STMICROELECTRONICS HCF40174BEY

HCC/HCF40174B
HEX ”D” – TYPE FLIP–FLOP
.
.
..
..
STANDARDIZED SYMMETRICAL OUTPUT
CHARACTERISTICS
QUIESCENT CURRENT SPECIFIED AT 20V
FOR HCC DEVICE
5V, 10V, AND 15V PARAMETRIC RATINGS
INPUT CURRENT OF 100nA AT 18 V AND 25°C
FOR HCC DEVICE
100% TESTED FOR QUIESCENT CURRENT
MEETS ALL REQUIREMENTS OF JEDEC TENTATIVE STANDARD No. 13A, ”STANDARD
SPECIFICATIONS FOR DESCRIPTION OF ”B”
SERIES CMOS DEVICES”
EY
(Plastic Package)
M1
(Micro Package)
F
(Ceramic Frit Seal Package)
C1
(Plastic Chip Carrier)
ORDER CODES :
HCC40174BF
HCF40174BM1
HCF40174BEY HCF40174BC1
PIN CONNECTIONS
DESCRIPTION
The HCC40174B (extended temperature range)
and HCF40174B (intermediate temperature range)
are monolithic integrated circuits available in 16lead dual in-line plastic or ceramic package and
plastic micro package.
The HCC/HCF40174B consists of six identical ’D’ type flip-flops having independent DATA inputs. The
CLOCK and CLEAR inputs are common to all six
units. Data is transferred to the Q outputs on the
positive-going transition of the clock pulse. All six
flip-flops are simultaneously reset by a low level on
the CLEAR input.
June 1989
1/12
HCC/HCF40174B
FUNCTIONAL DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
V DD *
Parameter
Supply Voltage : H CC Types
H C F Types
Vi
Input Voltage
II
Value
Unit
– 0.5 to + 20
– 0.5 to + 18
V
V
– 0.5 to V DD + 0.5
V
DC Input Current (any one input)
± 10
mA
Pt o t
Total Power Dissipation (per package)
Dissipation per Output Transistor
for T o p = Full Package-temperature Range
200
mW
100
mW
To p
Operating Temperature : HC C Types
H C F Types
– 55 to + 125
– 40 to + 85
°C
°C
T st g
Storage Temperature
– 65 to + 150
°C
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device
reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
V DD
VI
Top
2/12
Parameter
Supply Voltage : H CC Types
H C F Types
Input Voltage
Operating Temperature : HCC Types
H CF Types
Value
Unit
3 to 18
3 to 15
V
V
0 to V DD
V
– 55 to + 125
– 40 to + 85
°C
°C
HCC/HCF40174B
LOGIC DIAGRAM (1 of 6 Flip-Flops)
TRUTH TABLE
Inputs
Clock
–
–/
–
–/
–\
–
X
1 = High Level
0 = Low Level
Output
Data
Clear
Q
0
1
0
1
1
1
X
1
NC
X
0
0
X = Don’t Care
NC = No Change
3/12
HCC/HCF40174B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions
Symbol
IL
V OH
V OL
Parameter
Quiescent
Current
VI
(V)
VO
(V)
V IL
I OH
0/ 5
5
1
0.02
1
30
HCC
Types 0/15
10
2
0.02
2
60
15
4
0.02
4
120
0/20
20
20
0.04
20
600
0/ 5
HCF
0/10
Types
0/15
5
4
0.02
4
30
10
8
0.02
8
60
15
16
0.02
16
120
Output High
Voltage
Output Low
Voltage
0/ 5
<1
5
4.95
4.95
4.95
0/10
<1
10
9.95
9.95
9.95
0/15
<1
15
14.95
14.95
14.95
5/0
<1
5
0.05
0.05
0.05
10/0
<1
10
0.05
0.05
0.05
I OL
I IH , I IL
CI
Input High
Voltage
Input Low
Voltage
Output
Drive
Current
Output
Sink
Current
Input
Leakage
Current
|I O | V D D
T L o w*
25 °C
T Hi g h *
(µA) (V) Min. Max. Min. Typ. Max. Min. Max.
0/10
15/0
V IH
Value
0.05
0.05
<1
15
<1
5
3.5
3.5
3.5
1/9
<1
10
7
7
7
1.5/13.5 < 1
15
11
4.5/0.5
<1
5
1.5
1.5
1.5
9/1
<1
10
3
3
3
13.5/1.5 < 1
15
4
4
4
2.5
5
– 2
– 1.6 – 3.2
– 1.15
HCC
Types 0/10
4.6
5
– 0.64
– 0.51 – 1
– 0.36
9.5
10
– 1.6
– 1.3 – 2.6
– 0.9
0/15
13.5
15
– 4.2
– 3.4 – 6.8
– 2.4
0/ 5
2.5
5
– 1.53
– 1.36 – 3.2
– 1.1
0/ 5
HCF
Types 0/10
4.6
5
– 0.52
– 0.44 – 1
– 0.36
9.5
10
– 1.3
– 1.1 – 2.6
– 0.9
0/15
13.5
15
– 3.6
– 3.0 – 6.8
– 2.4
0/ 5
HCC
0/10
Types
0/15
0.4
5
0.64
0.51
1
0.36
0.5
10
1.6
1.3
2.6
0.9
1.5
15
4.2
3.4
6.8
2.4
0/ 5
0.4
5
0.52
0.44
1
0.36
HCF
0/10
Types
0/15
0.5
10
1.3
1.1
2.6
0.9
1.5
15
3.6
3.0
6.8
2.4
Input Capacitance
18
± 0.1
±10 – 5 ± 0.1
Any Input
15
± 0.3
±10
V
mA
mA
± 1
µA
Any Input
5
–5
± 0.3
7.5
* TLo w = – 55°C for HCC device : – 40°C for HCF device.
* THigh = + 125°C for HCC device : + 85°C for HCF device.
The Noise Margin for both ”1” and ”0” level is : 1V min. with VDD = 5V, 2V min. with VDD = 10V, 2.5 V min. with VDD = 15V.
4/12
V
11
0/ 5
HCF
Types 0/15
V
0.05
0/ 5
HCC
0/18
Types
µA
V
0.5/4.5
11
Unit
±1
pF
HCC/HCF40174B
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25°C, CL = 50pF, RL = 200kΩ,
typical temperature coefficient for all VDD values is 0.3%/°C, all input rise and fall time = 20ns)
Symbol
t PLH ,
tPHL
tPHL
t T HL,
t T LH
Parameter
Propagation Delay Time
Clock to Output
Propagation Delay Time
Clear to Output
Transition Time
Test Conditions
Value
V DD (V)
Min.
Typ.
Max.
5
150
300
10
70
140
15
50
100
5
100
200
10
50
100
15
40
80
5
100
200
10
50
100
40
80
15
tsetup
t ho l d
tW
tW
tW
tr, tf
trem
fCL
Data Setup Time
Data Hold Time
Clock Input Pulse Width
Low Level
Clock Input Pulse Width
High Level
Clear Input Pulse Width
Low Level
Clock Input Rise or Fall Time
Clear Removal Time
Maximum Clock Input Frequency
5
40
20
10
20
10
15
10
0
5
80
40
10
40
20
15
30
15
5
130
65
10
60
30
15
40
20
5
130
65
10
60
30
15
40
20
5
100
50
10
50
25
15
40
20
ns
ns
15
15
15
– 40
0
– 15
15
0
– 10
5
3.5
7
10
6
12
15
8
16
ns
ns
10
0
ns
ns
15
5
ns
ns
5
10
Unit
µs
ns
MHz
5/12
HCC/HCF40174B
WAVEFORMS
Output Low (sink) Current Characteristics.
Output High (source) Current Characteristics.
Typical Propagation Delay Time (clock to output) vs.
Load Capacitance.
Typical Transition Time vs. Load Capacitance.
6/12
HCC/HCF40174B
Typical Dynamical Power Dissipation vs. Clock Frequency.
TEST CIRCUITS
Quiescent Device Current.
Input Voltage.
Input Leakage Current.
Dynamic Power Dissipation.
7/12
HCC/HCF40174B
Plastic DIP16 (0.25) MECHANICAL DATA
mm
DIM.
MIN.
a1
0.51
B
0.77
TYP.
inch
MAX.
MIN.
TYP.
MAX.
0.020
1.65
0.030
0.065
b
0.5
0.020
b1
0.25
0.010
D
20
0.787
E
8.5
0.335
e
2.54
0.100
e3
17.78
0.700
F
7.1
0.280
I
5.1
0.201
L
Z
3.3
0.130
1.27
0.050
P001C
8/12
HCC/HCF40174B
Ceramic DIP16/1 MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
20
0.787
B
7
0.276
D
E
3.3
0.130
0.38
e3
0.015
17.78
0.700
F
2.29
2.79
0.090
0.110
G
0.4
0.55
0.016
0.022
H
1.17
1.52
0.046
0.060
L
0.22
0.31
0.009
0.012
M
0.51
1.27
0.020
0.050
N
P
Q
10.3
7.8
8.05
5.08
0.406
0.307
0.317
0.200
P053D
9/12
HCC/HCF40174B
SO16 (Narrow) MECHANICAL DATA
mm
DIM.
MIN.
TYP.
A
a1
inch
MAX.
MIN.
TYP.
1.75
0.1
0.068
0.2
a2
MAX.
0.004
0.007
1.65
0.064
b
0.35
0.46
0.013
0.018
b1
0.19
0.25
0.007
0.010
C
0.5
0.019
c1
45° (typ.)
D
9.8
E
5.8
10
0.385
6.2
0.228
0.393
0.244
e
1.27
0.050
e3
8.89
0.350
F
3.8
4.0
0.149
0.157
G
4.6
5.3
0.181
0.208
L
0.5
1.27
0.019
0.050
M
S
0.62
0.024
8° (max.)
P013H
10/12
HCC/HCF40174B
PLCC20 MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
9.78
10.03
0.385
0.395
B
8.89
9.04
0.350
0.356
D
4.2
4.57
0.165
0.180
d1
2.54
0.100
d2
0.56
0.022
E
7.37
8.38
0.290
0.330
e
1.27
0.050
e3
5.08
0.200
F
0.38
0.015
G
0.101
0.004
M
1.27
0.050
M1
1.14
0.045
P027A
11/12
HCC/HCF40174B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
 1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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