DISCRETE SEMICONDUCTORS DATA SHEET BTA216X series D, E and F Three quadrant triacs guaranteed commutation Product specification April 2002 NXP Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA216X series D, E and F GENERAL DESCRIPTION QUICK REFERENCE DATA Passivated guaranteed commutation triacs in a full pack, plastic envelope intended for use in motor control circuits or with other highly inductive loads. These devices balance the requirements of commutation performance and gate sensitivity. The "sensitive gate" E series and "logic level" D series are intended for interfacing with low power drivers, including micro controllers. PINNING - SOT186A PIN SYMBOL PARAMETER BTA216XBTA216XBTA216XRepetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current VDRM IT(RMS) ITSM PIN CONFIGURATION MAX. UNIT 600D 600E 600F 600 V 16 140 A A SYMBOL DESCRIPTION case 1 main terminal 1 2 main terminal 2 3 gate T2 T1 G 1 2 3 case isolated LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VDRM Repetitive peak off-state voltages IT(RMS) RMS on-state current ITSM Non-repetitive peak on-state current I2t dIT/dt IGM PGM PG(AV) Tstg Tj I2t for fusing Repetitive rate of rise of on-state current after triggering Peak gate current Peak gate power Average gate power CONDITIONS full sine wave; Ths ≤ 38 ˚C full sine wave; Tj = 25 ˚C prior to surge t = 20 ms t = 16.7 ms t = 10 ms ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs over any 20 ms period Storage temperature Operating junction temperature MIN. MAX. UNIT - 6001 V - 16 A - 140 150 98 100 A A A2s A/µs - 2 5 0.5 A W W -40 - 150 125 ˚C ˚C 1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/µs. April 2002 1 Rev 2.000 NXP Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA216X series D, E and F ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS Visol R.M.S. isolation voltage from all three terminals to external heatsink f = 50-60 Hz; sinusoidal waveform; R.H. ≤ 65% ; clean and dustfree Cisol Capacitance from T2 to external f = 1 MHz heatsink MIN. TYP. MAX. UNIT - - 2500 V - 10 - pF MIN. TYP. MAX. UNIT - 55 4.0 5.5 - K/W K/W K/W THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-hs Thermal resistance junction to heatsink Rth j-a Thermal resistance junction to ambient full or half cycle with heatsink compound without heatsink compound in free air STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. BTA216X- 2 IGT Gate trigger current IL Latching current IH Holding current VD = 12 V; IT = 0.1 A T2+ G+ T2+ GT2- GVD = 12 V; IGT = 0.1 A T2+ G+ T2+ GT2- GVD = 12 V; IGT = 0.1 A MAX. UNIT ...D ...E ...F - 5 5 5 10 10 10 25 25 25 mA mA mA - 15 25 25 25 30 30 30 40 40 mA mA mA - 15 25 30 mA ...D, E, F VT VGT On-state voltage Gate trigger voltage ID Off-state leakage current IT = 20 A VD = 12 V; IT = 0.1 A VD = 400 V; IT = 0.1 A; Tj = 125 ˚C VD = VDRM(max); Tj = 125 ˚C 0.25 1.5 1.5 - V V V - 0.5 mA 2 Device does not trigger in the T2-, G+ quadrant. April 2002 2 Rev 2.000 NXP Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA216X series D, E and F DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER dVD/dt Critical rate of rise of off-state voltage dIcom/dt Critical rate of change of commutating current dIcom/dt Critical rate of change of commutating current April 2002 CONDITIONS MIN. MAX. UNIT BTA216X- ...D ...E ...F VDM = 67% VDRM(max); Tj = 110 ˚C; exponential waveform; gate open circuit VDM = 400 V; Tj = 125 ˚C; IT(RMS) = 16 A; dVcom/dt = 10V/µs; gate open circuit VDM = 400 V; Tj = 125 ˚C; IT(RMS) = 16 A; dVcom/dt = 0.1V/µs; gate open circuit 30 60 70 - V/µs 2.5 6.2 18 - A/ms 12 20 50 - A/ms 3 Rev 2.000 NXP Semiconductors Product specification Three quadrant triacs guaranteed commutation 25 BTA216X series D, E and F Ths(max) / C Ptot / W 25 20 IT(RMS) / A BT139X = 180 20 38 C 45 120 1 15 90 15 65 60 10 30 10 85 5 105 0 0 5 10 IT(RMS) / A 5 125 20 15 0 -50 Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where α = conduction angle. 1000 0 50 Ths / C 100 150 Fig.4. Maximum permissible rms current IT(RMS) , versus heatsink temperature Ths. ITSM / A 50 IT(RMS) / A 40 dI T /dt limit 30 100 20 I TSM IT T 10 time Tj initial = 25 C max 10 10us 100us 1ms T/s 10ms 0 0.01 100ms Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp ≤ 20ms. 150 100 1.6 ITSM T 10 Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Ths ≤ 38˚C. ITSM / A IT 0.1 1 surge duration / s VGT(Tj) VGT(25 C) 1.4 time Tj initial = 25 C max 1.2 1 50 0.8 0.6 0 1 10 100 Number of cycles at 50Hz 0.4 -50 1000 Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz. April 2002 0 50 Tj / C 100 150 Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25˚C), versus junction temperature Tj. 4 Rev 2.000 NXP Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA216X series D, E and F IGT(Tj) IGT(25°C) 50 3 T2+ G+ T2+ GT2- G- 2.5 Tj = 125 C Tj = 25 C typ 40 2 BT139 IT / A max Vo = 1.195 V Rs = 0.018 Ohms 30 1.5 20 1 10 0.5 0 -50 0 50 Tj/°C 100 0 150 0.5 1 1.5 VT / V 2 2.5 3 Fig.10. Typical and maximum on-state characteristic. Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25˚C), versus junction temperature Tj. 3 0 IL(Tj) IL(25 C) 10 Zth j-hs (K/W) with heatsink compound without heatsink compound 2.5 1 unidirectional bidirectional 2 0.1 1.5 P D 1 tp 0.01 0.5 t 0 -50 0 50 Tj / C 100 0.001 10us 150 Fig.8. Normalised latching current IL(Tj)/ IL(25˚C), versus junction temperature Tj. 3 0.1ms 1ms 10ms tp / s 0.1s 1s 10s Fig.11. Transient thermal impedance Zth j-mb, versus pulse width tp. dIcom/dt (A/ms) IH(Tj) IH(25C) 100 F TYPE E TYPE D TYPE 2.5 2 10 1.5 1 0.5 0 -50 1 0 50 Tj / C 100 20 150 Fig.9. Normalised holding current IH(Tj)/ IH(25˚C), versus junction temperature Tj. April 2002 40 60 80 Tj/˚C 100 120 140 Fig.12. Minimum, critical rate of change of commutating current dIcom/dt versus junction temperature, dVcom/dt = 10V/µs. 5 Rev 2.000 NXP Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA216X series D, E and F MECHANICAL DATA Dimensions in mm Net Mass: 2 g 10.3 max 4.6 max 3.2 3.0 2.9 max 2.8 Recesses (2x) 2.5 0.8 max. depth 6.4 15.8 max. 19 max. 15.8 max seating plane 3 max. not tinned 3 2.5 13.5 min. 1 0.4 2 3 M 1.0 (2x) 0.6 2.54 0.9 0.7 0.5 2.5 5.08 1.3 Fig.13. SOT186A; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". April 2002 6 Rev 2.000 NXP Semiconductors Legal information DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 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