CYPRESS CY62256VLL

CY62256V
256K (32K x 8) Static RAM
Functional Description[1]
Features
• High Speed
The CY62256V family is composed of two high-performance
CMOS static RAM’s organized as 32K words by 8 bits. Easy
memory expansion is provided by an active LOW chip enable
(CE) and active LOW output enable (OE) and Tri-state drivers.
These devices have an automatic power-down feature,
reducing the power consumption by over 99% when
deselected.
— 70 ns
• Temperature Ranges
— Commercial: 0°C to 70°C
— Industrial: –40°C to 85°C
— Automotive: –40°C to 125°C
• CMOS for optimum speed/power
An active LOW write enable signal (WE) controls the
writing/reading operation of the memory. When CE and WE
inputs are both LOW, data on the eight data input/output pins
(I/O0 through I/O7) is written into the memory location
addressed by the address present on the address pins (A0
through A14). Reading the device is accomplished by selecting
the device and enabling the outputs, CE and OE active LOW,
while WE remains inactive or HIGH. Under these conditions,
the contents of the location addressed by the information on
address pins are present on the eight data input/output pins.
• Available in a Pb-free and non Pb-free standard 28-pin
narrow SOIC, 28-pin TSOP-1 and 28-pin Reverse
TSOP-1 packages
The input/output pins remain in a high-impedance state unless
the chip is selected, outputs are enabled, and write enable
(WE) is HIGH.
• Low voltage range:
— 2.7V – 3.6V
• Low active power and standby power
• Easy memory expansion with CE and OE features
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
Logic Block Diagram
I/O0
INPUTBUFFER
I/O1
32K × 8
ARRAY
I/O2
SENSE AMPS
ROW DECODER
A10
A9
A8
A7
A6
A5
A4
A3
A2
I/O3
I/O4
I/O5
CE
WE
COLUMN
DECODER
I/O6
POWER
DOWN
I/O7
A12
A11
A1
A0
A13
A14
OE
Note:
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05057 Rev. *F
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised July 25, 2006
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CY62256V
Product Portfolio
Power Dissipation
VCC Range (V)
Product
CY62256VLL
Range
Com’l/Ind’l
Speed
Operating, ICC (mA)
Standby, ISB2 (µA)
Min.
Typ.[2]
Max.
(ns)
Typ.[2]
Max.
Typ.[2]
Max.
2.7
3.0
3.6
70
11
30
0.1
5
Automotive
130
Pin Configurations
Narrow SOIC
Top View
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
WE
A4
A3
A2
A1
OE
A0
CE
I/O7
I/O6
I/O5
I/O4
I/O3
A11
A10
A9
A8
A7
A6
A5
VCC
WE
A4
A3
A2
A1
OE
7
6
8
9
5
4
3
2
10
11
12
13
14
15
16
17
18
1
28
27
26
25
24
23
22
TSOP I
Reverse Pinout
Top View
(not to scale)
19
20
21
A12
A13
A14
I/O0
I/O1
I/O2
GND
I/O3
I/O4
I/O5
I/O6
I/O7
CE
A0
OE
A1
A2
A3
A4
WE
VCC
A5
A6
A7
A8
A9
A10
A11
21
22
23
24
25
26
27
28
1
2
3
4
5
6
7
TSOP I
Top View
(not to scale)
20
19
18
17
16
15
14
13
12
11
10
9
8
A0
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A14
A13
A12
Pin Definitions
Pin Number
Type
Description
1–10, 21, 23–26
Input
A0–A14. Address Inputs
11–13, 15–19
Input/Output
I/O0–I/O7. Data lines. Used as input or output lines depending on operation
27
Input/Control
WE. When selected LOW, a WRITE is conducted. When selected HIGH, a READ
is conducted
20
Input/Control
CE. When LOW, selects the chip. When HIGH, deselects the chip
22
Input/Control
OE. Output Enable. Controls the direction of the I/O pins. When LOW, the I/O pins
behave as outputs. When deasserted HIGH, I/O pins are Tri-stated, and act as
input data pins
14
Ground
GND. Ground for the device
28
Power Supply
VCC. Power supply for the device
Note:
2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ.), TA = 25°C, and tAA = 70 ns.
Document #: 38-05057 Rev. *F
Page 2 of 12
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CY62256V
Maximum Ratings
Output Current into Outputs (LOW)............................. 20 mA
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage to Ground Potential
(Pin 28 to Pin 14) ........................................... –0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State[3] ....................................–0.5V to VCC + 0.5V
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.................................................... > 200 mA
Operating Range
Device
Range
CY62256V Commercial
[3]
DC Input Voltage .................................–0.5V to VCC + 0.5V
Ambient
Temperature (TA)[4]
VCC
0°C to +70°C
2.7V to 3.6V
Industrial
−40°C to +85°C
Automotive
−40°C to +125°C
Electrical Characteristics Over the Operating Range
CY62256V-70
Parameter
Description
Test Conditions
Min.
VOH
Output HIGH Voltage
IOH = −1.0 mA
VCC = 2.7V
VOL
Output LOW Voltage
IOL = 2.1 mA
VCC = 2.7V
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIX
Input Leakage Current
IOZ
Output Leakage Current
Typ.[2]
Max.
2.4
Unit
V
0.4
V
2.2
VCC
+0.3V
V
–0.5
0.8
V
Com’l, Ind’l
–1
+1
µA
Automotive
–10
+10
µA
GND < VIN < VCC, Output Disabled Com’l, Ind’l
–1
+1
µA
Automotive
–10
+10
µA
GND < VIN < VCC
ICC
VCC Operating Supply Current VCC = 3.6V, IOUT = 0 mA,
f = fMax = 1/tRC
All ranges
11
30
mA
ISB1
Automatic CE Power-down
Current— TTL Inputs
VCC = 3.6V, CE > VIH,
VIN > VIH or VIN < VIL, f = fMax
All ranges
100
300
µA
ISB2
Automatic CE Power-down
Current— CMOS Inputs
Com’l
VCC = 3.6V, CE > VCC – 0.3V
VIN > VCC – 0.3V or VIN < 0.3V, f = 0
Ind’l
0.1
5
µA
0.1
10
0.1
130
Automotive
Notes:
3. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
4. TA is the “Instant-On” case temperature.
Document #: 38-05057 Rev. *F
Page 3 of 12
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CY62256V
Capacitance[5]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
Max.
Unit
6
pF
8
pF
TA = 25°C, f = 1 MHz, VCC = VCC(typ.)
Thermal Resistance
Parameter
Description
Test Conditions
ΘJA
Thermal Resistance
(Junction to Ambient)[6]
ΘJC
Thermal Resistance
(Junction to Case)[5]
Still Air, soldered on a 3 × 4.5 inch,
2-layer printed circuit board
SOIC
TSOPI
RTSOPI
Unit
68.45
87.62
87.62
°C/W
26.94
23.73
23.73
°C/W
AC Test Loads and Waveforms
R1
VCC
ALL INPUT PULSES
OUTPUT
VCC
R2
50 pF
90%
10%
90%
10%
GND
< 5 ns
< 5 ns
INCLUDING
JIG AND
SCOPE
Equivalent to:
THEVENIN EQUIVALENT
RTH
OUTPUT
Parameter
VTH
3.3V
Units
R1
1100
Ohms
R2
1500
Ohms
RTH
645
Ohms
VTH
1.750
Volts
Data Retention Characteristics (Over the Operating Range)
Parameter
Conditions[6]
Description
VDR
VCC for Data Retention
ICCDR
Data Retention Current
Typ.[2]
Min.
Max.
1.4
tCDR[6]
Chip Deselect to Data
Retention Time
tR[6]
Operation Recovery Time
VCC = 1.4V, CE > VCC – 0.3V,
VIN > VCC – 0.3V or VIN < 0.3V
Unit
V
Com’l
0.1
3
Ind’l
0.1
6
Auto
0.1
50
µA
0
ns
tRC
ns
Data Retention Waveform
DATA RETENTION MODE
VCC
VCC(min)
VDR > 1.4V
tCDR
VCC(min)
tR
CE
Notes:
5. Tested initially and after any design or process changes that may affect these parameters.
6. No input may exceed VCC + 0.3V.
Document #: 38-05057 Rev. *F
Page 4 of 12
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CY62256V
Switching Characteristics Over the Operating Range[7]
CY62256V-70
Parameter
Description
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
70
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE LOW to Data Valid
70
ns
tDOE
OE LOW to Data Valid
35
ns
tLZOE
OE LOW to Low-Z[8]
70
10
OE HIGH to
tLZCE
CE LOW to Low-Z[8]
tHZCE
CE HIGH to
tPU
CE LOW to Power-up
tPD
CE HIGH to Power-down
ns
25
10
High-Z[8, 9]
ns
ns
5
High-Z[8, 9]
tHZOE
ns
ns
ns
25
0
ns
ns
70
ns
Write Cycle[10, 11]
tWC
Write Cycle Time
70
ns
tSCE
CE LOW to Write End
60
ns
tAW
Address Set-up to Write End
60
ns
tHA
Address Hold from Write End
0
ns
tSA
Address Set-up to Write Start
0
ns
tPWE
WE Pulse Width
50
ns
tSD
Data Set-up to Write End
30
ns
tHD
Data Hold from Write End
0
ns
High-Z[8, 9]
tHZWE
WE LOW to
tLZWE
WE HIGH to Low-Z[8]
25
10
ns
ns
Notes:
7. Test conditions assume signal transition time of 5 ns or less timing reference levels of VCC/2, input pulse levels of 0 to VCC, and output loading of the specified
IOL/IOH and 50 pF load capacitance.
8. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
9. tHZOE, tHZCE, and tHZWE are specified with CL = 5 pF as in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.
10. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can
terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
11. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Document #: 38-05057 Rev. *F
Page 5 of 12
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CY62256V
Switching Waveforms
Read Cycle No. 1 (Address Transition Controlled)[12, 13]
tRC
ADDRESS
tOHA
DATA OUT
tAA
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2 (OE Controlled)[13, 14]
t RC
CE
tACE
OE
DATA OUT
t HZOE
tHZCE
tDOE
t LZOE
HIGH IMPEDANCE
HIGH
IMPEDANCE
DATA VALID
tLZCE
t PD
t PU
ICC
VCC
SUPPLY
CURRENT
50%
50%
ISB
Write Cycle No. 1 (WE Controlled)[10, 15, 16]
tWC
ADDRESS
CE
tAW
tSA
tHA
t PWE
WE
OE
tSD
DATA I/O
NOTE 17
tHD
DATAINVALID
t HZOE
Notes:
12. Device is continuously selected. OE, CE = VIL.
13. WE is HIGH for read cycle.
14. Address valid prior to or coincident with CE transition LOW.
15. Data I/O is high impedance if OE = VIH.
16. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.
17. During this period, the I/Os are in output state and input signals should not be applied.
Document #: 38-05057 Rev. *F
Page 6 of 12
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CY62256V
Switching Waveforms (continued)
Write Cycle No. 2 (CE Controlled)[10, 15, 16]
tWC
ADDRESS
tSCE
CE
tSA
tAW
tHA
WE
tSD
t HD
DATAINVALID
DATA I/O
Write Cycle No. 3 (WE Controlled, OE LOW)[11, 16]
tWC
ADDRESS
CE
tAW
t HA
tSA
WE
tSD
DATA I/O
NOTE 17
DATA INVALID
t HZWE
Document #: 38-05057 Rev. *F
t HD
tLZWE
Page 7 of 12
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CY62256V
Typical DC and AC Characteristics
1.4
1.6
1.4
1.2
2.5
1.0
2.0
0.4
0.0
25
125
2.5
1.6
2.0
1.4
NORMALIZED t
AA
VCC = 3.0V
TA = 25°C
1.0
0.0
1.65
VCC = 2.5V
1.2
1.0
0.8
0.5
2.1
2.6
3.1
3.6
0.6
−55
25
125
OUTPUT SOURCE CURRENT (mA)
3.
3V
=
2.
5V
105
OUTPUT SINK CURRENT
14 vs. OUTPUT VOLTAGE
12
10
8
6
VCC = 2.5 V
4
TA = 25°C
2
0
0.0
1.0
2.0
3.0
OUTPUT VOLTAGE (V)
AMBIENT TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
25
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
NORMALIZED ACCESS TIME
vs. AMBIENT TEMPERATURE
NORMALIZED ACCESS TIME
vs. SUPPLY VOLTAGE
ISB
–0.5
−55
=
0.2
0.0
−55
3.6
3.2
2.8
2.4
2.0
1.8
1.6
0.5
SUPPLY VOLTAGE (V)
1.5
1.0
0.4
OUTPUT SINK CURRENT (mA)
0.6
0.6
1.5
cc
TA= 25°C
VCC = 2.5V
cc
0.8
0.8
V
1.0
V
1.2
3.0
VCC = 3.0V
ISB2 µA
NORMALIZED I CC
NORMALIZED ICC
1.8
0.2
NORMALIZED t AA
STANDBY CURRENT
vs. AMBIENT TEMPERATURE
NORMALIZED SUPPLY CURRENT
vs. AMBIENT TEMPERATURE
NORMALIZED SUPPLY CURRENT
vs. SUPPLY VOLTAGE
OUTPUT SOURCE CURRENT
vs. OUTPUT VOLTAGE
–14
–12
–10
–8
–6
VCC = 2.5V
TA = 25°C
–4
0
0.0
0.5
1.0
1.5
2
2.5
OUTPUT VOLTAGE (V)
Document #: 38-05057 Rev. *F
Page 8 of 12
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CY62256V
Typical DC and AC Characteristics (continued)
TYPICAL ACCESS TIME CHANGE
vs. OUTPUT LOADING
NORMALIZED I CC vs.CYCLE TIME
1.25
25.0 T = 25°C
A
VCC = 3V
20.0
NORMALIZED ICC
DELTA tAA (ns)
30.0
15.0
10.0
VCC = 3.0V
1.00
TA = 25°C
VIN = 0.5V
0.75
5.0
0.0
0
200
400
600
0.50
1
800 1000
10
20
30
CYCLE FREQUENCY (MHz)
CAPACITANCE (pF)
Truth Table
CE
WE
OE
Inputs/Outputs
Mode
Power
H
X
X
High-Z
Deselect/Power-down
Standby (ISB)
L
H
L
Data Out
Read
Active (ICC)
L
L
X
Data In
Write
Active (ICC)
L
H
H
High-Z
Deselect, Output Disabled
Active (ICC)
Ordering Information
Speed
(ns)
70
Ordering Code
Package
Diagram
Package Type
CY62256VLL-70SNC
51-85092
28-pin (300-mil Narrow Body) SNC
CY62256VLL-70SNXC
CY62256VLL-70ZC
51-85071
28-pin TSOP I
28-pin TSOP I (Pb-Free)
CY62256VLL-70SNXI
51-85092
28-pin (300-mil Narrow Body) SNC (Pb-Free)
CY62256VLL-70ZI
51-85071
28-pin TSOP I
CY62256VLL-70ZXI
51-85074
51-85092
CY62256VLL-70ZRXE
28-pin (300-mil Narrow Body) SNC
Automotive
28-pin (300-mil Narrow Body) SNC (Pb-Free)
51-85071
CY62256VLL-70ZXE
CY62256VLL-70ZRE
28-pin Reverse TSOP I
28-pin Reverse TSOP I (Pb-Free)
CY62256VLL-70SNXE
CY62256VLL-70ZE
Industrial
28-pin TSOP I (Pb-Free)
CY62256VLL-70ZRXI
CY62256VLL-70SNE
Commercial
28-pin (300-mil Narrow Body) SNC (Pb-Free)
CY62256VLL-70ZXC
CY62256VLL-70ZRI
Operating
Range
28-pin TSOP I
28-pin TSOP I (Pb-Free)
51-85074
28-pin Reverse TSOP I
28-pin Reverse TSOP I (Pb-Free)
Please contact your local Cypress sales representative for availability of these parts
Document #: 38-05057 Rev. *F
Page 9 of 12
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CY62256V
Package Diagrams
28-pin (300-mil) SNC (Narrow Body) (51-85092)
51-85092-*B
28-pin Thin Small Outline Package Type 1 (8 × 13.4 mm) (51-85071)
51-85071-*G
Document #: 38-05057 Rev. *F
Page 10 of 12
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CY62256V
Package Diagrams (continued)
28-pin Reverse Thin Small Outline Package Type 1 (8 × 13.4 mm) (51-85074)
51-85074-*F
All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-05057 Rev. *F
Page 11 of 12
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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CY62256V
Document History Page
Document Title: CY62256V, 256K (32K x 8) Static RAM
Document Number: 38-05057
REV.
ECN NO. Issue Date
Orig. of
Change
Description of Change
**
107248
09/10/01
SZV
Changed from spec number: 38-00519 to 38-05057
*A
111445
11/01/01
MGN
Removed obsolete parts. Change to standard format
*B
115229
05/23/02
GBI
Changed SN package diagram
*C
116507
09/04/02
GBI
Added footnote 1
Clarified ICC spec for VCC(typ) = 2.5V
*D
239134
See ECN
AJU
Added Automotive product information
*E
344595
See ECN
SYT
Added Pb-Free packages on page# 10
*F
493277
See ECN
VKN
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Removed part # CY62256V25LL from the product offering
Updated Ordering Information Table
Document #: 38-05057 Rev. *F
Page 12 of 12
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