MAX4627EUK Rev. A RELIABILITY REPORT FOR MAX4627EUK PLASTIC ENCAPSULATED DEVICES October 1, 2001 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl Quality Assurance Executive Director Conclusion The MAX4627 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments I. Device Description A. General The MAX4627 is a low-on-resistance, low-voltage, single-pole/single-throw (SPST) analog switch that operates from a +1.8V to +5.5V single supply. The MAX4627 is normally closed (NC). This device also has a fast switching speed (t ON = 50ns max, tOFF = 30ns max). When powered from a +5V supply, the MAX4627 offers 0.5 ohms max on-resistance (RON) with 0.1 ohms max RON flatness, and its digital logic input is TTL compatible. This switch also features overcurrent protection to prevent device damage from short circuits and excessive loads. B. Absolute Maximum Ratings Item Voltages Referenced to GND V+, IN, NO, NC, COM (Note 1) Continuous Current NO, NC to COM Peak Current NO, NC to COM (pulsed at 1ms, 10% duty cycle max) Continuous Power Dissipation (TA = 700C) Junction Temperature Storage Temp. Lead Temp. (10 sec.) Power Dissipation 5 Lead SOT-23 Derates above +70°C 5 Lead SOT-23 Rating -0.3V to +6V -0.3V to (V+ + 0.3V) ±400mA ±800mA +150°C -65°C to +150°C +300°C 571mW 7.1mW/°C II. Manufacturing Information A. Description/Function: 1Ω, Low-Voltage, Single-Supply SPDT Analog Switch B. Process: T06 (0.6 micron TSMC CMOS) C. Number of Device Transistors: 186 D. Fabrication Location: Taiwan, USA E. Assembly Location: Malaysia F. Date of Initial Production: January, 2000 III. Packaging Information A. Package Type: 5 Lead SOT-23 B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: Non-Conductive E. Bondwire: Gold (1 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: Buildsheet # 05-1201-0129 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimensions: 57 x 35 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Al/Si/Cu (Aluminum/ Silicon/ Copper) D. Backside Metallization: None E. Minimum Metal Width: Metal 1: 0.9 microns; Metal 2: 0.9 microns (as drawn) F. Minimum Metal Spacing: Metal 1: 0.8 microns; Metal 2: 0.8 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl (Executive Director of QA) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (λ) is calculated as follows: λ= 1 = MTTF 4.04 192 x 4389 x 160 x 2 (Chi square value for MTTF upper limit) Thermal acceleration factor assuming a 0.8eV activation energy λ = 14.98 x 10-9 λ= 14.98 F.I.T. (60% confidence level @ 25°C) This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure the reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on lots exceeding this level. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1L). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The AH25Z-3Z die type has been found to have all pins able to withstand a transient pulse of ±1000V, per Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±250mA and/or ±20V. Table 1 Reliability Evaluation Test Results MAX4627EUK TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased Time = 192 hrs. FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES DC Parameters & functionality 160 1 Moisture Testing (Note 2) Pressure Pot Ta = 121°C P = 15 psi. RH= 100% Time = 168hrs. DC Parameters & functionality 77 0 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. DC Parameters & functionality 77 0 DC Parameters 77 Mechanical Stress (Note 2) Temperature Cycle -65°C/150°C 1000 Cycles Method 1010 0 Note 1: Life Test Data may represent plastic D.I.P. qualification lots for the SOT-23 package. Note 2: Generic Package/Process Data. Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ Terminal A (Each pin individually connected to terminal A with the other floating) Terminal B (The common combination of all like-named pins connected to terminal B) 1. All pins except VPS1 3/ All VPS1 pins 2. All input and output pins All other input-output pins 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 c. Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the TERMINAL C R1 R2 S1 TERMINAL A REGULATED HIGH VOLTAGE SUPPLY S2 C1 DUT SOCKET SHORT TERMINAL B TERMINAL D CURRENT PROBE (NOTE 6) R = 1.5kΩ Ω C = 100pf other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open. Mil Std 883D Method 3015.7 Notice 8