ESD5Z2.5T1 SERIES Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection The ESD5Z Series is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. http://onsemi.com 1 Cathode Specification Features: 2 Anode • Small Body Outline Dimensions: • • • • • • • • 0.047″ x 0.032″ (1.20 mm x 0.80 mm) Low Body Height: 0.028″ (0.7 mm) Stand−off Voltage: 2.5 V − 7.0 V Peak Power up to 200 Watts @ 8 x 20 s Pulse Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000−4−2 Level 4 ESD Protection IEC61000−4−4 Level 4 EFT Protection 2 1 SOD−523 CASE 502 PLASTIC MARKING DIAGRAM Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic XXd 1 Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any 2 XX = Specific Device Code d = Date Code QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements ORDERING INFORMATION MAXIMUM RATINGS Rating Value Unit ±30 ±30 kV IEC 61000−4−4 (EFT) 40 A ESD Voltage 16 400 kV V 100 mW IEC 61000−4−2 (ESD) Symbol Air Contact Per Human Body Model Per Machine Model Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) °PD° TJ, Tstg −55 to +150 °C TL 260 °C Device ESD5ZxxxT1 Package Shipping† SOD−523 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 2 of this data sheet. Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in. Semiconductor Components Industries, LLC, 2004 November, 2004 − Rev. 0 1 Publication Order Number: ESD5Z2.5T1/D ESD5Z2.5T1 SERIES ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) Symbol IF Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR V IR VF IT Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF Ppk Peak Power Dissipation C VC VBR VRWM Working Peak Reverse Voltage IPP Uni−Directional TVS Max. Capacitance @VR = 0 and f = 1 MHz ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Device** Device Marking VRWM (V) IR (A) @ VRWM VBR (V) @ IT (Note 2) IT VC (V) @ IPP = 5.0 A* VC (V) @ Max IPP* IPP (A)* Ppk (W)* C (pF) Max Max Min mA Typ Max Max Max Typ 6.5 10.9 11.0 120 145 ESD5Z2.5T1 ZD 2.5 6.0 4.0 1.0 ESD5Z3.3T1 ZE 3.3 0.05 5.0 1.0 8.4 14.1 11.2 158 105 ESD5Z5.0T1 ZF 5.0 0.05 6.2 1.0 11.6 18.6 9.4 174 80 ESD5Z6.0T1 ZG 6.0 0.01 6.8 1.0 12.4 20.5 8.8 181 70 ESD5Z7.0T1 ZH 7.0 0.01 7.5 1.0 13.5 22.7 8.8 200 65 **Other voltages available upon request. *Surge current waveform per Figure 1. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C. % OF PEAK PULSE CURRENT 100 tr 90 PEAK VALUE IRSM @ 8 s PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 s 80 70 60 HALF VALUE IRSM/2 @ 20 s 50 40 30 tP 20 10 0 0 20 40 60 t, TIME (s) Figure 1. 8 x 20 s Pulse Waveform http://onsemi.com 2 80 ESD5Z2.5T1 SERIES PACKAGE DIMENSIONS SOD−523 CASE 502−01 ISSUE A −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A −Y− B 1 2 D 2 PL 0.08 (0.003) M DIM A B C D J K S T X Y C K J S −T− SEATING PLANE SOLDERING FOOTPRINT 1.40 0.0547 0.40 0.0157 0.40 0.0157 SCALE 10:1 http://onsemi.com 3 mm inches MILLIMETERS MIN NOM MAX 1.10 1.20 1.30 0.70 0.80 0.90 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 0.15 0.20 0.25 1.50 1.60 1.70 MIN 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 INCHES NOM 0.047 0.032 0.024 0.012 0.0055 0.008 0.063 MAX 0.051 0.035 0.028 0.014 0.0079 0.010 0.067 ESD5Z2.5T1 SERIES ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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