CM1401-03 4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB Features Product Description • The CM1401-03 is a multichannel array with four lowpass filter + ESD channels and four ESD-only channels. They reduce EMI/RFI emissions on a data port and protect against ESD on a USB port. Each EMI/RFI channel integrates a high quality pi-style filter (C-R-C) which provides greater than 30dB attenuation in the 800-2700 MHz range relative to the pass band attenuation. These pi-style filters are bidirectional, controlling EMI both to and from a data port connector. • • • • • • • • • • Functionally and pin compatible with CSPEMI307A device Optiguard™ coated for improved reliability at assembly Four channels of combined EMI/RFI filtering + ESD protection Four additional channels of ESD-only protection 40dB absolute attenuation (typical) at 1 GHz 35dB attenuation (typical) at 1 GHz relative to pass band ±15kV ESD protection on all channels (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on all channels (HBM) 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available Applications • • • • • • • EMI filtering and ESD protection for both data and I/O ports Outer 4 channels provide ESD protection for USB lines and other I/O port applications Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs The CM1401-03 provides a high-level of ESD protection on all eight channels for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of ±15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±30kV. The CM1401-03 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CM1401-03 incorporates Optiguard™ coating which results in improved reliability at assembly and is available in a space-saving, low-profile chip scale package with optional lead-free finishing. Electrical Schematic 100Ω ESDn* FILTER+ESDn* FILTER+ESDn* 30pF 30pF 30pF GND (Pins B1-B3) 1 of 4 ESD-only Channels 1 of 4 EMI/RFI + ESD Channels. * See Package/Pinout Diagram for expanded pin information © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1401-03 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 FILTER+ESD_2 ESD_3 A C1 C2 C3 N013 GND Orientation Marking C B1 A1 A1 B2 GND ESD_1 C6 A3 FILTER+ESD_1 ESD_4 GND FILTER+ESD_2 A2 C5 FILTER+ESD_3 FILTER+ESD_1 B FILTER+ESD_4 C4 B3 FILTER+ESD_4 A4 A5 FILTER+ESD_3 A6 ESD_2 CM1401-03 Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION A1 ESD_1 ESD Channel 1 A2 FILTER+ESD_1 Filter + ESD Channel 1 A3 FILTER+ESD_2 Filter + ESD Channel 2 A4 FILTER+ESD_3 Filter + ESD Channel 3 A5 FILTER+ESD_4 Filter + ESD Channel 4 A6 ESD_2 ESD Channel 2 B1-B3 GND Device Ground C1 ESD_3 C2 FILTER+ESD_1 Filter + ESD Channel 1 ESD Channel 3 C3 FILTER+ESD_2 Filter + ESD Channel 2 C4 FILTER+ESD_3 Filter + ESD Channel 3 C5 FILTER+ESD_4 Filter + ESD Channel 4 C6 ESD_4 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Pins Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 15 CSP CM1401-03CS N013 CM1401-03CP N013 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 10/04/05 CM1401-03 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 600 mW RATING UNITS -40 to +85 °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL PARAMETER R Resistance C Capacitance CONDITIONS At 2.5V DC TCR Temperature Coefficient of Resistance TCC Temperature Coefficient of Capacitance At 2.5V DC Diode Voltage (reverse bias) IDIODE=10μA ILEAK Diode Leakage Current (reverse bias) VDIODE=3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 and 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3 and 4 Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R=100Ω , C=30pF VDIODE VCL fC MIN TYP MAX UNITS 80 100 120 Ω 24 30 36 pF 5.6 -1.5 1200 ppm/°C -300 ppm/°C 6.0 V 6.8 -0.8 100 nA 9.0 -0.4 V V ±30 kV ±15 kV +10 -5 V V 58 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping voltage is measured at Pin C2. Note 4: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1401-03 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A2-C2 to GND B2) Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 10/04/05 CM1401-03 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A4-C4 to GND B2) Figure 4. Insertion Loss vs. Frequency (A5-C5 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1401-03 Performance Information Typical Filter Performance (TA=25°C, 50 Ohm Environment) Figure 5. Comparison of Filter Response Curves for CM1401-03CS with DC Bias © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 10/04/05 CM1401-03 Performance Information (cont’d) 1.6 1.5 Normalized Capacitance 1.4 1.3 1.2 T = -40C T = +25C 1.1 T = +70C 1.0 0.9 0.8 0.7 0 1 2 3 4 5 DC Input Voltage (V) Figure 6. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) 1.100 1.080 Nornalized Resistance 1.060 1.040 1.020 1.000 0.980 0.960 0.940 0.920 0.900 -40 -20 0 20 40 60 80 100 Temperature ['C] Figure 7. Resistance vs. Temperature (normalized to resistance at 25°C) © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1401-03 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 9. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 10. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 10/04/05 CM1401-03 Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams The CM1401-03 is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. BOTTOM VIEW OptiGuardTM Coating A1 C1 Bumps 15 Dim Millimeters Min Nom C B A Inches Max Min Nom 1 Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel A2 Custom CSP C2 Package B2 B1 B4 B3 PACKAGE DIMENSIONS 2 3 4 5 6 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1401-03 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1401-03 2.96 X 1.33 X 0.644 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 11. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9