.
CAPACITIVE LOADING
Figures 22 and 23 show the capacitive loading characteristics of
the ADSP-2183.
25
T = +85ⴗC
VDD = 3.0V
INPUT
OR
OUTPUT
1.5V
1.5V
RISE TIME (0.4V – 2.4V) – ns
20
Figure 24. Voltage Reference Levels for AC Measurements (Except Output Enable/Disable)
15
Output Enable Time
Output pins are considered to be enabled when they have made
a transition from a high-impedance state to when they start
driving. The output enable time (tENA) is the interval from when
a reference signal reaches a high or low voltage level to when the
output has reached a specified high or low trip point, as shown
in the Output Enable/Disable diagram. If multiple pins (such as
the data bus) are enabled, the measurement value is that of the
first pin to start driving.
10
5
0
0
20
40
60
80
100 120
CL – pF
140
160
180
200
Figure 22. Typical Output Rise Time vs. Load Capacitance,
CL (at Maximum Ambient Operating Temperature)
REFERENCE
SIGNAL
tMEASURED
18
tENA
16
VOH
(MEASURED)
VALID OUTPUT DELAY
OR HOLD – ns
14
12
tDIS
VOH
(MEASURED)
OUTPUT
10
VOH (MEASURED) – 0.5V
2.0V
VOL (MEASURED) +0.5V
1.0V
VOL
(MEASURED)
8
VOL
(MEASURED)
tDECAY
6
OUTPUT STARTS
DRIVING
OUTPUT STOPS
DRIVING
4
2
HIGH-IMPEDANCE STATE. TEST CONDITIONS CAUSE
THIS VOLTAGE LEVEL TO BE APPROXIMATELY 1.5V.
NOMINAL
–2
Figure 25. Output Enable/Disable
–4
–6
0
40
80
120
CL – pF
160
IOL
200
Figure 23. Typical Output Valid Delay or Hold vs. Load
Capacitance, CL (at Maximum Ambient Operating
Temperature)
TO
OUTPUT
PIN
TEST CONDITIONS
Output Disable Time
Output pins are considered to be disabled when they have
stopped driving and started a transition from the measured
output high or low voltage to a high impedance state. The output disable time (tDIS) is the difference of tMEASURED and tDECAY,
as shown in the Output Enable/Disable diagram. The time is the
interval from when a reference signal reaches a high or low
voltage level to when the output voltages have changed by 0.5 V
from the measured output high or low voltage. The decay time,
tDECAY, is dependent on the capacitive load, CL, and the current
load, iL, on the output pin. It can be approximated by the following equation:
t DECAY =
IOH
Figure 26. Equivalent Device Loading for AC Measurements (Including All Fixtures)
ENVIRONMENTAL CONDITIONS
Ambient Temperature Rating:
TAMB = TCASE – (PD × θ CA)
TCASE = Case Temperature in °C
PD = Power Dissipation in W
θ CA = Thermal Resistance (Case-to-Ambient)
θ JA = Thermal Resistance (Junction-to-Ambient)
θ JC = Thermal Resistance (Junction-to-Case)
CL • 0.5V
iL
from which
t DIS = t MEASURED – t DECAY
REV. C
+1.5V
50pF
Package
␪JA
␪JC
␪CA
LQFP
Mini-BGA
50°C/W
70.7°C/W
2°C/W
7.4°C/W
48°C/W
63.3°C/W
–25–
ADSP-2183
104 IRD
103 IWR
105 IAD15
106 IAD14
108 IAD12
107 IAD13
109 IAD11
111 IAD9
110 IAD10
112 IAD8
114 IAD6
113 IAD7
115 VDD
116 GND
117 IAD5
118 IAD4
119 IAD3
121 IAD1
120 IAD2
122 IAD0
124 PF6
123 PF7
126 PF4
125 PF5
128 IS
127 GND
128-Lead LQFP Package Pinout
102 GND
IAL
1
PF3
2
PF2
3
PF1
4
99 D21
PF0
5
98 D20
WR
6
97 D19
RD
7
96 D18
IOMS
8
95 D17
BMS
9
PIN 1
IDENTIFIER
101 D23
100 D22
94 D16
DMS 10
93 D15
CMS 11
92 GND
GND 12
91 VDD
VDD 13
90 GND
PMS 14
89 D14
A0 15
88 D13
A1 16
87 D12
86 D11
A2 17
A3 18
85 D10
ADSP-2183
A4 19
84 D9
TOP VIEW
(Not to Scale)
A5 20
83 D8
A6 21
82 D7
A7 22
81 D6
XTAL 23
80 D5
79 GND
CLKIN 24
GND 25
78 D4
CLKOUT 26
77 D3
GND 27
76 D2
VDD 28
75 D1
A8 29
74 D0
A9 30
73 VDD
A10 31
72 BG
A11 32
71 EBG
70 BR
A12 33
IRQE 35
69 EBR
68 EINT
MMAP 36
67 ELIN
A13 34
PWD 37
IRQ2 38
66 ELOUT
–26–
EMS 63
EE 64
ERESET 61
RESET 62
SCLK1 60
DR1/FI 59
RFS1/IRQ0 57
GND 58
DT1/F0 55
TFS1/ IRQ1 56
SCLK0 54
DR0 53
RFS0 52
TFS0 51
DT0 50
FL2 49
FL1 48
FL0 47
IRQL0 45
IRQL1 46
VDD 43
GND 44
IACK 41
BGH 42
BMODE 39
PWDACK 40
65 ECLK
REV. C
ADSP-2183
LQFP Pin Configurations
LQFP
Number
Pin
Name
LQFP
Number
Pin
Name
LQFP
Number
Pin
Name
LQFP
Number
Pin
Name
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
IAL
PF3
PF2
PF1
PF0
WR
RD
IOMS
BMS
DMS
CMS
GND
VDD
PMS
A0
A1
A2
A3
A4
A5
A6
A7
XTAL
CLKIN
GND
CLKOUT
GND
VDD
A8
A9
A10
A11
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
A12
A13
IRQE
MMAP
PWD
IRQ2
BMODE
PWDACK
IACK
BGH
VDD
GND
IRQL0
IRQL1
FL0
FL1
FL2
DT0
TFS0
RFS0
DR0
SCLK0
DT1/F0
TFS1/IRQ1
RFS1/IRQ0
GND
DR1/FI
SCLK1
ERESET
RESET
EMS
EE
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
ECLK
ELOUT
ELIN
EINT
EBR
BR
EBG
BG
VDD
D0
D1
D2
D3
D4
GND
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
GND
VDD
GND
D15
D16
D17
D18
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
D19
D20
D21
D22
D23
GND
IWR
IRD
IAD15
IAD14
IAD13
IAD12
IAD11
IAD10
IAD9
IAD8
IAD7
IAD6
VDD
GND
IAD5
IAD4
IAD3
IAD2
IAD1
IAD0
PF7
PF6
PF5
PF4
GND
IS
REV. C
–27–
ADSP-2183
144-Lead Mini-BGA Package Pinout
(Bottom View)
12
11
10
9
8
7
6
5
4
3
2
1
GND
GND
IWR
IAD14
IAD10
IAD6
GND
IAD2
PF6
GND
IS
IAL
A
D21
D23
IRD
IAD15
IAD11
VDD
GND
IAD1
PF5
GND
PF3
PF1
B
D17
D20
D22
IAD13
IAD8
VDD
IAD0
PF4
PF2
WR
PF0
RD
C
GND
D15
D18
D19
D16
IAD9
IAD5
PF7
IOMS
GND
DMS
GND
D
D14
GND
VDD
GND
GND
IAD7
CMS
IAD3
BMS
A0
VDD
VDD
E
D10
D11
D13
D12
IAD12
D8
IAD4
PMS
A3
A4
A1
A2
F
D6
D5
D9
D4
D7
DT0
A7
A8
A6
GND
A5
XTAL
G
GND
D2
GND
D0
D3
DT1
IRQL0
VDD
GND
GND
GND
CLKIN
H
VDD
VDD
D1
BG
RFS1
SCLK0
IRQL1
VDD
VDD
A10
VDD
CLKOUT
J
EBG
BR
EBR
ERESET
SCLK1
TFS1
TFS0
FL2
PWDACK
A11
A12
A9
K
EINT
ELOUT
ELIN
RESET
GND
DR0
FL0
GND
IACK
IRQE
MMAP
A13
L
ECLK
EE
EMS
DR1
GND
RFS0
FL1
GND
BGH
BMODE
IRQ2
PWD
M
–28–
REV. C
ADSP-2183
Mini-BGA Pin Configurations
Ball #
Name
Ball #
Name
Ball #
Name
Ball #
Name
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
B01
B02
B03
B04
B05
B06
B07
B08
B09
B10
B11
B12
C01
C02
C03
C04
C05
C06
C07
C08
C09
C10
C11
C12
IAL
IS
GND
PF6
IAD2
GND
IAD6
IAD10
IAD14
IWR
GND
GND
PF1
PF3
GND
PF5
IAD1
GND
VDD
IAD11
IAD15
IRD
D23
D21
RD
PF0
WR
PF2
PF4
IAD0
VDD
IAD8
IAD13
D22
D20
D17
D01
D02
D03
D04
D05
D06
D07
D08
D09
D10
D11
D12
E01
E02
E03
E04
E05
E06
E07
E08
E09
E10
E11
E12
F01
F02
F03
F04
F05
F06
F07
F08
F09
F10
F11
F12
GND
DMS
GND
IOMS
PF7
IAD5
IAD9
D16
D19
D18
D15
GND
VDD
VDD
A0
BMS
IAD3
CMS
IAD7
GND
GND
VDD
GND
D14
A2
A1
A4
A3
PMS
IAD4
D8
IAD12
D12
D13
D11
D10
G01
G02
G03
G04
G05
G06
G07
G08
G09
G10
G11
G12
H01
H02
H03
H04
H05
H06
H07
H08
H09
H10
H11
H12
J01
J02
J03
J04
J05
J06
J07
J08
J09
J10
J11
J12
XTAL
A5
GND
A6
A8
A7
DT0
D7
D4
D9
D5
D6
CLKIN
GND
GND
GND
VDD
IRQL0
DT1
D3
D0
GND
D2
GND
CLKOUT
VDD
A10
VDD
VDD
IRQL1
SCLK0
RFS1
BG
D1
VDD
VDD
K01
K02
K03
K04
K05
K06
K07
K08
K09
K10
K11
K12
L01
L02
L03
L04
L05
L06
L07
L08
L09
L10
L11
L12
M01
M02
M03
M04
M05
M06
M07
M08
M09
M10
M11
M12
A9
A12
A11
PWDACK
FL2
TFS0
TFS1
SCLK1
ERESET
EBR
BR
EBG
A13
MMAP
IRQE
IACK
GND
FL0
DR0
GND
RESET
ELIN
ELOUT
EINT
PWD
IRQ2
BMODE
BGH
GND
FL1
RFS0
GND
DR1
EMS
EE
ECLK
REV. C
–29–
ADSP-2183
OUTLINE DIMENSIONS
Dimensions given in mm and (inches).
128-Lead Metric Plastic Thin Quad Flatpack (LQFP)
(ST-128)
16.20 (0.638)
16.00 (0.630)
15.80 (0.622)
1.60 (0.063)
MAX
0.75 (0.030)
0.60 (0.024)
0.50 (0.020)
103
102
128
1
22.20 (0.874)
22.00 (0.866)
21.80 (0.858)
SEATING
PLANE
TOP VIEW
0.08 (0.003)
MAX LEAD
COPLANARITY
0.15 (0.006)
0.05 (0.002)
38
39
1.45 (0.057)
1.40 (0.055)
1.35 (0.053)
20.10 (0.792)
20.00 (0.787)
19.90 (0.783)
(PINS DOWN)
65
64
0.50 (0.020)
BSC
LEAD PITCH
0.27 (0.011)
0.22 (0.009)
0.17 (0.007)
LEAD WIDTH
14.10 (0.555)
14.00 (0.551)
13.90 (0.547)
NOTES:
THE ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08
(0.0032) FROM ITS IDEAL POSITION WHEN MEASURED IN THE
LATERAL DIRECTION.
CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED
–30–
REV. C
ADSP-2183
OUTLINE DIMENSIONS
Dimensions given in mm and (inches).
0.404 (10.25)
0.394 (10.00) SQ
0.384 (9.75)
TOP VIEW
C00184b–0–7/00 (rev. C)
144-Lead Mini-BGA Package Pinout
(CA-144)
12 11 10 9 8 7 6 5 4 3 2 1
0.404 (10.25)
0.394 (10.00) SQ
0.384 (9.75)
A
B
C
D
E
F
G
H
J
K
L
M
0.346
(8.80)
BSC
0.031
(0.80)
BSC
0.031 (0.80) BSC
0.346 (8.80) BSC
DETAIL A
0.067 (1.70) MAX
0.010
(0.25)
NOM
NOTE
THE ACTUAL POSITION OF THE BALL POPULATION
0.010 (0.25) MIN
IS WITHIN 0.006 (0.150) OF ITS IDEAL POSITION
RELATIVE TO THE PACKAGE EDGES. THE ACTUAL
POSITION OF EACH BALL IS WITHIN 0.003 (0.08) OF
ITS IDEAL POSITION RELATIVE TO THE BALL POPULATION.
DETAIL A
0.034 (0.85) MIN
0.022 (0.55)
0.005
(0.12)
0.020 (0.50)
MAX
0.018 (0.45)
BALL DIAMETER
SEATING
PLANE
Part Number
Ambient
Temperature
Range
Instruction
Rate
(MHz)
Package
Description
Package
Option
ADSP-2183KST-115
ADSP-2183BST-115
ADSP-2183KST-133
ADSP-2183BST-133
ADSP-2183KST-160
ADSP-2183BST-160
ADSP-2183KST-210
ADSP-2183KCA-210
0°C to +70°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
28.8
28.8
33.3
33.3
40
40
52
52
128-Lead LQFP
128-Lead LQFP
128-Lead LQFP
128-Lead LQFP
128-Lead LQFP
128-Lead LQFP
128-Lead LQFP
144-Lead Mini-BGA
ST-128
ST-128
ST-128
ST-128
ST-128
ST-128
ST-128
CA-144
REV. C
–31–
PRINTED IN U.S.A.
ORDERING GUIDE