CALMIRCO CM1405-01CS

CM1405
LCD EMI Filter Array with ESD Protection
Features
Product Description
•
•
California Micro Device's CM1405 is an EMI filter array
with ESD protection, which integrates eight Pi- filters
(C-R-C). The CM1405 has component values of 25pF100Ω-25pF. The parts include avalanche-type ESD
diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
ESD diodes connected to the filter ports are designed
and characterized to safely dissipate ESD strikes of
±30kV, exceeding the maximum requirement of the
IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body
Model (HBM) ESD, the pins are protected for contact
discharges at greater than ±30kV.
•
•
•
•
•
•
Eight channels of EMI filtering
±30kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±30kV ESD protection on each channel (HBM)
Better than 35dB of attenuation at 800-2700MHz
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
20-bump, 4.000mm x 1.458mm footprint
Chip Scale Package
OptiGuard™ coated version available for
improved reliability at assembly
Lead-free version available
Applications
•
•
•
•
•
•
•
LCD data lines in mobile handsets
EMI filtering & ESD protection for high-speed I/O
ports
EMI filtering for high-speed data lines
Wireless handsets
Cell phones
Notebook computers
PDAs / Handheld PCs
This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-touse pin assignments. In particular, the CM1405 is
ideal for EMI filtering and protecting data lines from
ESD for the LCD display in mobile handsets.
The CM1405-03 incorporates OptiGuard™ coating
which results in improved reliability at assembly and is
available in space-saving, low-profile chip-scale packages with optional lead-free finishing.
Electrical Schematic
100Ω
FILTERn*
FILTERn*
25pF
25pF
GND
(Pins B1-Bn)
1 of 8 EMI Filtering + ESD Channels
* See Package/Pinout Diagram for expanded pin information.
© 2004 California Micro Devices Corp. All rights reserved.
06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
1
CM1405
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
5
6
7
8
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
C1
C2
C3
C4
C5
C6
C7
C8
A
GND
N051
B
GND
B1
Orientation
Marking
C
GND
B2
GND
B3
B4
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A1
A2
A3
A4
A5
A6
A7
A8
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
C1
C2
C3
C4
C5
C6
C7
C8
A1
CM1405-01
Chip Scale Package
Orientation
Marking
(see note 2)
1
2
3
4
5
6
7
8
A
GND
N053
B
GND
B1
Orientation
Marking
C
GND
B2
GND
B3
B4
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A1
A2
A3
A4
A5
A6
A7
A8
A1
CM1405-03
Notes:
Chip Scale Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
A1
FILTER1
Filter Channel 1
C1
FILTER1
Filter Channel 1
A2
FILTER2
Filter Channel 2
C2
FILTER2
Filter Channel 2
A3
FILTER3
Filter Channel 3
C3
FILTER3
Filter Channel 3
A4
FILTER4
Filter Channel 4
C4
FILTER4
Filter Channel 4
A5
FILTER5
Filter Channel 5
C5
FILTER5
Filter Channel 5
A6
FILTER6
Filter Channel 6
C6
FILTER6
Filter Channel 6
A7
FILTER7
Filter Channel 7
C7
FILTER7
Filter Channel 7
A8
FILTER8
Filter Channel 8
C8
FILTER8
Filter Channel 8
B1-B4
GND
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
OptiguardTM Coated
No Coating
Ordering Part
OptiguardTM Coated
No Coating
Number1
Number1
Part
Marking
Ordering Part
Number1
Part
Marking
Ordering Part
PKG
Part
Marking
Ordering Part
Bumps
Number1
Part
Marking
20
CSP
CM1405-01CS
N051
CM1405-03CS
N053
CM1405-01CP
N051
CM1405-03CP
N053
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/16/04
CM1405
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
PARAMETER
MIN
TYP
MAX
UNITS
80
100
120
Ω
At 2.5V DC, 1MHz, 30mV
AC
20
25
30
pF
Diode Standoff Voltage
IDIODE = 10µA
5.5
ILEAK
Diode Leakage Current (reverse bias)
VDIODE = 3.3V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
R
Resistance
C
Capacitance
VDIODE
VESD
VCL
fC
CONDITIONS
V
100
5.6
-0.4
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
R = 100Ω, C = 25pF
6.8
-0.8
nA
9.0
-1.5
V
V
±30
kV
±30
kV
+12
-7
V
V
70
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
© 2004 California Micro Devices Corp. All rights reserved.
06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
3
CM1405
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. A1-C1 EMI Filter Performance
Figure 2. A2-C2 EMI Filter Performance
© 2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/16/04
CM1405
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. A3-C3 EMI Filter Performance
Figure 4. A4-C4 EMI Filter Performance
© 2004 California Micro Devices Corp. All rights reserved.
06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
5
CM1405
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 5. A5-C5 EMI Filter Performance
Figure 6. A6-C6 EMI Filter Performance
© 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/16/04
CM1405
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 7. A7-C7 EMI Filter Performance
Figure 8. A8-C8 EMI Filter Performance
© 2004 California Micro Devices Corp. All rights reserved.
06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
7
CM1405
Performance Information (cont’d)
Figure 9. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
© 2004 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/16/04
CM1405
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260°C
Non-Solder MaskDefinedPad
0.275mmDIA.
Solder Stencil Opening
0.330mmDIA.
Solder MaskOpening
0.325mmDIA.
Figure 10. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 11. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 12. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2004 California Micro Devices Corp. All rights reserved.
06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
9
CM1405
Mechanical Details
CM1405-01 Mechanical Specifications
Mechanical Package Diagrams
The package dimensions for the CM1405-01 are presented below.
BOTTOM VIEW
A1
C1
C
B
Bumps
20
A
Millimeters
Min
Nom
Max
Inches
Min
Nom
A1
3.955 4.000 4.045 0.1557 0.1575 0.1593
A2
1.413 1.458 1.503 0.0556 0.0574 0.0592
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.200 0.250 0.300 0.0079 0.0098 0.0118
C2
0.244 0.294 0.344 0.0096 0.0116 0.0135
D1
0.561 0.605 0.649 0.0221 0.0238 0.0255
D2
0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
A
1
Max
A2
Custom CSP
C2
Package
Dim
B4
B3
PACKAGE DIMENSIONS
SIDE
VIEW
B2
B1
2
3
4
5
6
7
8
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
D1
D2
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1405-01 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
© 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/16/04
CM1405
Mechanical Details (cont’d)
CM1405-03 Mechanical Specifications
Mechanical Package Diagrams
The package dimensions for the CM1405-03 are presented below.
OptiGuardTM
Coating
BOTTOM VIEW
A1
PACKAGE DIMENSIONS
Custom CSP
Bumps
20
B2
B1
B4
B3
Package
C1
C
Inches
A
Min
Nom
Max
Min
Nom
Max
A1
3.955 4.000 4.045 0.1557 0.1575 0.1593
A2
1.413 1.458 1.503 0.0556 0.0574 0.0592
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.200 0.250 0.300 0.0079 0.0098 0.0118
C2
0.244 0.294 0.344 0.0096 0.0116 0.0135
D1
0.600 0.670 0.739 0.0236 0.0264 0.0291
D2
0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
A2
Dim
C2
B
Millimeters
A
1
2
3
4
5
7
6
8
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1405-03 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
CM1405
4.00 X 1.46 X 0.6
4.11 X 1.57 X 0.76
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
12mm
330mm (13")
3500
4mm
4mm
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 13. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
06/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
11