INTEL DG33FB

Intel® Desktop Board
DG33FB
Technical Product Specification
May 2007
Order Number: D88105-001US
The Intel® Desktop Board DG33FB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG33FB Specification Update.
Revision History
Revision
-001
Revision History
First release of the
Specification
Intel®
Date
Desktop Board DG33FB Technical Product
May 2007
This product specification applies to only the standard Intel® Desktop Board DG33FB with BIOS
identifier DPP3510A.86A.
Changes to this specification will be published in the Intel Desktop Board DG33FB Specification
Update before being incorporated into a revision of this document.
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to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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Copyright © 2007, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board DG33FB. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DG33FB and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter
Description
1
A description of the hardware used on the board
2
A map of the resources of the board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
#
INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DG33FB Technical Product Specification
Other Common Notation
iv
#
Used after a signal name to identify an active-low signal (such as USBP0#)
GB
Gigabyte (1,073,741,824 bytes)
GB/sec
Gigabytes per second
Gbit
Gigabit (1, 073,741,824 bits)
KB
Kilobyte (1024 bytes)
Kbit
Kilobit (1024 bits)
kbits/sec
1000 bits per second
MB
Megabyte (1,048,576 bytes)
MB/sec
Megabytes per second
Mbit
Megabit (1,048,576 bits)
Mbit/sec
Megabits per second
xxh
An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V
Volts. Voltages are DC unless otherwise specified.
*
This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
Contents
1 Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Board Layout ....................................................................... 12
1.1.3 Block Diagram ..................................................................... 14
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.5.1 Memory Configurations ......................................................... 17
1.6 Intel® G33 Express Chipset ............................................................... 19
1.6.1 Intel G33 Graphics Subsystem ............................................... 19
1.6.2 Intel® Viiv™ Processor Technology .......................................... 21
1.6.3 USB ................................................................................... 21
1.6.4 Serial ATA Interfaces ............................................................ 21
1.7 Parallel IDE Controller ...................................................................... 22
1.8 Real-Time Clock Subsystem .............................................................. 22
1.9 Legacy I/O Controller ....................................................................... 23
1.9.1 Serial Port Interface.............................................................. 23
1.9.2 Parallel Port Interface ........................................................... 23
1.9.3 Diskette Drive Interface ........................................................ 23
1.9.4 PS/2 Keyboard and Mouse Interface........................................ 23
1.10 Audio Subsystem............................................................................. 24
1.10.1 Audio Subsystem Software .................................................... 24
1.10.2 Audio Connectors and Headers ............................................... 25
1.11 LAN Subsystem ............................................................................... 26
1.11.1 Intel® 82566DC Gigabit Ethernet Controller.............................. 26
1.11.2 LAN Subsystem Software....................................................... 27
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27
1.12 Hardware Management Subsystem .................................................... 28
1.12.1 Hardware Monitoring and Fan Control...................................... 28
1.12.2 Fan Monitoring ..................................................................... 28
1.12.3 Chassis Intrusion and Detection.............................................. 28
1.12.4 Thermal Monitoring .............................................................. 29
1.13 Power Management ......................................................................... 30
1.13.1 ACPI .................................................................................. 30
1.13.2 Hardware Support ................................................................ 33
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Intel Desktop Board DG33FB Technical Product Specification
2 Technical Reference
2.1 Memory Map................................................................................... 37
2.1.1 Addressable Memory............................................................. 37
2.2 Connectors and Headers................................................................... 40
2.2.1 Back Panel Connectors .......................................................... 41
2.2.2 Component-side Connectors and Headers ................................ 42
2.3 Jumper Block .................................................................................. 50
2.4 Mechanical Considerations ................................................................ 51
2.4.1 Form Factor......................................................................... 51
2.5 Electrical Considerations ................................................................... 52
2.5.1 Power Supply Considerations ................................................. 52
2.5.2 Fan Header Current Capability................................................ 53
2.5.3 Add-in Board Considerations .................................................. 53
2.6 Thermal Considerations .................................................................... 54
2.7 Reliability ....................................................................................... 56
2.8 Environmental ................................................................................ 57
3 Overview of BIOS Features
3.1 Introduction ...................................................................................
3.2 BIOS Flash Memory Organization .......................................................
3.3 Resource Configuration ....................................................................
3.3.1 PCI* Autoconfiguration..........................................................
3.3.2 PCI IDE Support...................................................................
3.4 System Management BIOS (SMBIOS).................................................
3.5 Legacy USB Support ........................................................................
3.6 BIOS Updates .................................................................................
3.6.1 Language Support ................................................................
3.6.2 Custom Splash Screen ..........................................................
3.7 BIOS Recovery................................................................................
3.8 Boot Options...................................................................................
3.8.1 CD-ROM Boot ......................................................................
3.8.2 Network Boot.......................................................................
3.8.3 Booting Without Attached Devices...........................................
3.8.4 Changing the Default Boot Device During POST ........................
3.9 Adjusting Boot Speed.......................................................................
3.9.1 Peripheral Selection and Configuration.....................................
3.9.2 BIOS Boot Optimizations .......................................................
3.10 BIOS Security Features ....................................................................
59
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62
63
63
64
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65
65
65
65
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66
66
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67
4 Error Messages and Beep Codes
4.1
4.2
4.3
4.4
vi
Speaker ......................................................................................... 69
BIOS Beep Codes ............................................................................ 69
BIOS Error Messages ....................................................................... 69
Port 80h POST Codes ....................................................................... 70
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance.....................................................................
5.1.1 Safety Standards..................................................................
5.1.2 European Union Declaration of Conformity Statement ................
5.1.3 Product Ecology Statements...................................................
5.1.4 EMC Regulations ..................................................................
5.1.5 Product Certification Markings (Board Level).............................
5.2 Battery Disposal Information.............................................................
75
75
76
78
82
84
85
Figures
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
Major Board Components..................................................................
Block Diagram ................................................................................
Memory Channel Configuration and DIMM Configuration........................
Back Panel Audio Connector Options ..................................................
LAN Connector LED Locations ............................................................
Thermal Sensors and Fan Headers .....................................................
Location of the Standby Power Indicator LED .......................................
Detailed System Memory Address Map ...............................................
Back Panel Connectors .....................................................................
Component-side Connectors and Headers ...........................................
Connection Diagram for Front Panel Header ........................................
Connection Diagram for Front Panel USB Headers ................................
Location of the Jumper Block.............................................................
Board Dimensions ...........................................................................
Localized High Temperature Zones.....................................................
12
14
18
25
27
29
36
38
41
42
47
49
50
51
55
Tables
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
Feature Summary............................................................................
Board Components Shown in Figure 1 ................................................
Supported Memory Configurations .....................................................
Audio Jack Support ..........................................................................
LAN Connector LED States ................................................................
Effects of Pressing the Power Switch ..................................................
Power States and Targeted System Power...........................................
Wake-up Devices and Events ............................................................
System Memory Map .......................................................................
Component-side Connectors and Headers Shown in Figure 10................
Serial ATA Connectors ......................................................................
Chassis Intrusion Header ..................................................................
Serial Port Header ...........................................................................
Front and Rear Chassis Fan Headers ..................................................
Processor Fan Header ......................................................................
Front Panel Audio Header .................................................................
Auxiliary Front Panel Power/Sleep LED Header.....................................
Processor Core Power Connector........................................................
10
13
16
24
27
30
31
32
39
43
44
44
44
44
44
45
45
46
vii
Intel Desktop Board DG33FB Technical Product Specification
19.
20.
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viii
Main Power Connector......................................................................
Front Panel Header ..........................................................................
States for a One-Color Power LED ......................................................
States for a Two-Color Power LED......................................................
Auxiliary Front Panel Power LED Header..............................................
BIOS Setup Configuration Jumper Settings..........................................
Recommended Power Supply Current Values .......................................
Fan Header Current Capability...........................................................
Thermal Considerations for Components .............................................
Desktop Board DG33FB Environmental Specifications............................
BIOS Setup Program Menu Bar..........................................................
BIOS Setup Program Function Keys....................................................
Acceptable Drives/Media Types for BIOS Recovery ...............................
Boot Device Menu Options ................................................................
Supervisor and User Password Functions.............................................
Beep Codes ....................................................................................
BIOS Error Messages .......................................................................
Port 80h POST Code Ranges..............................................................
Port 80h POST Codes .......................................................................
Typical Port 80h POST Sequence........................................................
Safety Standards.............................................................................
Lead-Free Board Markings ................................................................
EMC Regulations .............................................................................
Product Certification Markings ...........................................................
46
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48
50
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53
56
57
60
60
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1
Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 10
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.6 Intel® G33 Express Chipset ............................................................... 19
1.7 Parallel IDE Controller ...................................................................... 22
1.8 Real-Time Clock Subsystem .............................................................. 22
1.9 Legacy I/O Controller ....................................................................... 23
1.10 Audio Subsystem............................................................................. 24
1.11 LAN Subsystem ............................................................................... 26
1.12 Hardware Management Subsystem .................................................... 28
1.13 Power Management ......................................................................... 30
9
Intel Desktop Board DG33FB Technical Product Specification
1.1
Overview
1.1.1
Feature Summary
Table 1 summarizes the major features of the Desktop Board DG33FB.
Table 1. Feature Summary
Form Factor
ATX (11.60 inches by 9.60 inches [294.64 millimeters by 243.84 millimeters])
Processor
Support for the following:
• Intel® Core™2 Quad processor in an LGA775 socket with a 1066 MHz
system bus
• Intel® Core™2 Duo processor in an LGA775 socket with a 1333 or 1066 or
800 MHz system bus
• Intel® Pentium® Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
• Intel® Celeron® processor in an LGA775 socket with an 800 MHz system bus
Memory
• Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 667 or DDR2 800 MHz DIMMs
• Support for up to 8 GB of system memory
Chipset
Intel® G33 Express Chipset, consisting of:
• Intel® 82G33 Graphics and Memory Controller Hub (GMCH)
• Intel® 82801IH I/O Controller Hub (ICH9DH)
Video
Intel® Graphics Media Accelerator (Intel® GMA) 3100 onboard graphics
subsystem
Audio
6-channel (5.1) audio subsystem using the Realtek* ALC888 audio codec
Legacy I/O Control
Legacy I/O controller for diskette drive, serial, and PS/2* ports
Peripheral
Interfaces
• 12 USB 2.0 ports
• Four Serial ATA interfaces
• One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support
• One diskette drive interface
• One IEEE 1394a port
• PS/2 keyboard and mouse ports
• One serial port header (may require specialized chassis or cable for use)
LAN Support
Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82566DC
Gigabit Ethernet Controller
BIOS
• Intel® BIOS (resident in the SPI Flash device)
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available
PC Technology
• Support for PCI* Local Bus Specification Revision 2.3
• Support for PCI Express* Revision 1.1
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
continued
10
Product Description
Table 1. Feature Summary (continued)
Expansion
Capabilities
• Three PCI Conventional bus connectors
Hardware Monitor
Subsystem
• Intel® Quiet System Technology implemented through the Intel® Management
Engine in ICH9DH
• Three PCI Express x1 bus add-in card connector
• One PCI Express x16 bus add-in card connector
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan headers
• Three fan sense inputs used to monitor fan activity
For information about
Refer to
Available configurations for the Desktop Board DG33FB
Section 1.2, page 15
11
Intel Desktop Board DG33FB Technical Product Specification
1.1.2
Board Layout
Figure 1 shows the location of the major components.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
12
Product Description
Table 2. Board Components Shown in Figure 1
Item/callout
from Figure 1
A
Description
PCI Conventional bus add-in card connector
B
Auxiliary rear chassis fan header
C
PCI Express x1 connector
D
PCI Express x1 connector
E
PCI Conventional bus add-in card connector
F
Front panel audio header
G
PCI Conventional bus add-in card connector
H
PCI Express x1 connector
I
Speaker
J
PCI Express x16 connector
K
Back panel connectors
L
Processor core power connector (2 X 2)
M
Rear chassis fan header
N
LGA775 processor socket
O
Intel 82G33 GMCH
P
Processor fan header
Q
DIMM Channel A sockets
R
Serial port header
S
DIMM Channel B sockets
T
Main Power connector (2 X 12)
U
Diskette drive connector
V
Chassis intrusion header
W
Battery
X
Front chassis fan header
Y
BIOS Setup configuration jumper block
Z
Auxiliary front panel power LED header
AA
Front panel header
BB
Serial ATA connectors [4]
CC
Parallel ATA IDE connector
DD
Front panel USB headers [3]
EE
Intel 82801IH I/O Controller Hub (ICH9DH)
FF
IEEE 1394a header
13
Intel Desktop Board DG33FB Technical Product Specification
1.1.3
Block Diagram
Figure 2 is a block diagram of the major functional areas.
Figure 2. Block Diagram
14
Product Description
1.2
Legacy Considerations
This board differs from other Intel® Desktop Board products, with specific changes
including (but not limited to) the following:
•
•
•
•
1.3
No parallel port
The location of the floppy drive connector has moved
No serial port on the back panel
The serial port header is located between the memory sockets and may require a
specialized chassis or cabling solution to use
Online Support
To find information about…
Visit this World Wide Web site:
Intel Desktop Board DG33FB
http://www.intel.com/products/motherboard/DG33FB/index.htm
Desktop Board Support
http://support.intel.com/support/motherboards/desktop
Available configurations for the
Desktop Board DG33FB
http://www.intel.com/products/motherboard/DG33FB/index.htm
Supported processors
http://www.intel.com/go/findcpu
Chipset information
http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates
http://downloadcenter.intel.com
Tested Memory
http://support.intel.com/support/motherboards/desktop/sb/CS025414.htm
1.4
Processor
The board is designed to support the following processors:
•
•
•
•
Intel Core 2 Quad processor in an LGA775 socket with a 1066 MHz system bus
Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
Intel Pentium Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
Intel Celeron processor in an LGA775 socket with an 800 MHz system bus
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W. The processors listed above are only
supported when falling within the wattage requirements of the DG33FB board. See
the Intel web site listed below for the most up-to-date list of supported processors.
For information about…
Refer to:
Supported processors
http://www.intel.com/go/findcpu
CAUTION
#
INTEGRATOR’S NOTE
Use only ATX12V-compliant power supplies.
For information about
Refer to
Power supply connectors
Section 2.2.2.4, page 46
15
Intel Desktop Board DG33FB Technical Product Specification
1.5
System Memory
The board has four DIMM sockets and supports the following memory features:
•
•
1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
•
•
•
•
•
•
•
8 GB maximum total system memory. Refer to Section 2.1.1 on page 37 for
information on the total amount of addressable memory.
Minimum total system memory: 512 MB
Non-ECC DIMMs
Serial Presence Detect
DDR2 667 or DDR2 800 MHz SDRAM DIMMs
DDR2 667 DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP)
DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This enables the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
16
DIMM
Type
SDRAM
Technology
Smallest usable
DIMM (one x16
Single-sided
DIMM)
DDR2 667
512 Mbit
256 MB
Largest usable
DIMM (one x8
Double-sided
DIMM)
Maximum capacity
with four identical
x8 Double-sided
DIMMs
1 GB
4 GB
DDR2 667
1 Gbit
512 MB
2 GB
8 GB
DDR2 800
512 Mbit
256 MB
1 GB
4 GB
DDR2 800
1 Gbit
512 MB
2 GB
8 GB
For information about…
Refer to:
Tested Memory
http://support.intel.com/support/motherboards/desktop/sb/CS025414.htm
Product Description
1.5.1
Memory Configurations
The Intel 82G33 GMCH supports the following types of memory organization:
•
•
•
Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about…
Refer to:
Memory Configuration Examples
http://support.intel.com/support/motherboards/desktop/sb/CS025414.htm
17
Intel Desktop Board DG33FB Technical Product Specification
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels
are black.
Figure 3. Memory Channel Configuration and DIMM Configuration
#
INTEGRATOR’S NOTE
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated. This is a requirement of the
Intel Management Engine in ICH9DH.
18
Product Description
Intel® G33 Express Chipset
1.6
The Intel G33 Express chipset consists of the following devices:
•
•
Intel 82G33 Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
Intel 82801IH I/O Controller Hub (ICH9DH) with DMI interconnect
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D, and display capabilities. The ICH9DH is a centralized controller for
the board’s I/O paths.
The chipset supports the following features:
•
•
•
•
•
Onboard Graphics
Dynamic Video Memory Technology
USB
Serial ATA
Parallel IDE
For information about
Refer to
The Intel G33 Express chipset
http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset
Chapter 2
1.6.1
Intel G33 Graphics Subsystem
The Intel G33 Express chipset contains two separate, mutually exclusive graphics
options. Either the Intel Graphics Media Accelerator 3100 (Intel GMA 3100) graphics
controller (contained within the 82G33 GMCH) is used, or a PCI Express x16 add-in
card can be used. When a PCI Express x16 add-in card is installed, the Intel GMA
3100 graphics controller is disabled.
1.6.1.1
Intel® Graphics Media Accelerator 3100 Graphics
Controller
The Intel GMA 3100 graphics controller features the following:
•
•
•
•
400 MHz core frequency
High quality texture engine
⎯ DX9.0c* and OpenGL* 1.4 compliant
⎯ Hardware Pixel Shader 2.0
⎯ Vertex Shader Model 2.0
3D Graphics Rendering enhancements
⎯ 1.6 dual texture GigaPixel/sec max fill rate
⎯ 16-bit and 32-bit color
⎯ Vertex cache
Video
⎯ Software DVD at 30 fps full screen
⎯ DVMT support up to 256 MB
19
Intel Desktop Board DG33FB Technical Product Specification
•
Display
⎯ Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯ Dual independent display support
⎯ DDC2B compliant interface with Advanced Digital Display 2 card or Media
Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display
connections
1.6.1.2
Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be
allocated to DVMT on systems that have 512 MB or more of total system memory
installed. DVMT returns system memory back to the operating system when the
additional system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.6.1.3
Configuration Modes
The video modes supported by this board are based on the Extended Display
Identification Data (EDID) modes of the monitor to which the system is connected.
Standard monitors are assumed.
1.6.1.4
Advanced Digital Display (ADD2/MEC) Card Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
225 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC card is
detected, the Intel GMA 3100 graphics controller is enabled and the PCI Express x16
connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be
accessed by the ADD2/MEC card. An ADD2/MEC card can either be configured to
support simultaneous display with the primary VGA display or can be configured to
support dual independent display as an extended desktop configuration with different
color depths and resolutions. ADD2/MEC cards can be designed to support the
following configurations:
•
•
•
•
20
Low Voltage Differential Signaling (LVDS)
Single device operating in dual channel mode
HDTV output
HDMI support (when used with the HD Audio Link)
Product Description
1.6.2
Intel® Viiv™ Processor Technology
This Intel desktop board supports Intel® Viiv™ processor technology. To be eligible for
the Intel Viiv processor technology brand, a system must meet certain hardware and
software requirements. To get the list of requirements for Intel Viiv processor
technology branding as well as all the features supported by Intel Viiv processor
technology, refer to:
http://www.intel.com/products/viiv/index.htm
1.6.3
USB
The board supports up to 12 USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers.
The ICH9DH provides the USB controller for all ports. The port arrangement is as
follows:
• Six ports are implemented with stacked back panel connectors
• Six ports are routed to three separate front panel USB headers
For information about
Refer to
The location of the USB connectors on the back panel
Figure 9, page 41
The location of the front panel USB headers
Figure 10, page 42
1.6.4
Serial ATA Interfaces
The board provides four Serial ATA (SATA) connectors, which support one device per
connector.
1.6.4.1
Serial ATA Support
The DG33FB Desktop Board’s Serial ATA controller offers four independent Serial ATA
ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device
can be installed on each port for a maximum of four Serial ATA devices. A point-topoint interface is used for host to device connections, unlike Parallel ATA IDE which
supports a master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP
operating system.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about
Refer to
The location of the Serial ATA connectors
Figure 10, page 42
21
Intel Desktop Board DG33FB Technical Product Specification
1.7
Parallel IDE Controller
The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The
Parallel ATA IDE interface supports the following modes:
•
•
•
•
•
•
Programmed I/O (PIO): processor controls data transfer.
8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/sec.
Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up
to 88 MB/sec.
ATA-133: DMA protocol on IDE bus allows host and target throttling. The ATA-133
logic is designed to achieve read transfer rates up to 133 MB/sec and write transfer
rates in excess of 100 MB/sec.
NOTE
ATA-66, ATA-100, and ATA-133 are faster timings and require a specialized cable to
reduce reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives)
and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended
Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate
and translation mode to the BIOS.
1.8
For information about
Refer to
The location of the Parallel ATA IDE connector
Figure 10, page 42
Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 12 shows the location of the battery.
22
Product Description
1.9
Legacy I/O Controller
The I/O controller provides the following features:
•
•
•
•
•
•
•
One serial port header
One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
Serial IRQ interface compatible with serialized IRQ support for PCI systems
PS/2-style mouse and keyboard interfaces
Interface for one 1.44 MB or 2.88 MB diskette drive
Intelligent power management, including a programmable wake-up event interface
PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.9.1
Serial Port Interface
The serial port header is located on the component side of the board. The serial port
supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about
Refer to
The location of the serial port header
Figure 10, page 42
The serial port header signal mapping
Table 11, page 44
1.9.2
Parallel Port Interface
The parallel port connector is located on the back panel of the board. Use the BIOS
Setup program to set the parallel port mode.
For information about
Refer to
The location of the parallel port connector
Figure 9, page 41
1.9.3
Diskette Drive Interface
The I/O controller supports one diskette drive. Use the BIOS Setup program to
configure the diskette drive interface.
For information about
Refer to
The location of the diskette drive connector
Figure 10, page 42
1.9.4
PS/2 Keyboard and Mouse Interface
The PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported
in the top PS/2 connector. Power to the computer should be turned off before a
keyboard or mouse is connected or disconnected.
For information about
Refer to
The location of the keyboard and mouse connectors
Figure 9, page 41
23
Intel Desktop Board DG33FB Technical Product Specification
1.10 Audio Subsystem
The onboard audio subsystem consists of the following:
•
•
•
•
Intel 82801IH (ICH9DH)
Realtek ALC888 audio codec
Back panel audio connectors
Component-side audio headers:
⎯ Intel® High Definition Audio front panel header
⎯ HD audio link header
The audio subsystem supports the following features:
•
•
A signal-to-noise (S/N) ratio of 95 dB
Independent 5.1 audio playback from back panel connectors and stereo playback
from the Intel High Definition Audio front panel header.
NOTE
Systems built with AC 97 front panel will not be able to obtain the Microsoft Windows
Vista* logo after June 2007.
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Support
Audio Jack
Supports
Line in?
Supports
Line out?
Supports
Microphone?
Supports
Headphones?
No
Yes
No
Yes
Front panel – Green
Front panel – Pink
No
No
Yes
No
Back panel – Blue
Yes
Yes
No
No
Back panel – Green
No
Yes
No
Yes
Back panel – Pink
No
Yes
Yes
No
1.10.1
Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
24
For information about
Refer to
Obtaining audio software and drivers
Section 1.2, page 15
Product Description
1.10.2
Audio Connectors and Headers
The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable audio ports are shown in Figure 4.
Item
Description
A
Line in
B
Line out
C
Mic in
Figure 4. Back Panel Audio Connector Options
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about
Refer to
The location of the front panel audio header
Figure 10, page 42
The signal names of the front panel audio header
Table 16, page 45
The back panel audio connectors
Section 2.2.1, page 41
25
Intel Desktop Board DG33FB Technical Product Specification
1.11 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82566DC Gigabit Ethernet Controller (10/100/1000 Mbits/sec)
• Intel 82801IH (ICH9DH)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between ICH9DH and the LAN controller
• PCI Conventional bus power management
⎯ ACPI technology support
•
⎯ LAN wake capabilities
LAN subsystem software
For information about
Refer to
LAN software and drivers
http://downloadcenter.intel.com
1.11.1
Intel® 82566DC Gigabit Ethernet Controller
The Intel 82566DC Gigabit Ethernet Controller supports the following features:
•
•
•
•
•
•
•
26
PCI Express link
10/100/1000 IEEE 802.3 compliant
Compliant to IEEE 802.3x flow control support
802.1p and 802.1q
TCP, IP, UDP checksum offload (for IPv4 and IPv6)
Full device driver compatibility
PCI Express power management support
Product Description
1.11.2
LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about
Refer to
Obtaining LAN software and drivers
Section 1.2, page 15
1.11.3
RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).
Item
Description
A
Link LED (Green)
B
Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 5. LAN Connector LED States
LED
Link
Data Rate
LED Color
Green
Green/Yellow
LED State
Condition
Off
LAN link is not established.
On
LAN link is established.
Blinking
LAN activity is occurring.
Off
10 Mbits/sec data rate is selected.
Green
100 Mbits/sec data rate is selected.
Yellow
1000 Mbits/sec data rate is selected.
27
Intel Desktop Board DG33FB Technical Product Specification
1.12 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
•
•
•
Fan monitoring and control
Thermal and voltage monitoring
Chassis intrusion detection
1.12.1
Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
•
•
•
•
•
Intel Quiet System Technology, delivering acoustically-optimized thermal
management
Fan speed control controllers and sensors integrated into the ICH9DH
Four thermal sensors (processor, 82G33 GMCH, 82801IH ICH9DH, and a remote
thermal sensor)
Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.25 V, and
+VCCP) to detect levels above or below acceptable values
Thermally monitored closed-loop fan control, for all four fans, that can adjust the
fan speed or switch the fans on or off as needed
1.12.2
Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Utilities or third-party
software.
For information about
Refer to
The functions of the fan headers
Section 1.13.2.2, page 34
Location of the fan headers
Figure 6, page 29
1.12.3
Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
28
For information about
Refer to
The location of the chassis intrusion header
Figure 10, page 42
Product Description
1.12.4
Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Item
Description
A
Auxiliary rear chassis fan
B
Rear chassis fan
C
Thermal diode, located on processor die
D
Thermal diode, located on the GMCH die
E
Processor fan
F
Front chassis fan
G
Thermal diode, located on the ICH9DH die
Figure 6. Thermal Sensors and Fan Headers
NOTE
The minimum thermal reporting threshold for the GMCH is 66°C. The GMCH thermal
sensor will display 66°C until the temperature rises above this point.
29
Intel Desktop Board DG33FB Technical Product Specification
1.13 Power Management
Power management is implemented at several levels, including:
•
•
Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support:
⎯ Power connector
⎯ Fan headers
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB
⎯ Wake from PS/2 devices
⎯ Power Management Event signal (PME#) wake-up support
1.13.1
ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with the board requires an
operating system that provides full ACPI support. ACPI features include:
•
•
•
•
•
•
Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (see Table 8 on page 32)
Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch
30
If the system is in this
state…
…and the power switch
is pressed for
Off
(ACPI G2/G5 – Soft off)
Less than four seconds
Power-on
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Less than four seconds
Soft-off/Standby
(ACPI G1 – sleeping state)
On
(ACPI G0 – working state)
More than four seconds
Fail safe power-off
(ACPI G2/G5 – Soft off)
Sleep
(ACPI G1 – sleeping state)
Less than four seconds
Wake-up
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
More than four seconds
Power-off
(ACPI G2/G5 – Soft off)
…the system enters this state
Product Description
1.13.1.1
System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 7 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 7. Power States and Targeted System Power
Global
States
Sleeping States
Processor
States
G0 – working
state
S0 – working
C0 – working
D0 – working
state.
Full power > 30 W
G1 – sleeping
state
S1 – Processor
stopped
C1 – stop
grant
D1, D2, D3 –
device
specification
specific.
5 W < power < 52.5 W
G1 – sleeping
state
S3 – Suspend to
RAM. Context
saved to RAM.
No power
D3 – no power
except for
wake-up logic.
Power < 5 W (Note 2)
G1 – sleeping
state
S4 – Suspend to
disk. Context
saved to disk.
No power
D3 – no power
except for
wake-up logic.
Power < 5 W (Note 2)
G2/S5
S5 – Soft off.
Context not saved.
Cold boot is
required.
No power
D3 – no power
except for
wake-up logic.
Power < 5 W (Note 2)
G3 –
mechanical off.
AC power is
disconnected
from the
computer.
No power to the
system.
No power
D3 – no power for
wake-up logic,
except when
provided by
battery or
external source.
No power to the system.
Service can be performed
safely.
Device States
Targeted System
Power (Note 1)
Notes:
1.
Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2.
Dependent on the standby power consumption of wake-up devices used in the system.
31
Intel Desktop Board DG33FB Technical Product Specification
1.13.1.2 ENERGY STAR*
In 2007, the US Department of Energy and the US Environmental Protection Agency
revised the ENERGY STAR* requirements. Intel has worked directly with these two
governmental agencies to define the new requirements. Currently Intel Desktop
Boards meet the new requirements.
For information about
Refer to
ENERGY STAR requirements and recommended configurations
http://www.intel.com/go/energystar
1.13.1.3
Wake-up Devices and Events
Table 8 lists the devices or specific events that can wake the computer from specific
states.
Table 8. Wake-up Devices and Events
These devices/events can wake up the computer…
…from this state
LAN
S1, S3, S4, S5 (Note)
PME# signal
S1, S3, S4, S5 (Note)
Power switch
S1, S3, S4, S5
PS/2 devices
S1, S3
RTC alarm
S3, S4, S5
Serial port
S3
USB
S3
WAKE# signal
S1, S3, S4, S5
Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to
Power On will enable a wake-up event from LAN in the S5 state.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
32
Product Description
1.13.2
Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
•
•
•
•
•
•
•
•
Power connector
Fan headers
LAN wake capabilities
Instantly Available PC technology
Wake from USB
Wake from PS/2 keyboard
PME# signal wake-up support
WAKE# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
1.13.2.1
Power Connector
ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.
For information about
Refer to
The location of the main power connector
Figure 10, page 42
The signal names of the main power connector
Table 19, page 46
33
Intel Desktop Board DG33FB Technical Product Specification
1.13.2.2
Fan Headers
The function/operation of the fan headers is as follows:
•
•
•
•
The fans are on when the board is in the S0 state.
The fans are off when the board is off or in the S3, S4, or S5 state.
The processor and Auxiliary fan headers are wired to a fan tachometer input and
the Front and Rear fan headers share the tachometer input of the hardware
monitoring and fan control device. All fan headers support closed-loop fan control
that can adjust the fan speed or switch the fan on or off as needed.
All fan headers have a +12 V DC connection.
For information about
Refer to
The locations of the fan headers and thermal sensors
Figure 6, page 29
The signal names of the processor fan header
Table 15, page 44
The signal names of the chassis fan headers
Table 14, page 44
1.13.2.3
LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line from the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing LAN wake capabilities can damage the power
supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
•
•
•
34
The PCI Express WAKE# signal
The PCI bus PME# signal for PCI 2.3 compliant LAN designs
The onboard LAN subsystem
Product Description
1.13.2.4
Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line from the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 8 on page 32 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.3 compliant add-in cards and drivers.
1.13.2.5
Wake from USB
USB bus activity wakes the computer from ACPI S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.13.2.6
Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S3 state.
1.13.2.7
PME# Signal Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI
S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.13.2.8
WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S3, S4, or S5 state.
35
Intel Desktop Board DG33FB Technical Product Specification
1.13.2.9
+5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power
indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 7. Location of the Standby Power Indicator LED
36
2
Technical Reference
What This Chapter Contains
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.1
2.1.1
Memory Map................................................................................... 37
Connectors and Headers................................................................... 40
Jumper Block .................................................................................. 50
Mechanical Considerations ................................................................ 51
Electrical Considerations ................................................................... 52
Thermal Considerations .................................................................... 54
Reliability ....................................................................................... 56
Environmental ................................................................................ 57
Memory Map
Addressable Memory
The board utilizes 8 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total
system memory). On a system that has 8 GB of system memory installed, it is not
possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
•
•
•
•
•
•
•
•
•
BIOS/ SPI Flash (8 Mbits)
Local APIC (19 MB)
Digital Media Interface (40 MB)
Front side bus interrupts (17 MB)
PCI Express configuration space (256 MB)
GMCH base address registers, internal graphics ranges, PCI Express ports (up to
512 MB)
Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express add-in cards
Intel Management Engine support (6 MB)
Base graphics memory support (1 MB or 8 MB)
37
Intel Desktop Board DG33FB Technical Product Specification
The amount of installed memory that can be used will vary based on add-in cards and
BIOS settings. Figure 8 shows a schematic of the system memory map. All installed
system memory can be used when there is no overlap of system addresses.
8 GB
Top of System Address Space
Upper
4 GB of
address
space
FLASH
APIC
~20 MB
Reserved
PCI Memory Range contains PCI, chipsets,
Direct Media Interface
(DMI), and ICH ranges
(approximately 750 MB)
0FFFFFH
0F0000H
0EFFFFH
Top of usable
DRAM (memory
visible to the
operating system)
0E0000H
0DFFFFH
0C0000H
DRAM
Range
0BFFFFH
1 MB
DOS
Compatibility
Memory
640 KB
0A0000H
1 MB
Upper BIOS
area (64 KB)
960 KB
Lower BIOS
area
(64 KB;
16 KB x 4)
896 KB
Add-in Card
BIOS and
Buffer area
(128 KB;
16 KB x 8)
768 KB
Standard PCI/
ISA Video
Memory (SMM
Memory)
128 KB
640 KB
09FFFFH
DOS area
(640 KB)
0 MB
00000H
0 KB
OM18311
Figure 8. Detailed System Memory Address Map
38
Technical Reference
Table 9 lists the system memory map.
Table 9. System Memory Map
Address Range
(decimal)
Address Range
(hex)
Size
Description
1024 K - 8388608 K
100000 - 1FFFFFFFF
8191 MB
Extended memory
960 K - 1024 K
F0000 - FFFFF
64 KB
Runtime BIOS
896 K - 960 K
E0000 - EFFFF
64 KB
Reserved
800 K - 896 K
C8000 - DFFFF
96 KB
Potential available high DOS
memory (open to the PCI bus).
Dependent on video adapter used.
640 K - 800 K
A0000 - C7FFF
160 KB
Video memory and BIOS
639 K - 640 K
9FC00 - 9FFFF
1 KB
Extended BIOS data (movable by
memory manager software)
512 K - 639 K
80000 - 9FBFF
127 KB
Extended conventional memory
0 K - 512 K
00000 - 7FFFF
512 KB
Conventional memory
39
Intel Desktop Board DG33FB Technical Product Specification
2.2
Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: Back panel
and front panel USB, PS/2, and VGA.
The other internal connectors/headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors/headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
This section describes the board’s connectors and headers. The connectors and
headers can be divided into these groups:
•
•
40
Back panel I/O connectors (see page 41)
Component-side connectors and headers (see page 42)
Technical Reference
2.2.1
Back Panel Connectors
Figure 9 shows the locations of the back panel connectors.
Item
Description
A
B
C
D
E
F
G
H
I
J
K
PS/2 mouse port
PS/2 keyboard port
VGA port
IEEE 1394a port
USB ports [2]
USB ports [2]
LAN
USB ports [2]
Line in
Mic in
Line out
Figure 9. Back Panel Connectors
41
Intel Desktop Board DG33FB Technical Product Specification
2.2.2
Component-side Connectors and Headers
Figure 10 shows the locations of the component-side connectors and headers.
Figure 10. Component-side Connectors and Headers
42
Technical Reference
Table 10 lists the component-side connectors and headers identified in Figure 10.
Table 10. Component-side Connectors and Headers Shown in Figure 10
Item/callout
from Figure 10
A
Description
PCI Conventional bus add-in card connector
B
Auxiliary rear chassis fan header
C
PCI Express x1 connector
D
PCI Express x1 connector
E
PCI Conventional bus add-in card connector
F
Front panel audio header
G
PCI Conventional bus add-in card connector
H
PCI Express x1 connector
I
PCI Express x16 connector
J
Processor core power connector (2 X 2)
K
Rear chassis fan header
L
Processor fan header
M
Serial port header
N
Main power connector (2 X 12)
O
Diskette drive connector
P
Chassis intrusion header
Q
Front chassis fan header
R
Auxiliary front panel power LED header
S
Front panel header
T
Serial ATA connectors [4]
U
Parallel ATA IDE connector
V
Front panel USB header
W
Front panel USB header
X
Front panel USB header
Y
IEEE 1394a header
43
Intel Desktop Board DG33FB Technical Product Specification
2.2.2.1
Signal Tables for the Connectors and Headers
Table 11. Serial ATA Connectors
Pin
Signal Name
1
Ground
2
TXP
3
TXN
4
Ground
5
RXN
6
RXP
7
Ground
Table 12. Chassis Intrusion Header
Pin
Signal Name
1
Intruder
2
Ground
Table 13. Serial Port Header
Pin
Signal Name
Pin
Signal Name
1
DCD
2
RXD#
3
TXD#
4
DTR
5
Ground
6
DSR
7
RTS
8
CTS
9
RI
10
Key (no pin)
Table 14. Front and Rear Chassis Fan Headers
Pin
Signal Name
1
Control
2
+12 V
3
Tach
Table 15. Processor Fan Header
44
Pin
Signal Name
1
Ground
2
+12 V
3
FAN_TACH
4
FAN_CONTROL
Technical Reference
Table 16. Front Panel Audio Header
Pin
Signal Name
Pin
Signal Name
1
[Port 1] Left channel
2
Ground
3
[Port 1] Right channel
4
PRESENCE# (Dongle present)
5
[Port 2] Right channel
6
[Port 1] SENSE_RETURN
7
SENSE_SEND (Jack detection)
8
Key (no pin)
9
[Port 2] Left channel
10
[Port 2] SENSE_RETURN
2.2.2.2
Add-in Card Connectors
The board has the following add-in card connectors:
•
•
•
One PCI Express x16 connector supporting simultaneous transfer speeds up to
4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent
bandwidth.
PCI Express x1: three PCI Express x1 connectors. The x1 interface supports
simultaneous transfer speeds up to 250 Mbytes/sec of peak bandwidth per
direction and up to 500 MBytes/sec concurrent bandwidth.
PCI Conventional (rev 2.3 compliant) bus: three PCI Conventional bus add-in card
connectors. The SMBus is routed to all PCI Conventional bus connectors. PCI
Conventional bus add-in cards with SMBus support can access sensor data and
other information residing on the board.
Note the following considerations for the PCI Conventional bus connectors:
•
•
All of the PCI Conventional bus connectors are bus master capable.
SMBus signals are routed to all PCI Conventional bus connectors. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the
board. The specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
⎯ The SMBus data line is connected to pin A41.
2.2.2.3
Auxiliary Front Panel Power/Sleep LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 17. Auxiliary Front Panel Power/Sleep LED Header
Pin
Signal Name
In/Out
Description
1
HDR_BLNK_GRN
Out
Front panel green LED
2
Not connected
3
HDR_BLNK_YEL
Out
Front panel yellow LED
45
Intel Desktop Board DG33FB Technical Product Specification
2.2.2.4
Power Supply Connectors
The board has the following power supply connectors:
•
•
Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24
unconnected.
Processor core power – a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
Table 18. Processor Core Power Connector
Pin
Signal Name
Pin
Signal Name
1
Ground
2
Ground
3
+12 V
4
+12 V
Table 19. Main Power Connector
Pin
Signal Name
Pin
Signal Name
1
+3.3 V
13
+3.3 V
2
+3.3 V
14
-12 V
3
Ground
15
Ground
4
+5 V
16
PS-ON# (power supply remote on/off)
5
Ground
17
Ground
6
+5 V
18
Ground
7
Ground
19
Ground
8
PWRGD (Power Good)
20
No connect
9
+5 V (Standby)
21
+5 V
10
+12 V
22
11
+12 V (Note)
23
+5 V
+5 V (Note)
12
2 x 12 connector detect (Note)
24
Ground (Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
46
For information about
Refer to
Power supply considerations
Section 2.5.1, page 52
Technical Reference
2.2.2.5
Front Panel Header
This section describes the functions of the front panel header. Table 20 lists the signal
names of the front panel header. Figure 11 is a connection diagram for the front panel
header.
Table 20. Front Panel Header
Pin
In/
Out
Signal
Description
Pin
In/
Out
Signal
Hard Drive Activity LED
Description
Power LED
1
HD_PWR
Out
Hard disk LED pull-up
to +5 V
2
HDR_BLNK_
GRN
Out
Front panel green
LED
3
HDA#
Out
Hard disk active LED
4
HDR_BLNK_
YEL
Out
Front panel yellow
LED
Reset Switch
5
Ground
7
FP_RESET#
In
On/Off Switch
Ground
6
FPBUT_IN
Reset switch
8
Ground
Power
9
+5 V
In
Power switch
Ground
Not Connected
Power
10
N/C
Not connected
Figure 11. Connection Diagram for Front Panel Header
2.2.2.5.1
Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
•
•
A Serial ATA hard drive connected to an onboard Serial ATA connector
A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector
47
Intel Desktop Board DG33FB Technical Product Specification
2.2.2.5.2
Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.5.3
Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 21 shows the
possible states for a one-color LED. Table 22 shows the possible states for a two-color
LED.
Table 21. States for a One-Color Power LED
LED State
Description
Off
Power off/sleeping
Steady Green
Running
Table 22. States for a Two-Color Power LED
LED State
Description
Off
Power off
Steady Green
Running
Steady Yellow
Sleeping
NOTE
The colors listed in Table 21 and Table 22 are suggested colors only. Actual LED
colors are chassis-specific.
2.2.2.5.4
Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
2.2.2.6
Auxiliary Front Panel Power LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 23. Auxiliary Front Panel Power LED Header
48
Pin
Signal Name
In/Out
Description
1
HDR_BLNK_GRN
Out
Front panel green LED
2
Not connected
3
HDR_BLNK_YEL
Out
Front panel yellow LED
Technical Reference
2.2.2.7
Front Panel USB Headers
Figure 12 is a connection diagram for the front panel USB headers.
#
INTEGRATOR’S NOTES
•
•
The +5 V DC power on the front panel USB headers is fused.
Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 12. Connection Diagram for Front Panel USB Headers
49
Intel Desktop Board DG33FB Technical Product Specification
2.3
Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 13 shows the location of the jumper block. The jumper determines the BIOS
Setup program’s mode. Table 24 lists the jumper settings for the three modes:
normal, configure, and recovery. When the jumper is set to configure mode and the
computer is powered-up, the BIOS compares the processor version and the microcode
version in the BIOS and reports if the two match.
Figure 13. Location of the Jumper Block
Table 24. BIOS Setup Configuration Jumper Settings
Function/Mode
Jumper Setting
Configuration
Normal
1-2
The BIOS uses current configuration information and
passwords for booting.
3 2 1
Configure
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
2-3
3 2 1
Recovery
None
3 2 1
50
The BIOS attempts to recover the BIOS configuration. See
Section 3.7 for more information on BIOS recovery.
Technical Reference
2.4
2.4.1
Mechanical Considerations
Form Factor
The board is designed to fit into an ATX-form-factor chassis. Figure 14 illustrates the
mechanical form factor of the board. Dimensions are given in inches [millimeters].
The outer dimensions are 11.60 inches by 9.60 inches [292 millimeters by 241
millimeters]. Location of the I/O connectors and mounting holes are in compliance
with the ATX specification.
Figure 14. Board Dimensions
51
Intel Desktop Board DG33FB Technical Product Specification
2.5
Electrical Considerations
2.5.1
Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a system consisting of a supported 65 W processor (see Section 1.4
on page 15 for a list of supported processors), 1 GB DDR2 RAM, one hard disk drive,
one optical drive, and all board peripherals enabled, the minimum recommended
power supply is 300 W. Table 25 lists the recommended power supply current values.
Table 25. Recommended Power Supply Current Values
52
Output Voltage
3.3 V
5V
12 V1
12 V2
-12 V
5 VSB
Current
15 A
15 A
10 A
10 A
0.3 A
3.0 A
For information about
Refer to
Selecting an appropriate power supply
http://support.intel.com/support/motherboards/desktop/s
b/CS-026472.htm
Technical Reference
2.5.2
Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 26 lists the current capability of the fan headers.
Table 26. Fan Header Current Capability
Fan Header
Maximum Available Current
Processor fan
2.0 A
Front chassis fan
1.5 A
Rear chassis fan
1.5 A
Auxiliary fan
2.0 A
2.5.3
Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (all six
expansion slots and the PCI Express x16 connector filled) must not exceed 14 A.
53
Intel Desktop Board DG33FB Technical Product Specification
2.6
Thermal Considerations
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 15) can reach a temperature of up to 85 oC in
an open chassis.
54
Technical Reference
Figure 15 shows the locations of the localized high temperature zones.
Item
Description
A
B
C
D
Processor voltage regulator area
Processor
Intel 82G33 GMCH
Intel 82801IH (ICH9DH)
Figure 15. Localized High Temperature Zones
55
Intel Desktop Board DG33FB Technical Product Specification
Table 27 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 27. Thermal Considerations for Components
2.7
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel 82G33 GMCH
97 oC (under bias)
Intel 82801IH (ICH9DH)
92 oC (under bias)
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 15
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG33FB
MTBF is 134,638 hours.
56
Technical Reference
2.8
Environmental
Table 28 lists the environmental specifications for the board.
Table 28. Desktop Board DG33FB Environmental Specifications
Parameter
Specification
Temperature
Non-Operating
-40 °C to +70 °C
Operating
0 °C to +55 °C
Shock
Unpackaged
50 g trapezoidal waveform
Packaged
Half sine 2 millisecond
Velocity change of 170 inches/second²
Product weight (pounds)
Free fall (inches)
Velocity change
(inches/sec²)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged
10 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
57
Intel Desktop Board DG33FB Technical Product Specification
58
3
Overview of BIOS Features
What This Chapter Contains
3.1 Introduction ...................................................................................
3.2 BIOS Flash Memory Organization .......................................................
3.3 Resource Configuration ....................................................................
3.4 System Management BIOS (SMBIOS).................................................
3.5 Legacy USB Support ........................................................................
3.6 BIOS Updates .................................................................................
3.7 BIOS Recovery................................................................................
3.8 Boot Options...................................................................................
3.9 Adjusting Boot Speed.......................................................................
3.10 BIOS Security Features ....................................................................
3.1
59
60
60
61
62
63
64
65
66
67
Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug
and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as DPP3510A.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main
Advanced
Security
Power
Boot
Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 50 shows how to put the board in configure mode.
59
Intel Desktop Board DG33FB Technical Product Specification
Table 29 lists the BIOS Setup program menu features.
Table 29. BIOS Setup Program Menu Bar
Maintenance
Main
Advanced
Security
Power
Boot
Exit
Clears
Displays
Configures
Sets
Configures
Selects boot
Saves or
passwords and
processor
advanced
passwords
power
options
discards
displays
and memory
features
and security
management
changes to
processor
configuration
available
features
features and
Setup
through the
power supply
program
chipset
controls
options
information
Table 30 lists the function keys available for menu screens.
Table 30. BIOS Setup Program Function Keys
BIOS Setup Program
Function Key
Description
<←> or <→>
Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓>
Selects an item (Moves the cursor up or down)
<Tab>
Selects a field (Not implemented)
<Enter>
Executes command or selects the submenu
<F9>
Load the default configuration values for the current menu
<F10>
Save the current values and exits the BIOS Setup program
<Esc>
Exits the menu
3.2
BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes an 8 Mbit (1024 KB)
flash memory device.
3.3
3.3.1
Resource Configuration
PCI* Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.
60
Overview of BIOS Features
3.3.2
PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the
PCI IDE connector with independent I/O channel support. The IDE interface supports
hard drives up to ATA-66/100/133 and recognizes any ATAPI compliant devices,
including CD-ROM drives, tape drives, and Ultra DMA drives. The BIOS determines the
capabilities of each drive and configures them to optimize capacity and performance.
To take advantage of the high capacities typically available today, hard drives are
automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4,
depending on the capability of the drive. You can override the auto-configuration
options by specifying manual configuration in the BIOS Setup program.
To use ATA-66/100/133 features the following items are required:
•
•
•
An ATA-66/100/133 peripheral device
An ATA-66/100/133 compatible cable
ATA-66/100/133 operating system device drivers
NOTE
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master
device. For example, do not connect an ATA hard drive as a slave to an ATAPI
CD-ROM drive.
3.4
System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
•
•
•
•
BIOS data, such as the BIOS revision level
Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
61
Intel Desktop Board DG33FB Technical Product Specification
3.5
Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.
62
Overview of BIOS Features
3.6
BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
•
•
Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.
For information about
Refer to
BIOS update utilities
http://support.intel.com/support/motherboards/desktop/s
b/CS-022312.htm
3.6.1
Language Support
The BIOS Setup program and help messages are supported in US English. Additional
languages are available in the Integrator’s Toolkit utility. Check the Intel website for
details.
63
Intel Desktop Board DG33FB Technical Product Specification
3.6.2
Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel® Integrator Toolkit that is
available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about
Refer to
Intel Integrator Toolkit
http://developer.intel.com/design/motherbd/software/itk/
Additional Intel software tools
http://developer.intel.com/products/motherboard/dg965wh/tools.htm
and
http://developer.intel.com/design/motherbd/software.htm
3.7
BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 31 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 31. Acceptable Drives/Media Types for BIOS Recovery
64
Media Type
Can be used for BIOS recovery?
CD-ROM drive connected to the Parallel ATA interface
Yes
CD-ROM drive connected to the Serial ATA interface
Yes
USB removable drive (a USB flash drive, for example)
Yes
USB diskette drive (with a 1.44 MB diskette)
No
USB hard disk drive
No
Legacy diskette drive (with a 1.44 MB diskette) connected to the
legacy diskette drive interface
No
For information about
Refer to
BIOS recovery
http://support.intel.com/support/motherboards/desktop
Overview of BIOS Features
3.8
Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard
drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for
the diskette drive to be the first boot device, the hard drive second, and the ATAPI
CD-ROM third. The fourth device is disabled.
3.8.1
CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM
format specification. Under the Boot menu in the BIOS Setup program, ATAPI CDROM is listed as a boot device. Boot devices are defined in priority order. Accordingly,
if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot
from the next defined drive.
3.8.2
Network Boot
The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.8.3
Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
•
•
•
Video adapter
Keyboard
Mouse
3.8.4
Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices (as set in the BIOS setup program’s
Boot Device Priority Submenu). Table 32 lists the boot device menu options.
Table 32. Boot Device Menu Options
Boot Device Menu Function Keys
Description
<↑> or <↓>
Selects a default boot device
<Enter>
Exits the menu, saves changes, and boots from the selected
device
<Esc>
Exits the menu without saving changes
65
Intel Desktop Board DG33FB Technical Product Specification
3.9
Adjusting Boot Speed
These factors affect system boot speed:
•
•
Selecting and configuring peripherals properly
Optimized BIOS boot parameters
3.9.1
Peripheral Selection and Configuration
The following techniques help improve system boot speed:
•
•
•
•
Choose a hard drive with parameters such as “power-up to data ready” less than
eight seconds, that minimize hard drive startup delays.
Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
3.9.2
BIOS Boot Optimizations
Use of the following BIOS Setup program settings reduces the POST execution time.
•
•
In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced
Menu in the Drive Configuration Submenu of the BIOS Setup program).
66
Overview of BIOS Features
3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
•
•
•
•
•
•
•
The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
For enhanced security, use different passwords for the supervisor and user
passwords.
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 33 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 33. Supervisor and User Password Functions
Setup Options
Password
to Enter
Setup
Password
During
Boot
None
None
None
Can change a
Supervisor Password
limited number
of options
Supervisor
None
N/A
Can change all
options
User
User
Can change all
options
Can change a
Supervisor Password
limited number Enter Password
of options
Supervisor or
user
Supervisor or
user
Password
Set
Supervisor
Mode
User Mode
Neither
Can change all
options (Note)
Can change all
options (Note)
Supervisor
only
Can change all
options
User only
Supervisor
and user set
Note:
Enter Password
Clear User Password
If no password is set, any user can change all Setup options.
67
Intel Desktop Board DG33FB Technical Product Specification
68
4
Error Messages and Beep Codes
What This Chapter Contains
4.1
4.2
4.3
4.4
4.1
Speaker ......................................................................................... 69
BIOS Beep Codes ............................................................................ 69
BIOS Error Messages ....................................................................... 69
Port 80h POST Codes ....................................................................... 70
Speaker
The board-mounted speaker provides audible error code (beep code) information
during POST.
4.2
For information about
Refer to
The location of the onboard speaker
Figure 1, page 12
BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS displays an error
message describing the problem (see Table 34).
Table 34. Beep Codes
Type
Pattern
Frequency
Memory error
Three long beeps
1280 Hz
Four alternating beeps:
High tone: 2000 Hz
High tone, low tone, high tone, low tone
Low tone: 1600 Hz
Thermal warning
4.3
BIOS Error Messages
Table 35 lists the error messages and provides a brief description of each.
Table 35. BIOS Error Messages
Error Message
Explanation
CMOS Battery Low
The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad
The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased
Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available
System did not find a device to boot.
69
Intel Desktop Board DG33FB Technical Product Specification
4.4
Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the
BIOS:
•
•
•
Table 36 lists the Port 80h POST code ranges
Table 37 lists the Port 80h POST codes themselves
Table 38 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 36. Port 80h POST Code Ranges
Range
Category/Subsystem
00 – 0F
Debug codes: Can be used by any PEIM/driver for debug.
10 – 1F
Host Processors: 1F is an unrecoverable CPU error.
20 – 2F
Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 – 3F
Recovery: 3F indicated recovery failure.
40 – 4F
Reserved for future use.
50 – 5F
I/O Busses: PCI, USB, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 – 6F
Reserved for future use (for new busses).
70 – 7F
Output Devices: All output consoles. 7F is an unrecoverable error.
80 – 8F
Reserved for future use (new output console codes).
90 – 9F
Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 – AF
Reserved for future use (new input console codes).
B0 – BF
Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 – CF
Reserved for future use.
D0 – DF
Boot device selection.
E0 – FF
E0 – EE: Miscellaneous codes. See Table 37.
EF: boot/S3 resume failure.
F0 – FF: FF processor exception.
70
Error Messages and Beep Codes
Table 37. Port 80h POST Codes
POST Code
Description of POST Operation
Host Processor
10
Power-on initialization of the host processor (Boot Strap Processor)
11
Host processor Cache initialization (including APs)
12
Starting Application processor initialization
13
SMM initialization
21
Initializing a chipset component
Chipset
Memory
22
Reading SPD from memory DIMMs
23
Detecting presence of memory DIMMs
24
Programming timing parameters in the memory controller and the DIMMs
25
Configuring memory
26
Optimizing memory settings
27
Initializing memory, such as ECC init
28
Testing memory
50
Enumerating PCI busses
51
Allocating resources to PCI bus
PCI Bus
52
Hot Plug PCI controller initialization
53 – 57
Reserved for PCI Bus
USB
58
Resetting USB bus
59
Reserved for USB
ATA/ATAPI/SATA
5A
Resetting PATA/SATA bus and all devices
5B
Reserved for ATA
SMBus
5C
Resetting SMBus
5D
Reserved for SMBus
Local Console
70
Resetting the VGA controller
71
Disabling the VGA controller
72
Enabling the VGA controller
Remote Console
78
Resetting the console controller
79
Disabling the console controller
7A
Enabling the console controller
continued
71
Intel Desktop Board DG33FB Technical Product Specification
Table 37. Port 80h POST Codes (continued)
POST Code
Description of POST Operation
Keyboard (PS/2 or USB)
90
Resetting keyboard
91
Disabling keyboard
92
Detecting presence of keyboard
93
Enabling the keyboard
94
Clearing keyboard input buffer
95
Instructing keyboard controller to run Self Test (PS/2 only)
Mouse (PS/2 or USB)
98
Resetting mouse
99
Disabling mouse
9A
Detecting presence of mouse
9B
Enabling mouse
Fixed Media
B0
Resetting fixed media
B1
Disabling fixed media
B2
Detecting presence of a fixed media (IDE hard drive detection etc.)
B3
Enabling/configuring a fixed media
Removable Media
B8
Resetting removable media
B9
Disabling removable media
BA
Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC
Enabling/configuring a removable media
Dy
Trying boot selection y (y=0 to 15)
BDS
PEI Core
E0
Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2
Permanent memory found
E1, E3
Reserved for PEI/PEIMs
DXE Core
E4
Entered DXE phase
E5
Started dispatching drivers
E6
Started connecting drivers
continued
72
Error Messages and Beep Codes
Table 37. Port 80h POST Codes (continued)
POST Code
Description of POST Operation
DXE Drivers
E7
Waiting for user input
E8
Checking password
E9
Entering BIOS setup
EB
Calling Legacy Option ROMs
F4
Entering Sleep state
F5
Exiting Sleep state
F8
EFI boot service ExitBootServices ( ) has been called
F9
EFI runtime service SetVirtualAddressMap ( ) has been called
FA
EFI runtime service ResetSystem ( ) has been called
30
Crisis Recovery has initiated per User request
31
Crisis Recovery has initiated by software (corrupt flash)
34
Loading recovery capsule
35
Handing off control to the recovery capsule
3F
Unable to recover
Runtime Phase/EFI OS Boot
PEIMs/Recovery
73
Intel Desktop Board DG33FB Technical Product Specification
Table 38. Typical Port 80h POST Sequence
74
POST Code
Description
21
Initializing a chipset component
22
Reading SPD from memory DIMMs
23
Detecting presence of memory DIMMs
25
Configuring memory
28
Testing memory
34
Loading recovery capsule
E4
Entered DXE phase
12
Starting application processor initialization
13
SMM initialization
50
Enumerating PCI busses
51
Allocating resourced to PCI bus
92
Detecting the presence of the keyboard
90
Resetting keyboard
94
Clearing keyboard input buffer
95
Keyboard Self Test
EB
Calling Video BIOS
58
Resetting USB bus
5A
Resetting PATA/SATA bus and all devices
92
Detecting the presence of the keyboard
90
Resetting keyboard
94
Clearing keyboard input buffer
5A
Resetting PATA/SATA bus and all devices
28
Testing memory
90
Resetting keyboard
94
Clearing keyboard input buffer
E7
Waiting for user input
01
INT 19
00
Ready to boot
5
Regulatory Compliance and Battery
Disposal Information
What This Chapter Contains
5.1 Regulatory Compliance..................................................................... 75
5.2 Battery Disposal Information............................................................. 85
5.1
Regulatory Compliance
This section contains the following regulatory compliance information for Desktop
Board DG33FB:
•
•
•
•
•
5.1.1
Safety standards
European Union Declaration of Conformity statement
Product Ecology statements
Electromagnetic Compatibility (EMC) standards
Product certification markings
Safety Standards
Desktop Board DG33FB complies with the safety standards stated in Table 39 when
correctly installed in a compatible host system.
Table 39. Safety Standards
Standard
Title
UL 60950-1, First Edition
Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1:2006, Second
Edition
Information Technology Equipment – Safety - Part 1: General
Requirements (European Union)
IEC 60950-1:2005, Second
Edition
Information Technology Equipment – Safety - Part 1: General
Requirements (International)
75
Intel Desktop Board DG33FB Technical Product Specification
5.1.2
European Union Declaration of Conformity
Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel®
Desktop Board DG33FB is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and
2006/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC a
2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC & 2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC & 2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC
kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC & 2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC & 2006/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC και 2006/95/EC.
Magyar E termék megfelel a 2004/108/EC és 2006/95/EC Európai Irányelv
előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC & 2006/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC &
2006/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC un 2006/95/EC
noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC ir 2006/95/EC
nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC u 2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC & 2006/95/EC.
76
Regulatory Compliance and Battery Disposal Information
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC
& 2006/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC a 2006/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in
2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &
2006/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar.
77
Intel Desktop Board DG33FB Technical Product Specification
5.1.3
Product Ecology Statements
The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1
Disposal Considerations
This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2
Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作
恰当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del
programa, que incluye los productos que abarca, los lugares disponibles, instrucciones
de envío, términos y condiciones, etc.
78
Regulatory Compliance and Battery Disposal Information
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir
plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les
instructions d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/intel
/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butirbutir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia,
arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para
obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os
locais disponíveis, as instruções de envio, os termos e condições, etc.
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
79
Intel Desktop Board DG33FB Technical Product Specification
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology Web sayfasına gidin.
5.1.3.3
Lead Free Desktop Board
This Desktop Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six
materials. One of the six restricted materials is lead.
This Desktop Board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance
and/or reliability. This Desktop Board is referred to as “Lead-free second level
interconnect.” The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it
requires different product marking and controlled substance information. The required
mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as
the number of years for which controlled listed substances will not leak or chemically
deteriorate while in the product.
80
Regulatory Compliance and Battery Disposal Information
Table 40 shows the various forms of the “Lead-Free 2nd Level Interconnect” mark as it
appears on the board and accompanying collateral.
Table 40. Lead-Free Board Markings
Description
Mark
nd
Lead-Free 2 Level
Interconnect: This symbol is
used to identify electrical and
electronic assemblies and
components in which the lead
(Pb) concentration level in the
desktop board substrate and the
solder connections from the board
to the components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).
or
or
81
Intel Desktop Board DG33FB Technical Product Specification
5.1.4
EMC Regulations
Desktop Board DG33FB complies with the EMC regulations stated in Table 41 when
correctly installed in a compatible host system.
Table 41. EMC Regulations
82
Regulation
Title
FCC 47 CFR Part 15,
Subpart B
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Frequency Devices. (USA)
ICES-003 Issue 4
(Class B)
Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022: 2006
(Class B)
Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024:1998
Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022:2006
(Class B)
Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 222005
+A1:2005 +A2:2006
(Class B)
Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment. (International)
CISPR 24: 1997
+A1:2001 +A2:2002
Information Technology Equipment – Immunity Characteristics – Limits and
Methods of Measurement. (International)
VCCI V-3/2007.04,
V-4/2007.04, Class B
Voluntary Control for Interference by Information Technology Equipment.
(Japan)
Regulatory Compliance and Battery Disposal Information
Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.
Korean Class B statement translation: this is household equipment that is certified to
comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.
83
Intel Desktop Board DG33FB Technical Product Specification
5.1.5
Product Certification Markings (Board Level)
Desktop Board DG33FB has the product certification markings shown in Table 42:
Table 42. Product Certification Markings
Description
Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel desktop boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment. Includes
Intel name and DG33FB model designation.
CE mark. Declaring compliance to European Union (EU) EMC directive and
Low Voltage directive.
Australian Communications Authority (ACA) C-tick mark. Includes adjacent
Intel supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea MIC (Ministry of Information and Communication) mark.
Includes adjacent MIC certification number: CPU-DG33FB (B)
For information about MIC certification, go to
http://support.intel.com/support/motherboards/desktop/
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique
UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an
example of the symbol used on Intel Desktop Boards and associated
collateral. The color of the mark may vary depending upon the application.
The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has
been determined to be 10 years.
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V-0
Regulatory Compliance and Battery Disposal Information
5.2
Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
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Intel Desktop Board DG33FB Technical Product Specification
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYAZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
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Regulatory Compliance and Battery Disposal Information
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUTIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей
должна проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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Intel Desktop Board DG33FB Technical Product Specification
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