SHOULDER HDBF19900A22

规格书编号
SPEC NO :
产品规格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDBF19900A22
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:[email protected]
Page 1 of 6
SAW FILTER
HDBF19900A22
更改历史记录
History Record
更改日期
Date
www.shoulder.cn
规格书编号
Spec No
产品型号
Part No
客户产品型号
Customer No
Tel:0755-82916880
Fax:0755-82916881
更改内容描述
Modify Content
E-mail:[email protected]
备注
Remark
Page 2 of 6
SAW FILTER
HDBF19900A22
1. SCOPE
This specification shall cover the characteristics of SAW filter with
the page system.
HDBF19900A22 used for
2. ELECTRICAL SPECIFICATION
Maximum incident power in passband
Max.DC voltage between any 2 terminals
Storage temperature range
Operation temperature range
Suitable for lead-free soldering-Max.soldering profile
+15dBm
30VDC
-40℃ to +85℃
-10℃ to +85℃
260℃ for 30s
Electronic Characteristics
Parameter
Center Frequency
Insertion Loss
1dB Bandwidth
Amplitude Ripple over f0±100KHz
f0-800 to f0-600KHz and f0+600 to f0+800KHz
f0-30MHz to f0-800KHz
f0+800KHz to f0+17MHz
f0-80MHz to f0-30MHz
f0+17MHz to f0+80MHz
Group Delay Variation overf0±100KHz
Frequency Temperature coefficient
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
Minimum
±100
20
28
28
35
35
-
Typical
199.0
0.032
E-mail:[email protected]
Maximum
7
0.5
500
Unit
MHz
dB
KHz
dB
dB
dB
dB
dB
dB
nsec
ppm/°C
Page 3 of 6
SAW FILTER
HDBF19900A22
TEST CIRCUIT
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:[email protected]
Page 4 of 6
SAW FILTER
HDBF19900A22
4.DIMENSION
Dimension
A
B
C
D
E
H
P
min
8.9
6.9
0.72
mm
typ
9.1
7.1
0.9
0.8
0.76
2.54
max
9.3
7.3
1.5
0.80
Pin Configuration
2
Input
7
Output
Other
Ground
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:[email protected]
Page 5 of 6
SAW FILTER
HDBF19900A22
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30 Minutes.
Then release the device into the room conditions for 1 to 2 hours prior to the measurement.
It shall meet the
specifications in table 1.
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec.
Then release the device into the room conditions for 4 hours. It shall meet the specifications
in table 1.
5-3 Solderability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in table 1.
5-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the
filter shall fulfill the specifications in table 1.
5-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude
of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in table 1.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the
component.
Please avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:[email protected]
Page 6 of 6