Agilent HFCT-5944xxx Single Mode SFF Transceivers for SONET OC-48/SDH STM-16 Multirate Operation Part of the Agilent METRAK family Data Sheet Description The HFCT-5944xxx are high performance, cost effective modules for serial optical data communications applications that range from 125 Mb/s to 2.7 Gb/s. They are designed to provide SONET/SDH compliant links at 2488 Mb/s for both short and intermediate reach links. The modules are designed for single mode fiber and operate at a nominal wavelength of 1300 nm. They incorporate high performance, reliable, long wavelength optical devices and proven circuit technology to give long life and consistent service. The transmitter section of the HFCT-5944L/AL/G/AG incorporates a 1300 nm Fabry Perot (FP) laser. The transmitter in the HFCT-5944TL/ATL/TG/ ATG uses a Distributed Feedback (DFB) Laser packaged in conjunction with an optical isolator for excellent back reflection performance. The transmitter has full IEC 825 and CDRH Class 1 eye safety. For each device the receiver section uses an MOVPE grown planar SEDET PIN photodetector for low dark current and excellent responsivity. A positive ECL logic interface simplifies interface to external circuitry. The transceivers are supplied in the new industry standard 2 x 10 DIP style package with the LC fiber connector interface and is footprint compatible with SFF Multi Source Agreement (MSA). Features • Multirate operation from 125 Mb/s to 2.7 Gb/s • HFCT-5944L/AL: Links of 2 km with 9/125 µm single mode fiber (SMF) • HFCT-5944TL/ATL: Links of 15 km with 9/125 µm single mode fiber (SMF) • Multisourced 2 x 10 package style with LC receptacle • Single +3.3 V power supply • Temperature range: HFCT-5944L/G: 0°C to +70°C HFCT-5944TL/TG: 0°C to +70°C HFCT-5944AL/AG: -40°C to +85°C HFCT-5944ATL/ATG: -20°C to +85°C • Wave solder and aqueous wash process compatible • Manufactured in an ISO9002 certified facility • Fully Class 1 CDRH/IEC 825 compliant • Compliant with ITU-T G.957 STM-16, I-16 and S-16.1 Optical Interfaces • HFCT-5944L/AL/TL/ATL: metalized nose and EMI shield • HFCT-5944G/AG/TG/ATG: no metalization and no EMI shield Applications • SONET/SDH equipment interconnect • Multirate Client Interface on Metro Gateways and Edge Switches Functional Description Receiver Section Design The receiver section for the HFCT-5944xxx contains an InGaAs/InP photo detector and a preamplifier mounted in an optical subassembly. This optical subassembly is coupled to a postamp/decision circuit on a circuit board. The design of the optical assembly is such that it provides better than 27 dB Optical Return Loss (ORL). The postamplifier is ac coupled to the preamplifier as illustrated in Figure 1. The coupling capacitors are large enough to pass the SONET/SDH test pattern at 155 Mb/s, 622 Mb/s and 2488 Mb/s without significant distortion or performance penalty. For multirate applications the sensitivity will meet the maximum SONET specification for OC48 across all datarates (19 dBm), also for DC balanced codes, e.g. 8B/10B. For codes which have a significantly lower frequency content, jitter and pulse distortion could be degraded. Figure 1 also shows a filter function which limits the bandwidth of the preamp output signal. The filter is designed to bandlimit the preamp output noise and thus improve the receiver sensitivity. These components will reduce the sensitivity of the receiver as the signal bit rate is increased above 2.7 Gb/s. As an optional feature the device also incorporates a photodetector bias circuit. The circuit works by providing a mirrored output of the bias current within the photodiode. This output must be connected to VCC and can be monitored by connecting through a series resistor (see Application Section). Noise Immunity The receiver includes internal circuit components to filter power supply noise. However under some conditions of EMI and power supply noise, external power supply filtering may be necessary (see Application Section). The Signal Detect Circuit The signal detect circuit works by sensing the peak level of the received signal and comparing this level to a reference. The SD output is low voltage TTL. PHOTODETECTOR BIAS PECL OUTPUT BUFFER AMPLIFIER GND Figure 1. Receiver Block Diagram 2 DATA OUT FILTER TRANSIMPEDANCE PREAMPLIFIER SIGNAL DETECT CIRCUIT TTL OUTPUT BUFFER DATA OUT SD Functional Description Transmitter Section Design A schematic diagram for the transmitter is shown in Figure 2. The HFCT-5944L/AL/G/AG incorporates an FP laser and the HFCT-5944TL/TG/ATL/ATG uses a DFB packaged in conjunction with an optical isolator. Both packages have been designed to be compliant with IEC 825 eye safety requirements under any single fault condition and CDRH under normal operating conditions. The optical output is controlled by a custom IC that detects the laser output via the monitor photodiode. This IC provides both dc and ac current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over temperature, supply voltage and operating life. The transmitters also include monitor circuitry for both the laser diode bias current and laser diode optical power. FP or DFB LASER DATA LASER MODULATOR DATA PECL INPUT BMON(+) BMON(-) PMON(+) PMON(-) Figure 2. Simplified Transmitter Schematic 3 LASER BIAS DRIVER LASER BIAS CONTROL PHOTODIODE (rear facet monitor) Package The overall package concept for the device consists of the following basic elements; two optical subassemblies, two electrical subassemblies and the housing as illustrated in the block diagram in Figure 3. The package outline drawing and pin out are shown in Figures 4 and 5. The details of this package outline and pin out are compliant with the multisource definition of the 2 x 10 DIP. In combination witht he metalized nose segment of the package a metallic nose clip provides connection to chassis ground for both EMI and thermal dissipation. The electrical subassemblies consist of high volume multilayer printed circuit boards on which the IC and various surface-mounted passive circuit elements are attached. The receiver electrical subassembly includes an internal shield for the electrical and optical subassembly to ensure high immunity to external EMI fields. The optical subassemblies are each attached to their respective transmit or receive electrical subassemblies. These two units are then fitted within the outer housing of the transceiver that is molded of filled nonconductive plastic to provide mechanical strength. The housing is then encased with a metal EMI protective shield. The case is signal ground and we recommend soldering the four ground tabs to host card signal ground. The pcb’s for the two electrical subassemblies both carry the signal pins that exit from the bottom of the transceiver. The solder posts are fastened into the molding of the device and are designed to provide the mechanical strength required to withstand the loads imposed on the transceiver by mating with the LC connectored fiber cables. Although they are not connected electrically to the transceiver, it is recommended to connect them to chassis ground. RX SUPPLY * PHOTO DETECTOR BIAS DATA OUT PIN PHOTODIODE PREAMPLIFIER SUBASSEMBLY QUANTIZER IC DATA OUT RX GROUND SIGNAL DETECT LC RECEPTACLE TX GROUND DATA IN DATA IN Tx DISABLE BMON(+) BMON(-) PMON(+) PMON(-) LASER BIAS MONITORING LASER DRIVER AND CONTROL CIRCUIT LASER DIODE OUTPUT POWER MONITORING TX SUPPLY LASER OPTICAL SUBASSEMBLY CASE * NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION. Figure 3. Block Diagram 4 15.0 ± 0.2 (0.591 ± 0.008) 13.59 + 0 - 0.2 0.535 +0 -0.008 ( 13.59 (0.535) MAX ) TOP VIEW 48.2 (1.898) 6.25 (0.246) 9.8 (0.386) MAX 10.8 ± 0.2 9.6 ± 0.2 (0.425 ± 0.008)(0.378 ±0.008) 4.06 (0.16) 3.81 (0.15) 10.16 (0.4) Ø 1.07 (0.042) 19.5 ±0.3 (0.768 ±0.012) FRONT VIEW 1 (0.039) 20 x 0.5 (0.02) 1.78 (0.07) 1 (0.039) 0.25 (0.01) BACK VIEW SIDE VIEW 48.2 (1.898) 9.8 (0.386) MAX G MODULE - NO NOSE METALIZATION 3.81 (0.15) Ø 1.07 (0.042) 19.5 ±0.3 (0.768 ±0.012) 1 (0.039) 20 x 0.5 (0.02) 1.78 (0.07) 0.25 (0.01) SIDE VIEW 20 x 0.25 (PIN THICKNESS) (0.01) NOTE: END OF PINS CHAMFERED BOTTOM VIEW DIMENSIONS IN MILLIMETERS (INCHES) DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA. Figure 4. HFCT-5944xxx Package Outline Drawing 5 Connection Diagram RX TX Mounting Studs/ Solder Posts Package Grounding Tabs PHOTO DETECTOR BIAS RECEIVER SIGNAL GROUND RECEIVER SIGNAL GROUND NOT CONNECTED NOT CONNECTED RECEIVER SIGNAL GROUND RECEIVER POWER SUPPLY SIGNAL DETECT RECEIVER DATA OUTPUT BAR RECEIVER DATA OUTPUT o 1 20 o o 2 Top 19 o o 3 o View 18 o 4 17 o o 5 16 o o 6 15 o o 7 14 o o 8 13 o o 9 12 o o 10 11 o LASER DIODE OPTICAL POWER MONITOR - POSITIVE END LASER DIODE OPTICAL POWER MONITOR - NEGATIVE END LASER DIODE BIAS CURRENT MONITOR - POSITIVE END LASER DIODE BIAS CURRENT MONITOR - NEGATIVE END TRANSMITTER SIGNAL GROUND TRANSMITTER DATA IN BAR TRANSMITTER DATA IN TRANSMITTER DISABLE TRANSMITTER SIGNAL GROUND TRANSMITTER POWER SUPPLY Figure 5. Pin Out Diagram (Top View) Pin Descriptions: Pin 1 Photo Detector Bias, VpdR: This pin enables monitoring of photo detector bias current. The pin should either be connected directly to VCCRX, or to VCCRX through a resistor for monitoring photo detector bias current. Pins 2, 3, 6 Receiver Signal Ground VEE RX: Directly connect these pins to the receiver ground plane. Pins 4, 5 DO NOT CONNECT Pin 7 Receiver Power Supply VCC RX: Provide +3.3 V dc via the recommended receiver power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCC RX pin. Note: the filter circuit should not cause VCC to drop below minimum specification. Pin 8 Signal Detect SD: Normal optical input levels to the receiver result in a logic “1” output. Low optical input levels to the receiver result in a logic “0” output. This Signal Detect output can be used to drive a TTL input on an upstream circuit, such as Signal Detect input or Loss of Signalbar. 6 Pin 9 Receiver Data Out Bar RD-: PECL logic family. Output internally biased and ac coupled. Pin 10 Receiver Data Out RD+: PECL logic family. Output internally biased and ac coupled. Pin 11 Transmitter Power Supply VCC TX: Provide +3.3 V dc via the recommended transmitter power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCC TX pin. Pins 12, 16 Transmitter Signal Ground VEE TX: Directly connect these pins to the transmitter signal ground plane. Pin 13 Transmitter Disable TDIS: Optional feature, connect this pin to +3.3 V TTL logic high “1” to disable module. To enable module connect to TTL logic low “0”. Pin 14 Transmitter Data In TD+: PECL logic family. Internal terminations are provided (Terminations, ac coupling). Pin 15 Transmitter Data In Bar TD-: Internal terminations are provided (Terminations, ac coupling). Pin 17 Laser Diode Bias Current Monitor - Negative End BMON– The laser diode bias current is accessible by measuring the voltage developed across pins 17 and 18. Dividing the voltage by 10 Ohms (internal) will yield the value of the laser bias current. Pin 18 Laser Diode Bias Current Monitor - Positive End BMON+ See pin 17 description. Pin 19 Laser Diode Optical Power Monitor - Negative End PMON– The back facet diode monitor current is accessible by measuring the voltage developed across pins 19 and 20. The voltage across a 200 Ohm resistor between pins 19 and 20 will be proportional to the photo current. Pin 20 Laser Diode Optical Power Monitor - Positive End PMON+ See pin 19 description. Mounting Studs/Solder Posts The two mounting studs are provided for transceiver mechanical attachment to the circuit board. It is recommended that the holes in the circuit board be connected to chassis ground. Package Grounding Tabs Connect four package grounding tabs to signal ground. Application Information The Applications Engineering Group at Agilent is available to assist you with technical understanding and design tradeoffs associated with these transceivers. You can contact them through your Agilent sales representative. The following information is provided to answer some of the most common questions about the use of the parts. minimum transmitter output optical power (dBm avg) and the lowest receiver sensitivity (dBm avg). This OPB provides the necessary optical signal range to establish a working fiber-optic link. The OPB is allocated for the fiber-optic cable length and the corresponding link penalties. For proper link performance, all penalties that affect the link performance must be accounted for within the link optical power budget. Optical Power Budget and Link Penalties The worst-case Optical Power Budget (OPB) in dB for a fiberoptic link is determined by the difference between the Electrical and Mechanical Interface Recommended Circuit Figure 6 shows the recommended interface for deploying the Agilent transceivers in a +3.3 V system. Data Line Interconnections Agilent’s HFCT-5944xxx fiberoptic transceivers are designed to couple to +3.3 V PECL signals. The transmitter driver circuit regulates the output optical power. The regulated light output will maintain a constant output optical power provided the data pattern is balanced in duty cycle. If the data duty cycle has long, continuous state times (low or high data duty cycle), then the output optical power will gradually change its average output optical power level to its preset value. Z = 50 W VCC (+3.3 V) TDIS (LVTTL) 130 W BMON- TD- Z = 50 W BMON+ NOTE A 130 W PMON- TD+ PMON+ VEE TX o TD- o VEE TX o VCC TX o o DNC o DNC o VEE RX o VCC RX o SD o RD- o RD+ TDIS o BMON - o o VEERX TD+ o PMON - o BMON + o o VEE RX RX 11 PMON + o TX 17 16 15 14 13 12 o VpdR 20 19 18 1 2 3 4 5 6 7 8 9 10 VCC (+3.3 V) 1 µH C2 10 µF RD+ C1 10 µF 2 kW NOTE C VCC (+3.3 V) 1 µH Z = 50 W VCCRX (+3.3 V) C3 NOTE B 100 W RD- 10 nF Z = 50 W 3k SD LVTTL Note: C1 = C2 = C3 = 10 nF or 100 nF TD+, TD- INPUTS ARE INTERNALLY TERMINATED AND AC COUPLED. RD+, RD- OUTPUTS ARE INTERNALLY BIASED AND AC COUPLED. Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT. Note B: CIRCUIT ASSUMES HIGH IMPENDANCE INTERNAL BIAS @ V CC - 1.3 V. Note C: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 2 kW. Figure 6. Recommended Interface Circuit 7 The HFCT-5944xxx has a transmit disable function which is a single-ended +3.3 V TTL input which is dc-coupled to pin 13. In addition the devices offer the designer the option of monitoring the laser diode bias current and the laser diode optical power. The voltage measured between pins 17 and 18 is proportional to the bias current through an internal 10 Ω resistor. Similarly the optical power rear facet monitor circuit provides a photo current which is proportional to the voltage measured between pins 19 and 20, this voltage is measured across an internal 200 Ω resistor. 2 x Ø 2.29 MAX. 2 x Ø 1.4 ±0.1 (0.09) (0.055 ±0.004) The receiver section is internally ac-coupled between the preamplifier and the post-amplifier stages. The Data and Data-bar outputs of the post-amplifier are internally biased and ac-coupled to their respective output pins (pins 9, 10). Signal Detect is a single-ended, +3.3 V TTL compatible output signal that is dc-coupled to pin 8 of the module. Signal Detect should not be ac-coupled externally to the follow-on circuits because of its infrequent state changes. 8.89 (0.35) 7.11 (0.28) 2 x Ø 1.4 ±0.1 (0.055 ±0.004) The designer also has the option of monitoring the PIN photo detector bias current. Figure 6 shows a resistor network, which could be used to do this. Note that the photo detector bias current pin must be connected to VCC. Agilent also recommends that a decoupling capacitor is used on this pin. Caution should be taken to account for the proper interconnection between the supporting Physical Layer integrated circuits and these transceivers. Figure 6 illustrates a recommended interface circuit for interconnecting to a +3.3 V dc PECL fiber-optic transceiver. 3.56 (0.14) 4 x Ø 1.4 ±0.1 (0.055 ±0.004) 13.34 (0.525) 10.16 (0.4) 7.59 (0.299) 9.59 (0.378) 3 (0.118) 9 x 1.78 (0.07) 3 (0.118) 6 (0.236) 4.57 (0.18) 16 (0.63) 2 (0.079) 2 2 x Ø 2.29 (0.079) (0.09) 3.08 (0.121) 20 x Ø 0.81 ±0.1 (0.032 ±0.004) DIMENSIONS IN MILLIMETERS (INCHES) NOTES: 1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER. 2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR GROUND CONNECTION IN KEEP-OUT AREAS. 3. 2 x 10 TRANSCEIVER MODULE REQUIRES 26 PCB HOLES (20 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE GROUNDING TABS). PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND. 4. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS. 5. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND. Figure 7. Recommended Board Layout Hole Pattern 8 Power Supply Filtering and Ground Planes It is important to exercise care in circuit board layout to achieve optimum performance from these transceivers. Figure 6 shows the power supply circuit which complies with the small form factor multisource agreement. It is further recommended that a continuous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. This recommendation is in keeping with good high frequency board layout practices. Package footprint and front panel considerations The Agilent transceivers comply with the circuit board “Common Transceiver Footprint” hole pattern defined in the current multisource agreement which defined the 2 x 10 package style. This drawing is reproduced in Figure 7 with the addition of ANSI Y14.5M compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. Figure 8 shows the front panel dimensions associated with such a layout. Eye Safety Circuit For an optical transmitter device to be eye-safe in the event of a single fault failure, the transmit-ter must either maintain eye-safe operation or be disabled. The HFCT-5944xxx is intrinsically eye safe and does not require shut down circuitry. 000 000 000 15.24 (0.6) 10.16 ± 0.1 (0.4 ± 0.004) TOP OF PCB 000 000 000 000 000 000 000 000000000 000000000 000000000 000000000 000000000 B B DETAIL A 15.24 (0.6) 1 (0.039) 00 00 00 00000000000000000000000000000 00000000000000000000000000000 14.22 ±0.1 (0.56 ±0.004) 00 00 00 SOLDER POSTS 0000000000 0000000000 00000000000000000000000000000 00000000000000000000000000000 15.75 MAX. 15.0 MIN. (0.62 MAX. 0.59 MIN.) SECTION B - B DIMENSIONS IN MILLIMETERS (INCHES) 1. 2. FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER. SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING. Figure 8. Recommended Panel Mounting Signal Detect The Signal Detect circuit provides a deasserted output signal when the optical link is broken (or when the remote transmitter is OFF). The Signal Detect threshold is set to transition from a high to low state between the minimum receiver input optical power and -35 dBm avg. input optical power indicating a definite optical fault (e.g. unplugged connector for the receiver or transmitter, broken fiber, or failed far-end transmitter or data source). The Signal Detect does not detect receiver data error or error-rate. Data errors can be determined by signal processing offered by upstream PHY ICs. Electromagnetic Interference (EMI) One of a circuit board designer’s foremost concerns is the control of electromagnetic emissions from electronic equipment. Success in controlling generated Electromagnetic Interference 9 A (EMI) enables the designer to pass a governmental agency’s EMI regulatory standard and more importantly, it reduces the possibility of interference to neighboring equipment. Agilent has designed the HFCT-5944xxx to provide good EMI performance. The EMI performance of a chassis is dependent on physical design and features which help improve EMI suppression. Agilent encourages using standard RF suppression practices and avoiding poorly EMI-sealed enclosures. Agilent’s OC-48 LC transceivers (HFCT-5944xxx) have nose shields which provide a convenient chassis connection to the nose of the transceiver. This nose shield and the underlying metalization (except ‘G’ options) improve system EMI performance by effectively closing off the LC aperture. Localized shielding is also improved by tying the four metal housing package grounding tabs to signal ground on the PCB. Though not obvious by inspection, the nose shield and metal housing are electrically separated for customers who do not wish to directly tie chassis and signal grounds together. The recommended transceiver position, PCB layout and panel opening for both devices are the same, making them mechanically drop-in compatible. Figure 8 shows the recommended positioning of the transceivers with respect to the PCB and faceplate. Package and Handling Instructions Flammability The HFCT-5944xxx transceiver housing consists of high strength, heat resistant and UL 94 V-0 flame retardant plastic and metal packaging. Recommended Solder and Wash Process The HFCT-5944xxx are compatible with industrystandard wave solder processes. 10 Process plug This transceiver is supplied with a process plug for protection of the optical port within the LC connector receptacle. This process plug prevents contamination during wave solder and aqueous rinse as well as during handling, shipping and storage. It is made of a hightemperature, molded sealing material that can withstand +85°C and a rinse pressure of 110 lbs per square inch. Recommended Solder fluxes Solder fluxes used with the HFCT-5944xxx should be water-soluble, organic fluxes. Recommended solder fluxes include Lonco 3355-11 from London Chemical West, Inc. of Burbank, CA, and 100 Flux from Alpha-Metals of Jersey City, NJ. Recommended Cleaning/Degreasing Chemicals Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane, heptane Other: naphtha. Do not use partially halogenated hydrocarbons such as 1,1.1 trichloroethane, ketones such as MEK, acetone, chloroform, ethyl acetate, methylene dichloride, phenol, methylene chloride, or N-methylpyrolldone. Also, Agilent does not recommend the use of cleaners that use halogenated hydrocarbons because of their potential environmental harm. LC SFF Cleaning Recommendations In the event of contamination of the optical ports, the recommended cleaning process is the use of forced nitrogen. If contamination is thought to have remained, the optical ports can be cleaned using a NTT international Cletop stick type (diam. 1.25mm) and HFE7100 cleaning fluid. Regulatory Compliance The Regulatory Compliance for transceiver performance is shown in Table 1. The overall equipment design will determine the certification level. The transceiver performance is offered as a figure of merit to assist the designer in considering their use in equipment designs. Electrostatic Discharge (ESD) The device has been tested to comply with MIL-STD-883E (Method 3015). It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, work benches, and floor mats in ESD controlled areas. Electromagnetic Interference (EMI) Most equipment designs utilizing these high-speed transceivers from Agilent will be required to meet FCC regulations in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. Refer to EMI section (page 9) for more details. Immunity Transceivers will be subject to radio-frequency electromagnetic fields following the IEC 61000-4-3 test method. Table 1: Regulatory Compliance - Targeted Specification Eye Safety These laser-based transceivers are classified as AEL Class I (U.S. 21 CFR(J) and AEL Class 1 per EN 60825-1 (+A11). They are eye safe when used within the data sheet limits per CDRH. They are also eye safe under normal operating conditions and under all reasonably foreseeable single fault conditions per EN60825-1. Agilent has tested the transceiver design for compliance with the requirements listed below under normal operating conditions and under single fault conditions where applicable. TUV Rheinland has granted certification to these transceivers for laser eye safety and use in EN 60950 and EN 60825-2 applications. Their performance enables the transceivers to be used without concern for eye safety up to 3.6 V transmitter VCC. Feature Test Method Performance Electrostatic Discharge (ESD) MIL-STD-883E Class 2 (>2 kV). to the Electrical Pin Electrostatic Discharge (ESD) Method 3015 Variation of IEC 61000-4-2 Tested to 8 kV contact discharge. to the LC Receptacle Electromagnetic Interference FCC Class B Margins are dependent on customer board and chassis designs. (EMI) CENELEC EN55022 Class B (CISPR 22A) VCCI Class I Immunity Variation of IEC 61000-4-3 Typically show no measurable effect from a 10 V/m field swept from 27 to 1000 MHz applied to the transceiver without a chassis enclosure. Laser Eye Safety US 21 CFR, Subchapter J AEL Class I, FDA/CDRH and Equipment Type Testing per Paragraphs 1002.10 CDRH Accession Number: and 1002.12 HFCT-5944L/AL ) 9521220 - 37 HFCT-5944ATL/TL ) 9521220 - 38 HFCT-5944ATG/AG/G/TG ) 9521220 - 41 EN 60825-1: 1994 +A11 AEL Class 1, TUV Rheinland of North America EN 60825-2: 1994 TUV Bauart License: EN 60950: 1992+A1+A2+A3 Component Recognition Underwriters Laboratories and Canadian Standards Association Joint Component Recognition for Information Technology Equipment Including Electrical Business Equipment. 11 HFCT-5944L/GL/AL/AG ) 933/510111/04 HFCT-5944ATL/ATG/TL/TG ) 933/510111/05 UL File Number: E173874 CAUTION: There are no user serviceable parts nor any maintenance required for the HFCT-5944xxx. All adjustments are made at the factory before shipment to our customers. Tampering with or modifying the performance of the parts will result in voided product warranty. It may also result in improper operation of the circuitry, and possible overstress of the laser source. Device degradation or product failure may result. Connection of the devices to a non-approved optical source, operating above the recommended absolute maximum conditions or operating the HFCT-5944xxx in a manner inconsistent with its design and function may result in hazardous radiation exposure and may be considered an act of modifying or manufacturing a laser product. The person(s) performing such an act is required by law to recertify and reidentify the laser product under the provisions of U.S. 21 CFR (Subchapter J). 12 Absolute Maximum Ratings (HFCT-5944xxx) Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Symbol Min. Max. Unit Storage Temperature TS -40 +85 °C Supply Voltage VCC -0.5 3.6 V Data Input Voltage VI -0.5 VCC V 50 mA 85 % 6 dBm Max. Unit Reference +70 +85 +85 3.5 °C °C °C V 2 2 2 mVP-P 3 Data Output Current ID Relative Humidity RH Receiver Optical Input PINABS Typ. 0 Reference 1 Recommended Operating Conditions (HFCT-5944xxx) Parameter Symbol Min. Ambient Operating Temperature HFCT-5944L/TL/G/TG HFCT-5944AL/AG HFCT-5944ATL/ATG Supply Voltage TA TA TA VCC 0 -40 -20 3.1 Power Supply Rejection PSR Transmitter Differential Input Voltage VD Data Output Load RDL TTL Signal Detect Output Current - Low IOL TTL Signal Detect Output Current - High IOH Typ. 100 0.3 2.4 V 1.0 mA W 50 -400 µA Transmit Disable Input Voltage - Low TDIS Transmit Disable Input Voltage - High TDIS Transmit Disable Assert Time TASSERT 10 µs 4 Transmit Disable Deassert Time TDEASSERT 50 µs 5 Max. Unit Reference +260/10 °C/sec. 6 0.6 2.2 V V Process Compatibility (HFCT-5944xxx) Parameter Symbol Wave Soldering and Aqueous Wash TSOLD/tSOLD Min. Typ. Notes: 1. The transceiver is class 1 eye safe up to V CC = 3.6 V. 2. Ambient operating temperature utilizes air flow of 2 ms-1 over the device. 3. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the VCC supply with the recommended power supply filter in place. Typically less than a 1 dB change in sensitivity is experienced. 4. Time delay from Transmit Disable Assertion to laser shutdown. 5. Time delay from Transmit Disable Deassertion to laser startup. 6. Aqueous wash pressure <110 psi. 13 Transmitter Electrical Characteristics HFCT-5944L/G: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V) HFCT-5944AL/AG: TA = -40°C to +85°C, VCC = 3.1 V to 3.5 V) Parameter Symbol Supply Current ICCT Min. Power Dissipation PDIST Data Input Voltage Swing (single-ended) VIH - VIL 150 Data Input Current - Low IIL -350 Transmitter Differential Data Input Current - High IIH Typ. Max. Unit 100 175 mA 0.33 0.61 W 1200 mV Reference Transmitter Differential -2 18 Laser Diode Bias Monitor Voltage Power Monitor Voltage 10 µA 350 µA 400 mV 1, 2 100 mV 1, 2 Receiver Electrical Characteristics HFCT-5944L/G: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V) HFCT-5944AL/AG: TA = -40°C to +85°C, VCC = 3.1 V to 3.5 V) Parameter Symbol Typ. Max. Unit Reference Supply Current ICCR Min. 115 140 mA 3 Power Dissipation PDISR 0.38 0.49 W 4 Data Output Voltage Swing (single-ended) VOH - VOL 930 mV 5 Data Output Rise Time tr 125 150 ps 6 Data Output Fall Time tf 125 150 ps 6 Signal Detect Output Voltage - Low VOL 0.8 V 7 Signal Detect Output Voltage - High VOH V 7 575 2.0 Signal Detect Assert Time (OFF to ON) ASMAX 100 µs Signal Detect Deassert Time (ON to OFF) ANSMAX 100 µs 1.2 µA/µW Responsivity 0.6 0.9 8 Notes: 1. Measured at TA = +25°C. 2. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing resistors, 10 W and 200 W (under modulation). 3. Includes current for biasing Rx data outputs. 4. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of VCC and ICC minus the sum of the products of the output voltages and currents. 5. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs. 6. These are 20 - 80% values. 7. SD is LVTTL compatible. 8. Responsivity is valid for input optical power from -18 dBm to -4 dBm at 1310 nm. 14 Transmitter Optical Characteristics HFCT-5944L/G: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V) HFCT-5944AL/AG: TA = -40°C to +85°C, VCC = 3.1 V to 3.5 V) Parameter Symbol Min. Typ. Max. Unit Reference Output Optical Power 9 µm SMF POUT -10 -6 -3 dBm 1 Center Wavelength lC 1260 1360 nm Spectral Width - rms s 1.8 4 nm rms 2 Optical Rise Time tr 30 70 ps 3 Optical Fall Time tf 150 225 ps 3 Extinction Ratio ER Output Optical Eye Compliant with eye mask Telcordia GR-253-GORE 8.2 12 Back Reflection Sensitivity Jitter Generation dB -8.5 dB 4 pk to pk 70 mUI 5 RMS 7 mUI 5 Typ. Max. Unit Reference -23 -19 dBm avg. 6, 7 dBm avg. 6 Receiver Optical Characteristics HFCT-5944L/G: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V) HFCT-5944AL/AG: TA = -40°C to +85°C, VCC = 3.1 V to 3.5 V) Parameter Symbol Receiver Sensitivity PIN MIN Min. Receiver Overload PIN MAX -3 Input Operating Wavelength l 1260 +1 1570 nm Signal Detect - Asserted PA Signal Detect - Deasserted PD -35 -28.7 Signal Detect - Hysteresis PH 0.5 1.4 4 dB -35 -27 dB Reflectance -27.3 -19.5 dBm avg. dBm avg. Notes: 1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life. 2. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian shaped spectrum which results in RMS = FWHM/2.35. 3. These are unfiltered 20 - 80% values. 4. This meets the “desired” requirement in SONET specification (GR253). The figure given is the allowable mismatch for 1 dB degradation in receiver sensitivity. 5. For the jitter measurements, the device was driven with SONET OC-48C data pattern filled with a 223-1 PRBS payload. 6. PIN represents the typical optical input sensitivity of the receiver. Minimum sensitivity (PINMIN ) and saturation (PINMAX ) levels for a 2 23-1 PRBS with 72 ones and 72 zeros inserted. Over the range the receiver is guaranteed to provide output data with a Bit Error Rate better than or equal to 1 x 10-10. For multirate applications the sensitivity will meet the maximum SONET specification for OC48 across all datarates (-19 dBm). 7. Beginning of life sensitivity at +25°C is -22 dBm (worst case). 15 Transmitter Electrical Characteristics HFCT-5944TL/TG: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V) HFCT-5944ATL/ATG: TA = -20°C to +85°C, VCC = 3.1 V to 3.5 V) Parameter Symbol Supply Current ICCT Min. Power Dissipation PDIST Data Input Voltage Swing (single-ended) VIH - VIL 150 Data Input Current - Low IIL -350 Transmitter Differential Data Input Current - High IIH Typ. Max. Unit 100 175 mA 0.33 0.61 W 1200 mV Reference Transmitter Differential -2 18 µA 350 µA Laser Diode Bias Monitor Voltage 0 400 mV 1, 2 Power Monitor Voltage 10 100 mV 1, 2 Receiver Electrical Characteristics HFCT-5944TL/TG: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V) HFCT-5944ATL/ATG: TA = -20°C to +85°C, VCC = 3.1 V to 3.5 V) Parameter Symbol Supply Current ICCR Min. Typ. Max. Unit Reference 115 140 mA 3 0.38 0.49 W 4 930 mV 5 Power Dissipation PDISR Data Output Voltage Swing (single-ended) VOH - VOL Data Output Rise Time tr 125 150 ps 6 Data Output Fall Time tf 125 150 ps 6 Signal Detect Output Voltage - Low VOL Signal Detect Output Voltage - High VOH Signal Detect Assert Time (OFF to ON) ASMAX Signal Detect Deassert Time (ON to OFF) ANSMAX Responsivity 575 0.8 2.0 100 0.6 0.9 V 7 V 7 µs 100 µs 1.2 µA/µW 8 Notes: 1. Measured at TA =+25°C. 2. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing resistors, 10 W and 200 W (under modulation). 3. Includes current for biasing Rx data outputs. 4. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of VCC and ICC minus the sum of the products of the output voltages and currents. 5. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs. 6. These are 20 - 80% values. 7. SD is LVTTL compatible. 8. Responsivity is valid for input optical power from -18 dBm to -4 dBm at 1310 nm. 16 Transmitter Optical Characteristics HFCT-5944TL/TG: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V) HFCT-5944ATL/ATG: TA = -20°C to +85°C, VCC = 3.1 V to 3.5 V) Parameter Symbol Min. Typ. Max. Unit Reference Output Optical Power 9 µm SMF POUT -5 -3 0 dBm 1 Center Wavelength lC 1260 1360 nm 1 nm (pk -20 dB) Spectral Width s Side Mode Suppression Ratio SMSR Optical Rise Time tr 30 Optical Fall Time tf Extinction Ratio ER Output Optical Eye Compliant with eye mask Telcordia GR-253-CORE 8.2 10.5 Back Reflection Sensitivity Jitter Generation 2 dB ns 3 ns 3 dB -8.5 dB 4 pk to pk 70 mUI 5 RMS 7 mUI 5 Typ. Max. Unit Reference -23 -19 dBm avg. 6, 7 dBm avg. 6 1570 nm -19.5 dBm avg. Receiver Optical Characteristics HFCT-5944TL/TG: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V) HFCT-5944ATL/ATG: TA = -20°C to +85°C, VCC = 3.1 V to 3.5 V) Parameter Symbol Receiver Sensitivity PIN MIN Receiver Overload PIN MAX 0 Input Operating Wavelength l 1260 Signal Detect - Asserted PA Signal Detect - Deasserted PD -35 -28.7 Signal Detect - Hysteresis PH 0.5 1.4 4 dB -35 -27 dB Reflectance Min. +1 -27.3 dBm avg. Notes: 1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life. 2. Spectral width of main laser peak measured 20 dB below peak spectral density. 3. These are unfiltered 20 - 80% values. 4. This meets the “desired” requirement in SONET specification (GR253). The figure given is the allowable mismatch for 1 dB degradation in receiver sensitivity. 5. For the jitter measurements, the device was driven with SONET OC-48C data pattern filled with a 223-1 PRBS payload. 6. PIN represents the typical optical input sensitivity of the receiver. Minimum sensitivity (PIN MIN) and saturation (PINMAX ) levels for a 2 23-1 PRBS with 72 ones and 72 zeros inserted. Over the range the receiver is guaranteed to provide output data with a Bit Error Rate better than or equal to 1 x 10-10. For multirate applications the sensitivity will meet the maximum SONET specification for OC48 across all datarates (-19 dBm). 7. Beginning of life sensitivity at +25°C is -22 dBm (worst case). 17 Design Support Materials Agilent has created a number of reference designs with major PHY IC vendors in order to demonstate full functionality and interoperability. Such design information and results can be made available to the designer as a technical aid. Please contact your Agilent representative for further information if required. Ordering Information 1300 nm FP Laser (Temperature range 0°C to +70°C) HFCT-5944L HFCT-5944G 1300 nm FP Laser (Temperature range -40°C to +85°C) HFCT-5944AL HFCT-5944AG 1300 nm DFB Laser (Temperature range 0°C to +70°C) HFCT-5944TL HFCT-5944TG 1300 nm DFB Laser (Temperature range -20°C to +85°C) HFCT-5944ATL HFCT-5944ATG Class 1 Laser Product: This product conforms to the applicable requirements of 21 CFR 1040 at the date of manufacture Date of Manufacture: Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore Handling Precautions 1. The HFCT-5944xxx can be damaged by current surges or overvoltage. Power supply transient precautions should be taken. 2. Normal handling precautions for electrostatic sensitive devices should be taken. For product information and a complete list of Agilent contacts and distributors, please go to our web site. www.agilent.com/ semiconductors E-mail: [email protected] Data subject to change. Copyright © 2002 Agilent Technologies, Inc. November 25, 2002 5988-8282EN