GTL2009 3-bit GTL Front-Side Bus frequency comparator Rev. 01 — 22 September 2005 Product data sheet 1. General description The GTL2009 is designed for the Nocona and Dempsey/Blackford dual Intel Xeon processor platforms to compare the Front-Side Bus (FSB) frequency settings and set the common FSB frequency at the lowest setting if both processor slots are occupied or the FSB setting of the occupied processor slot if only one processor is being used. A default FSB frequency of 100 MHz is initially set upon power-up when VDD is greater than 1.5 V. Magnitude comparisons and frequency multiplexing to compute the common FSB frequency occurs when the two 3-bit FSB GTL inputs from the chip sets are valid. The common FSB frequency GTL outputs switch from the default frequency to the computed frequency when the GTL reference voltage input (VREF) crosses a static 0.6 V internally generated input comparator reference voltage. The GTL2009 then continually monitors the FSB frequency and slot occupied inputs for any further changes. The Nocona and Dempsey/Blackford Xeon processors specify a VTT of 1.2 V and 1.1 V, as well as a nominal Vref of 0.76 V and 0.73 V respectively. To allow for future voltage level changes that may extend Vref to 0.63 of VTT (minimum of 0.693 V with VTT of 1.1 V) the GTL2009 allows a minimum Vref of 0.66 V. Characterization results show that there is little DC or AC performance variation between these levels. The GTL2009 is a companion chip to the GTL2006 platform health management GTL-to-LVTTL translator and the newer GTL2007 that adds an enable function that disables the error output to the monitoring agent for platforms that monitor the individual error conditions from each processor. 2. Features ■ Compares FSB frequency inputs to set the lowest frequency as the common bus frequency. ■ Operates at a range of GTL signal levels ■ 3.0 V to 3.6 V operation ■ LVTTL I/O are not 5 V tolerant ■ Companion chip to GTL2006 and GTL2007 ■ ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101 ■ Latch-up testing is done to JEDEC Standard JESD78, which exceeds 500 mA ■ Available in TSSOP16 package GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 3. Quick reference data Table 1: Quick reference data Tamb = 25 °C Symbol Parameter tPLH tPHL Conditions Min Typ Max Unit LOW-to-HIGH propagation delay; CL = 30 pF; BI to BO VDD = 3.3 V 3.0 16.5 30 ns HIGH-to-LOW propagation delay; BI to BO 2.3 16.2 30 ns 4. Ordering information Table 2: Ordering information Type number Topside mark Package Name Description Version GTL2009PW TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 GTL2009 5. Functional diagram GTL2009 VDD VREF START-UP A≥B common FSB 1=B BSEL1 A MUX BO1 BSEL2 BO2 BSEL3 B 1BI1 1BI2 1BI3 1AI 2AI 2BI1 2BI2 2BI3 A - BSEL1 A - BSEL2 A - BSEL3 A - Occupied# GTL to TTL A≥B A AO2 active LOW COMPARE B - Occupied# B - BSEL1 B - BSEL2 B - BSEL3 BO3 default output is 101 = 100 MHz active LOW equal AO1 B GTL to TTL VSS 002aaa997 If B - Occupied only, then A ≥ B = 1. If A - Occupied only, then A ≥ B = 0. If A and B - Occupied, then A ≥ B = 1 if A frequency higher than B frequency. Pin assignment: A = LVTTL, B = GTL, I = Input, O = Output. Refer to Section 7.2 “Default conditions input”. Fig 1. Functional diagram of GTL2009 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 2 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 6. Pinning information 6.1 Pinning VDD 1 16 1BI1 VREF 2 15 1BI2 BO3 3 14 1BI3 BO2 4 BO1 5 AO2 6 11 2BI1 AO1 7 10 2BI2 VSS 8 GTL2009PW 13 1AI 12 2AI 9 2BI3 002aaa996 Fig 2. Pin configuration for TSSOP16 6.2 Pin description Table 3: Pin description Symbol Pin Type Description VDD 1 supply supply voltage VREF 2 Vref Vref input voltage BO3 3 GTL output BSEL3 BO2 4 GTL output BSEL2 BO1 5 GTL output BSEL1 AO2 6 LVTTL output A≥B AO1 7 LVTTL output equal VSS 8 ground ground supply 2BI3 9 GTL input B-BSEL3 2BI2 10 GTL input B-BSEL2 2BI1 11 GTL input B-BSEL1 2AI 12 LVTTL input B-occupied 1AI 13 LVTTL input A-occupied 1BI3 14 GTL input A-BSEL3 1BI2 15 GTL input A-BSEL2 1BI1 16 GTL input A-BSEL1 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 3 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 7. Functional description Refer to Figure 1 “Functional diagram of GTL2009”. 7.1 Function tables Table 4: FSB frequency selection BSEL3 BSEL2 BSEL1 FSB H L H 100 MHz L L H 133 MHz L H H 166 MHz L H L 200 MHz L L L 266 MHz H L L 333 MHz H H L 400 MHz H H H reserved Table 5: FSB frequency comparison Default on start-up is 101 Processor A FSB Processor B FSB Pins BO1/BO2/BO3 A≥B A≥B B A<B A<B A not occupied B B A not occupied A A=B A=B A or B Common FSB frequency Table 6: FSB the same output Processor A FSB Processor B FSB Compare Pin AO1 A>B A>B no L A<B A<B no L A=B A=B yes H A frequency = B frequency Table 7: FSB processor A greater than or equal to processor B output Pin 1AI Pin 2AI Compare A-occupied B-occupied A frequency > B frequency L yes L yes no L yes H H no L yes X H L yes H no X L H no H no X H 9397 750 13556 Product data sheet Pin AO2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 4 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 7.2 Default conditions input The FSB GTL output data is masked and a specific default value (100 MHz) is inserted upon power-up when VDD is greater than 1.5 V. The FSB GTL output data is unmasked and valid data is supplied when the VREF input crosses a static 0.6 V internally generated input comparator reference voltage. For slowly rising GTL VTT supply (0.7 V/500 µs), the switch-over happens at the 0.6 V threshold. For fast rising GTL VTT supply (0.7 V/100 ns), the switch-over typically occurs between 350 ns to 1.5 µs after the 0.6 V threshold is exceeded. The AO1 and AO2 outputs do not have ‘default conditions’ like those assigned to the GTL outputs. Instead, these two pins will power-up according to the conditions applied to the 1A1 and 2A1 input pins as shown in Table 8. If the slot is occupied, the input is LOW. Table 8: AO1 and AO2 power-up conditions H = HIGH; L = LOW. 1AI 2AI VDD AO1 AO2 L L <1.5 V L L L L >1.5 V H H L H <1.5 V L L L H >1.5 V L L H L <1.5 V L L H L >1.5 V L H H H <1.5 V L L H H >1.5 V H H It is important to note that the AO1 and AO2 outputs may be valid a little before 1.5 V and will rise with VDD. Valid outputs from the system level perspective will be achieved after VDD is in regulation, VTT ramps up, and after the internal propagation delay of the GTL2009. No firm answer for this can be given since the time it takes for VDD to be in regulation varies from 100 ms to 1000 ms, and the rise time of VTT is unknown. The GTL2009 outputs are valid after the GTL inputs are valid plus 19.6 ns (worst-case propagation delay of the GTL-to-LVTTL path). 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 5 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 8. Application design-in information VTT VTT 56 Ω R 2R common front-side bus VDD 1BI1 VREF 1BI2 BO3 1BI3 BO2 1AI slot A occupied BO1 2AI slot B occupied AO2 2BI1 AO1 2BI2 VSS 2BI3 PROCESSOR A PROCESSOR B 002aaa998 Fig 3. Application diagram 8.1 Frequently asked questions Question 1: When the GTL2009 is unpowered, the LVTTL inputs may be pulled up to 3.3 V and we want to make sure that there is no leakage path to the power rail under this condition. Are the LVTTL inputs high-impedance when the device is unpowered and will there be any leakage? Answer 1: When the device is unpowered, the LVTTL inputs will be in a high-impedance state and will not leak to VDD if they are pulled HIGH or LOW while the device is unpowered. Question 2: What is the condition of the GTL and LVTTL output pins when the device is unpowered? Answer 2: The open-drain GTL outputs will not leak to the power supply if they are pulled HIGH or allowed to float while the device is unpowered. The GTL inputs will also not leak to the power supply under the same conditions. The LVTTL totem pole outputs, however, are not open-drain type outputs and there will be current flow on these pins if they are pulled HIGH when VDD is at ground. 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 6 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 9. Limiting values Table 9: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). [1] Voltages are referenced to VSS (ground = 0 V). Symbol Parameter Conditions VDD supply voltage IIK input clamping current VI < 0 V VI input voltage A port (LVTTL) B port (GTL) Min Max Unit −0.5 +4.6 V - −50 mA [3] −0.5 +4.6 V [3] - −50 mA IOK output clamping current VO < 0 V - −50 mA VO output voltage output in Off or HIGH state; A port [3] −0.5 +4.6 V output in Off or HIGH state; B port [3] −0.5 +4.6 V A port - 24 mA B port - 30 mA A port - −24 mA −60 +150 °C - +125 °C current [4] IOL LOW-state output IOH HIGH-state output current [5] Tstg storage temperature [2] junction temperature Tj [1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Section 10 “Recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. [2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C. [3] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [4] Current into any output in the LOW state. [5] Current into any output in the HIGH state. 10. Recommended operating conditions Table 10: Recommended operating conditions Symbol Parameter VDD supply voltage VTT termination voltage Vref VI Conditions Min Typ Max Unit 3.0 3.3 3.6 V GTL - 1.2 - V reference voltage GTL 0.66 0.8 1.1 V input voltage A port 0 3.3 3.6 V B port 0 VTT 3.6 V 2 - - V VIH HIGH-state input voltage A port B port Vref + 0.050 - - V VIL LOW-state input voltage A port - - 0.8 V B port - - Vref − 0.050 V IOH HIGH-state output current A port - - –12 mA IOL LOW-state output current A port - - 12 mA B port - - 15 mA operating in free air −40 - +85 °C Tamb ambient temperature 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 7 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 11. Static characteristics Table 11: Static characteristics Over recommended operating conditions. Voltages are referenced to VSS (ground = 0 V). Tamb = −40 °C to +85 °C. Symbol Unit VDD − 0.2 2.99 - V [2] 2.1 2.37 - V VDD = 3.0 V; IOL = 8 mA [2] - 0.27 0.4 V VDD = 3.0 V; IOL = 12 mA [2] - 0.4 0.55 V LOW-level output voltage; B port VDD = 3.0 V; IOL = 15 mA [2] - 0.11 0.4 V input current; A port VDD = 3.6 V; VI = VDD - - ±1 µA VDD = 3.6 V; VI = 0 V - - ±1 µA input current; B port VDD = 3.6 V; VI = VTT or VSS - - ±1 µA ILO output leakage current; B port VDD = 3.6 V; VO = VTT - - ±1 µA IDD supply current; A or B port VDD = 3.6 V; VI = VDD or VSS; IO = 0 mA - 5.5 10 mA ∆IDD additional quiescent supply current; VDD = 3.6 V; VI = VDD − 0.6 V A port or control inputs - 32 500 µA Cio input/output capacitance; A port VO = 3.0 V or 0 V - 7.8 - pF input/output capacitance; B port VO = VTT or 0 V - 4.5 - pF HIGH-level output voltage; A port LOW-level output voltage; A port VOL II Conditions Min Typ [1] Max VOH Parameter VDD = 3.0 V to 3.6 V; IOH = −100 µA [2] VDD = 3.0 V; IOH = −16 mA [3] [1] All typical values are measured at VDD = 3.3 V and Tamb = 25 °C. [2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [3] This is the increase in supply current for each input that is at the specified LVTTL voltage level, rather than VDD or VSS. 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 8 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 12. Dynamic characteristics Table 12: Dynamic characteristics VDD = 3.3 V ± 0.3 V Symbol Parameter Conditions Limits Vref = 0.73 V; VTT = 1.1 V Unit Vref = 0.76 V; VTT = 1.2 V Min Typ [1] Max Min Typ [1] Max 1.4 7.9 14.5 1.4 7.8 14.5 ns tPHL LOW-to-HIGH propagation delay; AI to AO Figure 4 and HIGH-to-LOW propagation delay; AI to AO Figure 8 2.0 9.0 16.0 2.0 8.8 16.0 ns tPLH LOW-to-HIGH propagation delay; BI to AO Figure 6 2.6 16.3 30.0 2.5 16.5 30.5 ns tPHL HIGH-to-LOW propagation delay; BI to AO 2.8 13.9 25.0 2.9 14.0 25.0 ns tPLH LOW-to-HIGH propagation delay; BI to BO Figure 7 3.0 16.5 30.0 3.0 16.5 30.0 ns tPHL HIGH-to-LOW propagation delay; BI to BO 2.3 16.2 30.0 2.3 16.2 30.0 ns tPLH LOW-to-HIGH propagation delay; AI to BO Figure 5 2.1 7.9 14.0 2.0 8.3 14.5 ns tPHL HIGH-to-LOW propagation delay; AI to BO 1.4 7.3 13.5 1.5 7.7 14.0 ns tPLH [1] All typical values are at VDD = 3.3 V and Tamb = 25 °C. 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 9 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 12.1 AC waveforms VM = 1.5 V at VDD ≥ 3.0 V for A ports; VM = Vref for B ports. tp 3.0 V VOH VM input 1.5 V 1.5 V VM 0V 0V tPLH 002aaa999 tPHL VTT VM = 1.5 V for A port and Vref for B port. output Vref Vref VOH = 3 V for A port and VTT for B port VOL 002aab000 tp = pulse duration Fig 4. Pulse duration Fig 5. Propagation delay, A port to B port VTT input Vref Vref VTT input 1/ V 3 TT tPLH tPHL Vref Vref tPLH tPHL 1/ V 3 TT VOH 1.5 V output 1.5 V VTT output Vref Vref VOL VOL 002aab001 002aab003 PRR ≤ 10 MHz; Zo = 50 Ω; tr ≤ 2.5 ns; tf ≤ 2.5 ns Fig 6. Propagation delay, BI to AO Fig 7. Propagation delay, BI to BO 3.0 V input 1.5 V 1.5 V tPLH tPHL 3.0 V input 1.5 V 1.5 V tPLH tPHL 0V 0V VOH output 1.5 V 1.5 V VOH output 1.5 V 1.5 V VOL VOL 002aab004 Fig 8. Propagation delay, AI to AO 002aab664 Fig 9. Propagation delay, 1AI to AO2 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 10 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 13. Test information VDD PULSE GENERATOR VI VO D.U.T. RL 500 Ω CL 50 pF RT 002aab006 Fig 10. Load circuitry for A outputs VTT VDD PULSE GENERATOR VI 50 Ω VO D.U.T. CL 30 pF RT 002aab007 Fig 11. Load circuit for B outputs Definitions: RL — load resistor CL — load capacitance includes jig and probe capacitance. RT — termination resistance should be equal to Zo of pulse generators. 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 11 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 14. Package outline TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 12. Package outline SOT403-1 (TSSOP16) 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 12 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 15. Soldering 15.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 15.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: • below 225 °C (SnPb process) or below 245 °C (Pb-free process) – for all BGA, HTSSON..T and SSOP..T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 15.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 13 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 15.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 15.5 Package related soldering information Table 13: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Wave Reflow [2] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [4] suitable PLCC [5], SO, SOJ suitable suitable not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not recommended [7] suitable CWQCCN..L [8], PMFP [9], WQCCN..L [8] not suitable LQFP, QFP, TQFP [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 9397 750 13556 Product data sheet not suitable © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 14 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. 16. Abbreviations Table 14: Abbreviations Acronym Definition CDM Charged Device Model ESD Electrostatic Discharge FSB Front-Side Bus GTL Gunning Transceiver Logic HBM Human Body Model LVTTL Low Voltage Transistor-Transistor Logic MM Machine Model PRR Pulse Rate Repetition 17. Revision history Table 15: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes GTL2009_1 20050922 Product data sheet - 9397 750 13556 - 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 15 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 18. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19. Definitions customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 21. Trademarks 20. Disclaimers Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 22. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 13556 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 — 22 September 2005 16 of 17 GTL2009 Philips Semiconductors 3-bit GTL Front-Side Bus frequency comparator 23. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 8 8.1 9 10 11 12 12.1 13 14 15 15.1 15.2 15.3 15.4 15.5 16 17 18 19 20 21 22 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Function tables . . . . . . . . . . . . . . . . . . . . . . . . . 4 Default conditions input . . . . . . . . . . . . . . . . . . 5 Application design-in information . . . . . . . . . . 6 Frequently asked questions . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Recommended operating conditions. . . . . . . . 7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . 10 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14 Package related soldering information . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information . . . . . . . . . . . . . . . . . . . . 16 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 22 September 2005 Document number: 9397 750 13556 Published in The Netherlands