FAIRCHILD FDC6901L

FDC6901L
Integrated Load Switch
General Description
Features
This device is particularly suited for compact power
management. In portable electronic equipment where 2.5V
to 6V input capability is needed. This load switch integrates
a Slew Rate Control Driver that drives a P-Channel Power
MOSFET in one tiny SuperSOT-6 package. The
integrated slew rate control driver is specifically designed
to control the turn on of the P-Channel MOSFET in order to
limit the inrush current in battery switching applications with
high capacitance loads. For turn-off, the IC pulls the
MOSFET gate up quickly.
•
•
•
•
•
•
Three programmable slew rates
Reduces inrush current
Minimizes EMI
Normal turn-off speed
Low-power CMOS operates over wide voltage range
High performance trench technology for extremely
low RDS(ON)
Applications
•
•
Load switch
Power management
D2
S1
D1
G2
SuperSOT
TM
-6
Pin 1
S2
G1
SuperSOT™-6
Absolute Maximum Ratings
Symbol
VDD
VIN
PD
TSTG
TA=25oC unless otherwise noted
Parameter
Ratings
Units
Supply Voltage
DC Input Voltage (Logic Inputs)
Power Dissipation
Storage Junction Temperature Range
–0.5 to 10
–0.7 to 6
V
V
–55 to +150
°C
–0.5 to 10
–55 to +150
V
°C
180
60
°C/W
°C/W
Recommended Operating Range
VDD
TJ
Supply Voltage
Operating Junction Temperature
Thermal Characteristics
RθJA
RθJC
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Package Marking and Ordering Information
Device Marking
.901
 2002 Fairchild Semiconductor Corporation
Device
FDC6901L
Reel Size
7”
Tape Width
8mm
Quantity
3000 units
FDC6901L Rev C (W)
FDC6901L
May 2002
Symbol
TA=25oC unless otherwise noted
Parameter
Test Conditions
Min
Typ
Max
Units
Logic Levels
VIH
VIL
Logic HIGH Input Voltage
Logic LOW Input Voltage
VDD = 2.7 V to 6.0 V
75%*
VDD
V
25%*
VDD
VDD = 2.7 V to 6.0 V
V
OFF Characteristics – Slew Rate Control Driver
BVDG
BVSLEW
BVIN
IRDG
IRSLEW
IRIN
Supply Input Breakdown Voltage
Slew Input Breakdown Voltage
Logic Input Breakdown Voltage
Supply Input Leakage Current
Slew Input Leakage Current
Logic Input Leakage Current
IDG = 10 µA, VIN = 0 V, VSLEW = 0 V
ISLEW = 10 µA, VIN = 0 V
IIN = 10 µA, VSLEW = 0 V
VDG = 8 V, VIN = 0 V, VSLEW = 0 V
VSLEW = 8 V, VIN = 0 V
VIN = 8 V, VSLEW = 0 V
9
9
9
100
100
100
V
V
V
nA
nA
nA
100
V
nA
OFF Characteristics – Slew Rate Control Driver + P-Channel MOSFET
BVIO
IRIO
IO Breakdown Voltage
IO Leakage Current
ID = –250 µA
VR = 16 V
9
ON Characteristics – Slew Rate Control Driver
IG
Output/Gate Current
VIN = 6V
VGATE = 2V
Slew Pin = OPEN
= GROUND
= VDD
90
1
10
µA
µA
nA
ON Characteristics – P-Channel MOSFET
VGS(th)
RDS(ON)
Gate Threshold Voltage
Static Drain-Source On
Resistance
VDS = VGS , ID = –250 µA
VGS = –4.5 V, ID = –1.5 A
VGS = –2.5 V, ID = –1.2 A
–0.6
–1.0
120
170
–1.5
145
210
V
mΩ
mΩ
ON Characteristics – Slew Rate Control Driver + P-Channel MOSFET
VDROP
Dropout Voltage
VDD = 6V, VIN = 2.5V to 6V, IL = 1.5 A
VDD = 6V, VIN = 2.5V to 6V, IL = 1.2 A
160
130
300
300
mV
mV
RON
Load switch On Resistance
VDD = 6V, VIN = 2.5V to 6V, IL = 1.5 A
VDD = 6V, VIN = 2.5V to 6V, IL = 1.2 A
105
110
180
210
ILOAD
Load Current
VGS = 2.5 V, VDS = 6 V
mΩ
mΩ
A
3
P-Channel MOSFET Switching Times
Vsupply = 5.5V, VDD = 5.5V, Logic IN = 5.5V, ILOAD = 1.5A
Output Turn-On Delay Time
Slew Pin = OPEN
tdon
= GROUND
= VDD
trise
Output Rise Time
Slew Pin = OPEN
= GROUND
= VDD
dv/dt
Output Slew Rate
Slew Pin = OPEN
= GROUND
= VDD
6.20
42
115
6.75
124
162
600
41
24
µs
µs
µs
µs
µs
µs
V/ms
V/ms
V/ms
FDC6901L Rev C (W)
FDC6901L
Electrical Characteristics
FDC6901L
Typical Characteristics
450
220
VDD = 6V
VIN = 2.55V to 6V
400
200
Dropout Voltage, VDrop (mV)
Dropout Voltage, VDrop (mV)
VDD = 6V
VIN = 2.55V to 6V
IL = 1.5A
180
160
IL = 1.2A
140
120
350
300
250
200
o
TJ = 125 C
150
o
TJ = 25 C
100
50
100
-50
-25
0
25
50
75
100
125
0
150
0
o
1
Junction Temperature, C
Figure 1. Dropout Voltage vs. Temperature.
SLEW = OPEN
140
ILOAD = 1A
VDD = 6V
VIN = 2.55V to 6V
IL = 1.2A
130
180
On-Resistance, RON (mΩ)
Dropout Voltage, VDrop (mV)
3
Figure 2. Dropout Voltage vs. Load Current.
SLEW = OPEN
200
160
TJ = 125oC
140
120
IL = 1.5A
120
110
100
o
TJ = 25 C
90
80
100
2.5
3
3.5
4
-50
4.5
-25
0
75
100
125
150
Figure 4. On-Resistance vs. Temperature.
SLEW = OPEN
200
VDD = 6V
VIN = 2.55V to 6V
On-Resistance, RON (mΩ)
ILOAD = 1A
1
o
TJ = 125 C
o
0.1
0.01
0.01
50
Junction Temperature, C
Figure 3. Dropout Voltage vs. Input Voltage.
SLEW = OPEN
10
25
o
Input Voltage, VDD (V)
On Resistance, RON (Ω)
2
Load Current, Amps (A)
TJ = 25 C
180
160
o
TJ = 125 C
140
120
o
TJ = 25 C
100
0.1
1
Load Current, Amps (A)
Figure 5. On-Resistance vs. Load Current.
SLEW = OPEN
10
2.5
3
3.5
4
4.5
Input Voltage, VDD (V)
Figure 6. . On-Resistance vs. Input Voltage.
SLEW = OPEN
FDC6901L Rev C (W)
FDC6901L
Typical Characteristics
160
7.5
Slew = Open
Vdd=Vin=5.5V
7.0
120
trise
time, µsecs
time, microseconds (µs)
Slew = Gnd
Vdd=Vin=5.5V
140
6.5
trise
6.0
100
80
tdon
60
40
tdon
5.5
20
5.0
0
0
10
20
30
40
50
0
10
Load Resistance, ohms (Ω)
Figure 7. Switching Time vs. Load
Resistance. SLEW = OPEN
30
40
50
Figure 8. Switching Time vs. Load
Resistance. SLEW = GROUND
200
7.5
Slew = Vdd
Vdd=Vin=5.5V
Slew = Open
Vdd=Vin=5.5V
175
7.0
time, (µsec)
time, microseconds (µs)
20
Load Resistance, ohms (Ω)
150
tris
125
trise
6.5
tdon
6.0
tdon
100
5.5
5.0
75
0
10
20
30
40
0.0
50
0.5
1.0
Load Resistance, ohms (Ω)
1.5
2.0
2.5
Load Current, Amps (A)
Figure 10. Switching time vs. Load Current.
SLEW = OPEN
Figure 9. Switching Time vs. Load
Resistance. SLEW = VDD
200
160
Slew = Gnd
Vdd=Vin=5.5V
Slew = Vdd
Vdd=Vin=5.5V
140
time, µsec
time, microseconds (µs)
175
trise
120
100
80
60
trise
150
125
tdon
100
tdon
40
75
20
0.0
0.5
1.0
1.5
2.0
2.5
Load Current, Amps (A)
Figure 11. Switching time vs. Load Current.
SLEW = GROUND
0.0
0.5
1.0
1.5
2.0
2.5
Load Current, Amps (A)
Figure 12. Switching time vs. Load Current.
SLEW = VDD
FDC6901L Rev C (W)
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
E2CMOSTM
EnSignaTM
FACT™
FACT Quiet Series™
FAST â
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
I2C™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
OPTOLOGIC â
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench â
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER â UHC™
SMART START™
UltraFET â
SPM™
VCX™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
STAR*POWER is used under license
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
2. A critical component is any component of a life
1. Life support devices or systems are devices or
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H5