AVAGO HSMD-C265

HSMx-C265
Surface Mount Chip LEDs
Data Sheet
Description
Features
The HSMx-C265 is a reverse mountable chip-type LED for
lighting the non-component side of a PCB board. In this
reverse mounting configuration, this LED is designed to
emit light through a small cut-out hole in the PC board.
• Reverse mountable
The HSMx-C265 is available in four colors. The small size,
narrow footprint, and low profile make this series of LEDs
excellent for backlighting, status indication, and front panel
illumination application.
• Undiffused optics
• Small 3.4 x 1.25 mm footprint
• Operating temperature range of –30°C to +85°C
• Compatible with IR solder reflow
• Four colors available: red, orange, yellow, and green
• Available in 8 mm tape on 7" (178 mm) diameter
reels
Applications
• Keypad backlighting
• Symbol backlighting
• LCD backlighting
• Status indication
Device Selection Guide
Part Number
Color Parts Per Reel
HSMS-C265
HSMD-C265
HSMY-C265
HSMG-C265
HSMH-C265
High Efficiency Red
Orange
Yellow
Green
AlGaAs Red
3000
3000
3000
3000
3000
Package Dimensions
3.4 (0.134)
CATHODE
MARK
LED DIE
1.25 (0.049)
R 0.25 (0.01)
0.4 (0.016)
WHITE SOLDER MASK
(THICKNESS = 0.15 (0.006)
0.4 (0.016)
GREEN CATHODE MARK
(CUM SOLDER MASK)
1.2
(0.047)
UNDIFFUSED
EPOXY
1.1 (0.043)
POLARITY
1.1 (0.043)
PC BOARD
0.3 (0.012)
0.25 (0.01)
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
SOLDERING
TERMINAL
Notes:
NOTE:
ALL DIMENSIONS IN MILLIMETERS (INCHES).
1. All dimensions in millimeters1.(inches).
2. TOLERANCE IS ± 0.1 mm UNLIESS OTHERWISE SPECIFIED.
2. Tolerance is ± 0.1 mm (± 0.004
in.) unless otherwise specified.
3. Polarity of HSMH-C265 will be the opposite of whatHSMx-C260
is shown on
above
drawing.
Pkg
Dimen
Absolute Maximum Ratings
TA = 25°C
Parameter
HSMD/G/S/Y-C265
DC Forward Current[1]
Peak Pulsing Current[2]
Power Dissipation
Reverse Voltage (IR = 100 µA)
Led Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
25 25
100 100
65 65
5
5
95
95
–30 to +85
–30 to +85
–40 to +85
–40 to +85
See IR soldering profile (Figure 6)
Notes:
1. Derate linearly as shown in Figure 4.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
HSMH-C265
Units
mA
mA
mW
V
°C
°C
°C
Electrical Characteristics TA = 25°C
Part Number
Forward Voltage
VF (Volts) @ IF = 20 mA
Typ. Max.
Reverse Breakdown
VR (Volts) @ IR = 100 µA
Min.
Capacitance
C (pF), VF = 0,
f = 1 MHz Typ.[1]
Thermal
Resistance
RθJ-PIN (°C/W) Typ.
HSMS-C265
HSMD-C265
HSMY-C265
HSMG-C265
HSMH-C265
2.1
2.2
2.1
2.2
1.8
5
5
5
5
5
8
6
7
6
18
250
250
250
250
300
2.6
2.6
2.6
2.6
2.6
Optical Characteristics TA = 25°C
Part Number
Color
Luminous Intensity
Iv (mcd) @ 20 mA[1]
Min. Typ.
Peak Wavelength
λpeak (nm)
Typ.
Dominant Wavelength λd (nm)[2]
Typ.
Viewing Angle
2θ1/2 Degrees[3]
Typ.
HSMS-C265
HSMD-C265
HSMY-C265
HSMG-C265
HSMH-C265
2.5 2.5 2.5 4.0 6.3
630
605
589
570
660
626
604
586
572
639
150
150
150
150
150
HER
Orange
Yellow
Green
AlGaAs
10.0
8.0
8.0
15.0
17.0
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the
lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represent the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1.0
RELATIVE INTENSITY
GREEN
YELLOW
0.5
ORANGE
0
500
HER
550
600
650
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
HSMx-C260 fig 1
700
750
HER
10
GREEN
1
YELLOW
0.1
ORANGE
1.5
1.7
1.9
2.1
1.2
0.8
0.4
0
2.3
0
10
20
30
IF – FORWARD CURRENT – mA
VF – FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
HSMX-C190 fig 2
Figure 3. Luminous intensity vs. forward current.
HSMx-C260 fig 3
40
IF MAX. – MAXIMUM FORWARD CURRENT – mA
1.6
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
100
35
30
25
20
RθJ-A = 600°C/W
15
RθJ-A = 800°C/W
10
5
0
0
20
40
60
80
Figure 4. Maximum forward current vs. ambient
temperature. HSMx-C260 fig 4
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle.
HSMx-C260 fig 5
2.2 (0.087) DIA. PCB HOLE
TEMPERATURE
10 SEC. MAX.
230°C MAX.
4°C/SEC. MAX.
140-160°C
4°C/SEC.
MAX.
1.25 (0.049)
3°C/SEC. MAX.
OVER 2 MIN.
TIME
Figure 6. Recommended reflow soldering profile.
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
Figure 7. Recommended soldering pad pattern.
HSMx-C260 fig 7
HSMx-C260 fig 6
Note:
1. All dimensions in millimeters (inches).
100
TA – AMBIENT TEMPERATURE – °C
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 8. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
Figure 9. Reel Dimensions.
Note:
1. All dimensions in millimeters (inches).
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
HSMx-C260 Reel Dimensions
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
HSMx-C265 SERIES
3.70 (0.146)
1.45 (0.057)
1.30 (0.051)
Figure 10. Tape dimensions.
HSMx-C260 fig 10
END
START
Convective IR Reflow Soldering
For more information on IR reflow
soldering, refer to Application Note 1060, Surface Mounting
SMT LED Indicator Components.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 11. Tape leader and trailer dimensions.
HSMx-C260 fig 11
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
Storage Condition: 5 to 30˚C at 60% RH max.
Baking is required under the condition:
a) the blue silica gell indicator becoming white/transparent color
b) the pack has been open for more than 1 week
Baking recommended condition: 60 ± 5˚C for 20 hours.
6
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5980-1655E
5980-2435E November 27, 2007