HLMP-HD61, HLMP-HM61 and HLMP-HB61 Precision Optical Performance Red, Green and Blue 5mm Standard Oval LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in these lamps: Aluminum Indium Gallium Phosphide (AlInGaP II) for red and Indium Gallium Nitride for blue and green. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. • Well defined spatial radiation pattern • High brightness material • Available in red, green and blue color. Red AlInGaP 630mm Green InGaN 525nm Blue InGaN 470nm • Superior resistance to moisture • Standoff package Applications • Full color signs • Commercial outdoor advertising. Package Dimensions 1.50 max. 0.059 max. 10.80±0.50 0.425±0.020 Notes: 1. Measured at base of lens 1.50±0.15 0.059±0.006 3.80 0.150 0.50±0.10 sq. 0.020±0.004 0.70 max. 0.028 5.20 0.205 cathode lead 7.01 0.276 24.00 min 0.945 min 2.54 0.10 1.00 min 0.039 Notes: All dimensions in millimeters (inches). For Blue and Green if heat-sinking application is required, the terminal for heat sink is anode. Caution: InGaN devices are Class 1C HBM ESD Sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Device Selection Guide Part Number Color and Dominant Wavelength ld (nm) Typ Luminous Intensity lv(mcd) at 20 mA Min Luminous Intensity lv(mcd) at 20 mA Max HLMP-HD61-TXTZZ Red 630 800 1990 HLMP-HM61-Y30ZZ Green 525 1990 5040 HLMP-HB61-QU0ZZ Blue 470 460 1150 Tolerance for each intensity limit is ± 15%. Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. Part Numbering System HLMP - H x 61 - x x x x x Packaging Option ZZ: Flexi Ammo-packs Color Bin Selection 0: Open distribution T: Red Color, Vf max =2.6V Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity Bin Refer to Device Selection Guide. Color B: Blue 470 D: Red 630 M: Green 525 Package H: 5mm Standard Oval 40˚ x 100˚� Absolute Maximum Rating (TA = 25°C) Parameter Red Blue and Green Unit DC Forward Current [1] 50 30 mA Peak Forward Current 100[2] 100[3] mA Power Dissipation 130 116 mW Reverse Voltage 5 (IR = 100 mA) 5 (IR = 10 mA) V LED Junction Temperature 130 110 °C Operating Temperature Range -40 to +100 -40 to +85 °C Storage Temperature Range -40 to +120 -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 2 and Figure 8. 2. Duty Factor 30%, frequency 1KHz. 3. Duty Factor 10%, frequency 1KHz. Electrical / Optical Characteristics (TA = 25°C) Parameter Symbol Forward Voltage Red Green Blue VF Reverse Voltage Red Green & blue VR Dominant Wavelength Red Green Blue lD Peak Wavelength Red Green Blue lPEAK Spectral Half width Red Green Blue Dl1/2 Thermal Resistance, RqJ-PIN Luminous Efficacy [3] Red Green Blue hV Min. 2.0 2.8 2.8 Typ. 2.3 3.3 3.2 Max. 2.6[1] 3.8 3.8 Test Conditions V IF = 20 mA V 5 5 622 520 460 Units 630 525 470 634 540 480 nm IR = 100 mA IR = 10 mA IF = 20 mA 639 516 464 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA 17 32 23 nm Wavelength Width at Spectral Distribution ½ Power Point at ,IF = 20 mA 240 °C/W LED Junction-to-pin 155 520 75 lm/W Emitted Luminous Power/Emitted Radiant Power Notes: 1. For option –xxTxx, the VF maximum is 2.6V, refer to Vf bin table 2. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp 3. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is the luminous efficacy in lumens/watt. 4. Forward voltage allowable tolerance is ± 0.05V. 5. For AlInGaP Red, thermal resistance applied to LED junction to cathode lead. For InGaN blue and Green, thermal resistance applied to LED junction to anode lead. RELATIVE INTENSITY 1.0 0.5 0 550 600 650 700 I F MAX . - MAXIMUM FORWARD CURRENT - mA AlInGaP Red 60 50 40 30 20 10 0 WAVELENGTH – nm 50 2.5 40 2.0 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 V F - FORWARD VOLTAGE - V Figure 3. Forward Current vs Forward Voltage 20 40 60 80 TA - AMBIENT TEMPERATURE - o C 100 Figure 2. Maximum Forward Current vs Ambient Temperature RELATIVE INTENSITY (NORMALIZED AT 20 mA) IF - FORWARD CURRENT - mA Figure 1. Relative Intensity vs Wavelength 0 3.0 1.5 1.0 0.5 0 0 10 30 20 40 FORWARD CURRENT - mA Figure 4. Relative Intensity vsForward Current 50 InGaN Blue and Green 1.00 35 30 GREEN BLUE FORWARD CURRENT - mA RELATIVE INTENSITY 0.80 0.60 0.40 0.20 0 350 400 450 500 550 600 25 20 15 10 5 0 650 WAVELENGTH - nm IF - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 5 10 15 20 25 DC FORWARD CURRENT - mA Figure 7. Relative Intensity vs Forward Current 1 3 2 FORWARD VOLTAGE - V 4 Figure 6. Forward Current vs Forward Voltage Figure 5. Relative Intensity vs Wavelength 0 0 30 35 30 25 20 15 10 5 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - oC Figure 8. Maximum Forward Current vs Ambient Temperature 100 RELATIVE DOMINANT WAVELENGHT SHIFT (NORMALIZED AT 20mA) 10 8 6 4 GREEN 2 BLUE 0 -2 -4 0 5 10 15 20 25 FORWARD CURRENT - mA 30 Figure 9. Relative dominant wavelength vs Forward Current NORMALIZED INTENSITY 1 0.8 0.6 0.4 0.2 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 10. Radiation pattern-Major Axis NORMALIZED INTENSITY 1 0.8 0.6 0.4 0.2 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 11. Radiation pattern-Minor Axis 90 Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) Green Color Bin Table Intensity (mcd) at 20 mA Bin Min Max Q 460 550 R 550 660 S 660 800 T 800 960 U 960 1150 V 1150 1380 W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 Bin Min Dom Max Dom 1 520.0 524.0 2 524.0 528.0 3 528.0 532.0 4 532.0 536.0 5 536.0 540.0 Bin ID Min. Max. VA 2.0 2.2 VB 2.2 2.4 VC 2.4 2.6 634 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 Xmin Ymin Xmax Ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 5 Xmax Ymax 0.6904 0.3094 0.6945 0.2888 0.6726 0.3106 0.7135 0.2865 Tolerance for each bin limit is ± 0.5 nm 0.8338 Max Dom 3 Red Color Range 622 0.0743 Min Dom 4 Ymin Ymax Bin 2 Tolerance for each bin limit is ± 0.05 Xmin Xmax Blue Color Bin Table VF bin Table (V at 20mA) Max Dom Ymin Tolerance for each bin limit is ± 0.5nm Tolerance for each bin limit is ± 15% Min Dom Xmin 464.0 468.0 472.0 476.0 468.0 472.0 476.0 480.0 Tolerance for each bin limit is ± 0.5nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. Avago Color Bin on CIE 1931 Chromaticity Diagram 1.000 0.800 1 2 3 4 Green 5 Y 0.600 0.400 Red 0.200 5 4 3 2 0.000 0.000 0.100 Blue 1 0.200 0.300 0.400 0.500 0.600 0.700 X Relative Light Output vs. Junction Temperature 1.6 RELATIVE LIGHT OUTPUT (NORMALIZED at TJ = 25˚C) 1.4 1.2 Green 1 0.8 0.6 Red Blue 0.4 0.2 0 -40 -20 0 20 40 60 T J - JUNCTION TEMPERATURE - ˚C 80 100 0.800 Avago Technologies LED configuration Precautions Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to length rather that doing it manually. Soldering Condition: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED closer than 1.59mm might damage the LED. 1.59mm • Recommended soldering condition: Wave Soldering Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 30 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to daily check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again prior to loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding recommendation of 250 ° C. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. AlInGaP Device InGaN Device Note: Electrical connection between bottom surface of LED die and the leadframe material through conductive paste or solder. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. Note: In order to further assist customer in designing jig accurately that fit Avago Technologies’ product, 3D model of the product is available upon request. • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must be allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through holes size for LED component leads. LED component Lead size Diagonal Plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. • Over sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 TEMPERATURE - °C 200 TOP SIDE OF PC BOARD BOTTOM SIDE OF PC BOARD 150 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C ± 5°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA LEAD FREE SOLDER 96.5%Sn; 3.0%Ag; 0.5% Cu FLUXING 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 TIME - SECONDS 10 60 70 80 90 100 Ammo Packs Drawing Note: The ammo-packs drawing is applicable for packaging option –DD & - ZZ and regardless standoff or non-standoff Packaging Box for Ammo Packs Note: For InGaN device, the ammo pack packaging box contain ESD logo DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0418EN AV02-0339EN - April 19, 2007 12