MITSUBISHI MH8S72BAFD-7

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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PRELIMINARY
Some of contents are subject to change without notice.
DESCRIPTION
The MH8S72BAFD is 8388608 - word x 72-bit
Synchronous DRAM stacked structural module. This consist
of nine industry standard 8M x 8 Synchronous DRAMs in
TSOP.
The mounting of TSOP on a card edge dual in-line package
provides any application where high densities and large of
quantities memory are required.
This is a socket-type memory module ,suitable for easy
interchange or addition of module.
FEATURES
CLK
Access Time
[component level]
MH8S72BAFD-7
100MHz
6ns (CL = 2, 3)
MH8S72BAFD-8
100MHz
6ns (CL = 3)
APPLICATION
Main memory unit for computers, Microcomputer memory.
MIT-DS-0273-0.2
1pin
94pin
10pin
95pin
11pin
124pin
40pin
125pin
41pin
168pin
84pin
Front side
Utilizes industry standard 8M X 8 Synchronous DRAMs in
TSOP package , industry standard Resister in TSSOP
package
Single 3.3V +/- 0.3V supply
LVTTL Interface
4096 refresh cycles every 64ms
Discrete IC and module design conform to
PC/100 specification.
(module Spec. Rev. 1.1 and SPD 1.2A)
Back side
Type name
Max.
Frequency
85pin
1/ Dec./1998
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PIN NO.
PIN NAME
PIN NO.
PIN NAME
PIN NO.
PIN NAME
PIN NO.
1
VSS
43
VSS
2
DQ0
44
NC
3
DQ1
45
4
DQ2
46
5
DQ3
47
6
VDD
48
7
DQ4
8
DQ5
PIN NAME
85
VSS
127
VSS
86
DQ32
128
CKE0
/S2
87
DQ33
129
NC
DQMB2
88
DQ34
130
DQMB6
DQMB3
89
DQ35
131
DQMB7
NC
90
VDD
132
49
VDD
91
DQ36
133
NC
VDD
50
NC
92
DQ37
134
NC
9
DQ6
51
NC
93
DQ38
135
NC
10
DQ7
52
CB2
94
DQ39
136
CB6
11
DQ8
VSS
53
CB3
VSS
95
DQ40
137
54
96
VSS
138
CB7
VSS
13
DQ9
55
DQ16
97
DQ41
139
DQ48
14
DQ10
56
DQ17
98
DQ42
140
DQ49
15
DQ11
57
DQ18
99
DQ43
141
DQ50
16
DQ12
58
DQ19
100
DQ44
142
DQ51
17
DQ13
59
VDD
101
DQ45
143
VDD
18
VDD
60
DQ20
102
VDD
144
DQ52
19
DQ14
61
DQ46
145
NC
DQ15
62
NC
NC
103
20
104
DQ47
146
NC
21
CB0
63
CKE1
105
CB4
147
REGE
22
64
VSS
106
VSS
65
DQ21
107
CB5
VSS
148
23
CB1
VSS
149
DQ53
24
NC
66
DQ22
108
NC
150
DQ54
25
NC
67
NC
151
DQ55
68
110
VDD
152
VSS
27
VDD
/WE
DQ23
VSS
109
26
69
DQ24
111
/CAS
153
DQ56
28
DQMB0
70
DQ25
112
DQMB4
154
DQ57
29
DQMB1
71
DQ26
113
DQMB5
155
DQ58
30
/S0
72
DQ27
114
NC
156
DQ59
31
NC
73
VDD
115
/RAS
157
VDD
32
VSS
74
DQ28
116
VSS
158
DQ60
33
A0
75
DQ29
117
A1
159
DQ61
34
A2
76
DQ30
118
A3
160
DQ62
35
A4
77
DQ31
119
A5
161
DQ63
36
A6
78
VSS
120
A7
162
VSS
37
A8
79
A9
163
A10
80
CK2
NC
121
38
122
BA0
164
CK3
NC
39
BA1
VDD
81
WP
123
SA0
82
SDA
124
A11
VDD
165
40
166
SA1
41
42
VDD
CK0
83
84
SCL
VDD
125
126
CK1
NC
167
168
SA2
VDD
12
NC = No Connection
MIT-DS-0273-0.2
1/ Dec./1998
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
/RS0
RDQMB0
RDQMB1
RDQMB4
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
D0
RDQMB5
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
D1
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
D5
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
D6
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
D7
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
D8
RDQMB6
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
D2
/RS2
RDQMB7
RDQMB2
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
D3
RDQMB3
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
D4
SERIAL PD
SCL
WP
47K
A0 A1 A2
SDA
/S0 , /S2
DQMB0 to DQMB7
BA0-BA1
A0-A11
/RAS
/CAS
CKE0
/WE
10K
VDD
MIT-DS-0273-0.2
CK2
REGE
SA0 SA1 SA2
CK0,CK1,CK3
/RS0 , /RS2
RDQMB0 to RDQMB7
BA0-BAN:D0-D8
RBA0-RBA1
A0-A11:D0-D8
RA0-RA11
/RAS: D0-D8
R/RAS
/CAS: D0-D8
R/CAS
RCKE0
/WE:D0-D8
R/WE
D0-D8(3EACH)
VDD
D0 to D8
VSS
D0 to D8
1/ Dec./1998
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Serial Presence Detect Table
Byte
Function described
SPD enrty data
SPD DATA(hex)
0
Defines # bytes written into serial memory at module mfgr
128
80
1
Total # bytes of SPD memory device
256 Bytes
08
2
Fundamental memory type
SDRAM
04
3
# Row Addresses on this assembly
A0-A11
0C
4
# Column Addresses on this assembly
A0-A8
09
5
# Module Banks on this assembly
1BANK
01
6
Data Width of this assembly...
x72
48
7
... Data Width continuation
0
00
8
Voltage interface standard of this assembly
LVTTL
01
9
SDRAM Cycletime at Max. Supported CAS Latency (CL).
-7
-8
10ns
A0
-7
-8
6ns
60
ECC
02
Cycle time for CL=3
10
SDRAM Access from Clock
tAC for CL=3
11
DIMM Configuration type (Non-parity,Parity,ECC)
12
Refresh Rate/Type
self refresh(15.625uS)
80
13
SDRAM width,Primary DRAM
x8
08
14
Error Checking SDRAM data width
x8
08
15
Minimum Clock Delay,Back to Back Random Column Addresses
1
01
Burst Lengths Supported
1/2/4/8/FP
8F
16
17
# Banks on Each SDRAM device
4bank
18
CAS# Latency
CL=2/3
06
19
CS# Latency
0
01
20
Write Latency
0
01
21
SDRAM Module Attributes
22
SDRAM Device Attributes:General
23
SDRAM Cycle time(2nd highest CAS latency)
Cycle time for CL=2
24
SDRAM Access form Clock(2nd highest CAS latency)
tAC for CL=2
25
SDRAM Cycle time(3rd highest CAS latency)
Cycle time for CL=
26
SDRAM Access form Clock(3rd highest CAS latency)
tAC for CL=
MIT-DS-0273-0.2
04
Registered and Buffered
1B
Precharge All,Auto precharge,sw/br
0E
-7
10ns
A0
-8
-7
13ns
6ns
D0
60
-8
-7
7ns
N/A
70
00
-8
N/A
00
-7
N/A
00
-8
N/A
00
1/ Dec./1998
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MITSUBISHI LSIs
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Serial Presence Detect Table
27
28
Precharge to Active Minimum
Row Active to Row Active Min.
20ns
14
20ns
14
29
RAS to CAS Delay Min
20ns
14
30
Active to Precharge Min
50ns
32
31
Density of each bank on module
64MByte
10
32
Command and Address signal input setup time
2ns
20
33
Command and Address signal input hold time
1ns
10
34
Data signal input setup time
2ns
20
35
Data signal input hold time
1ns
10
36-61
Superset Information (may be used in future)
option
00
rev 1.2A
12
SPD Revision
62
63
64-71
72
Checksum for bytes 0-62
Check sum for -7
Manufactures Jedec ID code per JEP-108E
Manufacturing location
Check sum for -8
32
72
MITSUBISHI
1CFFFFFFFFFFFFFF
Miyoshi,Japan
01
Tajima,Japan
02
NC,USA
03
Germany
73-90
Manufactures Part Number
04
MH8S72BAFD-7
4D4838533634424146442D37202020202020
MH8S72BAFD-8
4D4838533634424146442D38202020202020
91-92
Revision Code
PCB revision
rrrr
93-94
Manufacturing date
year/week code
yyww
serial number
ssssssss
option
00
-8
100MHz
64
-7
CK0,1,2,3,CL=2/3,AP
FF
-8
CK0,1,2,3,CL=3,AP
FD
95-98
99-125
126
127
128+
Assembly Serial Number
Manufacture Specific Data
Intetl specification frequency
Intel specification detail for 100MHz support
open
Unused storage locations
MIT-DS-0273-0.2
00
1/ Dec./1998
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MITSUBISHI LSIs
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PIN FUNCTION
Input
Master Clock:All other inputs are referenced to the rising
edge of CK
CKE0
Input
Clock Enable:CKE controls internal clock.When CKE is
low,internal clock for the following cycle is ceased. CKE is
also used to select auto / self refresh. After self refresh
mode is started, CKE E becomes asynchronous input.Self
refresh is maintained as long as CKE is low.
/S0,2
Input
Chip Select: When /S is high,any command means
No Operation.
/RAS,/CAS,/W
Input
Combination of /RAS,/CAS,/W defines basic commands.
A0-11
Input
A0-11 specify the Row/Column Address in conjunction with
BA.The Row Address is specified by A0-11.The Column
Address is specified by A0-9.A10 is also used to indicate
precharge option.When A10 is high at a read / write
command, an auto precharge is performed. When A10 is
high at a precharge command, both banks are precharged.
BA0-1
Input
Bank Address:BA0,1 is not simply BA.BA0,1 specifies
the bank to which a command is applied.BA must be set
with ACT,PRE,READ,WRITE commands
CK0
DQ0-63
CB0-7
DQM0-7
Vdd,Vss
REGE
MIT-DS-0273-0.2
Data In and Data out are referenced to the rising edge of
Input/Output CK
Input
Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is high
in burst read,Dout is disabled at the next but one cycle.
Power Supply Power Supply for the memory mounted module.
Output
Register enable:When REGE is low,All control signals and
address are buffered. (Buffer mode) When REGE is
high,All control and address are latched. (Latch mode)
1/ Dec./1998
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MITSUBISHI LSIs
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BASIC FUNCTIONS
The MH8S72BAFD provides basic functions,bank(row)activate,burst read / write,
bank(row)precharge,and auto / self refresh.
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In
addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and precharge
option,respectively.
To know the detailed definition of commands please see the command truth table.
CK
/S
Chip Select : L=select, H=deselect
/RAS
Command
/CAS
Command
/WE
Command
CKE
Refresh Option @refresh command
A10
Precharge Option @precharge or read/write command
define basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank is
deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks are
deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address are
generated internally. After this command, the banks are precharged automatically.
MIT-DS-0273-0.2
1/ Dec./1998
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
COMMAND TRUTH TABLE
COMMAND
MNEMONIC
CK
n-1
CK
n
/S
Deselect
No Operation
DESEL
NOP
H
H
X
X
H
L
X
H
Row Adress Entry &
Bank Activate
ACT
H
X
L
Single Bank Precharge
Precharge All Bank
PRE
PREA
H
H
X
X
Column Address Entry
& Write
WRITE
H
Column Address Entry
& Write with AutoPrecharge
WRITEA
Column Address Entry
& Read
/RAS /CAS
/WE
BA
A10
A0-9
X
H
X
H
X
X
X
X
X
X
L
H
H
V
V
V
L
L
L
L
H
H
L
L
V
V
L
H
X
X
X
L
LH
H
L
V
L
V
H
X
L
H
L
L
V
H
V
READ
H
X
L
H
L
H
V
L
V
Column Address Entry
& Read with Auto
Precharge
READA
H
X
L
H
L
H
V
H
V
Auto-Refresh
Self-Refresh Entry
Self-Refresh Exit
REFA
REFS
REFSX
Burst Terminate
Mode Register Set
TERM
MRS
H
H
L
L
H
H
H
L
H
H
X
X
L
L
H
L
L
L
HL
L
LX
H
H
L
L
L
X
H
H
L
H
H
X
H
L
L
X
X
X
X
X
L
X
X
X
X
X
L
X
X
X
X
X
V*1
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
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MITSUBISHI LSIs
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE
Current State
/S
IDLE
H
L
X
H
X
H
X
H
X
X
L
H
H
L
BA
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
L
L
H
L
BA,A10
PRE/PREA
L
L
L
H
X
L
L
L
L
H
X
X
X
X
DESEL
NOP
L
H
H
H
X
NOP
NOP
L
H
H
L
BA
TBST
NOP
L
H
L
H
BA,CA,A10
L
H
L
L
BA,CA,A10
L
L
H
H
BA,RA
ACT
Bank Active/ILLEGAL*2
L
L
H
L
BA,A10
PRE/PREA
Precharge/Precharge All
L
L
L
H
X
L
L
L
L
H
X
X
X
X
DESEL
NOP(Continue Burst to END)
L
H
H
H
X
NOP
NOP(Continue Burst to END)
L
H
H
L
BA
TBST
Terminate Burst
ROW ACTIVE
READ
/RAS /CAS
/WE
Address
Command
DESEL
NOP
TBST
Action
NOP
NOP
ILLEGAL*2
READ/WRITE ILLEGAL*2
Op-Code,
Mode-Add
Mode-Add
NOP*4
REFA
Auto-Refresh*5
MRS
Mode Register Set*5
READ/READA
Op-Code,
Bank Active,Latch RA
Begin Read,Latch CA,
Determine Auto-Precharge
WRITE/
Begin Write,Latch CA,
WRITEA
Determine Auto-Precharge
REFA
ILLEGAL
MRS
ILLEGAL
Terminate Burst,Latch CA,
L
H
L
H
BA,CA,A10
READ/READA Begin New Read,Determine
Auto-Precharge*3
Terminate Burst,Latch CA,
L
H
L
L
BA,CA,A10
WRITE/WRITEA Begin Write,Determine AutoPrecharge*3
MIT-DS-0273-0.2
L
L
H
H
BA,RA
ACT
L
L
H
L
BA,A10
PRE/PREA
L
L
L
H
X
L
L
L
L
Op-Code,
Mode-Add
Bank Active/ILLEGAL*2
Terminate Burst,Precharge
REFA
ILLEGAL
MRS
ILLEGAL
1/ Dec./1998
MITSUBISHI
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MITSUBISHI LSIs
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE(continued)
Current State
WRITE
READ with
AUTO
PRECHARGE
WRITE with
AUTO
PRECHARGE
MIT-DS-0273-0.2
/S
H
L
L
/RAS /CAS
X
X
H
H
H
H
/WE
Address
X
X
H X
L
BA
L
H
L
H
BA,CA,A10
L
H
L
L
BA,CA,A10
L
L
H
H
BA,RA
L
L
L
L
H
L
L
H
L
L
L
L
BA,A10
X
Op-Code,
H
L
L
L
X
H
H
H
X
H
H
L
X
H
L
H
Mode-Add
X
X
BA
BA,CA,A10
L
H
L
L
BA,CA,A10
L
L
H
H
BA,RA
L
L
L
L
H
L
L
H
L
L
L
L
H
L
L
L
X
H
H
H
X
H
H
L
X
H
L
H
BA,A10
X
Op-Code,
Mode-Add
X
X
BA
BA,CA,A10
L
H
L
L
BA,CA,A10
L
L
L
L
L
L
H
H
L
H
L
H
L
L
L
L
BA,RA
BA,A10
X
Op-Code,
Mode-Add
Command
DESEL
NOP
TBST
Action
NOP(Continue Burst to END)
NOP(Continue Burst to END)
Terminate Burst
Terminate Burst,Latch CA,
READ/READA Begin Read,Determine AutoPrecharge*3
Terminate Burst,Latch CA,
WRITE/
Begin Write,Determine AutoWRITEA
Precharge*3
ACT
Bank Active/ILLEGAL*2
PRE/PREA
REFA
MRS
DESEL
NOP
TBST
READ/READA
WRITE/
WRITEA
ACT
PRE/PREA
REFA
MRS
DESEL
NOP
TBST
READ/READA
WRITE/
WRITEA
ACT
PRE/PREA
REFA
MRS
Terminate Burst,Precharge
ILLEGAL
ILLEGAL
NOP(Continue Burst to END)
NOP(Continue Burst to END)
ILLEGAL
ILLEGAL
ILLEGAL
Bank Active/ILLEGAL*2
ILLEGAL*2
ILLEGAL
ILLEGAL
NOP(Continue Burst to END)
NOP(Continue Burst to END)
ILLEGAL
ILLEGAL
ILLEGAL
Bank Active/ILLEGAL*2
ILLEGAL*2
ILLEGAL
ILLEGAL
1/ Dec./1998
MITSUBISHI
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MITSUBISHI LSIs
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE(continued)
Current State
/S
PRE -
H
X
X
X
X
DESEL
NOP(Idle after tRP)
CHARGING
L
H
H
H
X
NOP
NOP(Idle after tRP)
L
H
H
L
BA
TBST
ILLEGAL*2
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
L
L
H
L
BA,A10
PRE/PREA
L
L
L
H
X
L
L
L
L
ROW
H
X
X
X
X
DESEL
NOP(Row Active after tRCD
ACTIVATING
L
H
H
H
X
NOP
NOP(Row Active after tRCD
L
H
H
L
BA
TBST
ILLEGAL*2
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
ILLEGAL*2
L
L
H
L
BA,A10
PRE/PREA
ILLEGAL*2
L
L
L
H
X
L
L
L
L
WRITE RE-
H
X
X
X
X
DESEL
NOP
COVERING
L
H
H
H
X
NOP
NOP
L
H
H
L
BA
TBST
ILLEGAL*2
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
ILLEGAL*2
L
L
H
L
BA,A10
PRE/PREA
ILLEGAL*2
L
L
L
H
X
L
L
L
L
MIT-DS-0273-0.2
/RAS /CAS
/WE
Address
Command
Action
READ/WRITE ILLEGAL*2
Op-Code,
Mode-Add
ILLEGAL*2
NOP*4(Idle after tRP)
REFA
ILLEGAL
MRS
ILLEGAL
READ/WRITE ILLEGAL*2
Op-Code,
Mode-Add
REFA
ILLEGAL
MRS
ILLEGAL
READ/WRITE ILLEGAL*2
Op-Code,
Mode-Add
REFA
ILLEGAL
MRS
ILLEGAL
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE(continued)
Current State
/S
/RAS /CAS
/WE
Address
Command
Action
RE-
H
X
X
X
X
DESEL
NOP(Idle after tRC)
FRESHING
L
H
H
H
X
NOP
NOP(Idle after tRC)
L
H
H
L
BA
TBST
ILLEGAL
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
ILLEGAL
L
L
H
L
BA,A10
PRE/PREA
ILLEGAL
L
L
L
H
X
REFA
ILLEGAL
L
L
L
L
MRS
ILLEGAL
MODE
H
X
X
X
X
DESEL
NOP(Idle after tRSC)
REGISTER
L
H
H
H
X
NOP
NOP(Idle after tRSC)
SETTING
L
H
H
L
BA
TBST
ILLEGAL
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
ILLEGAL
L
L
H
L
BA,A10
PRE/PREA
ILLEGAL
L
L
L
H
X
REFA
ILLEGAL
L
L
L
L
MRS
ILLEGAL
READ/WRITE ILLEGAL
Op-Code,
Mode-Add
READ/WRITE ILLEGAL
Op-Code,
Mode-Add
ABBREVIATIONS:
H = Hige Level, L = Low Level, X = Don't Care
BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
1. All entries assume that CKE was High during the preceding clock cycle and the current
clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA,
depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and / or date-integrity are not guaranteed.
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE FOR CKE
Current State
CK
n-1
CK
n
/S
SELF -
H
X
X
X
REFRESH*1
L
H
H
L
H
L
/RAS /CAS
/WE
Add
Action
X
X
X
INVALID
X
X
X
X
Exit Self-Refresh(Idle after tRC)
L
H
H
H
X
Exit Self-Refresh(Idle after tRC)
H
L
H
H
L
X
ILLEGAL
L
H
L
H
L
X
X
ILLEGAL
L
H
L
L
X
X
X
ILLEGAL
L
L
X
X
X
X
X
NOP(Maintain Self-Refresh)
POWER
H
X
X
X
X
X
X
INVALID
DOWN
L
H
X
X
X
X
X
Exit Power Down to Idle
L
L
X
X
X
X
X
NOP(Maintain Self-Refresh)
ALL BANKS
H
H
X
X
X
X
X
Refer to Function Truth Table
IDLE*2
H
L
L
L
L
H
X
Enter Self-Refresh
H
L
H
X
X
X
X
Enter Power Down
H
L
L
H
H
H
X
Enter Power Down
H
L
L
H
H
L
X
ILLEGAL
H
L
L
H
L
X
X
ILLEGAL
H
L
L
L
X
X
X
ILLEGAL
L
X
X
X
X
X
X
Refer to Current State = Power Down
ANY STATE
H
H
X
X
X
X
X
Refer to Function Truth Table
other than
H
L
X
X
X
X
X
Begin CK0 Suspend at Next Cycle*3
listed above
L
H
X
X
X
X
X
Exit CK0 Suspend at Next Cycle*3
L
L
X
X
X
X
X
Maintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
3. Must be legal command.
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
POWER ON SEQUENCE
Before starting normal operation, the following power on sequence is necessary to prevent a
SDRAM from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQMB high and NOP
condition at the inputs.
2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 500µs.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
register(MRS). The mode register stores these date until the next MRS command, which may
be issue when both banks are in idle state. After tRSC from a MRS command, the SDRAM is
ready for new command.
CK
/S
BA0 BA1 A11 A10 A9
A8
A7 A6
0
0
A5
A4 A3
A2
A1 A0
/RAS
/CAS
0
0
0
0
WM
LTMODE
BT
BL
/WE
V
BA0,1 A11-0
LATENCY
MODE
WRITE
MODE
CL
000
001
010
011
100
101
110
111
0
1
MIT-DS-0273-0.2
/CAS LATENCY
R
R
2
3
R
R
R
R
BURST
SINGLE BIT
BURST
LENGTH
BURST
TYPE
BL
BT= 0
BT= 1
000
001
010
011
100
101
110
111
1
2
4
8
R
R
R
FP
1
2
4
8
R
R
R
R
0
1
SEQUENTIAL
INTERLEAVED
R:Reserved for Future Use
FP: Full Page
1/ Dec./1998
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
CK
Command
Read
Write
Y
Y
Address
Q0
DQ
CL= 3
BL= 4
/CAS Latency
Q1
Q2
Q3
D0
Burst Length
D1
D2
D3
Burst Length
Burst Type
Initial Address BL
Column Addressing
A2
A1
A0
0
0
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
1
1
2
3
4
5
6
7
0
1
0
3
2
5
4
7
6
0
1
0
2
3
4
5
6
7
0
1
2
3
0
1
6
7
4
5
0
1
1
3
4
5
6
7
0
1
2
3
2
1
0
7
6
5
4
Sequential
Interleaved
8
1
0
0
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
1
0
1
5
6
7
0
1
2
3
4
5
4
7
6
1
0
3
2
1
1
0
6
7
0
1
2
3
4
5
6
7
4
5
2
3
0
1
1
1
1
7
0
1
2
3
4
5
6
7
6
5
4
3
2
1
0
-
0
0
0
1
2
3
0
1
2
3
-
0
1
1
2
3
0
1
0
3
2
4
-
1
0
2
3
0
1
2
3
0
1
-
1
1
3
0
1
2
3
2
1
0
-
-
0
0
1
0
1
1
0
1
0
2
-
-
1
MIT-DS-0273-0.2
1/ Dec./1998
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Condition
Ratings
Unit
Vdd
Supply Voltage
with respect to Vss
-0.5 ~ 4.6
V
VI
Input Voltage
with respect to Vss
-0.5 ~ 4.6
V
VO
Output Voltage
with respect to Vss
-0.5 ~ 4.6
V
IO
Output Current
50
mA
Pd
Power Dissipation
11
W
Topr
Operating Temperature
0 ~ 70
°C
Tstg
Storage Temperature
-45 ~ 100
°C
Ta=25°C
RECOMMENDED OPERATING CONDITION
(Ta=0 ~ 70°C, unless otherwise noted)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Vdd
Supply Voltage
3.0
3.3
3.6
V
Vss
Supply Voltage
0
0
0
V
VIH
High-Level Input Voltage all inputs
2.0
Vdd+0.3
V
VIL
Low-Level Input Voltage all inputs
-0.3
0.8
V
CAPACITANCE
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted)
Symbol
Parameter
Test Condition
Limits(max.)
Unit
CI(A)
Input Capacitance, address pin
VI = Vss
20
pF
CI(C)
Input Capacitance, control pin
20
pF
38
pF
22
pF
CI(K)
Input Capacitance, CK pin
CI/O
MIT-DS-0273-0.2
Input Capacitance, I/O pin
f=1MHz
Vi=25mVrms
1/ Dec./1998
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
AVERAGE SUPPLY CURRENT from Vdd
(Ta=0 ~70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
Parameter
Symbol
Limits
(max)
Test Condition
Unit
-7, -8
operating current
one bank active (discrete)
precharge stanby current
in power-down mode
precharge stanby current
in non power-down mode
active stanby current
in power-down mode
active stanby current
in non power-down mode
Icc1
tRC=min.tCLK=min, BL=1, IOL=min
Icc2P
CKE=VILmax,tCLK=15ns
Icc2PS CKE=CLK=VILmax(fixed)
Icc2N CKE=/CS=VIHmin,tCLK=15ns(Note)
Icc2NS CKE=VIHmin,CLK=VILmax(fixed)
Icc3P CKE=VILmax,tCLK=15ns
Icc3PS CKE=CLK=VILmax(fixed)
mA
42
mA
mA
mA
mA
mA
mA
33
222
204
60
42
burst current
auto-refresh current
Icc3N CKE=/CS=VIHmin,tCLK=15ns
Icc3NS CKE=VIHmin,CLK=VILmax(fixed)
Icc4 tCLK=min, BL=4, CL=3,IOL=0mAall banks active(discerte)
tRC=min, tCLK=min
Icc5
self-refresh current
Icc6
one bank active (discrete)
1014
CKE <0.2V
519
384
1059
1374
mA
mA
33
mA
mA
mA
Note:Input signals are changed one time during 30ns.
AC OPERATING CONDITIONS AND CHARACTERISTICS
(Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
Symbol
VOH(DC)
VOL(DC)
VOH(AC
IOZ
)VOL(AC)
Ii
Parameter
High-Level Output Voltage(DC)
Low-Level Output Voltage(DC)
High-Level
Off-stare
Output
Output
Current
Voltage(AC)
Input
Current
Low-Level
Output Voltage(AC)
MIT-DS-0273-0.2
Test Condition
IOH=-2mA
IOL=2mA
CL=50pF,
Q
floating VO=0 ~ Vdd
IOH=-2mA
CL=50pF,
VIH=0
~ Vdd+0.3V
IOL=2mA
Limits
Unit
Min. Max.
2.4
V
0.4 V
2
V
-5
5 uA
V
-10 0.8
10 uA
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
AC TIMING REQUIREMENTS
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted)
Input Pulse Levels:
0.8V to 2.0V
Input Timing Measurement Level: 1.4V
LATCH MODE
Limits
-7
Symbol Parameter
Min.
CL=3
CL=4
tCLK
CK cycle time
tCH
tCL
tT
tIS
tIH
tRC
tRCD
tRAS
tRP
tWR
tRRD
tCCD
tRSC
tSRX
tREF
CK High pulse width
CK Low pilse width
Transition time of CK
Input Setup time(all inputs)
Input Hold time(all inputs)
Row cycle time
Row to Column Delay
Row Active time
Row Precharge time
Write Recovery time
Act to Act Deley time
Col to Col Delay time
Mode Register Set Cycle time
Self Refresh Exit time
Refresh Interval time
Unit
-8
Max.
Min.
10
13
10
3
3
1
2
0
70
20
50
20
10
20
10
20
10
10
4
4
1
2
0
70
20
50
20
10
20
10
20
10
10
100000
64
Max.
10
100000
64
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
Note:1 The timing requirements are assumed tT=1ns. If tT is longer than 1ns, (tT-1)ns
should be added to the parameter.
CK
1.4V
Signal
1.4V
MIT-DS-0273-0.2
Any AC timing is
referenced to the input
signal crossing through
1.4V.
1/ Dec./1998
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BUFFER MODE
Limits
-7
Symbol Parameter
Min.
CL=2
CL=3
tCLK
CK cycle time
tCH
tCL
tT
tIS
tIH
tRC
tRCD
tRAS
tRP
tWR
tRRD
tCCD
tRSC
tSRX
tREF
CK High pulse width
CK Low pilse width
Transition time of CK
Input Setup time(all inputs)
Input Hold time(all inputs)
Row cycle time
Row to Column Delay
Row Active time
Row Precharge time
Write Recovery time
Act to Act Deley time
Col to Col Delay time
Mode Register Set Cycle time
Self Refresh Exit time
Refresh Interval time
Unit
-8
Max.
Min.
10
13
10
3
3
1
8
0
70
20
50
20
10
20
10
20
10
10
4
4
1
8
0
70
20
50
20
10
20
10
20
10
10
100000
Max.
10
100000
64
64
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
Note:1 The timing requirements are assumed tT=1ns. If tT is longer than 1ns, (tT-1)ns
should be added to the parameter.
SWITCHING CHARACTERISTICS
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted)
LATCH MODE
Limits
-7
Symbol Parameter
Min.
tAC
tOH
tOLZ
tOHZ
Access time from CK
Output Hold time
from CK
Delay time, output low
impedance from CK
Delay time, output high
impedance from CK
MIT-DS-0273-0.2
CL=3
CL=4
-8
Max.
Min.
Unit
Max.
6
7
6
6
ns
3
3
ns
0
0
ns
3
6
3
6
ns
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BUFFER MODE
Limits
-7
Symbol Parameter
Min.
tAC
tOH
tOLZ
tOHZ
Access time from CK
CL=2
CL=3
Output Hold time
from CK
Delay time, output low
impedance from CK
Delay time, output high
impedance from CK
-8
Max.
Min.
Unit
Max.
6
7
6
6
ns
3
3
ns
0
0
ns
3
6
3
6
ns
Output Load Condition
VTT=1.4V
CK
1.4V
50Ω
DQ
1.4V
VOUT
50pF
Output Timing Measurement
Reference Point
CK
1.4V
DQ
1.4V
tAC
MIT-DS-0273-0.2
tOH
tOHZ
1/ Dec./1998
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
WRITE CYCLE (single bank)
0
1
2
3
4
5
6
7
BL=4,Buffer mode(REGE="L")
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRAS
tRP
/RAS
tRCD
tRCD
/CAS
/WE
tWR
CKE
DQM
A0-9
X
A10
X
X
A11
X
X
BA0,1
0
Y
X
0
0
0
Y
0
REGE
D0
DQ
ACT#0
D0
WRITE#0
D0
D0
D0
PRE#0
ACT#0
D0
D0
D0
WRITE#0
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
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MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
WRITE CYCLE (dual bank)
0
1
2
3
4
5
6
7
BL=4,Buffer mode(REGE="L")
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRRD
tRRD
tRAS
tRP
/RAS
tRCD
tRCD
/CAS
/WE
tWR
tWR
CKE
DQM
A0-9
X
X
A10
X
A11
BA0,1
Y
Y
X
X
X
X
X
X
X
X
X
0
1
0
1
0
D1
D1
0
1
2
Y
0
REGE
D0
DQ
ACT#0
D0
WRITE#0
ACT#1
D0
D0
D1
D1
PRE#0
WRITE#1
D0
ACT#0
D0
D0
D0
ACT#2 WRITE#0
PRE#1
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
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MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
WRITE CYCLE (single bank)
0
1
2
3
4
5
6
7
BL=4,Lacth mode(REGE="H")
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRAS
tRP
/RAS
tRCD
tRCD
/CAS
/WE
tWR
CKE
DQM
A0-9
X
A10
X
X
A11
X
X
BA0,1
0
Y
X
0
0
0
Y
0
REGE
D0
DQ
ACT#0
WRITE#0
D0
D0
D0
PRE#0
D0
ACT#0
D0
D0
D0
WRITE#0
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
23
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
WRITE CYCLE (dual bank)
0
1
2
3
4
5
6
7
BL=4,Latch mode(REGE="H")
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRRD
tRRD
tRAS
tRP
/RAS
tRCD
tRCD
/CAS
/WE
tWR
tWR
CKE
DQM
A0-9
X
X
A10
X
A11
BA0,1
Y
Y
X
X
X
X
X
X
X
X
X
0
1
0
1
0
0
D0
D1
1
2
Y
0
REGE
D0
DQ
ACT#0
WRITE#0
ACT#1
D0
D0
D1
PRE#0
WRITE#1
D1
D1
ACT#0
D0
D0
D0
ACT#2 WRITE#0
PRE#1
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
24
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
READ CYCLE (single bank)
0
1
2
3
4
5
6
7
BL=4,CL=3,Buffer mode(REGE="L")
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRAS
tRP
/RAS
tRCD
tRCD
/CAS
/WE
CKE
DQM
DQM read latency =2
A0-9
X
A10
X
X
A11
X
X
BA0,1
0
Y
X
0
0
0
Y
0
REGE
CL=3
Q0
DQ
ACT#0
READ#0
Q0
Q0
PRE#0
Q0
Q0
ACT#0
Q0
READ#0
READ to PRE ≥BL allows full data out
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
25
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
READ CYCLE (dual bank)
0
1
2
3
4
5
6
7
BL=4,CL=3,Buffer mode(REGE="L")
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRRD
tRRD
tRAS
tRP
/RAS
tRCD
tRCD
/CAS
/WE
CKE
DQM
DQM read latency =2
A0-9
X
X
A10
X
A11
BA0,1
Y
Y
X
X
X
X
X
X
X
X
X
0
1
0
1
0
0
1
2
Q1
Q1
Q1
Y
0
REGE
CL=3
CL=3
Q0
DQ
ACT#0
READ#0
ACT#1
Q0
Q0
Q0
PRE#0
READ#1
Q1
ACT#0
PRE#1
Q0
READ#0
ACT#2
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
26
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
READ CYCLE (single bank)
0
1
2
3
4
5
6
7
BL=4, CL=3,Latch mode(REGE="H")
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRAS
tRP
/RAS
tRCD
tRCD
/CAS
/WE
CKE
DQM
DQM read latency =3
A0-9
X
A10
X
X
A11
X
X
BA0,1
0
Y
X
0
0
0
Y
0
REGE
CL=3
Q0
DQ
ACT#0
READ#0
Q0
Q0
PRE#0
Q0
Q0
ACT#0
Q0
READ#0
READ to PRE ≥BL allows full data out
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
27
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
READ CYCLE (dual bank)
0
1
2
3
4
5
6
7
BL=4,CL=3,Latch mode(REGE="H")
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRRD
tRRD
tRAS
tRP
/RAS
tRCD
tRCD
/CAS
/WE
CKE
DQM
DQM read latency =3
A0-9
X
X
A10
X
A11
BA0,1
Y
Y
X
X
X
X
X
X
X
X
X
0
1
0
1
0
0
1
2
Q1
Q1
Q1
Y
0
REGE
CL=3
CL=3
Q0
DQ
ACT#0
READ#0
ACT#1
Q0
Q0
Q0
PRE#0
READ#1
Q1
ACT#0
PRE#1
Q0
READ#0
ACT#2
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
28
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Burst WRITE (multi bank) with AUTO-PRECHARGE BL=4,Buffer mode(REGE="L")
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRRD
tRRD
/RAS
tRCD
tRCD
tRCD
/CAS
BL-1+ tWR + tRP
BL-1+ tWR + tRP
/WE
CKE
DQM
A0-9
X
X
A10
X
X
X
X
A11
X
X
X
X
BA0,1
0
1
Y
Y
0
X
1
Y
X
0
0
1
D1
D0
D0
Y
1
REGE
D0
DQ
ACT#0
ACT#1
D0
D0
WRITE#0 with
AutoPrecharge
D0
D1
D1
D1
ACT#0
WRITE#1 with
AutoPrecharge
D0
WRITE#0
ACT#1
D0
D1
WRITE#1
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
29
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Burst WRITE (multi bank) with AUTO-PRECHARGE BL=4,Latch mode(REGE="H")
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRRD
tRRD
/RAS
tRCD
tRCD
tRCD
/CAS
BL-1+ tWR + tRP
BL-1+ tWR + tRP
/WE
CKE
DQM
A0-9
X
X
A10
X
X
X
X
A11
X
X
X
X
BA0,1
0
1
Y
Y
0
X
1
Y
0
0
X
Y
1
1
REGE
D0
DQ
ACT#0
ACT#1
D0
WRITE#0 with
AutoPrecharge
D0
D0
D1
D1
D1
ACT#0
WRITE#1 with
AutoPrecharge
D1
D0
D0
WRITE#0
ACT#1
D0
D0
WRITE#1
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
30
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Burst READ (multi bank) with AUTO-PRECHARGE
0
1
2
3
4
5
6
7
8
9
BL=4,Buffer mode(REGE="L")
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRRD
tRRD
/RAS
tRCD
tRCD
tRCD
/CAS
BL+tRP
BL+tRP
/WE
CKE
DQM
DQM read latency =2
A0-9
X
X
A10
X
X
X
X
A11
X
X
X
X
BA0,1
0
1
Y
Y
0
X
1
Y
0
0
X
Y
1
1
REGE
CL=3
CL=3
Q0
DQ
ACT#0
ACT#1
READ#0 with
Auto-Precharge
Q0
Q0
CL=3
Q0
Q1
Q1
ACT#0
READ#1 with
Auto-Precharge
Q1
Q1
Q0
Q0
READ#0
ACT#1
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
31
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Burst READ (multi bank) with AUTO-PRECHARGE
0
1
2
3
4
5
6
7
8
9
BL=4,Latch mode(REGE="H")
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRRD
tRRD
/RAS
tRCD
tRCD
tRCD
/CAS
BL+tRP
BL+tRP
/WE
CKE
DQM
DQM read latency =3
A0-9
X
X
A10
X
X
X
X
A11
X
X
X
X
BA0,1
0
1
Y
Y
0
X
1
Y
0
0
X
Y
1
1
REGE
CL=3
CL=3
Q0
DQ
ACT#0
ACT#1
READ#0 with
Auto-Precharge
Q0
Q0
CL=3
Q0
Q1
Q1
ACT#0
READ#1 with
Auto-Precharge
Q1
Q1
Q0
Q0
READ#0
ACT#1
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
32
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Page Mode Burst Write (multi bank)
0
1
2
3
4
5
6
7
8
9
BL=4,Buffer mode(REGE="L")
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
CKE
DQM
A0-9
X
X
A10
X
X
A11
X
X
BA0,1
0
1
Y
Y
Y
Y
0
0
1
0
REGE
D0
DQ
ACT#0
D0
WRITE#0
ACT#1
D0
D0
D0
D0
D0
D0
D1
D1
WRITE#0
D1
D1
D0
D0
D0
WRITE#0
WRITE#1
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
33
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Page Mode Burst Write (multi bank)
0
1
2
3
4
5
6
7
8
9
BL=4,Latch mode(REGE="H")
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
CKE
DQM
A0-9
X
X
A10
X
X
A11
X
X
BA0,1
0
1
Y
Y
Y
Y
0
0
1
0
REGE
D0
DQ
ACT#0
WRITE#0
ACT#1
D0
D0
D0
D0
D0
D0
D0
D1
WRITE#0
D1
D1
D1
D0
D0
WRITE#0
WRITE#1
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
34
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Page Mode Burst Read (multi bank)
0
1
2
3
4
5
6
7
8
9
BL=4,Buffer mode(REGE="L")
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
CKE
DQM
DQM read latency=2
A0-9
X
X
A10
X
X
A11
X
X
BA0,1
0
1
Y
Y
Y
Y
0
0
1
0
REGE
CL=3
CL=3
Q0
DQ
ACT#0
READ#0
ACT#1
Q0
Q0
Q0
CL=3
Q0
Q0
Q0
READ#0
Q0
Q1
Q1
Q1
Q1
READ#0
READ#1
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
35
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Page Mode Burst Read (multi bank)
0
1
2
3
4
5
6
7
8
9
BL=4,Latch mode(REGE="H")
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
CKE
DQM
DQM read latency=3
A0-9
X
X
A10
X
X
A11
X
X
BA0,1
0
1
Y
Y
Y
Y
0
0
1
0
REGE
CL=3
CL=3
Q0
DQ
ACT#0
READ#0
ACT#1
Q0
Q0
Q0
CL=3
Q0
Q0
Q0
READ#0
Q0
Q1
Q1
Q1
Q1
READ#0
READ#1
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
36
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Write Interrupted by Write / Read
0
1
2
3
4
5
6
7
8
BL=4,Buffer mode(REGE="L")
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
tCCD
/CAS
/WE
CKE
DQM
A0-9
X
X
A10
X
X
A11
X
X
BA0,1
0
1
Y
Y
Y
Y
Y
0
0
0
1
0
REGE
CL=3
D0
DQ
D0
D0
D0
D0
D0
D1
D1
Q0
Q0
Q0
Q0
ACT#0
WRITE#0 WRITE#0 WRITE#0
READ#0
ACT#1
WRITE#1
Burst Write can be interrupted by Write or Read of any active bank.
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
37
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Write Interrupted by Write / Read
0
1
2
3
4
5
6
7
8
BL=4,Latch mode(REGE="H")
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
tCCD
/CAS
/WE
CKE
DQM
A0-9
X
X
A10
X
X
A11
X
X
BA0,1
0
1
Y
Y
Y
Y
Y
0
0
0
1
0
REGE
CL=3
D0
DQ
D0
D0
D0
D0
D0
D1
D1
Q0
Q0
Q0
Q0
ACT#0
WRITE#0 WRITE#0 WRITE#0
READ#0
ACT#1
WRITE#1
Burst Write can be interrupted by Write or Read of any active bank.
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
38
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Read Interrupted by Read / Write
0
1
2
3
4
5
6
7
8
BL=4,Buffer mode(REGE="L")
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
CKE
DQM
DQM read latency=2
A0-9
X
X
A10
X
X
A11
X
X
BA0,1
0
1
DQ
Y
Y
Y
Y
Y
Y
0
0
0
1
0
0
Q0
Q0
Q0
Q0
Q0
Q0
Q1
Q1
Q0
D0
D0
REGE
ACT#0
READ#0 READ#0 READ#0
READ#0
WRITE#0
ACT#1
READ#1
blank to prevent bus contention
Burst Read can be interrupted by Read or Write of any active bank.
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
39
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Read Interrupted by Read / Write
0
1
2
3
4
5
6
7
8
BL=4,Latch mode(REGE="H")
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
CKE
DQM
DQM read latency=3
A0-9
X
X
A10
X
X
A11
X
X
BA0,1
0
1
DQ
Y
Y
Y
Y
Y
Y
0
0
0
1
0
0
Q0
Q0
Q0
Q0
Q0
Q0
Q1
Q1
Q0
D0
REGE
ACT#0
READ#0 READ#0 READ#0
READ#0
WRITE#0
ACT#1
READ#1
blank to prevent bus contention
Burst Read can be interrupted by Read or Write of any active bank.
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
40
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Write Interrupted by Precharge
0
1
2
3
4
5
6
7
8
BL=4,Buffer mode(REGE="L")
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
CKE
DQM
A0-9
X
X
A10
X
X
X
A11
X
X
X
BA0,1
0
1
Y
0
D0
DQ
Y
D0
D0
D0
X
1
0
D1
D1
1
1
Y
1
D1
D1
D1
REGE
ACT#0
WRITE#0
ACT#1
PRE#0
WRITE#1
PRE#1
Burst Write is not interrupted by
Precharge of the other bank.
ACT#1
WRITE#1
Burst Write is interrupted by
Precharge of the same bank.
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
41
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Write Interrupted by Precharge
0
1
2
3
4
5
6
7
8
BL=4,Latch mode(REGE="H")
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
CKE
DQM
A0-9
X
X
A10
X
X
X
A11
X
X
X
BA0,1
0
1
Y
Y
0
D0
DQ
D0
D0
X
1
0
1
D0
D1
D1
1
Y
1
D1
D1
D1
REGE
ACT#0
WRITE#0
ACT#1
PRE#0
WRITE#1
PRE#1
Burst Write is not interrupted by
Precharge of the other bank.
ACT#1
WRITE#1
Burst Write is interrupted by
Precharge of the same bank.
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
42
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Read Interrupted by Precharge
0
1
2
3
4
5
6
7
8
BL=4,Buffer mode(REGE="L")
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
tRP
/RAS
tRCD
tRCD
/CAS
/WE
CKE
DQM
DQM read latency=2
A0-9
X
X
A10
X
X
X
A11
X
X
X
BA0,1
0
1
Y
Y
0
Q0
DQ
X
1
0
1
Q0
Q0
Q0
1
Q1
Y
1
Q1
REGE
ACT#0
READ#0
ACT#1
PRE#0
READ#1
PRE#1
Burst Read is not interrupted
by Precharge of the other bank.
ACT#1
READ#1
Burst Read is interrupted
by Precharge of the same bank.
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
43
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Read Interrupted by Precharge
0
1
2
3
4
5
6
7
8
BL=4,Latch mode(REGE="H")
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
tRP
/RAS
tRCD
tRCD
/CAS
/WE
CKE
DQM
DQM read latency=3
A0-9
X
X
A10
X
X
X
A11
X
X
X
BA0,1
0
1
Y
Y
0
Q0
DQ
X
1
0
1
Q0
Q0
Q0
1
Q1
Y
1
Q1
REGE
ACT#0
READ#0
ACT#1
PRE#0
READ#1
PRE#1
Burst Read is not interrupted
by Precharge of the other bank.
ACT#1
READ#1
Burst Read is interrupted
by Precharge of the same bank.
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
44
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Mode Register Setting
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
tRSC
tRC
/RAS
tRCD
/CAS
/WE
CKE
DQM
A0-9
M
X
A10
X
A11
X
BA0,1
0
0
Y
0
D0
DQ
D0
D0
D0
REGE
Auto-Ref (last of 8 cycles)
Mode
Register
Setting
ACT#0
WRITE#0
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
45
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Auto-Refresh @BL=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
tRC
/RAS
tRCD
/CAS
/WE
CKE
DQM
A0-9
X
A10
X
A11
X
BA0,1
0
Y
0
D0
DQ
D0
D0
D0
REGE
Auto-Refresh
ACT#0
WRITE#0
Before Auto-Refresh,
all banks must be idle state.
After tRC from Auto-Refresh,
all banks are idle state.
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
46
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Self-Refresh
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
CLK can be stopped
tRC
/CS
/RAS
/CAS
/WE
tSRX
CKE
CKE must be low to maintain Self-Refresh
DQM
A0-9
X
A10
X
A11
X
BA0,1
0
DQ
REGE
Self-Refresh Entry
Before Self-Refresh Entry,
all banks must be idle state.
Self-Refresh Exit
ACT#0
After tRC from Self-Refresh Exit,
all banks are idle state.
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
47
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
DQM Write Mask @BL=4
0
1
2
3
4
5
6
BL=4,Buffer mode(REGE="L")
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
tRCD
/CAS
/WE
CKE
DQM
A0-9
X
A10
X
A11
X
BA0,1
0
Y
Y
Y
0
0
0
masked
D0
DQ
D0
D0
D0
masked
D0
D0
D0
REGE
ACT#0
WRITE#0
WRITE#0
WRITE#0
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
48
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
DQM Write Mask @BL=4
0
1
2
3
4
5
6
BL=4,Latch mode(REGE="H")
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
tRCD
/CAS
/WE
CKE
DQM
A0-9
X
A10
X
A11
X
BA0,1
0
Y
Y
Y
0
0
0
masked
D0
DQ
D0
D0
D0
masked
D0
D0
D0
REGE
ACT#0
WRITE#0
WRITE#0
WRITE#0
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
49
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
DQM Read Mask @BL=4 CL=3
0
1
2
3
4
5
6
7
BL=4,Buffer mode(REGE="L")
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
tRCD
/CAS
/WE
CKE
DQM read latency=2
DQM
A0-9
X
A10
X
A11
X
BA0,1
0
Y
Y
Y
0
0
0
masked
Q0
DQ
Q0
Q0
Q0
masked
Q0
Q0
Q0
REGE
ACT#0
READ#0
READ#0
READ#0
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
50
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
DQM Read Mask @BL=4 CL=3
0
1
2
3
4
5
6
7
BL=4,Latch mode(REGE="H")
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
tRCD
/CAS
/WE
CKE
DQM read latency=3
DQM
A0-9
X
A10
X
A11
X
BA0,1
0
Y
Y
Y
0
0
0
masked
Q0
DQ
Q0
Q0
Q0
masked
Q0
Q0
Q0
REGE
ACT#0
READ#0
READ#0
READ#0
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
51
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Power Down
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
/CAS
/WE
Standby Power Down
Active Power Down
CKE
CKE latency=1
DQM
A0-9
X
A10
X
A11
X
BA0,1
0
DQ
REGE
Precharge All
ACT#0
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
52
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
CLK Suspend @BL=4 CL=3
0
1
2
3
4
5
6
BL=4,Buffer mode(REGE="L")
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
tRCD
/CAS
/WE
CKE
CKE latency=1
CKE latency=1
DQM
A0-9
X
A10
X
A11
X
BA0,1
0
Y
Y
0
0
D0
DQ
D0
D0
D0
Q0
Q0
Q0
Q0
REGE
ACT#0
WRITE#0
READ#0
CLK suspended
CLK suspended
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
53
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
CLK Suspend @BL=4 CL=3
0
1
2
3
4
5
6
BL=4,Latch mode(REGE="H")
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
tRCD
/CAS
/WE
CKE
CKE latency=2
CKE latency=2
DQM
A0-9
X
A10
X
A11
X
BA0,1
0
Y
Y
0
0
D0
DQ
D0
D0
D0
Q0
Q0
Q0
Q0
REGE
ACT#0
WRITE#0
READ#0
CLK suspended
CLK suspended
Italic parameter indicates minimum case
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
54
n
mi
i
l
Pre ec.
Sp
MITSUBISHI LSIs
ary
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
133.35
8.89
6.35
11.43
1.27
6.35
36.83
24.495
3
17.78
3
4
3
54.61
42.18
127.35
38.1
4.18Min
4.008Min
3.9Max
1.27
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
55
n
mi
i
l
Pre ec.
Sp
ary
MITSUBISHI LSIs
MH8S72BAFD -7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making
semiconductor products better and more reliable,but there is always the
possibility that trouble may occur with them. Trouble with semiconductors
consideration to safety when making your circuit designs,with appropriate
measures such as (i) placement of substitutive,auxiliary circuits,(ii) use of
non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1.These materials are intended as a reference to assist our customers in the
selection of the Mitsubishi semiconductor product best suited to the
customer's application;they do not convey any license under any
intellectual property rights,or any other rights,belonging to Mitsubishi
Electric Corporation or a third party.
2.Mitsubishi Electric Corporation assumes no responsibility for any damage,
or infringement of any third-party's rights,originating in the use of any
product data,diagrams,charts or circuit application examples contained in
these materials.
3.All information contained in these materials,including product data,
diagrams and charts,represent information on products at the time of
publication of these materials,and are subject to change by Mitsubishi
Electric Corporation without notice due to product improvements or other
reasons. It is therefore recommended that customers contact Mitsubishi
Electric Corporation or an authorized Mitsubishi Semiconductor product
distributor for the latest product information before purchasing a product
listed herein.
4.Mitsubishi Electric Corporation semiconductors are not designed or
manufactured for use in a device or system that is used under
circumstances in which human life is potentially at stake. Please contact
Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor
product distributor when considering the use of a product contained herein
for special applications,such as apparatus or systems for transportation,
vehicular,medical,aerospace,nuclear,or undersea repeater use.
5.The prior written approval of Mitsubishi Electric Corporation is necessary to
reprint or reproduce in whole or in part these materials.
6.If these products or technologies are subject the Japanese export
control restrictions,they must be exported under a license from the
Japanese government and cannot be imported into a country other than
the approved destination.
Any diversion or reexport contrary to the export control laws and
regulations of Japan and/or the country of destination is prohibited.
7.Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi
Semiconductor product distributor for further details on these materials or
the products contained therein.
MIT-DS-0273-0.2
1/ Dec./1998
MITSUBISHI
ELECTRIC
56