FAIRCHILD FAN8010MP

www.fairchildsemi.com
FAN8010MP
1 Channel DC Motor Driver
Features
Description
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The FAN8010MP is designed for Mobile camera, Digital still camera, and portable equipment.
Current mode control
High output current(Iomax 0.6A)
Low saturation voltage(0.3V typ)
Low voltage operation(2~6.5V)
Very low standby current( < 1uA)
Leadless miniature package(3*3*1mm3).
Selectable output current level
Available saturation mode control
Built in brake function.
Built in TSD
Typical Applications
• General DC Motor
• Digital Still Camera
• Moblie Camera
10MLP3X3
Ordering Information
Device
Package
Operating Temp.
FAN8010MPX
10MLP3X3
-30×C ~ +80×C
Rev.1.0.2
©2005 Fairchild Semiconductor Corporation
FAN8010MP
Pin Asignments
1
ADJ
2
FC
3
OUT1
4
GND
5
FAN8010MP
IN1
10
IN2
9
VCC
8
VM
7
OUT2
6
Sense
Pin Definitions
2
Pin Number
Pin Name
I/O
Pin Function Description
Remark
1
IN 1
I
Logic Input 1
-
2
ADJ
A
Output Current Adjust
-
3
FC
A
Compensation Capacitor
-
4
OUT1
A
Motor Ouput1
-
5
GND
P
Ground
-
6
SENSE
A
Motor Current Sensing
-
7
OUT2
A
Motor Output2
-
8
VM
P
Power Supply For Output Stage
-
9
VCC
P
Power Supply For Signal Block
-
10
IN 2
I
Logic Input 2
-
FAN8010MP
Internal Block Diagram
VM
1
10
IN1
IN2
Forward
Input
Stage
8
Reverse
Brake
OUT1
Stand-by
OUT2
4
7
TSD
9
5
2
VCC
SENSE
Reference
GND
ADJ
FC
6
3
R1
R2
3
FAN8010MP
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Value
Unit
Maximum Power Supply Voltage
VMMAX
7.5
V
Maximum Power Supply VoNtage
VCCMAX
7.5
V
Maximum Power Supply Current
IOMAX
600
mA
VINMAX
7.5
V
Maximum Output Sustain Voltage
VOUTMAX
8.5
V
Maximum Power Dissipation
PdMAXNote1
0.7 / 2.5
W
Operating Temperature
TOPR
−30 ~ +80
°C
Storage Temperature
TSTG
−55 ~ +150
°C
Maximum Logic Input Voltage
Note :
Case 1
Remark
Case 2
Power
plane(Cu)
Pd is measured
base on the JEDEC/STD(JESD
51-2)
GND
plane(Cu)
PCB(glass-epoxy)
Via
Pd=0.7W
Pd=2.5W
1. Refer: EIA/JESD 51-2 & EIA/JESD 51-3 & EIA/JESD 51-5 & EIA/JESD 51-7
2. Case 1: Single layer PCB with 1 signal plane only, PCB size 76mm × 114mm × 1.6mm.
3. Case 2: Multi layer PCB with 1 signal, 1 power and 1 ground planes, PCB size 76mm × 114mm × 1.6mm, Cu plane sizes for
power and ground 74mm × 74mm × 0.035mm, thermal via hole pitch 0.9mm, via hole φ size 0.3mm, 6 via hole.
4. Should not exceed PD or ASO value.
Power Dissipation Curve
Pd [mW]
3,000
case2
2,000
SOA
case1
1,000
0
0
25
50
75
100
125
150
175
Ambient Temperature, Ta [°C]
Recommended Operating Conditions (Ta = 25°C)
Parameter
4
Symbol
Min.
Typ.
Max.
Unit
Supply Voltage For Signal Block
VCC
2.2
-
6.5
V
Supply Voltage For Power Stage
VM
2.2
-
6.5
V
FAN8010MP
Equivalent Circuit
IN1/IN2
ADJ
VCC
VCC
Reference
40K
1
70K
10
2
80K
FC
7K
OUT1/OUT2
VM
VCC
4
6
3
5
FAN8010MP
Electrical Characteristics
(Ta= 25°C, VCC=3.3V, VM=3.3V unless otherwise specified)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
COMMON BLOCK
Standby Current
ISTB
VCC=7.5V, IN1=IN2=L
-
-
1.0
µA
Operating Current1
ICC1
IN1=H or IN2 =H
-
6
11
mA
Operating Current2
ICC2
IN1=IN2=H
-
16
25
mA
LOGIC INPUTS
Logic Input High Level Voltage
VH
1.8
-
VCC
V
Logic Input Low Level Voltage
VL
-0.3
-
0.4
V
Logic Input Current
IH
-
60
90
µA
0.19
0.2
0.21
V
180
200
220
mA
-
0.3
0.45
V
VH=5.0V, IN1=H or IN2=H
OUTPUT STAGE
Current Command
Output Current
Output Saturation Voltage
(PNP+NPN)
6
VADJ
IO
VSAT
RS=1.0Ω
IO=200mA
FAN8010MP
Typical Application Circuits
Constant Current Driver
Supply
1
10
2
IN1
VM
VCC
8
OUT1
4
9
CS
IN2
ADJ
M
FAN8010MP
ROPT
3
FC
5
GND
OUT2
7
SENSE
6
CFC
Rs
Normal H-Bridge Driver
Supply
1
10
2
IN1
VM
VCC
8
OUT1
4
9
CS
IN2
ADJ
M
FAN8010MP
3
FC
5
GND
OUT2
7
SENSE
6
7
FAN8010MP
Application Informations
1. Logic Inputs and Outputs
FAN8010MP has two input pins, IN1and IN2. The following truth table shows the relationship of the inputs and outputs.
IN1
IN2
OUT1
OUT2
Remark
L
L
Z
Z
Standby
H
L
H
L
Rotation
L
H
L
H
Rotation
H
H
H
H
Brake
2. Constant Output Current Control
The voltage, VADJ pin is 0.2V typically which is obtained by a internal reference and a resistor divider as shown in
the figure. The VADJ is used as the output current command and can be adjusted by the external resistor ROPT
between ADJ and GND. The output current is converted to the voltage VS through the current sense resistor RS.
By the negative feedback loop, the VS is regulated to VADJ. Actually 50mW, which is the sum of the internal bonding resistance and internal metal resistance, should be added to the RS. The output current is calculated
as followings ;
I O = ( V ADJ ) ⁄ ( R S + R W ) = 1.38 ( R OPT || 7K ) ⁄ { ( 40K + R OPT || 7K ) ( R S + R W )}
VM
Reference
1.38V
ADJ
ROPT
OUT1
40K
M
H-BRIDGE
7K
OUT2
IN1~2
Rw
FC
Vs
Sense
Rs
If oscillation or overshoot get loaded on the output current, they can be removed by connecting a ceramic capacitor
ranged from 1nF to 10nF between the FC pin and GND. When a capacitor is used, output response time is delayed
as the capacitance increases.
3. Unregulated Voltage Control
When the exact current control is not needed, the sense pin should be connected to the GND, and FAN8010MP is
operated as a normal H-bridge driver.
4. Thermal Shutdown
Thermal Shutdown Circuit turns OFF all outputs when the junction temperature typically reaches 175°C. It is
intended to protect the device from failures due to excessive junction temperature.
The Thermal Shutdown has the hysteresis of 25°C approximately.
8
FAN8010MP
9
FAN8010MP
Test Circuits
10
1
IN1
2
ADJ
3
FC
4
OUT1
5
GND
FAN8010MP
IN2
10
VCC
9
VM
8
OUT2
7
SENSE
6
FAN8010MP
Package Dimensions (Unit: mm)
11
FAN8010MP
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER
DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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© 2005 Fairchild Semiconductor Corporation