CY62126DV30 MoBL 1-Mbit (64K x 16) Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected (CE HIGH). The input/output pins (I/O0 through I/O15) are placed in a high-impedance state when: deselected (CE HIGH), outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH) or during a write operation (CE LOW and WE LOW). • Very high speed: 45 ns • Wide voltage range: 2.2V to 3.6V • Pin compatible with CY62126BV • Ultra-low active power — Typical active current: 0.85 mA @ f = 1 MHz — Typical active current: 5 mA @ f = fMAX • Ultra-low standby power • Easy memory expansion with CE and OE features • Automatic power-down when deselected • Packages offered in a 48-ball FBGA and a 44-lead TSOP Type II • Also available in Lead-free packages Functional Description[1] The CY62126DV30 is a high-performance CMOS static RAM organized as 64K words by 16 bits. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life™ (MoBL®) in portable applications such as cellular telephones. The device Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is written into the location specified on the address pins (A0 through A15). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A15). Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O8 to I/O15. See the truth table at the back of this data sheet for a complete description of read and write modes. Logic Block Diagram 64K x 16 RAM Array 2048 x 512 SENSE AMPS ROW DECODER DATA IN DRIVERS A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 I/O0–I/O7 I/O8–I/O15 BHE WE CE OE BLE A14 A15 A12 A13 A11 COLUMN DECODER Note: 1. For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com. Cypress Semiconductor Corporation Document #: 38-05230 Rev. *E • 3901 North First Street • San Jose, CA 95134 • 408-943-2600 Revised February 2, 2005 CY62126DV30 MoBL Pin Configurations[2, 3] FBGA (Top View) 4 5 3 6 A1 A2 NC A A3 A4 CE I/O0 B I/O10 A5 A6 I/O1 I/O2 C VSS I/O11 NC A7 I/O3 VCC D VCC I/O12 DNU NC I/O4 VSS E I/O14 I/O13 A14 A15 I/O5 I/O6 F I/O15 NC A12 A13 WE I/O7 G NC A8 A9 A10 A11 1 2 BLE OE A0 I/O8 BHE I/O9 TSOP II (Forward) Top View NC A4 A3 A2 A1 A0 CE I/O0 I/O1 I/O2 I/O3 VCC VSS I/O4 I/O5 I/O6 I/O7 WE A15 A14 A13 A12 NC H 1 44 2 3 43 42 4 41 40 39 38 5 6 7 8 9 10 11 12 37 36 35 34 33 32 31 30 29 28 27 13 14 15 16 17 18 19 20 21 22 26 25 24 23 A5 A6 A7 OE BHE BLE I/O15 I/O14 I/O13 I/O12 VSS VCC I/O11 I/O10 I/O9 I/O8 NC A8 A9 A10 A11 NC Product Portfolio Power Dissipation Operating, ICC (mA) VCC Range (V) f = 1 MHz f = fMAX Standby, ISB2 (µA) Product Min. Typ. Max. Speed (ns) Typ.[4] Max. Typ.[4] Max. Typ.[4] Max. CY62126DV30L 2.2 3.0 3.6 45 0.85 1.5 6.5 13 1.5 5 45 0.85 1.5 6.5 13 1.5 4 55 0.85 1.5 5 10 1.5 5 55 0.85 1.5 5 10 1.5 4 70 0.85 1.5 5 10 1.5 5 70 0.85 1.5 5 10 1.5 4 CY62126DV30LL CY62126DV30L 2.2 3.0 3.6 CY62126DV30LL CY62126DV30L 2.2 CY62126DV30LL 3.0 3.6 Notes: 2. NC pins are not connected to the die. 3. E3 (DNU) can be left as NC or VSS to ensure proper operation. (Expansion Pins on FBGA Package: E4 - 2M, D3 - 4M, H1 - 8M, G2 - 16M, H6 - 32M). 4. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25°C. Document #: 38-05230 Rev. *E Page 2 of 11 CY62126DV30 MoBL DC Input Voltage[5] ................................ −0.3V to VCC + 0.3V Maximum Ratings Output Current into Outputs (LOW)............................. 20 mA (Above which the useful life may be impaired. For user guidelines, not tested.) Static Discharge Voltage.......................................... > 2001V (per MIL-STD-883, Method 3015) Storage Temperature ................................. –65°C to +150°C Latch-up Current .................................................... > 200 mA Ambient Temperature with Power Applied............................................. –55°C to +125°C Operating Range Supply Voltage to Ground Potential ........................................................... −0.3V to 3.9V DC Voltage Applied to Outputs in High-Z State[5.] ...................................−0.3V to VCC + 0.3V Range Ambient Temperature (TA) VCC[6.] Industrial −40°C to +85°C 2.2V to 3.6V DC Electrical Characteristics (Over the Operating Range) CY62126DV30-45 Parameter Description Test Conditions Min. VOH Output HIGH 2.2 < VCC < 2.7 IOH = −0.1 mA 2.0 Voltage 2.7 < VCC < 3.6 IOH = −1.0 mA 2.4 VOL Output LOW 2.2 < VCC < 2.7 IOL = 0.1 mA Voltage 2.7 < VCC < 3.6 IOL = 2.1 mA VIH VIL Input HIGH Voltage Input LOW Voltage Typ.[4] CY62126DV30-55 CY62126DV30-70 Max. Min. Typ.[4] Max. Min Typ.[4] Max. Unit 2.0 2.0 2.4 V 2.4 0.4 0.4 0.4 0.4 0.4 0.4 2.2 < VCC < 2.7 1.8 VCC + 0.3 1.8 VCC 1.8 + 0.3 VCC + 0.3 2.7 < VCC < 3.6 2.2 VCC + 0.3 2.2 VCC 2.2 + 0.3 VCC + 0.3 2.2 < VCC < 2.7 −0.3 0.6 −0.3 0.6 −0. 3 0.6 2.7 < VCC < 3.6 −0.3 0.8 −0.3 0.8 −0. 3 0.8 V V V IIX Input Leakage Current GND < VI < VCC −1 +1 −1 +1 −1 +1 µA IOZ Output Leakage Current GND < VO < VCC, Output Disabled −1 +1 −1 +1 −1 +1 µA ICC VCC Operating Supply Current f = fMAX = 1/tRC mA Automatic CE Power-down Current − CMOS Inputs Automatic CE Power-down Current− CMOS Inputs ISB1 ISB2 6.5 13 5 10 5 10 0.85 1.5 0.85 1.5 0.85 1.5 CE > VCC − 0.2V, L VIN > VCC − 0.2V, VIN < 0.2V, LL f = fMAX (Address and Data Only), f = 0 (OE, WE, BHE and BLE) 1.5 5 1.5 5 1.5 5 1.5 4 1.5 4 1.5 4 CE > VCC − 0.2V, VIN > VCC − 0.2V or VIN < 0.2V, f = 0, VCC = 3.6V L 1.5 5 1.5 5 1.5 5 LL 1.5 4 1.5 4 1.5 4 f = 1 MHz VCC = 3.6V, IOUT = 0 mA, CMOS level µA µA Notes: 5. VIL(min.) = −2.0V for pulse durations less than 20 ns., VIH(max.) = VCC + 0.75V for pulse durations less than 20 ns. 6. Full device operation requires linear ramp of VCC from 0V to VCC(min) & VCC must be stable at VCC(min) for 500 µs. Document #: 38-05230 Rev. *E Page 3 of 11 CY62126DV30 MoBL Capacitance[7] Parameter Description CIN Input Capacitance COUT Output Capacitance Test Conditions TA = 25°C, f = 1 MHz VCC = VCC(typ) Max. Unit 8 pF 8 pF Thermal Resistance Parameter Description Test Conditions θJA Thermal Resistance (Junction to Ambient)[7] θJC Thermal Resistance (Junction to Case)[7] Still Air, soldered on a 3 x 4.5 inch, two-layer printed circuit board TSOP FBGA Unit 55 76 °C/W 12 11 °C/W AC Test Loads and Waveforms[8] R1 VCC ALL INPUT PULSES VCC Typ OUTPUT R2 50 pF GND Rise TIme: 1 V/ns 90% 10% 90% 10% Fall Time: 1 V/ns INCLUDING JIG AND SCOPE Equivalent to: THÉVENIN EQUIVALENT RTH OUTPUT Parameters 2.5V R1 R2 RTH VTH VTH 3.0V Unit 16600 1103 Ohms 15400 1554 Ohms 8000 645 Ohms 1.2 1.75 Volts Data Retention Characteristics Parameter Description VDR VCC for Data Retention ICCDR Data Retention Current tCDR tR[9] [7] Conditions Min. Typ.[4] Max. 1.5 VCC=1.5V, CE > VCC − 0.2V, VIN > VCC − 0.2V or VIN < 0.2V Chip Deselect to Data Retention Time Operation Recovery Time Unit V L 4 LL 3 µA 0 ns 100 µs Notes: 7. Tested initially and after any design or proces changes that may affect these parameters. 8. Test condition for the 45 ns part is a load capacitance of 30 pF 9. Full device operation requires linear VCC ramp from VDR to VCC(min.) >100 µs. Document #: 38-05230 Rev. *E Page 4 of 11 CY62126DV30 MoBL Data Retention Waveform VCC(min) VCC DATA RETENTION MODE VCC(min) VDR > 1.5 V tR tCDR CE Switching Characteristics (Over the Operating Range)[10] CY62126DV30-45[8] Parameter Description Min. Max. CY62126DV30-55 Min. Max. CY62126DV30-70 Min. Max. Unit Read Cycle tRC Read Cycle Time tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE LOW to Data Valid tDOE OE LOW to Data Valid tLZOE OE LOW to Low Z[11] tHZOE tLZCE OE HIGH to High CE LOW to Low 45 55 45 10 10 45 Z[11] 10 Z[11, 12] 10 25 5 15 10 70 ns 35 ns ns 25 10 ns ns tHZCE CE HIGH to High tPU CE LOW to Power-up tPD CE HIGH to Power-down 45 55 70 ns tDBE BLE/BHE LOW to Data Valid 25 25 35 ns 0 Z[11] tLZBE BLE/BHE LOW to Low tHZBE BLE/BHE HIGH to High-Z[11, 12] Write 20 ns ns 5 20 20 ns 70 55 25 5 Z[11, 12] 70 55 0 5 5 15 25 0 ns 5 20 ns ns 25 ns Cycle[13] tWC Write Cycle Time 45 55 70 ns tSCE CE LOW to Write End 40 40 60 ns tAW Address Set-up to Write End 40 40 60 ns tHA Address Hold from Write End 0 0 0 ns tSA Address Set-up to Write Start 0 0 0 ns tPWE WE Pulse Width 35 40 50 ns tBW BLE/BHE LOW to Write End 40 40 60 ns tSD Data Set-up to Write End 25 25 30 ns tHD Data Hold from Write End 0 0 0 ns [11, 12] tHZWE WE LOW to High Z tLZWE WE HIGH to Low Z[11] 15 10 20 10 25 5 ns ns Notes: 10. Test conditions assume signal transition time of 1V/ns or less, timing reference levels of VCC(typ.)/2, input pulse levels of 0 to VCC(typ.), and output loading of the specified IOL. 11. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZBE is less than tLZBE, tHZOE is less than tLZOE. 12. tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high-impedance state. 13. The internal Write time of the memory is defined by the overlap of WE, CE = VIL, BHE and/or BLE = VIL. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that terminates the write. Document #: 38-05230 Rev. *E Page 5 of 11 CY62126DV30 MoBL Switching Waveforms Read Cycle No. 1 (Address Transition Controlled)[14, 15] tRC ADDRESS tOHA DATA OUT tAA PREVIOUS DATA VALID DATA VALID Read Cycle No. 2 (OE Controlled)[15, 16] ADDRESS tRC CE tPD tHZCE tACE OE BHE/BLE ttLZOE LZOE tHZOE tDOE tHZBE tDBE tLZBE DATA OUT HIGH IMPEDANCE HIGH IMPEDANCE DATA VALID tLZCE VCC SUPPLY CURRENT tPU 50% 50% ICC ISB Notes: 14. Device is continuously selected. OE, CE = VIL, BHE, BLE = VIL. 15. WE is HIGH for Read cycle. 16. Address valid prior to or coincident with CE, BHE, BLE transition LOW. Document #: 38-05230 Rev. *E Page 6 of 11 CY62126DV30 MoBL Switching Waveforms(continued) Write Cycle No. 1 (WE Controlled[12, 13, 16, 17, 18] tWC ADDRESS tSCE CE tAW tHA tSA WE tPWE tBW BHE/BLE OE tSD DATA I/O NOTE 19 tHD DATAIN VALID tHZOE Write Cycle No. 2 (CE Controlled)[12, 13, 16, 17, 18] tWC ADDRESS tSCE CE tSA tAW tHA tPWE WE tBW BHE/BLE OE tSD DATA I/O tHD DATAIN VALID NOTE 19 tHZOE Notes: 17. Data I/O is high-impedance if OE = VIH. 18. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state. 19. During the DON'T CARE period in the DATA I/O waveform, the I/Os are in output state and input signals should not be applied. Document #: 38-05230 Rev. *E Page 7 of 11 CY62126DV30 MoBL Switching Waveforms(continued) Write Cycle No. 3 (WE Controlled, OE LOW)[17, 18] tWC ADDRESS tSCE CE tBW BHE/BLE tAW tHA tSA tPWE WE tSD DATAI/O NOTE 19 tHD DATAIN VALID tLZWE tHZWE Write Cycle No. 4 (BHE-/BLE-controlled, OE LOW)[17, 18] tWC ADDRESS CE tSCE tAW tHA tBW BHE/BLE tSA tPWE WE tSD DATA I/O NOTE 19 Document #: 38-05230 Rev. *E tHD DATAIN VALID Page 8 of 11 CY62126DV30 MoBL Truth Table CE WE OE BHE BLE Inputs/Outputs Mode Power H X X X X High Z Deselect/Power-Down Standby (ISB) L X X H H High Z Output Disabled Active (ICC) L H L L L Data Out (I/OO–I/O15) Read Active (ICC) L H L H L Data Out (I/OO–I/O7); I/O8–I/O15 in High Z Read Active (ICC) L H L L H Data Out (I/O8–I/O15); I/O0–I/O7 in High Z Read Active (ICC) L H H L L High Z Output Disabled Active (ICC) L H H H L High Z Output Disabled Active (ICC) L H H L H High Z Output Disabled Active (ICC) L L X L L Data In (I/OO–I/O15) Write Active (ICC) L L X H L Data In (I/OO–I/O7); I/O8–I/O15 in High Z Write Active (ICC) L L X L H Data In (I/O8–I/O15); I/O0–I/O7 in High Z Write Active (ICC) Ordering Information Speed (ns) 45 Ordering Code CY62126DV30LL-45BVI Package Name BV48A CY62126DV30LL-45BVXI CY62126DV30LL-45ZSXI 55 48-ball Fine Pitch BGA (6 mm x 8 mm x 1 mm) ZS44 BV48A 48-ball Fine Pitch BGA (6 mm x 8 mm x 1 mm) CY62126DV30LL-55BVI BV48A 48-ball Fine Pitch BGA (6 mm x 8 mm x 1 mm) CY62126DV30L-55ZSI ZS44 44-Lead TSOP Type II CY62126DV30LL-55ZSI ZS44 44-Lead TSOP Type II Industrial 44-Lead TSOP Type II (Pb-Free) CY62126DV30L-70BVI BV48A 48-ball Fine Pitch BGA (6 mm x 8 mm x 1 mm) CY62126DV30LL-70BVI BV48A 48-ball Fine Pitch BGA (6 mm x 8 mm x 1 mm) CY62126DV30L-70ZSI ZS44 44-Lead TSOP Type II CY62126DV30LL-70ZSI ZS44 44-Lead TSOP Type II Document #: 38-05230 Rev. *E Industrial 44-Lead TSOP Type II (Pb-free) CY62126DV30L-55BVI CY62126DV30LL-70ZSXI Operating Range 48-ball Fine Pitch BGA (6 mm x 8 mm x 1 mm) (Pb-free) CY62126DV30LL-55ZSXI 70 Package Type Industrial 44-Lead TSOP Type II (Pb-Free) Page 9 of 11 CY62126DV30 MoBL Package Diagrams 48-Lead VFBGA (6 x 8 x 1 mm) BV48A 51-85150-*B 44-pin TSOP II ZS44 51-85087-*A MoBL is a registered trademark, and MoBL2 and More Battery Life are trademarks of Cypress Semiconductor. All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05230 Rev. *E Page 10 of 11 © Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY62126DV30 MoBL Document History Page Document Title: CY62126DV30 MoBL 1- Mbit (64K x 16) Static RAM Document Number: 38-05230 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 117689 08/27/02 JUI *A 127313 06/13/03 MPR New Data Sheet Changed From Advanced Status to Preliminary. Changed ISB2 to 5 µA (L), 4 µA (LL) Changed ICCDR to 4 µA (L), 3 µA (LL) Changed CIN from 6 pF to 8 pF *B 128340 07/22/03 JUI Changed from Preliminary to Final Add 70-ns speed, updated ordering information *C 129002 08/29/03 CDY Changed ICC 1 MHz typ from 0.5 mA to 0.85 mA *D 238050 See ECN AJU Fixed typo: Changed tDBE from 70 ns to 35 ns *E 316039 See ECN PCI Added 45-ns Speed Bin in AC, DC and Ordering Information tables Added Footnote #8 on page #4 Added Pb-Free package ordering information on page # 9 Changed 44-pin TSOP-II package name from Z44 to ZS44 Document #: 38-05230 Rev. *E Page 11 of 11