STMICROELECTRONICS T810-600B

BTA08, BTB08 and T8 Series
®
8A TRIACS
SNUBBERLESS™, LOGIC LEVEL & STANDARD
Table 1: Main Features
A2
Symbol
Value
Unit
IT(RMS)
8
A
VDRM/VRRM
600 and 800
V
IGT (Q1)
5 to 50
mA
G
A1
A2
A2
A1 A2
A1
A2
G
G
DESCRIPTION
Available either in through-hole or surface-mount
packages, the BTA08, BTB08 and T8 triac series
is suitable for general purpose AC switching. They
can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase
control operation in light dimmers, motor speed
controllers,...
The snubberless versions (BTA/BTB...W and T8
series) are specially recommended for use on
inductive loads, thanks to their high commutation
performances.
Logic level versions are designed to interface
directly with low power drivers such as
microcontrollers.
By using an internal ceramic pad, the BTA series
provides voltage insulated tab (rated at
2500VRMS) complying with UL standards (file ref.:
E81734).
D2PAK
(T8-G)
IPAK
(T8-H)
A2
A1 A2
G
DPAK
(T8-B)
A2
A1
A2
G
TO-220AB Insulated
(BTA08)
Table 2: Order Codes
Part Number
BTA08-xxxxxRG
BTB08-xxxxxRG
T8xx-xxxG
T8xx-xxxH
T8xx-xxxB
February 2006
REV. 6
A1
A2
G
TO-220AB
(BTB08)
Marking
See page table 8 on
page 10
1/11
BTA08, BTB08 and T8 Series
Table 3: Absolute Maximum Ratings
Symbol
IT(RMS)
Parameter
RMS on-state current (full sine
wave)
tp = 10 ms
dI/dt
Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns
F = 120 Hz
IGM
Peak gate current
tp = 20 µs
PG(AV)
Tstg
Tj
8
A
Tc = 100°C
Non repetitive surge peak on-state F = 50 Hz
current (full cycle, Tj initial = 25°C) F = 60 Hz
I²t Value for fusing
I²t
Unit
IPAK/D2PAK/
T = 110°C
DPAK/TO-220AB c
TO-220AB Ins.
ITSM
Value
Average gate power dissipation
t = 20 ms
80
t = 16.7 ms
84
A
36
A ²s
Tj = 125°C
50
A/µs
Tj = 125°C
4
A
Tj = 125°C
1
W
- 40 to + 150
- 40 to + 125
°C
Storage junction temperature range
Operating junction temperature range
Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified)
■
SNUBBERLESS and Logic Level (3 quadrants)
Symbol
IGT (1)
VGT
T8
Quadrant
Test Conditions
VD = 12 V RL = 30 Ω
T810 T835
I - II - III MAX.
VD = VDRM RL = 3.3 kΩ
I - II - III
Tj = 125°C
MIN.
IH (2)
IT = 100 mA
MAX.
IL
IG = 1.2 IGT
I - III
II
VD = 67 %VDRM gate open
Tj = 125°C
(dV/dt)c = 0.1 V/µs
Tj = 125°C
(dI/dt)c (2) (dV/dt)c = 10 V/µs
Tj = 125°C
Without snubber
2/11
10
35
TW
SW
CW
BW
5
10
35
50
I - II - III MAX.
VGD
dV/dt (2)
BTA08 / BTB08
Tj = 125°C
MAX.
MIN.
MIN.
Unit
mA
1.3
V
0.2
V
15
35
10
15
35
50
25
50
10
25
50
70
30
60
15
30
60
80
40
400
20
40
400
5.4
-
3.5
5.4
-
-
2.8
-
1.5
2.98
-
-
-
4.5
-
-
4.5
7
mA
mA
1000 V/µs
A/ms
BTA08, BTB08 and T8 Series
■
Standard (4 quadrants)
Symbol
IGT (1)
Quadrant
RL = 30 Ω
I - II - III
IV
MAX.
ALL
MAX.
1.3
V
ALL
MIN.
0.2
V
VD = 12 V
VGT
VGD
VD = VDRM RL = 3.3 kΩ Tj = 125°C
IH (2)
IT = 500 mA
IL
IG = 1.2 IGT
dV/dt (2)
BTA08 / BTB08
Test Conditions
MAX.
I - III - IV
II
VD = 67 %VDRM gate open Tj = 125°C
(dV/dt)c (2) (dI/dt)c = 5.3 A/ms
Tj = 125°C
C
B
25
50
50
100
Unit
mA
25
50
40
50
80
100
MIN.
200
400
V/µs
MIN.
5
10
V/µs
MAX.
mA
mA
Table 5: Static Characteristics
Symbol
Test Conditions
VT (2)
ITM = 11 A
Vto (2)
tp = 380 µs
Value
Unit
Tj = 25°C
MAX.
1.55
V
Threshold voltage
Tj = 125°C
MAX.
0.85
V
Rd (2)
Dynamic resistance
Tj = 125°C
MAX.
50
mΩ
IDRM
IRRM
VDRM = VRRM
5
µA
1
mA
Tj = 25°C
Tj = 125°C
MAX.
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1.
Table 6: Thermal resistance
Symbol
Rth(j-c)
Rth(j-a)
Parameter
IPAK / D2PAK / DPAK / TO-220AB
1.6
TO-220AB Insulated
2.5
S = 1 cm²
D2PAK
45
S = 0.5 cm²
DPAK
70
TO-220AB / TO-220AB Insulated
60
IPAK
100
Junction to case (AC)
Junction to ambient
Value
Unit
°C/W
°C/W
S = Copper surface under tab.
3/11
BTA08, BTB08 and T8 Series
Figure 1: Maximum power dissipation versus
RMS on-state current (full cycle)
Figure 2: RMS on-state current versus case
temperature (full cycle)
P(W)
IT(RMS)(A)
10
10
9
9
8
8
7
7
6
6
5
5
4
4
3
3
2
2
1
BTB / T8
BTA
1
IT(RMS)(A)
TC(°C)
0
0
0
1
2
3
4
5
6
7
0
8
Figure 3: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35µm) (full cycle)
25
50
75
100
125
Figure 4: Relative variation of thermal
impedance versus pulse duration
IT(RMS)(A)
K=[Zth/Rth]
3.5
1E+0
Zth(j-c)
3.0
D2PAK
(S=1CM2)
DPAK/IPAK
Zth(j-a)
2.5
1E-1
TO-220AB/D2PAK
Zth(j-a)
2.0
DPAK
(S=0.5CM2)
1.5
1E-2
1.0
0.5
tp(s)
TC(°C)
1E-3
0.0
0
25
50
75
100
1E-3
125
Figure 5: On-state characteristics (maximum
values)
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
Figure 6: Surge peak on-state current versus
number of cycles
ITM(A)
ITSM(A)
100
90
Tj max.
Vto = 0.85V
Rd = 50 mΩ
Tj = Tj max.
80
70
t=20ms
60
One cycle
Non repetitive
Tj initial=25°C
50
10
Tj = 25°C.
40
Repetitive
TC=110°C
30
20
10
VTM(V)
Number of cycles
0
1
0.5
4/11
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1
10
100
1000
BTA08, BTB08 and T8 Series
Figure 7: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width tp < 10 ms
and corresponding value of I2t
2
Figure 8: Relative variation of gate trigger
current, holding current and latching current
versus junction temperature (typical values)
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
2
ITSM(A), I t (A s)
2.5
1000
Tj initial=25°C
2.0
IGT
dI/dt limitation:
50A/µs
ITSM
1.5
100
IH & IL
1.0
I2t
0.5
Tj(°C)
tp(ms)
10
0.01
0.0
0.10
1.00
10.00
Figure 9: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Snubberless & Logic level
types)
-20
0
20
40
60
80
100
120
140
Figure 10: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Standard types)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
2.2
2.0
-40
TW
1.8
1.8
1.6
1.6
C
1.4
1.4
1.2
T835/CW/BW
1.2
1.0
B
1.0
0.8
T810/SW
0.6
0.8
0.4
0.2
0.6
(dV/dt)c (V/µs)
0.0
(dV/dt)c (V/µs)
0.4
0.1
1.0
10.0
100.0
Figure 11: Relative variation of critical rate of
decrease of main current versus junction
temperature
0.1
1.0
10.0
100.0
Figure 12: DPAK and D2PAK Thermal resistance
junction to ambient versus copper surface under
tab (printed circuit board FR4, copper thickness:
35 µm)
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
Rth(j-a)(°C/W)
6
100
90
5
80
70
4
60
DPAK
50
3
40
2
30
D2PAK
20
1
S(cm²)
10
Tj(°C)
0
0
0
25
50
75
100
125
0
4
8
12
16
20
24
28
32
36
40
5/11
BTA08, BTB08 and T8 Series
Figure 13: Ordering Information Scheme (BTA08 and BTB08 series)
BT A 08 - 600 BW (RG)
Triac series
Insulation
A = insulated
B = non insulated
Current
08 = 8A
Voltage
600 = 600V
800 = 800V
Sensitivity and type
B = 50mA Standard
C = 25mA Standard
SW = 10mA Logic Level
BW = 50mA Snubberless
CW = 35mA Snubberless
TW = 5mA Logic Level
Packing mode
RG = Tube
Figure 14: Ordering Information Scheme (T8 series)
T 8 10 - 600 B (-TR)
Triac series
Current
8 = 8A
Sensitivity
10 = 10mA
35 = 35mA
Voltage
600 = 600V
800 = 800V
Package
B = DPAK
G = D2PAK
R = I2PAK
Packing mode
Blanck = Tube
-TR = Tape & Reel
Table 7: Product Selector
Part Number
Voltage (xxx)
Sensitivity
Type
X
X
X
X
X
X
50 mA
50 mA
25 mA
35 mA
10 mA
5 mA
Standard
Snubberless
Standard
Snubberless
Logic level
Logic Level
X
X
10 mA
Logic Level
T810-xxxH
T835-xxxB
X
X
X
X
10 mA
35 mA
Logic Level
Snubberless
T835-xxxG
X
X
35 mA
Snubberless
T835-xxxH
X
X
35 mA
Snubberless
600 V
800 V
BTA/BTB08-xxxB
BTA/BTB08-xxxBW
BTA/BTB08-xxxC
BTA/BTB08-xxxCW
BTA/BTB08-xxxSW
BTA/BTB08-xxxTW
X
X
X
X
X
X
T810-xxxG
BTB: non insulated TO-220AB package
6/11
Package
TO-220AB
TO-220AB
TO-220AB
TO-220AB
TO-220AB
TO-220AB
D2PAK
IPAK
DPAK
D2PAK
IPAK
BTA08, BTB08 and T8 Series
Figure 15: D2PAK Package Mechanical Data
DIMENSIONS
REF.
E
C2
L2
D
L
L3
A1
B2
R
C
Millimeters
Min.
A
B
G
A2
2mm min.
FLAT ZONE
V2
Typ.
Inches
Max.
Min.
Typ.
Max.
A
4.30
4.60 0.169
0.181
A1
2.49
2.69 0.098
0.106
A2
0.03
0.23 0.001
0.009
B
0.70
0.93 0.027
0.037
B2
1.25
C
0.45
0.60 0.017
C2
1.21
1.36 0.047
0.054
D
8.95
9.35 0.352
0.368
E
10.00
10.28 0.393
0.405
G
4.88
5.28 0.192
0.208
1.40
0.048 0.055
0.024
L
15.00
15.85 0.590
0.624
L2
1.27
1.40 0.050
0.055
L3
1.40
1.75 0.055
0.069
R
V2
0.40
0°
0.016
8°
0°
8°
Figure 16: D2PAK Foot Print Dimensions
(in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
7/11
BTA08, BTB08 and T8 Series
Figure 17: DPAK Package Mechanical Data
DIMENSIONS
REF.
E
A
B2
C2
L2
D
R
H
L4
A1
B
R
G
C
A2
V2
Figure 18: DPAK Foot Print Dimensions
(in millimeters)
6.7
3
3
1.6
2.3
6.7
2.3
1.6
8/11
Inches
Max
Min.
Max.
A
2.20
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.018
0.023
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.251
0.259
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.397
L2
0.60 MIN.
Millimeters
Min.
0.80 typ.
0.031 typ.
L4
0.60
1.00
0.023
0.039
V2
0°
8°
0°
8°
BTA08, BTB08 and T8 Series
Figure 19: TO-220AB Package Mechanical Data
REF.
C
B
ØI
b2
L
F
A
I4
l3
c2
a1
l2
a2
M
c1
b1
e
A
a1
a2
B
b1
b2
C
c1
c2
e
F
ØI
I4
L
l2
l3
M
DIMENSIONS
Millimeters
Inches
Min. Typ. Max. Min. Typ.
15.20
15.90 0.598
3.75
0.147
13.00
14.00 0.511
10.00
10.40 0.393
0.61
0.88 0.024
1.23
1.32 0.048
4.40
4.60 0.173
0.49
0.70 0.019
2.40
2.72 0.094
2.40
2.70 0.094
6.20
6.60 0.244
3.75
3.85 0.147
15.80 16.40 16.80 0.622 0.646
2.65
2.95 0.104
1.14
1.70 0.044
1.14
1.70 0.044
2.60
0.102
Max.
0.625
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
0.661
0.116
0.066
0.066
Figure 20: IPAK Package Mechanical Data
REF.
A
E
C2
B2
L2
D
H
L
B3
L1
B
A1
V1
B5
e
G
C
A3
A
A1
A3
B
B2
B3
B5
C
C2
D
E
e
G
H
L
L1
L2
V1
DIMENSIONS
Millimeters
Inches
Min. Typ. Max. Min. Typ.
2.20
2.40 0.086
0.90
1.10 0.035
0.70
1.30 0.027
0.64
0.90 0.025
5.20
5.40 0.204
0.95
0.30
0.035
0.45
0.60 0.017
0.48
0.60 0.019
6
6.20 0.236
6.40
6.60 0.252
2.28
0.090
4.40
4.60 0.173
16.10
0.634
9
9.40 0.354
0.8
1.20 0.031
0.80
1
0.031
10°
10°
Max.
0.094
0.043
0.051
0.035
0.212
0.037
0.023
0.023
0.244
0.260
0.181
0.370
0.047
0.039
9/11
BTA08, BTB08 and T8 Series
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 8: Ordering Information
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
BTA/BTB08-xxxyzRG
BTA/BTB08-xxxyz
TO-220AB
2.3 g
50
Tube
T8yy-xxxG
T8yyxx
Tube
T8yyxx
1.5 g
50
T8yy-xxxG-TR
D2PAK
1000
Tape & reel
T8yy-xxxB
T8yyxx
Tube
T8yyxx
0.3 g
75
T8yy-xxxB-TR
DPAK
2500
Tape & reel
T8yy-xxxH
T8yyxx
IPAK
0.4 g
75
Tube
Note: xxx = voltage, yy = sensitivity, z = type
Table 9: Revision History
Date
Revision
Apr-2002
5A
13-Feb-2006
6
10/11
Description of Changes
Last update.
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
BTA08, BTB08 and T8 Series
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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11/11