TI CDC1104

CDC1104
SCAS921 – SEPTEMBER 2011
www.ti.com
1 to 4 Configurable Clock Buffer for 3D Displays
Check for Samples: CDC1104
FEATURES
1
4
GND
5
S4
6
S1
S2
3
2
1
12
Top
View
11
10
7
8
9
OE
S3
CLKIN
RVK PACKAGE
(TOP VIEW)
CLKOUT4
•
Input Reference Clock 120Hz–240Hz
Output Clock (Fin/2) 60Hz–120Hz
Output Buffer Drive Strength: 8mA
4 Clock Outputs
4 Control Pins Select Phases of Clock Outputs
Supply Voltage: 3.8V–5.5V
Operating Temperature Range: –40°C to 85°C
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-B)
– 500-V Charged-Device Model (C101)
Package Offerings
– 12-pin QFN (3mm x 3mm)
CLKOUT3
•
•
•
•
•
•
•
•
CLKOUT1
VDD
CLKOUT2
DESCRIPTION
The CDC1104 is a 1 to 4 configurable clock buffer. The device accepts an input reference clock and creates 4
buffered output clocks with an output frequency equal to one half the input clock frequency. Four control inputs,
S1, S2, S3, S4 configurable phases of the clock outputs.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 85°C
(1)
(2)
RVK
Tape and reel
ORDERABLE PART NUMBER
TOP-SIDE MARKING
CDC1104RVKR
ZT
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
CDC1104
SCAS921 – SEPTEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PIN FUNCTIONS
NO.
(1)
NAME
TYPE
(1)
DESCRIPTION
1
S2
I
Output clock select. Refer to Output Clock Selection Table
2
S1
I
Output clock select. Refer to Output Clock Selection Table
3
CLKIN
I
Clock Input
4
S3
I
Output clock select. Refer to Output Clock Selection Table
5
GND
P
Ground
6
S4
I
Not internally connected
7
CLKOUT3
O
Buffered CLK Output. Refer to Output Clock Selection Table
8
CLKOUT4
O
Buffered CLK Output. Refer to Output Clock Selection Table
9
OE
I
Chip Enable
10
CLKOUT2
O
Buffered CLK Output. Refer to Output Clock Selection Table
11
VDD
P
Inverted output. No counter delay
12
CLKOUT1
O
Buffered CLK Output. Refer to Output Clock Selection Table
G = Ground, I = Input, O = Output, P = Power
TRUTH TABLE
INPUTS
2
OUTPUTS
OE
CLKIN
S4
S3
S2
S1
CLKOUT4
CLKOUT3
CLKOUT2
CLKOUT1
0
CLK
X
X
X
X
L
L
L
L
1
CLK
0
0
0
0
L
L
L
L
1
CLK
0
0
0
1
CLK\
CLK\
CLK\
CLK
1
CLK
0
0
1
0
CLK\
CLK\
CLK
CLK\
1
CLK
0
0
1
1
CLK\
CLK\
CLK
CLK
1
CLK
0
1
0
0
CLK\
CLK
CLK\
CLK\
1
CLK
0
1
0
1
CLK\
CLK
CLK\
CLK
1
CLK
0
1
1
0
CLK\
CLK
CLK
CLK\
1
CLK
0
1
1
1
CLK\
CLK
CLK
CLK
1
CLK
1
0
0
0
CLK
CLK\
CLK\
CLK\
1
CLK
1
0
0
1
CLK
CLK\
CLK\
CLK
1
CLK
1
0
1
0
CLK
CLK\
CLK
CLK\
1
CLK
1
0
1
1
CLK
CLK\
CLK
CLK
1
CLK
1
1
0
0
CLK
CLK
CLK\
CLK\
1
CLK
1
1
0
1
CLK
CLK
CLK\
CLK
1
CLK
1
1
1
0
CLK
CLK
CLK
CLK\
1
CLK
1
1
1
1
CLK
CLK
CLK
CLK
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CDC1104
CDC1104
SCAS921 – SEPTEMBER 2011
www.ti.com
Timing Diagram For Glitch Free Operation
Transition of outputs from any state to any other state
S4=1, S3=1, S2=1, S1=0
Change Area
S4=1, S3=1, S2=0, S1=1
Change Area
S4=0, S3=0, S2=1, S1=1
OE
CLKIN
CLKOUT1
CLKOUT2
CLKOUT3
CLKOUT4
NOTE: Transition to new state will happen after a latency of one output clock cycle after completing the present output clock
cycle. Transition to new state will happen after a latency of up to 3 input clock cycles excluding the input cycle where
the transition has occurred.
Power Up
10 μS (min)
OE
CLKIN
CLKOUT
Sx in any stable state
Valid Clock according to Sx
NOTE: Transition to new state will happen after a latency of 2 input clock cycles excluding the input cycle where the
transition has occurred.
OE Operation
10 μS (min)
OE
CLKIN
CLKOUT
Sx in any stable state
Valid Clock according to Sx
NOTE: Transition to new state will happen after a latency of 2 input clock cycles excluding the input cycle where the
transition has occurred.
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Product Folder Link(s) :CDC1104
3
CDC1104
SCAS921 – SEPTEMBER 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.3
6
V
VI
Input voltage range (2)
–0.3
6
V
VO
Output voltage range in the high or low state (2)
–0.3
6
IIK
Input clamp current
VI < 0
±20
mA
IOK
Output clamp current
VO < 0
±20
mA
IOL
Continuous output Low current
VO = 0 to VCC
±20
mA
IOH
Continuous output High current
VO = 0 to VCC
±20
mA
Tstg
Storage temperature range
150
°C
(1)
(2)
–65
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
θJA
(1)
Package thermal impedance
(1)
RVK Package
VALUE
UNIT
72.2
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
3.8
5.5
V
VIH
High-Level Input Voltage
1.6
5.5
V
VIL
Low-Level Input Voltage
0
0.8
V
IIH
High-level input current
1
µA
IIL
Low-level input current
1
µA
VI
0
5.5
V
VO
0
VCC
V
IOH
High-level output current
-8
mA
IOL
Low-level output current
8
mA
TA
Operating free-air temperature
85
°C
4
–40
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CDC1104
CDC1104
SCAS921 – SEPTEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –8 mA
VOH
VOL
IOL = 8 mA
Ii (CLKIN, OE, Sx)
VI = GND to 4 V
ICC (Disabled)
VIO = 0 V or 5.5V, OE = Low
IDD_ (Dynamic)
TA = –40°C to 85°C
VCC
MIN
3.8 V
Vcc-0.6
5V
Vcc-0.4
TYP
MAX
UNIT
V
V
3.8 V
0.40
5V
0.40
V
1
µA
5.5 V
V
3.8 V to 5.5 V
0.5
2
µA
OE = 5.5 V; Sx = 0 V, 5.5 V; CLKIN = 0 V, 5.5 V
5.5 V
20
50
µA
OE = 3.0 V; Sx = 0 V, 3.0 V; CLKIN = 0 V, 3.0 V
5.5 V
20
50
µA
OE = 1.6 V; Sx = 0 V, 1.6 V; CLKIN = 0 V, 1.6 V
5.5 V
20
50
µA
CI (CLKIN, OE, Sx) VI = VCC or GND
7
pF
SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
FCLKIN
FCLKOUT
FROM (INPUT)
TO(OUTPUT)
VCC
Input clock frequency
Output clock frequency
TA = –40°C to 85°C
MIN
TYP
MAX
UNIT
120
240
Hz
FCLKIN /2
FCLKIN /2
Hz
tRISE / tFALL
Output rise/fall time
10
µs
tRISE / tFALL
Input rise/fall time
50
µs
Input Duty Cycle
Input duty cycle
49%
50%
51%
Output Duty Cycle
Output duty cycle
49%
50%
5%1
tSU
Setup time on Sx
60
tH
Hold time on Sx
60
tSKEW
CLKOUTx skew
µs
µs
10
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Product Folder Link(s) :CDC1104
µs
5
CDC1104
SCAS921 – SEPTEMBER 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Propagation Delays
From Output
Under Test
VCC = 3.3 V
± 0.3 V
2 kΩ
CL
(See Note A)
CL
VM
VI
15 pF
VCC/2
VCC
VI
VM
VM
Input
0V
tPLH
tPHL
VOH
VM
Output
VM
VOL
tPHL
tPLH
VOH
Output
VM
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NON INVERTING OUTPUTS
6
A.
CL includes probe and jig capacitance.
B.
Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output
control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the
output control.
C.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, for
propagation delays tr/tf = 3 ns, for setup and hold times and pulse width tr/tf = 1.2 ns.
D.
The outputs are measured on at a time, with on transition per measurement.
E.
tPLH and tPHL are the same a tpd.
F.
All parameters and waveforms are no applicable to all devices.
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :CDC1104
PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2011
PACKAGING INFORMATION
Orderable Device
CDC1104RVKR
Status
(1)
ACTIVE
Package Type Package
Drawing
WQFN
RVK
Pins
Package Qty
12
3000
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CDC1104RVKR
Package Package Pins
Type Drawing
WQFN
RVK
12
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
330.0
12.4
Pack Materials-Page 1
3.3
B0
(mm)
K0
(mm)
P1
(mm)
3.3
1.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDC1104RVKR
WQFN
RVK
12
3000
367.0
367.0
35.0
Pack Materials-Page 2
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