ETC DN8797MS

Hall ICs
DN8797MS
3 V operation Hall IC
■ Overview
0.40 +– 0.10
0.05
1.45
0.65 ± 0.15
Unit: mm
The DN8797MS-A is a 3 V operation Hall IC which
includes a Hall element, amplifier circuit, Schmidt circuit,
stabilized power supply and temperature compensation
circuit which are integrated on a single chip with a fine
patterning technology. The magnetic input signal is outputted by being converted to high or low. We have improved the conventional circuit to realize a stable operation covering from low to high supply voltage and from
low to high temperature.
0.16 +– 0.10
0.06
0.40 ± 0.20
5°
2
0.95
1.90 ± 0.20
2.90 –+ 0.20
0.05
0.65 ± 0.15
1
0.95
2.80 +– 0.20
0.30
1.50 +– 0.25
0.05
3
+ 0.20
0 to 0.1 1.10 – 0.10
■ Features
• Wide operating supply voltage range
(VCC = 2.7 V to 14.4 V)
• Wide operating ambient temperature (−40°C to +85°C)
• Package: Mini type (3-pin type)
(1.1 mm thick: Same as a standard transistor)
0.30
1.10 +– 0.10
10°
MINI-3D
■ Applications
• DC brushless motor, fan motor, rotation sensor, detection of cover open/close (example for a cellular phone),
position sensor
2
VCC
■ Block Diagram
56 kΩ
(typ.)
Constant
voltage source
Comparator
Hall element
GND
1
Out
Amplifier
3
1
DN8797MS
Hall ICs
■ Pin Descriptions
Pin No.
Symbol
Description
1
Out
Output pin
2
VCC
Supply voltage pin
3
GND
Ground pin
■ Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
VCC
18
V
VOUT
18
Supply current
ICC

mA
Power dissipation
PD
120
mW
Operating ambient temperature
Topr
−20 to +85
°C
Storage temperature
Tstg
−55 to +125
°C
Supply voltage
Note) 1. Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C.
2. The reverse insertion of this IC will cause its breakdown.
3. It will operate normally in several tens of ms after power on.
4. This IC is designed for a general use and if you want to use for an automotive use, please consult our staff of the nearby
sales office beforehand.
■ Recommended Operating Range
Parameter
Symbol
Range
Unit
VCC
2.7 to 14.4
V
Supply voltage
■ Electrical Characteristics at Ta = 25°C
Parameter
Symbol
Operating magnetic flux density 1
BH-L
Operating magnetic flux density 2
Conditions
Min
Typ
Max
Unit
VCC = 3 V
−20


mT
BL-H
VCC = 3 V


−3
mT
Hysteresis width
BW
VCC = 3 V
0.2
1.5
4
mT
Output voltage 1
VOL1
VCC = 14.4 V, IO = 5 mA, B = −22 mT

0.07
0.30
V
Output voltage 2
VOL2
VCC = 2.7 V, IO = 5 mA, B = −22 mT

0.07
0.30
V
Output voltage 3
VOH1
VCC = 14.4 V, IO = −20 µA, B = −3 mT
12.8
13.3
13.8
V
Output voltage 4
VOH2
VCC = 2.7 V, IO = −20 µA, B = −3 mT
1.05
1.55
2.05
V
Output short-circuited current
−IOS
VCC = 14.4 V, B = −3 mT, VO = 0 V
0.19
0.27
0.39
mA
Supply current 1
ICC1
VCC = 14.4 V, B = −3 mT
1.0
3.4
6.0
mA
Supply current 2
ICC2
VCC = 2.7 V, B = −3 mT
1.0
2.5
6.0
mA
Note) 1. Symbol BH-L stands for the operating magnetic flux density where its output level varies from high to low.
2. Symbol BL-H stands for the operating magnetic flux density where its output level varies from low to high.
3. The variation of operating magnetic flux density does not depend on supply voltage due to its built-in stabilized power
source. (VCC should be confined to the range of 2.7 V to 14.4 V.)
4. A supply current changes by maximum 1 mA when its output level varies from high to low.
2
Hall ICs
DN8797MS
■ Caution on use of Hall ICs
As the Hall IC is often used to detect movement, the position of a Hall IC may be changed, and there is the risk of
a change in detection level, if exposed to shock or vibration over a long period of time. Secure the IC by applying
adhesive to the package or placing in a dedicated case.
1. On mounting of the surface mount type (MINI-3D package)
When mounted on the printed circuit board, the Hall IC may be highly stressed by the warping that may occur from
soldering. This may also cause a change in the operating flux density characteristic and a deterioration of its resistance
to moisture.
2. On using flux in soldering
Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The
ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the
disconnection of the aluminum wiring on the surface of an IC chip.
3. On fixing a Hall IC with the holder
When a Hall IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder
is large, the lead wire of the Hall IC will be stretched and it may give a stress to the Hall IC.
If the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package and
the lead wire may be weakened and caused a minute gap resulting in the deterioration of its resistance to moisture.
Sensitivity may also be changed by this stress.
4. Power supply line/power transmission line
If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line.
In this case, set the capacitor of 0.1 µF to 10 µF near a Hall IC to prevent it.
If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the ignition
pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing elements, etc.).
5. VCC and GND
Do not reverse VCC and GND. If the VCC and GND pins are reversely connected, this IC will be destroyed. If the
IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become same as a forward biased
diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will flow through
the IC, ending up in its destruction. (This is common to Monolithic IC.)
6. Cautions on power ON of Hall IC
When a Hall IC is turned ON, the position of the magnet or looseness may change the output of a Hall IC, and a
pulse may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the
supply power is ON.
3
DN8797MS
Hall ICs
■ Technical Data
• Position of a Hall element (unit in mm)
Distance from a package surface to sensor part: 0.71 mm
A Hall element is placed on the shaded part in the figure.
0.5
1.2
0.5
0.5
• Magneto-electro conversion characteristics
S
N
Direction of applied magnetic field
Output voltage
BL-H
BW
BH-L
Applied magnetic flux density B
4
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the
"Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial
property, the granting of relative rights, or the granting of any license.
(3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(4) The products and product specifications described in this material are subject to change without
notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to
make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, redundant design is recommended,
so that such equipment may not violate relevant laws or regulations because of the function of our
products.
(6) When using products for which dry packing is required, observe the conditions (including shelf life
and after-unpacking standby time) agreed upon when specification sheets are individually exchanged.
(7) No part of this material may be reprinted or reproduced by any means without written permission
from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic
semiconductor products best suited to their applications.
Due to modification or other reasons, any information contained in this material, such as available
product types, technical data, and so on, is subject to change without notice.
Customers are advised to contact our semiconductor sales office and obtain the latest information
before starting precise technical research and/or purchasing activities.
B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but
there is always the possibility that further rectifications will be required in the future. Therefore,
Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material.
C. These materials are solely intended for a customer's individual use.
Therefore, without the prior written approval of Panasonic, any other use such as reproducing,
selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR