PANASONIC DN8899UAS

Hall ICs
DN8899UAS
Hall IC for alternative magnetic field (SOH-4D type)
■ Overview
3
3.0±0.3
2
1.6
4
+0.15
0.4±0.15
0.4±0.2
1.5±0.3
0.95±0.2
1
0.2 –0.05
0.1±0.1
■ Features
Unit: mm
0.6±0.2
The DN8899UAS is a Hall IC in which a Hall element,
an amplifier circuit, Schmidt circuit, stabilized power supply and temperature compensation circuit are integrated
onto a single chip using IC technology. It amplifies Hall
element output in the amplifier and converts it into a digital
signal through the Schmidt circuit so as to drive the TTL
or MOS IC directly.
The characterisitcs are guaranteed at a normal temperature (25°C) and a high temparature (135°C).
3.0±0.3
• The characterisitcs are tested and guaranteed at a nor5.4±0.4
mal temperature (25°C) and a high temparature (135°C)
for all devices.
ESOP004-P-0200
• High sensitivity and low drift
• Stable temperature characteristics due to the built-in temperature compensation circuit
• Wide operating supply voltage range (VCC = 4.5 V to 16 V)
• Operating in alternative magnetic field
• Direct drivability of TTL and MOS ICs with output
• Open collector output
• The hysteresis width of the zero-cross type includes "0" tesla point.
• Operation magnetic flux density does not depend on the supply voltage due to the built-in stabilization power supply.
• Surface mount package
■ Applications
• Speed sensor, position sensor, rotation sensor, key board switch and micro switch etc.
1
DN8899UAS
Hall ICs
■ Block Diagram
VCC
1
Stabilized
power supply
Temperature compensation circuit
Output
stage
Hall element
Out
Amplifier
Schmidt circuit
4
N.C.
2
GND
3
■ Pin Descriptions
Pin No.
Description
1
Supply voltage pin
2
N.C.
3
Output pin
4
Ground pin
■ Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply voltage
VCC
− 0.3 to +18
V
Supply current
ICC
8
mA
Power dissipation *
PD
37.5
mW
Operating ambient temperature
Topr
−40 to +135
°C
Storage temperature
Tstg
−55 to +150
°C
Note) 1. Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C.
2. The reverse insertion of this IC will cause its breakdown.
3. It will operate normally in several tens of ms after power on.
4. Use it within 100 mT of magnetic flux density, because if 100 mT or more is applied, the output of Hall IC is likely to be
inverted.
5. Since this IC requires a special assembly, its anti-moisture characteristic is poor compared with other ordinary ICs.
If high reliability is required, you should dry PCB well after mounting and mold them with resin over the PCB.
6. * : Shows the allowable power consumption at Ta = 135°C.
If the operation condition exceeds 60 mW, take measure in mounting and etc.
■ Recommended Operating Range
Parameter
Supply voltage
2
Symbol
Range
Unit
VCC
4.5 to 16
V
Hall ICs
DN8899UAS
■ Electrical Characteristics
1. Electrical Characteristics at Ta = 25°C
Parameter
Symbol
Operating magnetic flux density 1
BH-L1
Operating magnetic flux density 2
Conditions
Min
Typ
Max
Unit
VCC = 12 V
0.1
6
12
mT
BL-H1
VCC = 12 V
−12
−6
− 0.1
mT
Hysteresis width
BW
VCC = 12 V
7
12

mT
Output voltage 1
VOL1
VCC = 4.5 V, IO = 15 mA
B = 12 mT


0.4
V
Output voltage 2
VOL2
VCC = 16 V, IO = 15 mA
B = 12 mT


0.4
V
Output current 1
IOH1
VCC = 4.5 V, VO = 16 V
B = −12 mT


10
µA
Output current 2
IOH2
VCC =16 V, VO = 16 V
B = −12 mT


10
µA
Supply current 1
ICC1
VCC = 4.5 V, B = 12 mT


6.5
mA
Supply current 2
ICC2
VCC = 16 V, B = 12 mT


7.0
mA
Min
Typ
Max
Unit
2. Electrical Characteristics at Ta = 135°C ± 10°C
Parameter
Symbol
Conditions
Operating magnetic flux density 3
BH-L2
VCC = 12 V


15
mT
Operating magnetic flux density 4
BL-H2
VCC = 12 V
−15


mT
Output voltage 3
VOL3
VCC = 4.5 V, IO = 15 mA
B = 15 mT


0.4
V
Output voltage 4
VOL4
VCC = 16 V, IO = 15 mA
B = 15 mT


0.4
V
Output current 3
IOH3
VCC = 4.5 V, VO = 16 V
B = −15 mT


10
µA
Output current 4
IOH4
VCC =16 V, VO = 16 V
B = −15 mT


10
µA
Supply current 3
ICC3
VCC = 4.5 V, B = 15 mT


6.5
mA
Supply current 4
ICC4
VCC = 16 V, B = 15 mT


7.0
mA
Note) 1. Symbol BH-L stands for the operating magnetic flux density where its output level varies from high to low.
2. Symbol BL-H stands for the operating magnetic flux density where its output level varies from low to high.
3. The variation of operating magnetic flux density does not depend on supply voltage due to its built-in stabilized power
source. (VCC should be confined to the range of 4.5 V to 16 V.)
3
DN8899UAS
Hall ICs
■ Electrical Characteristics (continued)
3. Desighn reference data at Ta = 25°C
Note) The characteristics listed below are not guaranteed values for design.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Operating magnetic flux density
supply voltage dependency 1 *1
∆BH-L
Difference of operating magnetic flux
density (BH-L) at VCC = 4.5 V, 16 V

0

mT
Operating magnetic flux density
supply voltage dependency 2 *1
∆BL-H
Difference of operating magneticc flux
destiny (BL-H) at VCC = 4.5 V, 16 V

0.6

mT
Hysteresis width supply voltage
dependency *1
∆BW
Difference of hysteresis width (BW)
at VCC = 4.5 V, 16 V

− 0.6

mT
Operating magnetic flux density
time lapse variation quantity *2
∆B


3
5
mT
Note) *1: A test circuit shall be identical with "■ Electrical Characteristics".
BH-L max.
12 + 5 = 17 mT
*2: At Ta = 25°C
BL-H min.
−12 − 5 = −17 mT
At Ta = 135°C
BH-L max.
15 + 5 = 20 mT
BL-H min.
−15 − 5 = −20 mT
Therefore, the magnetic flux density to be applied to Hall IC must be ±20 mT or more at Ta = 135°C.
Be cautious on use of a permanent magnet as it has its own temperature characteristic and time lapse variation.
4
Hall ICs
DN8899UAS
■ Caution on use of Hall ICs
As the Hall IC is often used to detect movement, the position of a Hall IC may be changed, and there is the risk of
a change in detection level, if exposed to shock or vibration over a long period of time. Secure the IC by applying
adhesive to the package or placing in a dedicated case.
1. On mounting of the surface mount type (ESO004-P-0200 package)
Set pin 2 to open or connect to GND. It will be damaged if it is connected to VCC . When mounted on the printed
circuit board, the Hall IC may be highly stressed by the warp that may occur from the soldering. This may also cause
a change in the operating magnetic flux density and a deterioration of its resistance to moisture.
Be cautious to keep the device from being stressed thermally or mechanically up to the 2 mm distance from the
package.
2. On using flux in soldering
Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The
ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the
disconnection of the aluminum wiring on the surface of an IC chip.
3. On fixing a Hall IC with the holder
When a Hall IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder
is large, the lead wire of the Hall IC will be stretched and it may give a stress to the Hall IC.
If the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package
and the lead wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture.
Sensitivity may also be changed by this stress.
4. Power supply line/power transmission line
If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line.
In this case, set the capacitor of 0.1 µF to 10 µF near a Hall IC to prevent it.
If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the
ignition pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing elements, etc.).
5. VCC and GND
Do not reverse VCC and GND. If the VCC and GND pins are reversely connected, this IC will be destroyed. If the
IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become same as a forward biased
diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will flow
through the IC, ending up in its destruction. (This is common to Monolithic IC.)
6. Cautions on power ON of Hall IC
When a Hall IC is turned ON, the position of the magnet or looseness may change the output of a Hall IC, and a
pulse may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the
supply power is ON.
7. When magnetic force of magnet is too strong
Output may be inverted when applying a magnetic flux density of 100mT or more. Accordingly, magnetic flux
density should be used within the range of 100 mT.
5
DN8899UAS
Hall ICs
■ Technical Data
• Position of a Hall element (unit in mm)
A Hall element is placed on the shaded part in the figure.
1.
0
0
1.
1.5
1.5
• Magneto-electro conversion characteristics
S
N
Output voltage
Direction of applied magnetic field
BL-H
BW
BH-L
Applied magnetic flux density B
6