www.fairchildsemi.com FAN8010MP 1 Channel DC Motor Driver Features Description • • • • • • • • • • The FAN8010MP is designed for Mobile camera, Digital still camera, and portable equipment. Current mode control High output current(Iomax 0.6A) Low saturation voltage(0.3V typ) Low voltage operation(2~6.5V) Very low standby current( < 1uA) Leadless miniature package(3*3*1mm3). Selectable output current level Available saturation mode control Built in brake function. Built in TSD Typical Applications • General DC Motor • Digital Still Camera • Moblie Camera 10MLP3X3 Ordering Information Device Package Operating Temp. FAN8010MPX 10MLP3X3 -30×C ~ +80×C Rev.1.0.2 ©2005 Fairchild Semiconductor Corporation FAN8010MP Pin Asignments 1 ADJ 2 FC 3 OUT1 4 GND 5 FAN8010MP IN1 10 IN2 9 VCC 8 VM 7 OUT2 6 Sense Pin Definitions 2 Pin Number Pin Name I/O Pin Function Description Remark 1 IN 1 I Logic Input 1 - 2 ADJ A Output Current Adjust - 3 FC A Compensation Capacitor - 4 OUT1 A Motor Ouput1 - 5 GND P Ground - 6 SENSE A Motor Current Sensing - 7 OUT2 A Motor Output2 - 8 VM P Power Supply For Output Stage - 9 VCC P Power Supply For Signal Block - 10 IN 2 I Logic Input 2 - FAN8010MP Internal Block Diagram VM 1 10 IN1 IN2 Forward Input Stage 8 Reverse Brake OUT1 Stand-by OUT2 4 7 TSD 9 5 2 VCC SENSE Reference GND ADJ FC 6 3 R1 R2 3 FAN8010MP Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Value Unit Maximum Power Supply Voltage VMMAX 7.5 V Maximum Power Supply VoNtage VCCMAX 7.5 V Maximum Power Supply Current IOMAX 600 mA VINMAX 7.5 V Maximum Output Sustain Voltage VOUTMAX 8.5 V Maximum Power Dissipation PdMAXNote1 0.7 / 2.5 W Operating Temperature TOPR −30 ~ +80 °C Storage Temperature TSTG −55 ~ +150 °C Maximum Logic Input Voltage Note : Case 1 Remark Case 2 Power plane(Cu) Pd is measured base on the JEDEC/STD(JESD 51-2) GND plane(Cu) PCB(glass-epoxy) Via Pd=0.7W Pd=2.5W 1. Refer: EIA/JESD 51-2 & EIA/JESD 51-3 & EIA/JESD 51-5 & EIA/JESD 51-7 2. Case 1: Single layer PCB with 1 signal plane only, PCB size 76mm × 114mm × 1.6mm. 3. Case 2: Multi layer PCB with 1 signal, 1 power and 1 ground planes, PCB size 76mm × 114mm × 1.6mm, Cu plane sizes for power and ground 74mm × 74mm × 0.035mm, thermal via hole pitch 0.9mm, via hole φ size 0.3mm, 6 via hole. 4. Should not exceed PD or ASO value. Power Dissipation Curve Pd [mW] 3,000 case2 2,000 SOA case1 1,000 0 0 25 50 75 100 125 150 175 Ambient Temperature, Ta [°C] Recommended Operating Conditions (Ta = 25°C) Parameter 4 Symbol Min. Typ. Max. Unit Supply Voltage For Signal Block VCC 2.2 - 6.5 V Supply Voltage For Power Stage VM 2.2 - 6.5 V FAN8010MP Equivalent Circuit IN1/IN2 ADJ VCC VCC Reference 40K 1 70K 10 2 80K FC 7K OUT1/OUT2 VM VCC 4 6 3 5 FAN8010MP Electrical Characteristics (Ta= 25°C, VCC=3.3V, VM=3.3V unless otherwise specified) Parameter Symbol Conditions Min. Typ. Max. Unit COMMON BLOCK Standby Current ISTB VCC=7.5V, IN1=IN2=L - - 1.0 µA Operating Current1 ICC1 IN1=H or IN2 =H - 6 11 mA Operating Current2 ICC2 IN1=IN2=H - 16 25 mA LOGIC INPUTS Logic Input High Level Voltage VH 1.8 - VCC V Logic Input Low Level Voltage VL -0.3 - 0.4 V Logic Input Current IH - 60 90 µA 0.19 0.2 0.21 V 180 200 220 mA - 0.3 0.45 V VH=5.0V, IN1=H or IN2=H OUTPUT STAGE Current Command Output Current Output Saturation Voltage (PNP+NPN) 6 VADJ IO VSAT RS=1.0Ω IO=200mA FAN8010MP Typical Application Circuits Constant Current Driver Supply 1 10 2 IN1 VM VCC 8 OUT1 4 9 CS IN2 ADJ M FAN8010MP ROPT 3 FC 5 GND OUT2 7 SENSE 6 CFC Rs Normal H-Bridge Driver Supply 1 10 2 IN1 VM VCC 8 OUT1 4 9 CS IN2 ADJ M FAN8010MP 3 FC 5 GND OUT2 7 SENSE 6 7 FAN8010MP Application Informations 1. Logic Inputs and Outputs FAN8010MP has two input pins, IN1and IN2. The following truth table shows the relationship of the inputs and outputs. IN1 IN2 OUT1 OUT2 Remark L L Z Z Standby H L H L Rotation L H L H Rotation H H H H Brake 2. Constant Output Current Control The voltage, VADJ pin is 0.2V typically which is obtained by a internal reference and a resistor divider as shown in the figure. The VADJ is used as the output current command and can be adjusted by the external resistor ROPT between ADJ and GND. The output current is converted to the voltage VS through the current sense resistor RS. By the negative feedback loop, the VS is regulated to VADJ. Actually 50mW, which is the sum of the internal bonding resistance and internal metal resistance, should be added to the RS. The output current is calculated as followings ; I O = ( V ADJ ) ⁄ ( R S + R W ) = 1.38 ( R OPT || 7K ) ⁄ { ( 40K + R OPT || 7K ) ( R S + R W )} VM Reference 1.38V ADJ ROPT OUT1 40K M H-BRIDGE 7K OUT2 IN1~2 Rw FC Vs Sense Rs If oscillation or overshoot get loaded on the output current, they can be removed by connecting a ceramic capacitor ranged from 1nF to 10nF between the FC pin and GND. When a capacitor is used, output response time is delayed as the capacitance increases. 3. Unregulated Voltage Control When the exact current control is not needed, the sense pin should be connected to the GND, and FAN8010MP is operated as a normal H-bridge driver. 4. Thermal Shutdown Thermal Shutdown Circuit turns OFF all outputs when the junction temperature typically reaches 175°C. It is intended to protect the device from failures due to excessive junction temperature. The Thermal Shutdown has the hysteresis of 25°C approximately. 8 FAN8010MP 9 FAN8010MP Test Circuits 10 1 IN1 2 ADJ 3 FC 4 OUT1 5 GND FAN8010MP IN2 10 VCC 9 VM 8 OUT2 7 SENSE 6 FAN8010MP Package Dimensions (Unit: mm) 11 FAN8010MP DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 1/6/05 0.0m 001 Stock#DSxxxxxxxx © 2005 Fairchild Semiconductor Corporation