ESD5B5.0ST1G Transient Voltage Suppressor Bi−directional Micro−Packaged Diode for ESD Protection The ESD5B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size and bi−directional design, it is ideal for use in cellular phones, MP3 players, and portable applications that require audio line protection. http://onsemi.com Specification Features • • • • • • • • • Small Body Outline Dimensions: nom 0.063″ x 0.032″ (1.6x0.8 mm) Low Body Height: nom 0.024″ (0.6 mm) Reverse Working (Stand−off) Voltage: 5.0 V Peak Power up to 50 W @ 8 x 20 ms Pulse Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000−4−2 Level 4 ESD Protection This is a Pb−Free Device SOD−523 CASE 502 PLASTIC MARKING DIAGRAM B5 MG G Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic B5 M G Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any = Specific Device Code Date Code = Pb−Free Package (Note: Microdot may be in either location) QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements ORDERING INFORMATION MAXIMUM RATINGS Rating Value Unit Contact ±30 kV Per Human Body Model Per Machine Model 16 400 kV V IEC 61000−4−2 (ESD) ESD Voltage Symbol Peak Power (Figure 1) Per 8 x 20 ms Waveform Peak Power (Figure 2) Per 10 x 1000 ms Waveform PPK 50 10 W Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C °PD° 200 mW TJ, Tstg −55 to +150 °C TL 260 °C Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) Device Package Shipping † ESD5B5.0ST1G SOD−523 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 x 0.75 x 0.62 in. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 1 1 Publication Order Number: ESD5B5.0ST1/D ESD5B5.0ST1G ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) Symbol IPP Parameter IPP Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IT VC VBR VRWM IR IR VRWM VBR VC IT Working Peak Reverse Voltage IR V Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT IPP Test Current Bi−Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Device* ESD5B5.0ST1G VRWM (V) IR (mA) @ VRWM VBR (V) @ IT (Note 2) Max Max Min 5.0 1.0 5.8 IT C (pF) @ VR = 0 V, f = 1 MHz Max mA Typ 7.8 1.0 32 *Other voltages available upon request. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C. tr 90 PEAK VALUE − IPP tr ≤ 10 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IPP. I PP HALF VALUE − 2 80 70 60 50 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IPP. 100 VALUE (%) % OF PEAK PULSE CURRENT 100 40 PEAK VALUE − IPP HALF VALUE − I PP 2 50 30 tP 20 tP 10 0 0 0 20 40 60 80 0 t, TIME (ms) 1 2 3 4 t, TIME (ms) Figure 1. 8 x 20 ms Pulse Waveform Figure 2. 10 x 1000 ms Pulse Waveform Figure 3. Positive 8 kV Contact per IEC 6100−4−2 ESD5B5.0ST1G Figure 4. Negative 8 kV Contact per IEC 6100−4−2 ESD5B5.0ST1G http://onsemi.com 2 ESD5B5.0ST1G PACKAGE DIMENSIONS SOD−523 CASE 502−01 ISSUE B −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A −Y− B 1 2 D 2 PL 0.08 (0.003) M DIM A B C D J K S T X Y C MIN 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 INCHES NOM 0.047 0.032 0.024 0.012 0.0055 0.008 0.063 MAX 0.051 0.035 0.028 0.014 0.0079 0.010 0.067 −T− K J MILLIMETERS MIN NOM MAX 1.10 1.20 1.30 0.70 0.80 0.90 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 0.15 0.20 0.25 1.50 1.60 1.70 SEATING PLANE S SOLDERING FOOTPRINT* 1.40 0.0547 0.40 0.0157 0.40 0.0157 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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