P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver Features Duplex LC Single Mode Transceiver Small Form Factor Multi-sourced 2 x 5 Pin Package Long reach SONET OC-3 / SDH STM-1 LR1 Compliant Single +3.3V Power Supply LVPECL Differential Inputs and Outputs Class 1 Laser International Safety Standard IEC 825 Compliant Solderability to MIL-STD-883, Method 2003 Flammability to UL94V0 Humidity RH 5-85% (5-95% short term) to IEC 68-2-3 Complies with Bellcore GR-468-CORE Uncooled laser diode with MQW structure ATM 155Mb/s Links RoHS compliance available Table 1 – Absolute Maximum Rating Parameter Symbol Min. Typical Max. Vcc Iout 0 3.6 V 0 30 mA - - 260 ºC Tstg -40 85 ºC Symbol Min. Typical Max. Notes Power Supply Voltage Vcc 3.1 3.3 3.5 V Operating Temperature (Case)1 Topr -40 - 85 ºC - - 155 - Mbps Power Supply Voltage Output Current Soldering Temperature Storage Temperature Notes 10 seconds on leads only Table 2 – Recommended Operating Condition Parameter Data Rate Note 1 : Please refer to ordering information -1- DS1960 Oct1508-Rev A.0 P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver Table 3 – Transmitter Specifications (Optical) Parameter Symbol Min. Typical Max. Unit Notes Optical Transmit Power Po -4.5 - 0 dBm Output power is coupled into a 9/125µm single mode fiber. Output center Wavelength λ 1280 1310 1335 nm ∆λ - - 1 nm Side Mode Suppression Ratio Sr 30 35 - dBm Extinction Ratio ER 10 - - dB Output Spectrum Width Output Eye -20 dB width Compliant with ITU recommendation G.957 Optical Rise Time tr - - 2 ns 10% to 90% Values Optical Fall Time tf - - 2 ns 10% to 90% Values RIN - - -116 dB/Hz TJ - - 1.2 ns Relative Intensity Noise Total Jitter 23 Measured with 2 -1 PRBS Table 4 – Transmitter Specifications (Electrical) Parameter Symbol Min. Typical Max. Unit ICC - - 180 mA Transmit Enable Voltage VEN 0 - 0.8 V Transmit Disable Voltage VD 2.0 - Vcc V Data Input Current-Low IIL -200 - - µA Data Input Current-High IIH - - 200 µA Data Input Voltage-Low VIL-VCC -2.0 - -1.58 V Data Input Voltage-High VIH-VCC -1.1 - -0.74 V Power Supply Current -2- Notes Maximum current is specified at Vcc= Maximum @ maximum temperature These inputs are compatible with 10K, 10KH and 100K ECL and PECL inputs DS1960 Oct1508-Rev A.0 P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver Table 5 – Receiver Specifications (Optical) Parameter Symbol Min. Typical Max. Unit Notes - - - -35 dBm Measured with 2 -1 PRBS with 72 ones and 72 zeros. (ITU-T recommendation G.958) Maximum Input Power Pin 0 - - dBm Signal Detect-Asserted Pa - - -35 dBm Measured on transition: low to high Signal Detect-Deasserted Pd -48 - - dBm Measured on transition: high to low Signal Detect-Hysteresis 0.5 - 4.0 dB Wavelength of Operation 1100 - 1600 nm 23 Sensitivity Table 6 – Receiver Specifications (Electrical) Parameter Symbol Min. Typical Max. Unit Notes ICC - - 100 mA Data Output Voltage-Low VOL-Vcc -1.98 - -1.71 V Data Output Voltage-High VOH-Vcc -1.1 - -0.91 V The current excludes the output load current These outputs are compatible with 10K, 10KH and 100K ECL and LVPECL outputs Signal Detect Output Voltage-Low VSDL-Vcc -1.98 - -1.71 V Signal Detect Output Voltage-High VSDH-Vcc -1.1 - -0.91 V Signal Detect Output Voltage-Low VSDL 0 - 0.5 V Signal Detect Output Voltage-High VSDH 2 - Vcc V Power Supply Current -3- C-13-155-FDFB-SLC8A-G5 LVPECL C-13-155C-FDFB-SLC8A-G5 LVTTL DS1960 Oct1508-Rev A.0 P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver Connection Diagram Pin Symbol 1 RxGND 2 TxVcc 3 SD Active high on this indicates a received optical signal(LVPECL/LVTTL) 4 RD- Receiver Data Out Bar (LVPECL) 5 RD+ Receiver Dat Out (LVPECL) 6 TxVcc +3.3 V dc power for the transmitter section 7 TxGND Directly connect this pin to the transmitter ground plane 8 TxDIS Transmitter disable (LVTTL) 9 TD+ Transmitter Data In (LVPECL) 10 TD- Transmitter Data In Bar (LVPECL) Attaching Posts Notes Directly connect this pin to the receiver ground plane +3.3 V dc power for the receiver section The attaching posts are at case potential and may be connected to chassis ground. They are isolated from circuit ground. -4- DS1960 Oct1508-Rev A.0 P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver Recommended Interface Circuit C-13-155-FDFB-SLC8A-G5 PHY DEVICE TERMINATE AT TRANSCEIVER INPUTS Vcc(+3.3V) Z=50Ω TD- LVPECL 100Ω Z=50Ω TD+ 130Ω 130Ω Tx Disable TxGND TxVcc RD- RD+ Rx 6 TxDIS Tx 7 SD TD+ RxVcc 8 TD- 9 RxGND 10 1μH Vcc(+3.3V) C2 C3 10μF Vcc(+3.3V) 1μH C1 1 2 3 4 LVTTL RD+ 5 Z=50Ω 100Ω LVPECL RD- Z=50Ω 130Ω Vcc(+3.3V) 130Ω Z=50Ω 130Ω SD LVPECL 82Ω NOTE:C1=C2=C3=100nF TERMINATE AT DEVICE INPUTS -5- DS1960 Oct1508-Rev A.0 P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver C-13-155C-FDFB-SLC8A-G5 PHY DEVICE TERMINATE AT TRANSCEIVER INPUTS Vcc(+3.3V) Z=50Ω TD- LVPECL 100Ω Z=50Ω TD+ 130Ω 130Ω Tx Disable TxGND TxVcc RD- RD+ Rx 6 TxDIS Tx 7 SD TD+ RxVcc 8 TD- 9 RxGND 10 1μH Vcc(+3.3V) C2 C3 10μF Vcc(+3.3V) 1μH C1 1 2 3 4 LVTTL RD+ 5 Z=50Ω 100Ω LVPECL RD- Z=50Ω Vcc(+3.3V) Z=50Ω SD LVTTL NOTE:C1=C2=C3=100nF TERMINATE AT DEVICE INPUTS The split-loaded terminations for ECL signals need to be located at the input of devices receiving those ECL signals. The power supply filtering is required for good EMI performance. Use short tracks from the inductor L1/L2 to the module Rx Vcc. A GND plane under the module is required for good EMI and sensitivity performance. -6- DS1960 Oct1508-Rev A.0 P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver Printed Circuit Board Layout Consideration A fiber-optic receiver employs a very high gain, wide bandwidth transimpedance amplifier. This amplifier detects and amplifies signals that are only tens of nA in amplitude when the receiver is operating near it’s limit. Any unwanted signal current that couples into the receiver circuitry causes a decrease in the receiver’s sensitivity and can also degrade the performance of the receiver’s signal detect (SD) circuit. To minimize the coupling of unwanted noise into the receiver, careful attention must be given to the printed circuit board. At a minimum, a double-sided printed circuit board(PCB) with a large component side ground plane beneath the transceiver must be used. In applications that include many other high speed devices, a multi-layer PCB is highly recommended. This permits the placement of power and ground on separate layers, wich allows them to be isolated from the signal lines. Multilayer construction also permits the routing of signal traces away from high level, high speed sinal lines. To minimize the possibility of coupling noise into the receiver section, high level, high speed signals such as transmitter inputs and clock lines should be routed as far away as possible from the receiver pins. Noise that couples into the receiver through the power supply pins can also degrade performance. It is recommended that a pi filter be used in both transmitter and receiver power supplies. EMI and ESD Consideration Source Photonics’ transceivers offer a metalized plastic case and a special chassis grounding clip. As shown in the drawing, this clip connects the module case to chassis ground then installs flush through the panel cutout. This way, the grounding clip brushes the edge of the cutout in order to make a proper contact. The use of a grounding clip also provides increased electrostatic protection and helps reduce radiated emission from the module or the host circuit board through the chassis faceplate. The attaching posts are at case potential and may be connected to chassis ground. They should not be connected to circuit ground. Plastic optical subassemblies are used to further reduce the possibility of radiated emission by eliminating the metal from the transmitter and receiver diode housings, which extend into connector space. By providing a non-metal receptacle for the optical cable ferrule, the gigabit speed RF electrical signal is isolated from the connector area thus preventing radiated energy leakage from these surfaces to the outside of the panel. -7- DS1960 Oct1508-Rev A.0 P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver Recommended Board Layout Hole Pattern DIMENSION IN MILLIMETER (INCHES) NOTES: 1.THIS FIGURE DESCRIBE THE RECOMMAND CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER. 2.THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFF. NO METAL TRACES OR GROUND CONNECTION IN KEEP-OUT AREAS. 3.THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY. Recommended Board Layout Hole Pattern DIMENSION IN MILLIMETER (INCHES) -8- DS1960 Oct1508-Rev A.0 P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver Package Diagram 48.8+0 -0.2 (0.070) 17.78 7.12 (0.280) 5.08 (0.200) 10.16 9.8 .000) (0.386) +( -(0.004) (0.400) .000) (0.535)+( -(0.004) 3.81±0.5 1.78 (0.039±0.002) (0.150±0.02) 0.50 (0.020) 1.00±0.05 +0 -0.1 13.6 +0 -0.1 9.50 10.50 (0.413) (0.374) (0.520) 13.20 .000) (1.921)+( -(0.008) 6.25 (0.246) (0.700) 48.8+0 -0.2 .000) (1.921)+( -(0.008) -9- DS1960 Oct1508-Rev A.0 P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver Ordering Information Table 7 – Available options Part No. C-13-155-FDFB-SLC8A-G5 C-13-155C-FDFB-SLC8A-G5 Part Numbering Definition: C - 13 - 155(C) - FDFB - S LC Tx Power Temperature -RoHS ● 13 = Wavelength 1310nm ● Communication protocol 155 = 155 Mbps LVPECL SD Output 155C = 155 Mbps LVTTL SD Output ● +3.3V Transceiver, DFB ● Single mode fiber ● Connector options ● Tx Power Range 8 = Tx Power -4.5 to 0 dBm ● Temperature A = Industrial Temperature (-40 to 85℃) ● RoHS G5 = RoHS compliant - 10 - DS1960 Oct1508-Rev A.0 P/N: C-13-155(C)-FDFB-SLC8A-G5 155 Mbps Single Mode SFF LC Transceiver Warnings Handling Precautions: This device is susceptible to damage as a result of electrostatic discharge (ESD). A static free environment is highly recommended. Follow guidelines according to proper ESD procedures. Laser Safety: Radiation emitted by laser devices can be dangerous to human eyes. Avoid eye exposure to direct or indirect radiation. Legal Notice IMPORTANT NOTICE! All information contained in this document is subject to change without notice, at Source Photonics’ sole and absolute discretion. Source Photonics warrants performance of its products to current specifications only in accordance with the company’s standard one-year warranty; however, specifications designated as “preliminary” are given to describe components only, and Source Photonics expressly disclaims any and all warranties for said products, including express, implied, and statutory warranties, warranties of merchantability, fitness for a particular purpose, and non-infringement of proprietary rights. Please refer to the company’s Terms and Conditions of Sale for further warranty information. Source Photonics assumes no liability for applications assistance, customer product design, software performance, or infringement of patents, services, or intellectual property described herein. No license, either express or implied, is granted under any patent right, copyright, or intellectual property right, and Source Photonics makes no representations or warranties that the product(s) described herein are free from patent, copyright, or intellectual property rights. Products described in this document are NOT intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. Source Photonics customers using or selling products for use in such applications do so at their own risk and agree to fully defend and indemnify Source Photonics for any damages resulting from such use or sale. THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN “AS IS” BASIS. Customer agrees that Source Photonics is not liable for any actual, consequential, exemplary, or other damages arising directly or indirectly from any use of the information contained in this document. Customer must contact Source Photonics to obtain the latest version of this publication to verify, before placing any order, that the information contained herein is current. Contact U.S.A. Headquarters 20550 Nordhoff Street Chatsworth, CA 91311 USA Tel: +1-818-773-9044 Fax: +1-818-773-0261 [email protected] China Building #2&5, West Export Processing Zone No. 8 Kexin Road, Hi-Tech Zone Chengdu, 611731, China Tel: +86-28-8795-8788 Fax: +86-28-8795-8789 [email protected] Taiwan 9F, No 81, Shui Lee Rd. Hsinchu, 300, Taiwan R.O.C. Tel: +886-3-5169222 Fax: +886-3-5169213 [email protected] © Copyright Source Photonics, Inc. 2007~2008 All rights reserved - 11 - DS1960 Oct1508-Rev A.0