YAS534 PRELIMINARY MSW1 Magnetic Switch ■ Description YAS534 is a magnetic switch device with high sensitivity and low supply voltage operation integrating single axis magnetic field sensor element with complete control and processing circuitry on single chip. YAS534 Catalog CATALOG No. LSI-4AS534A10 2013.9 PRELIMINARY YAS534 ■ Features ■ ■ ■ ■ ■ Single axis magnetic sensor element and complete control and processing circuitry on single chip High sensitivity magnetic field sensor element Very low supply voltage requirement allowing 1.5V battery operation Small footprint with small package Ultra low power consumption Package Pb-free 4-ball Size 1.1 mm × 1.0 mm Supply Voltage VDD Operating WLCSP 0.9 V to 1.6 V −20°C to +85°C Temperature Operating 20 uA (VDD = 1.0 V) Current Standard CMOS ＋ Magnetic Sensor Manufacturing process Off to On switching Magnetic Field magnetic field strength Sensor Element On to Off switching 0.8 mT 0.5 mT magnetic field strength Sampling period ■ 200 Hz Pin Assignment 2 3 1 4 < 4-pin WLCSP Top View > Pin No. Pin Label I/O 1 N.C. − 2 VSS − Ground 3 OUT Od Output 4 VDD − Power supply Od: Open-drain transistor output 4AS534A10 2 Description ■ ■ PRELIMINARY Block Diagram YAS534 Block Diagram ＶＤＤ Timer and Sequencer OUT Ｍａｇｎｅｔｉｃ Ｓｅｎｓｏｒ Comparator with Hysteresis Latch VSS Block diagram. ● Magnetic Sensor Integrated single axis magnetic field sensor element with bi-directional sensitivity. The orientation of the magnetic field sensitivity axis relative to the package and marking is shown below. Direction of Detectable Magnetic Field (Hx) Magnetic field sensitivity axis direction. (Top View) ● Timer and Sequencer The timer and sequencer block controls periodic measurements. ● OUT Pin Magnetic field stronger than the threshold intensity turns on the switch, and makes the OUT pin draw current with the open-drain output transistor. 4AS534A10 3 ■ ■ PRELIMINARY Application Circuit YAS534 Application Circuit An application circuit example is shown below. The pin labeled N.C. may either be left unconnected or tied to ground. Pull up the OUT pin with an external resistor. VOT VDD VDD N.C. YAS534 VSS OUT An application circuit. 4AS534A10 4 ■ ■ PRELIMINARY Electric Characteristics YAS534 Electric Characteristics ● Absolute Maximum Ratings Parameter Symbol Min. Power Supply Voltage VDD Output Voltage Storage Temperature Typ. Max. Unit –0.3 4.6 V VOT –0.3 4.6 V TSTG –50 125 ºC ● Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Unit Power Supply Voltage VDD 0.9 1.0 1.6 V Operating Temperature TOP -20 25 85 ºC Symbol Min. Typ. Max. Unit 20 35 µA ● Power Consumption Parameter Operating Current (VDD=1.0V) IDD (Operating under the Recommended Operating Conditions) Parameter Symbol Min. Typ. Max. Unit IDD during TON IDD_ON 100 µA IDD during TOFF IDD_OFF 19 µA 4AS534A10 5 ■ PRELIMINARY Electric Characteristics YAS534 ● Sampling Cycle Timings Parameter Symbol Min. Typ. Magnetic Field Sampling Time TON 100 Magnetic Field Sampling Period TSP 5 IDD Time Supply Current vs. Time 4AS534A10 10 IDD_ON TSP 6 Unit µs TOFF Supply Current TON Max. IDD_OFF ms ■ PRELIMINARY Electric Characteristics YAS534 ● Magnetic Field Sensor Element Characteristics See figure below for what each parameter value shows. Parameter Symbol Min. Typ. Max. Unit Magnetic Field Switch On Threshold *) HACT 0.4 0.8 1.2 mT Magnetic Field Threshold Difference *) HDIFF 0.1 0.6 mT HLO 0.2 1.0 mT Magnetic Field Switch Off Threshold 0.5 *) Applied magnetic field is both in the direction and the opposite direction of HACT sensitivity. · Applied Magnetic Field Strength and Output Switching YAS534's response to applied magnetic field strength as output pin state, displaying the characteristic hysteresis, is shown below. An pull-up resistor is put on the YAS534 output pin load. HACT : Magnetic field switch on threshold HDIFF : Magnetic field threshold difference HLO : Magnetic field switch off threshold Output 1 0 HDIFF HLO -HACT HLO 0 HDIFF HACT Direction Component of Magnetic Sensitivity (Hx) Output pin response versus applied magnetic field. 4AS534A10 7 ■ PRELIMINARY Electric Characteristics YAS534 ● Output Pin DC Characteristic Parameter Symbol Min. Output Current （VOL=0.2V) IDR Output Leak Current ILK Typ. Max. 100 Unit µA 100 nA ● Initialization Period The device output is not valid until initialized properly for some time after power is applied. Parameter Symbol Initialization Period Min. Typ. TST TST VDD Minimum of recommended supply voltage Data available OUT Initialization time and first valid output timing. 4AS534A10 8 Max. Unit 10 ms ■ ■ PRELIMINARY Package Information YAS534 Package Information Caution The product of the WLCSP package should be used under light-shielded conditions. Since the WLCSP package has a structure that a silicon wafer is exposed, if light (such as sunlight) hits the wafer, the device may malfunction (leak current increase etc.) due to electric charge internally generated by the photoelectric effect. 注） 1. 表面実装LSIは、保管条件、および、半田付けについての特別な配慮が必要です。 2. 組立工場により、寸法や形状などが異なる場合があります。 詳しくはヤマハ代理店までお問い合わせください。 Note: 1. Special attention needs to be paid to the storage conditions and soldering method of the surface mount IC. 2. Dimension, form, etc. may differ depending on assembly plants. For details, please contact your local Yamaha agent. 4AS534A10 9 PRELIMINARY YAS534 PRECAUTIONS AND INSTRUCTIONS FOR SAFETY WARNING Prohibited Prohibited Prohibited ! Instructions Do not use the device under stresses beyond those listed in Absolute Maximum Ratings.Such stresses may become causes of breakdown, damages, or deterioration, causing explosion or ignition, and this may lead to fire or personal injury. Do not mount the devic e reversely or improperly and also do not connect a supply voltage in wrong polarity. Otherw is e, this may cause current and/or power-consumption to exceed the absolute maximum ratings, causing personal injury due to explosion or ignition as well as causing breakdown, damages, or deterioration. And, do not use the device again that has been improperly mounted and pow ered once. Do not short between pins.In particular, when different power supply pins, such as between high-voltage and low -voltage pins, are shorted, smoke, fire, or explosion may take place. As to devic es capable of generating sound from its speaker outputs, please design with safety of your products and system in mind, such as the consequences of unusual speaker output due to a malfunction or failure. A speaker dissipates heat in a voice-coil by air flow accompanying vibration of a diaphragm. When a DC signal (several Hz or less) is input due to device failure, heat dis sipation characteris tics degrade rapidly, thereby leading to voice-coil burnout, smoking or ignition of the speaker even if it is used w ithin the rated input value. CAUTION Prohibited ! Instructions ! Instructions ! Instructions ! Instructions ! Instructions ! Instructions ! Instructions ! Instructions Do not use Yamaha products in close proximity to burning materials, combustible substances, or inflammable materials, in order to prevent the spread of the fir e caused by Yamaha products, and to prevent the smoke or fire of Yamaha products due to peripheral components. Generally, semiconductor products may malfunction and break down due to aging, degradation, etc. It is the responsibility of the designer to take actions such as safety design of products and the entire system and also fail-safe design according to applications, so as not to cause property damage and/or bodily injury due to malfunction and/or failure of semiconductor products. The built-in DSP may output the maximum amplitude w aveform suddenly due to malfunction from disturbances etc. and this may cause damage to headphones, external amplifiers, and human body (the ear). Please pay attention to safety measures for device malfunction and failure both in product and system design. As semiconductor devices are not nonflammable, overcurrent or failure may cause smoke or fire. Therefore, products should be designed w ith safety in mind such as using overcurrent protection circuits to control the amount of current during operation and to shut off on failure. Products should be designed with fail safe in mind in case of malfunction of the built-in protection circuits. Note that the built-in protection circuits such as overcurrent protection circuit and high-temperature protection circuit do not alw ays protect the internal cir cuits. In some cases, depending on usage or situations, such protection circuit may not w ork properly or the device itself may break dow n before the protection circuit kicks in. Use a robust power supply.The use of an unrobust power supply may lead to malfunctions of the protection circuit, causing device breakdow n, personal injury due to explosion, or smoke or fire. Product's housing should be designed with the considerations of short-circuiting between pins of the mounted device due to foreign conductive substances (such as metal pins etc.). Moreover, the housing should be designed w ith spatter prevention etc. due to explosion or burning. Otherw ise, the spattered substance may cause bodily injury. The device may be heated to a high temperature due to internal heat generation during operation.Therefore, please take care not to touch an operating device directly. Electrostatic dis charges can damage and destroy semiconductor devices.Pay close attention to static build-up when handling devices. v 03 4AS534A10 10 PRELIMINARY YAS534