GTL2034 4-bit GTL to GTL buffer Rev. 01 — 11 November 2005 Product data sheet 1. General description The GTL2034 is a 4-bit GTL−/GTL/GTL+ bus buffer. The GTL2034 GTL inputs and outputs operate up to 3.6 V, allowing the device to be used in higher voltage open-drain output applications. 2. Features ■ ■ ■ ■ ■ ■ Operates as a 4-bit GTL−/GTL/GTL+ to GTL−/GTL/GTL+ bus buffer 3.0 V to 3.6 V operation GTL input and output 3.6 V tolerant Vref adjustable from 0.5 V to VCC / 2 Partial power-down permitted ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-CC101 ■ Latch-up protection exceeds 500 mA per JESD78 ■ Package offered: TSSOP14 3. Quick reference data Table 1: Quick reference data Tamb = 25 °C Symbol Parameter Conditions Min Typ Max Unit GTL; BIn to BOn; CL = 50 pF; VCC = 3.3 V - 3.1 8 ns - 4.1 10 ns GTL; outputs disabled; VI/O = 0 V or 3.0 V - 4.5 - pF tPLH LOW-to-HIGH propagation delay tPHL HIGH-to-LOW propagation delay Ci input capacitance GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 4. Ordering information Table 2: Ordering information Type number GTL2034PW Package Name Description Version TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 4.1 Ordering options Table 3: Ordering options Type number Topside mark Temperature range GTL2034PW GTL2034 Tamb = −40 °C to +85 °C 5. Functional diagram GTL2034 BI0 BO0 BI1 BO1 BI2 BO2 BI3 BO3 VREF 002aab148 Fig 1. Logic diagram of GTL2034 9397 750 13543 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 2 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 6. Pinning information 6.1 Pinning n.c. 1 BO0 2 14 VCC 13 BI0 12 BI1 BO1 3 VREF 4 BO2 5 10 BI2 BO3 6 9 BI3 GND 7 8 GND GTL2034PW 11 GND 002aab147 Fig 2. Pin configuration for TSSOP14 6.2 Pin description Table 4: Pin description Symbol Pin Description n.c. 1 not connected BO0 2 data outputs (GTL) BO1 3 BO2 5 BO3 6 BI0 13 BI1 12 BI2 10 BI3 9 VREF 4 GTL reference voltage GND 7, 8, 11 ground (0 V) VCC 14 positive supply voltage data inputs (GTL) 7. Functional description Refer to Figure 1 “Logic diagram of GTL2034”. 7.1 Function table Table 5: Function table Input/output BIn (GTL) BOn (GTL) Input BOn = BIn 9397 750 13543 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 3 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 8. Limiting values Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). [1] Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current Conditions Min Max Unit −0.5 +4.6 V VI < 0 V - −50 mA +4.6 V VI input voltage B port −0.5 [2] IOK output clamping current VO < 0 V - −50 mA −0.5 [2] +4.6 V - 80 mA −60 +150 °C VO output voltage output in OFF or HIGH state; B port IOL LOW-state output current [3] B port [4] storage temperature Tstg [1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Section 9 “Recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. [2] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [3] Current into any output in the LOW state. [4] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C. 9. Recommended operating conditions Table 7: Recommended operating conditions Unused inputs must be held HIGH or LOW to prevent them from floating. Symbol Parameter VCC supply voltage VTT termination voltage [1] reference voltage Vref Conditions Min Typ Max Unit 3.0 - 3.6 V GTL− 0.85 0.9 0.95 V GTL 1.14 1.2 1.26 V GTL+ 1.35 1.5 1.65 V overall 0.5 2⁄ V 3 TT VCC / 2 V GTL− 0.5 0.6 0.63 V GTL 0.76 0.8 0.84 V GTL+ 0.87 1.0 1.10 V VI input voltage B port 0 VTT 3.6 V VIH HIGH-state input voltage B port Vref + 0.050 - - V VIL LOW-state input voltage B port - - Vref − 0.050 V IOL LOW-state output current B port - - 40 mA Tamb ambient temperature operating in free air −40 - +85 °C [1] VTT maximum of 3.6 V with resistor sized so IOL maximum is not exceeded. 9397 750 13543 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 4 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 10. Static characteristics Table 8: Static characteristics Recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb = −40 °C to +85 °C Symbol Parameter Conditions [2] Min Typ [1] Max Unit - 0.2 0.4 V VOL LOW-state output voltage B port; VCC = 3.0 V; IOL = 40 mA II input current B port; VCC = 3.6 V; VI = VTT or GND - - ±1 µA ILO output leakage current B port; VCC = 3.6 V; VO = VTT - - ±1 µA ICC quiescent supply current B port; VCC = 3.6 V; VI = VCC or GND; IO = 0 mA - 4 8 mA Ci input capacitance port BIn; VO = VTT or 0 V - 4.5 - pF Co output capacitance port BOn; VO = VTT or 0 V - 5.5 - pF [1] All typical values are measured at VCC = 3.3 V and Tamb = 25 °C. [2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 9397 750 13543 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 5 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 10.1 Performance curves 002aab144 1200 Vth+ and Vth− (mV) 1000 Vth+ Vth− Vref 800 Vth+ Vth− Vref 800 600 400 0.5 002aab145 1200 Vth+ and Vth− (mV) 1000 600 0.6 0.7 0.9 0.8 400 0.5 1.0 Vref (V) a. VCC = 3.0 V; Tamb = −40 °C 0.6 0.7 0.8 0.9 1.0 Vref (V) b. VCC = 3.3 V; Tamb = 25 °C 002aab146 1200 Vth+ and Vth− (mV) 1000 Vth+ Vth− Vref 800 600 400 0.5 0.6 0.7 0.8 0.9 1.0 Vref (V) c. VCC = 3.6 V; Tamb = 85 °C Fig 3. GTL Vth+ and Vth− versus Vref 9397 750 13543 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 6 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 11. Dynamic characteristics Table 9: Dynamic characteristics VCC = 3.3 V ± 0.3 V Symbol Parameter Conditions Min Typ [1] Max Unit BIn to BOn; see Figure 4 - 2.8 8 ns - 5.2 10 ns BIn to BOn; see Figure 4 - 3.1 8 ns - 4.1 10 ns BIn to BOn; see Figure 4 - 3.3 8 ns - 3.6 10 ns GTL−; Vref = 0.6 V; VTT = 0.9 V tPLH LOW-to-HIGH propagation delay tPHL HIGH-to-LOW propagation delay GTL; Vref = 0.8 V; VTT = 1.2 V tPLH LOW-to-HIGH propagation delay tPHL HIGH-to-LOW propagation delay GTL+; Vref = 1.0 V; VTT = 1.5 V tPLH LOW-to-HIGH propagation delay tPHL HIGH-to-LOW propagation delay [1] All typical values are at VCC = 3.3 V and Tamb = 25 °C. 11.1 Waveforms VM = Vref for B ports. VTT input Vref Vref1 1/ V 3 TT tPLH tpulse tPHL VOH 3.0 V VM output VM Vref Vref2 VOL 0V 002aab149 002aab140 a. Pulse duration b. Propagation delay times Fig 4. Voltage waveforms 12. Test information VTT VCC PULSE GENERATOR VI 25 Ω VO D.U.T. RT CL 30 pF 002aab143 CL = load capacitance; includes jig and probe capacitance. RT = termination resistance; should be equal to Zo of pulse generator. Fig 5. Load circuit for B outputs 9397 750 13543 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 7 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 13. Package outline TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.72 0.38 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 6. Package outline SOT402-1 (TSSOP14) 9397 750 13543 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 8 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 14.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: • below 225 °C (SnPb process) or below 245 °C (Pb-free process) – for all BGA, HTSSON..T and SSOP..T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; 9397 750 13543 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 9 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 14.5 Package related soldering information Table 10: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Wave Reflow [2] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [4] suitable PLCC [5], SO, SOJ suitable suitable not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not recommended [7] suitable CWQCCN..L [8], PMFP [9], WQCCN..L [8] not suitable LQFP, QFP, TQFP [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 9397 750 13543 Product data sheet not suitable © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 10 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. 15. Abbreviations Table 11: Abbreviations Acronym Description CDM Charged Device Model ESD ElectroStatic Discharge GTL Gunning Transceiver Logic HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 16. Revision history Table 12: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes GTL2034_1 20051111 Product data sheet - 9397 750 13543 - 9397 750 13543 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 11 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 17. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 18. Definitions customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 20. Trademarks 19. Disclaimers Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 21. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 13543 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 11 November 2005 12 of 13 GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 22. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 8 9 10 10.1 11 11.1 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 19 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Performance curves . . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 9 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 9 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 10 Package related soldering information . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information . . . . . . . . . . . . . . . . . . . . 12 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 11 November 2005 Document number: 9397 750 13543 Published in The Netherlands