ETC HFCT

Agilent HFCT-5218M 622 Mb/s
Single Mode Laser Transceiver for
ATM, SONET OC-12/SDH STM-4 (L4.1)
Data Sheet
Description
The HFCT-5218 transceiver is a
high performance, cost effective
module for serial optical data
communications applications
specified for a signal rate of
622 MBd. It is designed to provide
a SONET/SDH compliant link for
622 Mb/s long reach links.
Functional Description
Receiver Section
This module is designed for single
mode fiber and operates at a
nominal wavelength of 1300 nm.
It incorporates high performance,
reliable, long wavelength optical
devices and proven circuit
technology to give long life and
consistent service.
The postamplifier is ac coupled to
the preamplifier as illustrated in
Figure 1. The coupling capacitor is
large enough to pass the SONET/
SDH test pattern at 622 Mbd
without significant distortion or
performance penalty. If a lower
signal rate, or a code which has
significantly more low frequency
content is used, sensitivity, jitter
and pulse distortion could be
degraded.
The transmitter section uses an
advanced Distributed Feedback
(DFB) laser with full IEC 825 and
CDRH Class 1 eye safety.
A pseudo-ECL logic interface
simplifies interface to external
circuitry.
Design
The receiver section contains an
InGaAs/InP photodetector and a
preamplifier within the receptacle,
coupled to a postamp/decision
circuit on a separate circuit board.
Figure 1 also shows a filter
network which limits the
bandwidth of the preamp output
signal. The filter is designed to
bandlimit the preamp output noise
and thus improve the receiver
sensitivity.
These components will also
reduce the sensitivity of the
receiver as the signal bit rate is
increased above 622 Mbd.
Features
• SC duplex single mode
transceiver
• Link distances up to 40 km with
9/125 µm SMF
• Fully Class 1 CDRH/IEC 825
compliant
• Long reach SONET OC-12/ SDH
STM-4 (L4.1) compliant
• Single +5 V power supply
operation and PECL logic
interfaces
• Industry standard multisourced
1 x 9 mezzanine package style
• Wave solder and aqueous wash
process compatible
• Interchangeable with LED
multisourced 1 x 9 transceivers
Applications
• SONET/SDH equipment
interconnect, STS-12/SDH
STM-4 Rate
• Long reach (up to 40 km) ATM
links
Functional Description
Transmitter Section
Design
The transmitter section uses a
distributed feedback laser as its
optical source. The package of
this laser is designed to allow
repeatable coupling into single
mode fiber. In addition, this
package has been designed to be
compliant with IEC 825 eye safety
requirements under any single
fault condition. The optical output
is controlled by a custom IC
which detects the laser output via
the monitor photodiode, as shown
in Figure 2. This IC provides both
dc and ac current drive to the
laser to ensure correct
modulation, eye diagram and
extinction ratio over temperature,
supply voltage and life
DATA OUT
FILTER
TRANSIMPEDANCE
PREAMPLIFIER
PECL
OUTPUT
BUFFER
LIMITING
AMPLIFIER
DATA OUT
RECEIVER
RECEPTACLE
GND
SIGNAL
DETECT
CIRCUIT
PECL
OUTPUT
BUFFER
SD
Figure 1. Receiver Block Diagram
LASER
DATA
LASER
MODULATOR
DATA
PECL
INPUT
LASER BIAS
DRIVER
LASER BIAS
CONTROL
Figure 2. Simplified Transmitter Schematic
2
PHOTODIODE
(rear facet monitor)
Applications Information
Recommended Circuit Schematic
When designing the HFCT-5218M
circuit interface, there are a few
fundamental guidelines to follow.
For example, in the Recommended
Circuit Schematic, Figure 3, the
differential PECL data lines
should be treated as 50 Ohm
Microstrip or stripline
transmission lines. This will help
to minimize the parasitic
inductance and capacitance
effects. Proper termination of the
differential data signal will
prevent reflections and ringing
which would compromise the
signal fidelity and generate
unwanted electrical noise. Locate
terminations at the received
signal end of the transmission
line. The terminations should be
the standard Thevenin-equivalent
50 ohm to VCC - 2 V termination.
Other standard PECL terminating
techniques may be used. The
length of these lines should be
kept short and of equal length to
prevent pulse-width distortion
from occurring. For the highspeed signal lines, differential
signals should be used, not
single-ended signals. These
differential signals need to be
loaded symmetrically to prevent
unbalanced currents from flowing
which will cause distortion in the
signal.
The Signal Detect (SD) output of
the receiver is PECL logic and
must be loaded if it is to be used.
The signal detect circuit is much
slower that the data path, so the
ac noise generated by an
asymmetrical load is negligible.
Power consumption may be
reduced by using a higher than
normal load impedance for the SD
output. Transmission line effects
are not generally a problem as the
switching rate is slow.
3
MOUNTING POST
MOUNTING POST
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
HFCT-5218M
TOP VIEW
Rx
VEER
1
RD
2
RD
3
Rx
VCCR
5
SD
4
Tx
VCCT
6
TD
7
Tx
VEET
9
TD
8
C2
C1
VCC
TERMINATION
AT PHY
DEVICE
INPUTS
C7
VCC
R5
R2
L2
R8
RD
SD
VCC
R4
C5
TERMINATION
AT TRANSCEIVER
INPUTS
R10
RD
R3
R1
C3
C4
VCC FILTER
AT VCC PINS
TRANSCEIVER
R9
R7
C6
R6
L1
TD
TD
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR PECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE PECL SIGNALS. RECOMMEND MULTI-LAYER PRINTED
CIRCUIT BOARD WITH 50 OHM MICROSTRIP OR STRIPLINE SIGNAL PATHS BE USED.
R1 = R4 = R6 = R8 = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = 82 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = C7 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR (see text comments).
Figure 3. Recommended Circuit Schematic for dc Coupling (at +5 V) between Optical
Transceiver and Physical Layer IC
Maintain a solid, low inductance
ground plane for returning signal
currents to the power supply.
Multilayer plane printed circuit
board is best for distribution of
VCC, returning ground currents,
forming transmission lines and
shielding. Also, it is important to
suppress noise from influencing
the fiber-optic transceiver
performance, especially the
receiver circuit. Proper power
supply filtering of VCC for this
transceiver is accomplished by
using the recommended separate
filter circuits shown in Figure 3.
These filter circuits suppress VCC
noise greater than 100 mV peakto-peak or less over a broad
frequency range. This prevents
receiver sensitivity degradation .
It is recommended that surfacemount components be used. Use
tantalum capacitors for the 10 µF
capacitors and monolithic,
ceramic bypass capacitors for the
0.1 µF capacitors. Also, it is
recommended that a surfacemount coil inductor of 1 µH be
used. Ferrite beads can be used to
replace the coil inductors
when using quieter VCC supplies,
but a coil inductor is
recommended over a ferrite bead
to provide low frequency noise
filtering as well. Coils with a low,
series dc resistance (<0.7 ohms)
and high, self-resonating
frequency are recommended. All
power supply components need to
be placed physically next to the
VCC pins of the receiver and
transmitter. Use a good, uniform
ground plane with a minimum
number of holes to provide a lowinductance ground current return
path for the signal and power
supply currents.
2 x Ø 1.9 ± 0.1
(0.075 ± 0.004
20.32
(0.800)
9 x Ø 0.8 ± 0.1
(0.032 ± 0.004
20.32
(0.800)
2.54
(0.100)
TOP VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Figure 4. Recommended Board Layout Pattern
Although the front mounting posts
make contact with the metallized
housing these posts should not be
relied upon to provide adequate
electrical connection to the plated
housing. It is recommended to
either connect these front posts to
chassis ground or allow them to
remain unconnected. These front
posts should not be connected to
signal ground.
Figure 4 shows the recommended
board layout pattern.
In addition to these
recommendations, Agilent’s
Application Engineering staff is
available for consulting on best
layout practices with various
vendors serializer/deserializer,
clock generator.
4
Figure 5. 622.08 Mb/s OC-12 ATM-SONET/SDH Reference Design Board
Reference Design
Agilent has developed a reference
design for multimode and singlemode OC-12 ATM-SONET/SDH
applications shown in Figure 5.
This reference design uses a
Vitesse Semiconductor Inc.’s
VSC8117 clock recovery/clock
generation/serializer/deserializer
integrated circuit and a PMCSierra Inc. PM5355 framer IC.
Application Note 1178 documents
the design, layout, testing and
performance of this reference
design. Gerber files, schematic
and application note are available
from the Agilent Fiber-Optics
Components’ web site at the URL
of http://semiconductor.agilent.
com/fiber.
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
Electromagnetic Interference
(EMI) enables the designer to pass
a governmental agency’s EMI
regulatory standard; and more
importantly, it reduces the
possibility of interference to
neighboring equipment. There are
three options available for the
HFCT-5218M with regard to EMI
shielding for providing the
designer with a means to achieve
good EMI performance. The EMI
performance of an enclosure
using these transceivers is
dependent on the chassis design.
Agilent encourages using standard
RF suppression practices and
avoiding poorly EMI-sealed
enclosures. In addition, Agilent
advises that for the best EMI
performance, the metalized case
must be connected to chassis
ground using one of the shield
options.
An un-shielded option, shown in
Figure 6 is available for the
HFCT-5218M fiber optic
transceiver. This unit is intended
for applications where EMI is
either not an issue for the
designer, or the unit resides in a
highly-shielded enclosure.
The first shielded option, option
EM, is for applications where the
position of the transceiver module
will extend outside the equipment
enclosure. The metallized plastic
package and integral external
metal shield of the transceiver
helps locally to terminate EM
fields to the chassis to prevent
their emissions outside the
enclosure. This metal shield
contacts the panel or enclosure on
the inside of the aperture on all
but the bottom side of the shield
and provides a good RF
connection to the panel. This
5
option can accommodate various
panel or enclosure thicknesses,
i.e. 1.02 mm (.04 in) min to
2.54 mm (0.1 in) max. The
reference plane for this panel
thickness variation is from the
front surface of the panel or
enclosure. The recommended
length for protruding the
HFCT-5218EM transceiver beyond
the front surface of the panel or
enclosure is 6.35 mm (0.25 in) .
With this option, there is flexibility
of positioning the module to fit
the specific need of the enclosure
design. (See Figure 7 for the
mechanical drawing dimensions
of this shield.)
The second shielded option,
option FM, is for applications that
are designed to have a flush
mounting of the module with
respect to the front of the panel or
enclosure. The flush-mount design
accommodates a large variety of
panel thickness, i.e. 1.02 mm
(.04 in) min to 2.54 mm (0.1 in)
max. Note the reference plane for
the flush-mount design is the
interior side of the panel or
enclosure. The recommended
distance from the centerline of the
transceiver front solder posts to
the inside wall of the panel is
13.82 mm (0.544 in) . This option
contacts the inside panel or
enclosure wall on all four sides of
this metal shield. (See Figure 8 for
the mechanical drawing
dimensions of this shield.)
Both shielded design options
connect only to the equipment
chassis and not to the signal or
logic ground of the circuit board
within the equipment closure. The
front panel aperture dimensions
are recommended in Figures 9 and
10. When layout of the printed
circuit board is done to
incorporate these metal-shielded
transceivers, keep the area on the
printed circuit board directly
under the external metal shield
free of any components and
circuit board traces. For
additional EMI performance
advantage, use duplex SC fiberoptic connectors that have low
metal content inside the
connector. This lowers the ability
of the metal fiber-optic
connectors to couple EMI out
through the aperture of the panel
or enclosure.
Agilent
N.B. For shielded
module the label
is mounted on
the end as
shown.
TX
39.6
MAX.
(1.56)
12.7
(0.50)
(
KEY:
YYWW = DATE CODE
XXXX-XXXX = HFCT-5218M
ZZZZ = 1300 nm
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4 MAX.
(1.00)
+0.1
0.25 -0.05
+0.004
0.010 -0.002
XXXX-XXXX
ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
SLOT DEPTH
12.7
(0.50)
SLOT WIDTH
2.5
(0.10)
2.0 ± 0.1
(0.079 ± 0.004)
)
9.8
MAX.
(0.386)
0.51
(0.020)
3.3 ± 0.38
(0.130 ± 0.015)
+0.25
0.46 -0.05
9X Ø
+0.010
0.018 -0.002
(
23.8
(0.937)
20.32
(0.800)
2X Ø
20.32
(0.800)
)
20.32
(0.800)
14.5
(0.57)
Masked insulator material (no metalization)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX ±0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X ±0.05 mm
Figure 6. Package Outline Drawing for HFCT-5218M
6
+0.25
1.27 -0.05
2X Ø
+0.010
0.050 -0.002
(
8X 2.54
(0.100)
1.3
(0.051)
15.8 ± 0.15
(0.622 ± 0.006)
)
Recommended Solder and Wash
Process
The HFCT-5218M is compatible
with industry-standard wave or
hand solder processes.
HFBR-5000 Process Plug
The HFCT-5218M transceiver is
supplied with a process plug, the
HFBR-5000, for protection of the
optical ports with the Duplex SC
connector receptacle. This
process plug prevents contamination during wave solder and
aqueous rinse as well as during
handling, shipping or storage. It is
made of high-temperature,
molded, sealing material that will
withstand +80°C and a rinse
pressure of 110 lb/in 2 .
Recommended Solder Fluxes and
Cleaning/Degreasing Chemicals
Solder fluxes used with the
HFCT-5218M fiber-optic
transceiver should be watersoluble, organic solder fluxes.
Some recommended solder fluxes
are Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux from
Alpha-metals of Jersey City, NJ.
Recommended cleaning and
degreasing chemicals for the
HFCT-5218M are alcohols
(methyl, isopropyl, isobutyl),
aliphatics (hexane, heptane) and
other chemicals, such as soap
solution or naphtha. Do not use
partially halogenated
hydrocarbons for cleaning/
degreasing. Examples of
chemicals to avoid are 1,1.1
trichloroethane, ketones (such as
MEK), acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride or
N methylpyrolldone.
Regulatory Compliance
These transceiver products are
intended to enable commercial
system designers to develop
equipment that complies with the
various regulations governing
certification of Information
Technology Equipment. See the
Regulatory Compliance Table
for details. Additional information
is available from your Agilent
sales representative.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage is
important.
The first case is during handling of
the transceiver prior to mounting
it on the circuit board. It is
important to use normal ESD
handling precautions for ESD
sensitive devices. These
precautions include using
grounded wrist straps, work
benches, and floor mats in ESD
controlled areas.
Regulatory Compliance
Feature
Electrostatic Discharge
(ESD)
Immunity
Test Method
HBM
TA-NWT-000983
Machine Model
JEDEC
JESD22-A115-A
RAD
IEC-61000-4-2
FCC Class B
CENELEC EN55022
Class B (CISPR 22B)
VCCI Class 2
Variation of IEC 801-3
Eye Safety
IEC 825/CDRH Class 1
Electromagnetic
Interference (EMI)
7
Performance
Min 2000 V
Min 100 V
Products of this design typically withstand at least 25 kV
without damage.
Margins are dependant on customer board and chassis design.
It is recommended that the flush mount shield design
(HFCT-5218FM) is used for best EMI margin to FCC B.
Typically show no measurable effect from a 10 V/m field swept
from 26 to 1000 MHz applied to the transceiver when mounted to
a circuit card without a chassis enclosure.
CDRH Accession Numbers:
9521220 - 23
HFCT-5218xx
TUV Bauart License:
933/510908/01
HFCT-5218xx
Þ
Þ
The second case to consider is
static discharges to the exterior of
the equipment chassis containing
the transceiver parts. To the
extent that the duplex SC
connector receptacle is exposed
to the outside of the equipment
chassis, it may be subject to
whatever ESD system level test
criteria that the equipment is
intended to meet.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan.
The HFCT-5218M EMI has been
characterized with a chassis
enclosure to demonstrate
robustness of the parts.
Performance of a system
containing these transceivers will
vary depending on the individual
chassis design.
Immunity
Equipment utilizing these
HFCT-5218 transceivers will be
subject to radio-frequency
electromagnetic fields in some
environments. These transceivers,
with their integral shields, have
been characterized without the
benefit of a normal equipment
chassis enclosure and the results
are reported below. Performance
of a system containing these
transceivers within a welldesigned chassis is expected to be
better than the results of these
tests without a chassis enclosure.
8
Eye Safety
The HFCT-5218M transceiver is
classified as AEL Class I (U.S. 21
CFR(J) and AEL Class 1 per
EN 60825-1 (+A11). It is eye safe
when used within the data sheet
limits per CDRH. It is also eye safe
under normal operating
conditions and under all
reasonably foreseeable single
fault conditions per EN60825-1.
Agilent has tested the transceiver
design for compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV Rheinland
has granted certification to this
transceiver for laser eye safety
and use in EN 60950 and
EN 60825-2 applications. It’s
performance enables the
transceiver to be used without
concern for eye safety up to 5.25 V
transmitter VCC under single fault
conditions.
1 = VEER
N/C
2 = RD
3 = RD
4 = SD
5 = VCCR
TOP VIEW
6 = VCCT
N/C = NO INTERNAL CONNECTION
(MOUNTING POSTS) - CONNECT
TO CHASSSIS GROUND OR LEAVE
FLOATING, DO NOT CONNECT TO
SIGNAL GROUND.
7 = TD
8 = TD
N/C
9 = VEET
Table 1. Pinout Table
Pin
Symbol
Functional Description
Mounting Studs
The mounting studs are provided for transceiver mechanical attachment to the circuit boards,
they are embedded in the metalized plastic housing and are not connected to the transceiver
internal circuit. They should be soldered into plated-through holes on the printed circuit board
and not connected to signal ground.
1
VEER
Receiver Signal Ground
Directly connect this pin to receiver signal ground plane. Receiver VEER and transmitter VEET
can connect to a common circuit board ground plane.
2
RD+
Receiver Data Out
Terminate this high-speed, differential, PECL output with standard PECL techniques at the
follow-on device input pin.
3
RD-
Receiver Data Out Bar
Terminate this high-speed, differential, PECL output with standard PECL techniques at the
follow-on device input pin.
4
SD
Signal Detect
Normal input optical signal levels to the receiver result in a logic "1" output (VOH).
Low input optical signal levels to the receiver result in a fault condition indication shown by a
logic "0" output (VOL).
If Signal Detect output is not used, leave it open-circuited.
This Signal Detect output can be used to drive a PECL input on an upstream circuit, such as,
Signal Detect input or Loss of Signal-bar.
5
VCCR
Receiver Power Supply
Provide +5 V dc via the recommended receiver VCCR power supply filter circuit.
Locate the power supply filter circuit as close as possible to the VCCR pin.
6
VCCT
Transmitter Power Supply
Provide +5 V dc via the recommended transmitter VCCT power supply filter circuit.
Locate the power supply filter circuit as close as possible to the VCCT pin.
7
TD-
Transmitter Data In Bar
Terminate this high-speed, differential, Transmitter Data input with standard PECL techniques
at the transmitter input pin.
8
TD+
Transmitter Data In
Terminate this high-speed, differential, Transmitter Data input with standard PECL techniques
at the transmitter input pin.
9
VEET
Transmitter Signal Ground
Directly connect this pin to the transmitter signal ground plane. Transmitter VEET and receiver
VEER can connect to a common circuit board ground plane.
9
Performance Specifications
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter
in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that
limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum
ratings for extended periods can adversely affect device reliability.
Parameter
Storage Temperature
Operating Temperature
Lead Soldering Temperature/Time
Output Current (other outputs)
Input Voltage
Power Supply Voltage
Symbol
TS
Minimum
-40
0
Typical
Maximum
+85
+70
+260/10
30
VCC
6
Units
°C
°C
°C/s
mA
V
V
Notes
IOUT
0
GND
0
Symbol
VCC
TOP
PSR
Minimum
+4.75
0
Typical
Maximum
+5.25
+70
100
Units
V
°C
mV
Notes
Minimum
1280
Typical
Maximum
1335
1
2.0
Typical
Maximum
130
-7.0
-34
4.0
150
Operating Environment
Parameter
Power Supply Voltage
Ambient Operating Temperature
Power Supply Rejection
1
Transmitter Section
(Ambient Operating Temperature, VCC= 4.75 V to 5.25 V)
Parameter
Output Center Wavelength
Output Spectral Width (-20 dB)
Output Optical Power
Extinction Ratio
Power Supply Current
Output Eye
Symbol
Units
Notes
nm
lC
nm
Dl
PO
-3.0
dBm
2
ER
10
dB
ICC
140
mA
3
Compliant with Bellcore TR-NWT-000253 and ITU recommendation G.957
Receiver Section
(Ambient Operating Temperature, VCC = 4.75 V to 5.25 V)
Parameter
Receiver Sensitivity
Maximum Input Power
Alarm ON
Hysteresis
Power Supply Current
Data Outputs PECL
Alarm Output PECL
Symbol
Minimum
-28
-42
0.5
ICC
Units
dBm
dBm
dBm
dB
mA
Notes
4
5
6
Notes:
1. 2 ms-1 air flow required.
2. Output power is power coupled into a single mode fiber. Minimum output optical level is at end of life.
3. The power supply current varies with temperature. Maximum current is specified at VCC = Maximum @ maximum temperature (not including
terminations) and end of life.
4. Minimum sensitivity and saturation levels measured for a BER of 10 -10 with a 223-1 PRBS with 72 ones and 72 zeros inserted.
(CCITT recommendation G.958).
5. A high to low transition in SD typically occurs for a Rx bit error rate (BER) of 10 -6 or worse.
6. The current excludes the output load current.
10
Agilent
TX
XXXX-XXXX
ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
KEY:
YYWW = DATE CODE
FOR SINGLEMODE MODULES:
XXXX-XXXX = HFCT-5218EM
ZZZZ = 1300 nm
29.6
(1.16) UNCOMPRESSED
39.6
MAX.
(1.56)
12.7
(0.50)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4 MAX.
(1.00)
18.1
(0.711)
20.5
(0.805)
+0.1
0.25 -0.05
+0.004
0.010 -0.002
(
4.7
(0.185)
2.0 ± 0.1
SLOT WIDTH (0.079 ± 0.004)
3.3
(0.13)
10.2
MAX.
(0.40)
)
12.7
(0.50)
2.09 UNCOMPRESSED
(0.08)
9.8 MAX.
(0.386)
3.3 ± 0.38
(0.130 ± 0.015)
9X Ø
23.8
(0.937)
+0.25
0.46 -0.05
+0.010
0.018 -0.002
(
20.32
(0.800)
2X Ø
20.32
(0.800)
15.8 ± 0.15
(0.622 ± 0.006)
)
2X Ø
8X 2.54
(0.100)
1.3
(0.051)
14.5
(0.57)
Figure 7. Package Outline for HFCT-5218EM
+0.25
1.27 -0.05
+0.010
0.050 -0.002
(
20.32
(0.800)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX ±0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X
±0.05 mm
11
1.3
(0.05)
5.9
(0.23)
13.6
(0.54)
Masked insulator material (no metalization)
)
XXXX-XXXX
LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
Agilent ZZZZZ
TX
KEY:
YYWW = DATE CODE
FOR SINGLEMODE MODULES:
XXXX-XXXX = HFCT-5218FM
ZZZZ = 1300 nm
39.6
MAX.
(1.56)
1.01
(0.40)
(
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4 MAX.
(1.00)
+0.1
0.25 -0.05
+0.004
0.010 -0.002
12.7
(0.50)
25.8
MAX.
(1.02)
)
10.2
MAX.
(0.40)
2.2
SLOT DEPTH
(0.09)
3.3 ± 0.38
(0.130 ± 0.015)
22.0
(0.87)
+0.25
0.46 -0.05
9X Ø
+0.010
0.018 -0.002
23.8
(0.937)
20.32
(0.800)
2X Ø
20.32
(0.800)
15.8 ± 0.15
(0.622 ± 0.006)
+0.25
1.27 -0.05
2X Ø
+0.010
0.050 -0.002
)
(
AREA
RESERVED
FOR
PROCESS
PLUG
8X 2.54
(0.100)
1.3
(0.051)
Figure 8. Package Outline for HFCT-5218FM
20.32
(0.800)
14.5
(0.57)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX ±0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X ±0.05 mm
12
SLOT WIDTH 2.0 ± 0.1
(0.079 ± 0.004)
14.4
(0.57)
9.8 MAX.
(0.386)
(
12.7
(0.50)
29.7
(1.17)
Masked insulator material (no metalization)
)
0.8
2X (0.032)
0.8
2X (0.032)
+0.5
-0.25
+0.02
0.43
-0.01
10.9
)
9.4
(0.37)
PCB BOTTOM VIEW
6.35
(0.25)
MODULE
PROTRUSION
3.5
(0.14)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX ±0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X ±0.05 mm
Figure 9. Suggested Module Positioning and Panel Cut-out for HFCT-5218EM
13
27.4 ± 0.50
(1.08 ± 0.02)
)
1.98
(0.078)
DIMENSION SHOWN FOR MOUNTING MODULE
FLUSH TO PANEL. THICKER PANEL WILL
RECESS MODULE. THINNER PANEL WILL
PROTRUDE MODULE.
1.27 SEPTUM
(0.05)
30.2
(1.19)
0.36
(0.014)
10.82
(0.426)
13.82
(0.544)
BOTTOM SIDE OF PCB
1.82
(0.072)
12.0
(0.47)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX ±0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X ±0.05 mm
Figure 10. Suggested Module Positioning and Panel Cut-out for HFCT-5218FM
14
KEEP OUT ZONE
26.4
(1.04)
14.73
(0.58)
Ordering Information
1300 nm DFB Laser
HFCT-5218M
HFCT-5218EM
HFCT-5218FM
No shield, metallized housing.
Extended/protruding shield, metallized housing.
Flush shield, metallized housing.
Supporting Documentation
HFCT-5208xxx/HFCT-5218xx
HFCT-5218M
HFCT-5208M/HFCT-5218M
HFBR-5208M/HFCT-5208M/HFCT-5218M
Application Note
Characterization Report
Interim Qualification Report
Reference Design Application Note 1178
Class 1 Laser Product: This product conforms to the
applicable requirements of 21 CFR 1040 at the date of
manufacture
Date of Manufacture:
Agilent Technologies Ltd., Whitehouse Road, Ipswich, England
Handling Precautions
1. The HFCT-5218M can be damaged by current surges or overvoltage.
Power supply transient precautions should be taken.
2. Normal handling precautions for electrostatic sensitive devices
should be taken.
15
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2001 Agilent Technologies, Inc.
Obsoletes: 5988-0965EN
January 28, 2001
5988-2056EN