BTA/BTB24, BTA25, BTA26 and T25 Series 25A TRIACS SNUBBERLESS & STANDARD MAIN FEATURES: A2 Symbol Value Unit IT(RMS) 25 A V DRM/VRRM 600 and 800 V IGT (Q1) 35 to 50 mA A2 G A1 A1 A2 G IT(RMS) ITSM It dI/dt PG(AV) Tstg Tj A2 RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle, Tj initial = 25°C) I t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range September 2000 - Ed: 3 TO-220AB (BTB24) A1 A2 G D 2PAK (T25G) A1 A2 G A1 A2 RD91 (BTA25) Value D PAK TO-220AB RD91 TOP3 Ins. TO-220AB Ins. F = 60 Hz F = 50 Hz G TOP3 Insulated (BTA26) Parameter VDSM/VRSM Non repetitive surge peak off-state voltage IGM A1 A2 G TO-220AB Insulated (BTA24) DESCRIPTION Available either in through-hole of surface and T25 mount packages, the BTA/BTB24-25-26 triac series is suitable for general purpose AC power switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, water heaters, induction motor starting circuits...or for phase control operation in high power motor speed controllers, soft start circuits...The snubberless versions (BTA/BTB...W and T25 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500V RMS) complying with UL standards (File ref.: E81734). ABSOLUTE MAXIMUM RATINGS Symbol A2 A Tc = 100°C Tc = 90°C Tc = 75°C t = 16.7 ms t = 20 ms tp = 10 ms Unit 25 260 250 A 450 As F = 120 Hz Tj = 125°C 50 A/µs tp = 10 ms Tj = 25°C V DRM/VRRM V tp = 20 µs Tj = 125°C 4 A Tj = 125°C 1 W - 40 to + 150 - 40 to + 125 °C + 100 1/9 BTA/BTB24, BTA25, BTA26 and T25 Series ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) ■ SNUBBERLESS (3 Quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W Symbol IGT (1) V GT Test Conditions Quadrant R L = 33 Ω VD = 12 V VGD VD = VDRM IH (2) IT = 500 mA IL IG = 1.2 IGT RL = 3.3 kΩ Tj = 125°C T25 ■ CW BW 35 35 50 Unit mA MAX. I - II - III MAX. 1.3 V I - II - III MIN. 0.2 V I - III VD = 67 % VDRM gate open Tj = 125°C (dI/dt)c (2) Without snubber T2535 I - II - III MAX. 50 50 75 mA MAX. 70 70 80 mA 80 80 100 MIN. 500 500 1000 V/µs MIN. 13 13 22 A/ms II dV/dt (2) BTA/BTB Tj = 125°C STANDARD (4 Quadrants): BTA25...B, BTA26...B Symbol Test Condit ions IGT (1) VD = 12 V Quadrant RL = 33 Ω VGT VGD VD = VDRM IH (2) IT = 500 mA IL IG = 1.2 IGT RL = 3.3 kΩ Tj = 125°C MAX. 50 100 mA ALL MAX. 1.3 V ALL MIN. 0.2 V MAX. 80 mA 70 mA I - III - IV VD = 67 % VDRM gate open Tj = 125°C (dV/dt)c (2) (dI/dt)c = 13.3 A/ms Unit I - II - III IV MAX. II dV/dt (2) Value Tj = 125°C 160 MIN. 500 V/µs MIN. 10 V/µs STATIC CHARACTERISTICS Symbol VTM (2) Test Conditions ITM = 35 A tp = 380 µs Unit MAX. 1.55 V Vto (2) Threshold voltage Tj = 125°C MAX. 0.85 V Rd (2) Dynamic resistance Tj = 125°C MAX. 16 mΩ I DRM VDRM = VRRM Tj = 25°C 5 µA 3 mA I RRM Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1 2/9 Tj = 25°C Value Tj = 125°C MAX. BTA/BTB24, BTA25, BTA26 and T25 Series THERMAL RESISTANCES Symbol Parameter Value Junction to case (AC) Rth(j-c) Junction to ambient R th(j-a) D PAK TO-220AB 0.8 RD91 (Insulated) TOP3 Insulated 1.1 TO-220AB Insulated 1.7 D PAK 45 TOP3 Insulated 50 S = 1 cm TO-220AB TO-220AB Insulated Unit °C/W °C/W 60 S: Copper surface under tab PRODUCT SELECTOR Voltage (xxx) Part Number Sensitivity Type Package X 50 mA Standard TO-220AB X X 50 mA Snubberless TO-220AB BTA/BTB24-xxxCW X X 35 mA Snubberless TO-220AB BTA25-xxxB X X 50 mA Standard RD-91 BTA25-xxxBW X X 50 mA Snubberless RD-91 BTA25-xxxCW X X 35 mA Snubberless RD-91 BTA26-xxxB X X 50 mA Standard TOP3 Ins. BTA26-xxxBW X X 50 mA Snubberless TOP3 Ins. BTA26-xxxCW X X 35 mA Snubberless TOP3 Ins. T2535-xxxG X X 35 mA Snubberless D PAK 600 V 800 V BTB24-xxxB X BTA/BTB24-xxxBW BTB: Non insulated TO-220AB package ORDERING INFORMATION BT A 24 - 600 BW TRIAC SERIES INSULATION: A: insulated B: non insulated VOLTAGE: 600: 600V 800: 800V SENSITIVITY & TYPE B: 50mA STANDARD BW: 50mA SNUBBERLESS CW: 35mA SNUBBERLESS CURRENT: 24: 25A in TO-220AB 25: 25A in Rd91 26: 25A in TOP3 3/9 BTA/BTB24, BTA25, BTA26 and T25 Series T 25 35 - 600 G (-TR) TRIAC SERIES PACKAGE: G: D2PAK CURRENT: 25A VOLTAGE: 600: 600V 800: 800V PACKING MODE: Blank: Tube -TR: Tape & Reel SENSITIVITY: 35: 35mA OTHER INFORMATION Part Number Marking Weight Base quantity Packing mode BTA/BTB24-xxxyz BTA/BTB24xxxyz 2.3 g 250 Bulk BTA25-xxxyz BTA25xxxyz 20 g 25 Bulk BTA26-xxxyz BTA26xxxyz 4.5 g 120 Bulk T2535-xxxG T2535xxxG 1.5 g 50 Tube T2535-xxxG-TR T2535xxxG 1.5 g 1000 Tape & reel Note: xxx= voltage, y = sensitivity, z = type 4/9 BTA/BTB24, BTA25, BTA26 and T25 Series Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle). Fig. 2-1: RMS on-state current versus case temperature (full cycle). P (W) IT(RMS) (A) 30 30 25 25 20 20 15 15 10 10 BTB/T25 BTA24 5 0 5 IT(RMS) (A) 0 5 10 15 BTA25/26 Tc(°C) 20 25 Fig. 2-2: D PAK RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35 µm), full cycle. 0 0 25 75 100 125 Fig. 3: Relative variation of thermal impedance versus pulse duration. IT(RMS) (A) 1E+0 4.0 50 K=[Zth/Rth] 2 D PAK (S=1cm2) 3.5 Zth(j-c) 3.0 1E-1 2.5 Zth(j-a) BTA/BTB24/T25 2.0 1.5 1E-2 Zth(j-a) BTA26 1.0 0.5 0.0 Tamb(°C) 0 25 Fig. 4: values). 50 tp (s) 75 100 125 On-state characteristics (maximum 1E-3 1E-3 1E-1 1E+0 1E+1 1E+2 5E+2 Fig. 5: Surge peak on-state current versus number of cycles. ITM (A) ITSM (A) 300 100 1E-2 300 250 t=20ms Tj max One cycle Non repetitive Tj initial=25°C 200 150 10 Repetitive Tc=75°C Tj=25°C 100 Tj max. Vto = 0.85 V Rd = 16 mΩ VTM (V) 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 50 Number of cycles 4.5 0 1 10 100 1000 5/9 BTA/BTB24, BTA25, BTA26 and T25 Series Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10ms, and corresponding value of I t. Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values). IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25°C] ITSM (A), I t (A s) 2.5 3000 Tj initial=25°C 2.0 dI/dt limitation: 50A/µs IGT ITSM 1000 1.5 It IH & IL 1.0 0.5 Tj(°C) tp (ms) 100 0.01 0.10 1.00 10.00 Fig. 8: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). 100.0 50 40 30 20 6/9 S(cm ) 20 24 28 100 120 140 Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature. 1 60 16 80 2 D PAK 12 60 3 70 8 40 4 Rth(j-a) (°C/W) 4 20 5 80 0 0 6 Fig. 10: D PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm). 0 -20 (dI/dt)c [Tj] / (dI/dt)c [Tj specified] (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.4 2.2 2.0 1.8 1.6 BW/CW/T2535 1.4 B 1.2 1.0 0.8 0.6 (dV/dt)c (V/µs) 0.4 0.1 1.0 10.0 10 0.0 -40 32 36 40 0 Tj (°C) 0 25 50 75 100 125 BTA/BTB24, BTA25, BTA26 and T25 Series PACKAGE MECHANICAL DATA D PAK (Plastic) DIMENSIONS REF. A E Min. C2 L2 D L L3 A1 B2 Millimeters R C B G A2 2.0 MIN. FLAT ZONE V2 A A1 A2 B B2 C C2 D E G L L2 L3 R V2 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 Typ. Inches Max. Min. 1.40 0.169 0.098 0.001 0.027 0.048 0.60 0.017 1.36 0.047 9.35 0.352 10.28 0.393 5.28 0.192 15.85 0.590 1.40 0.050 1.75 0.055 0.40 0° Typ. 4.60 2.69 0.23 0.93 Max. 0.181 0.106 0.009 0.037 0.055 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 8° 0° 8° FOOTPRINT DIMENSIONS (in millimeters) D PAK (Plastic) 16.90 10.30 5.08 1.30 3.70 8.90 7/9 BTA/BTB24, BTA25, BTA26 and T25 Series PACKAGE MECHANICAL DATA RD91 (Plastic) DIMENSIONS L2 A2 L1 REF. Millimeters Min. B2 B1 C C2 C1 A1 N2 N1 B F E3 I A A A1 A2 B B1 B2 C C1 C2 E3 F I L1 L2 N1 N2 Max. 40.00 30.30 22.00 27.00 16.50 24.00 14.00 3.50 3.00 0.90 4.50 13.60 3.50 1.90 43° 38° 29.90 13.50 1.95 0.70 4.00 11.20 3.10 1.70 33° 28° Inches Min. Max. 1.575 1.193 0.867 1.063 0.650 0.945 0.551 0.138 0.118 0.035 0.177 0.535 0.138 0.075 43° 38° 1.177 0.531 0.077 0.027 0.157 0.441 0.122 0.067 33° 28° PACKAGE MECHANICAL DATA TOP3 (Plastic) DIMENSIONS REF. Millimeters Min. A B C D E F G H J K L P R 8/9 Typ. 4.4 1.45 14.35 0.5 2.7 15.8 20.4 15.1 5.4 3.4 4.08 1.20 4.60 Inches Max. Min. 4.6 1.55 15.60 0.7 2.9 16.5 21.1 15.5 5.65 3.65 4.17 1.40 0.173 0.057 0.565 0.020 0.106 0.622 0.815 0.594 0.213 0.134 0.161 0.047 Typ. Max. 0.181 0.061 0.614 0.028 0.114 0.650 0.831 0.610 0.222 0.144 0.164 0.055 0.181 BTA/BTB24, BTA25, BTA26 and T25 Series PACKAGE MECHANICAL DATA TO-220AB (Plastic) DIMENSIONS B REF. C Millimeters Inches b2 Min. L F I A l4 c2 a1 l3 l2 a2 b1 M c1 e A a1 a2 B b1 b2 C c1 c2 e F I I4 L l2 l3 M Typ. 15.20 Max. Min. Typ. 15.90 0.598 3.75 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 Max. 0.625 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.646 0.661 0.116 0.066 0.066 0.102 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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